SM5108E-030-A [SMI]
OEM Silicon Pressure Die;
| 型号： | SM5108E-030-A |
| 厂家： | 
Silicon Microstructures, Inc. |
| 描述： | OEM Silicon Pressure Die |
| 文件： | 总6页 (文件大小：612K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OEM Silicon Pressure Die
SM5108E Series
FEATURES
•
•
•
High performance absolute pressure sensor die
0.690 x 0.690 x 0.400 mm size
100 millivolt output
DESCRIPTION
This sensor is intended for high volume applications, such as
consumer tire pressure gauges, or stable performance disposable
gauges. The SM5108E is available as an absolute pressure sensor
in a full-scale range of 30, 60 & 100 PSI. It is designed to be
mounted on ceramic or PC board substrates by high-volume OEM
manufacturers.
The SM5108E is an all silicon micro-machined, piezoresistive
pressure sensing chip. The die is extremely small (0.69 mm x 0.69
mm) and has been optimized to provide the highest possible
accuracy for a die of this size. Performance is achieved through
careful resistor placement and mechanical configuration. The
small die results in a significant cost saving when compared to
larger sensor die.
Wafers are probed, visually inspected and shipped on tape.
Minimum order quantities apply to this product.
Medical
Industrial
Automotive
Wound therapy
Barometric Sensing
Engine Control
Automotive Tire Pressure Monitoring (TPMS)
Barometric pressure
Pneumatic Gauges
Hand-Held Meters
Silicon Microstructures, Inc. 2001-2018. All rights reserved
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS5168.03
Page 1
SM5108E Series
www.si-micro.com
Absolute Maximum Ratings
All parameters are specified at VSUPPLY = 5.00 V supply voltage at 25oC, unless otherwise noted.
No.
Characteristic
Excitation Voltage(a,b)
Symbol
VDD
Minimum
Maximum
Units
1
2
3
4
5
6
-
-40
-55
-
6.5
V
°C
°C
V
Operating Temperature
TOP
+125
+150
2000
2500
2000
Storage Temperature(a)
TSTG
ESD Rating, Human Body Model
Static Acceleration Level Withstand
Mechanical Shock Withstand
VESD
SAW
MSW
-
g
-
g
Notes:
a. Bridge shall be driven with the positive voltage applied to the V+ pad.
b. Voltage must not exceed 6.5 V under any operating conditions
Operating
Pressure
Proof Pressure
Burst Pressure
No.
Product Number
(c)
(c)
(PPROOF
)
(PBURST)
7
8
9
0 to 30 PSI
0 to 60 PSI
0 to 100 PSI
90 PSI
150 PSI
300 PSI
500 PSI
SM5108E-030-A
SM5108E-060-A
SM5108E-100-A
180 PSI
300 PSI
Notes:
c. Tested on a sample basis.
Silicon Microstructures, Inc. 2001-2018. All rights reserved
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS5168.03
Page 2
SM5108E Series
www.si-micro.com
Operating Characteristics For SM5108E Die
The operating characteristics are based on packaged die. The sensor performance may vary depending on the die attach and gel coating materials and the
assembly process. The die attach and gel coating materials and the assembly process should minimize the stress transferred to the sensor die.
All parameters are specified at VSUPPLY = 5.00 V supply voltage at 25oC, unless otherwise noted.
Operating Characteristics - Specifications
All parameters are specified at Vdd = 5.0 V supply voltage at 25oC, unless otherwise noted.
Characteristic
Over Pressure
No.
Symbol Minimum
Typical
Maximum
Units
30 PSI
(d,e)
11 Span (FS PRANGE
)
60 PSI
VSPAN
65
100
135
mV
100 PSI
12
13
Zero Offset
VZERO
NL
-35
0
-
35
mV
Pressure Nonlinearity, Max Absolute
Value at 25oC (e,f)
±0.12
0.2
%FS
Pressure Nonlinearity, Max Absolute
14
15
16
0
5.0
0
+0.16
6.2
0.2
7.0
%FS
kΩ
Value Between -40oC and +125oC (e,f)
Input Resistance
Pressure Hysteresis(e)
Maximum Absolute Value
RB
PHYST
0.1
0.25
%FS
17
18
19
TC Span(e,g)
TCS
TCZ
TCR
-0.24
-0.07
1750
-0.2
-
-0.155
+0.07
2650
%FS/°C
%FS/°C
ppm°C
TC Zero Offset (e,g)
TC Resistance (e,g)
2100
Temperature Zero Offset Hysteresis(e,g)
Maximum Absolute Value
20
THYST
0
0.13
0.6
%FS
Notes:
d. Span is the difference between the output at the maximum operating pressure and the output at zero pressure. It is then normalized to the supply
voltage.
e. Tested on a sample basis
f. Defined as best fit straight line.
g. Determined by measurements taken over -40°C to 125°C.
Silicon Microstructures, Inc. 2001-2018. All rights reserved
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS5168.03
Page 3
SM5108E Series
www.si-micro.com
SM5108E Diagrams and Dimensions
400 + 5
All dimensions are in microns.
Pad Coordinate
Typical Operation
PAD #
PAD DESCRIPTION
PAD LABEL
TYPE
VALUE Coordinate X-Axis (µm)
Coordinate Y-Axis (µm)
1
2
3
4
-Vexc
+Vsig
+Vexc
Vsig
V-
S+
V+
S-
Negative Power
Positive Analog Out
Positive Power
0 V
0
0
-
+5 V
-
0
459
459
0
459
459
Negative Analog Out
Bond pad opening size = 100x100 µm
Silicon Microstructures, Inc. 2001-2018. All rights reserved
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS5168.03
Page 4
SM5108E Series
www.si-micro.com
Ordering Information
Order Code
Full-Scale Pressure
Range
Pressure
Shipping
Method
Minimum Order
Quantity
Type
SM5108E-030-A
SM5108E-060-A
SM5108E-100-A
30 PSI
60 PSI
100 PSI
Diced on UV
Release Tape
Absolute
1 Wafer (1 wafer = 44,000 ±5%)
Part Number Legend
Qualification Standards
REACH Compliant
RoHS Compliant
PFOS/PFOA Compliant
For qualification specifications, please contact Sales at sales@si-micro.com
Silicon Microstructures, Inc. 2001-2018. All rights reserved
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS5168.03
Page 5
SM5108E Series
www.si-micro.com
Silicon Microstructures Warranty and Disclaimer:
Silicon Microstructures, Inc. reserves the right to make changes without further notice to any products herein and to amend
the contents of this data sheet at any time and at its sole discretion.
Information in this document is provided solely to enable software and system implementers to use Silicon Microstructures,
Inc. products and/or services. No express or implied copyright licenses are granted hereunder to design or fabricate any silicon-
based microstructures based on the information in this document.
Silicon Microstructures, Inc. makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Silicon Microstructures, Inc. assume any liability arising out of the application or use of any
product or silicon-based microstructure, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. “Typical” parameters which may be provided in Silicon Microstructure’s data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Silicon
Microstructures, Inc. does not convey any license under its patent rights nor the rights of others. Silicon Microstructures, Inc.
makes no representation that the circuits are free of patent infringement. Silicon Microstructures, Inc. products are not
designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Silicon Microstructures,
Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon
Microstructures, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon
Microstructures, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Silicon Microstructures, Inc. was negligent
regarding the design or manufacture of the part.
Silicon Microstructures, Inc. warrants goods of its manufacture as being free of defective materials and faulty workmanship.
Silicon Microstructures, Inc. standard product warranty applies unless agreed to otherwise by Silicon Microstructures, Inc. in
writing; please refer to your order acknowledgement or contact Silicon Microstructures, Inc. directly for specific warranty
details. If warranted goods are returned to Silicon Microstructures, Inc. during the period of coverage, Silicon Microstructures,
Inc. will repair or replace, at its option, without charge those items it finds defective. The foregoing is buyer’s sole remedy and
is in lieu of all warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no
event shall Silicon Microstructures, Inc. be liable for consequential, special, or indirect damages.
While Silicon Microstructures, Inc. provides application assistance personally, through its literature and the Silicon
Microstructures, Inc. website, it is up to the customer to determine the suitability of the product for its specific application. The
information supplied by Silicon Microstructures, Inc. is believed to be accurate and reliable as of this printing. However, Silicon
Microstructures, Inc. assumes no responsibility for its use. Silicon Microstructures, Inc. assumes no responsibility for any
inaccuracies and/or errors in this publication and reserves the right to make changes without further notice to any products or
specifications herein
Silicon Microstructures, Inc.TM and the Silicon Microstructures, Inc. logo are trademarks of Silicon Microstructures, Inc. All
other service or product names are the property of their respective owners.
© Silicon Microstructures, Inc. 2001-2018. All rights reserved.
Silicon Microstructures, Inc. 2001-2018. All rights reserved
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS5168.03
Page 6
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