SM5421BBES100000 [SMI]

Gauge & Differential Pressure Sensors;
SM5421BBES100000
型号: SM5421BBES100000
厂家: Silicon Microstructures, Inc.    Silicon Microstructures, Inc.
描述:

Gauge & Differential Pressure Sensors

仪表
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中文:  中文翻译
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Low Pressure  
Digital Sensor  
SM5221, SM5321 & SM5421  
Gauge & Differential Pressure Sensors  
FEATURES  
Pressure ranges from 0.8 to 2.49 psi; gauge, differential and  
asymmetric outputs  
Accuracy: ±1% full scale  
14-bit digital, pressure calibrated and temperature compensated  
output  
I2C Digital Interface  
Compensated temperature range: -20oC to 85oC  
Insensitive to mounting orientation  
Robust JEDEC SOIC-16 package for automated assembly  
Manufactured according to ISO9001 and ISO/TS 16949 standards  
DESCRIPTION  
The SM5221, SM5321 & SM5421 Series is a digital, low pressure  
MEMS sensor family offering state-of-the-art pressure transducer  
technology and CMOS mixed signal processing technology to  
produce a digital, fully conditioned, multi-order pressure and  
temperature compensated sensor in JEDEC standard SOIC-16  
package with a dual vertical porting option. It is available in both  
compound gage or differential pressure configurations. With the  
dual porting, a vacuum-gage measurement is possible to minimize  
altitude errors due to changes in ambient pressure.  
Combining the pressure sensor with a signal-conditioning ASIC in a  
single package simplifies the use of advanced silicon micro-machined  
pressure sensors. The pressure sensor can be mounted directly on a  
standard printed circuit board and a high level, calibrated pressure  
signal can be acquired from the digital interface. This eliminates the  
need for additional circuitry, such as a compensation network or  
microcontroller containing a custom correction algorithm.  
Customer-specified pressure ranges and supply voltages are  
available.  
The SM5221, SM5321 & SM5421 is shipped in sticks or tape & reel.  
Medical  
Industrial  
Consumer  
Sleep Apnea  
Airflow Measurement  
Sports Equipment  
CPAP  
Pneumatic Gauges  
Pressure Switches  
Safety Cabinets  
Appliances  
Ventilators  
Gas Flow Instrumentation  
Air Flow Monitors  
Negative Pressure Wound Therapy  
Life Sciences  
Gas Flow Instrumentation  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 1  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
Absolute Maximum Ratings  
All parameters are specified at Vdd = 3.3 V supply voltage at 25oC, unless otherwise noted.  
No.  
1
Characteristic  
Symbol  
VDD  
Minimum  
Typical  
Maximum  
6.00  
Units  
V
Supply Voltage  
2.7  
2
Supply Current  
IVDD  
4.00  
mA  
mS  
°C  
3
Update Period  
2
4
Compensated Temperature  
Operating Temperature(a)  
Storage Temperature(a)  
Media Compatibility(a,b)  
Proof Pressure(a, c)  
-20  
-40  
-40  
+85  
5
TOP  
+105  
+125  
°C  
6
TSTG  
-
°C  
7
8
PProof  
PBurst  
12  
15  
psi  
psi  
9
Burst Pressure(a, d)  
Notes:  
a. Tested on a sample basis.  
b. Clean, dry gas compatible with wetted materials. Wetted materials include silicon, epoxy, RTV, gold and aluminum.  
c. Proof pressure is defined as the maximum pressure to which the device can be taken and still perform within specifications after  
returning to the operating pressure range  
d. Burst pressure is the pressure at which the device suffers catastrophic failure resulting in pressure loss through the device.  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 2  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
OPERATING CHARACTERISTICS TABLE All parameters are specified at Vdd = 3.3 V DC supply voltage at 25oC,  
unless otherwise noted.  
No.  
Characteristic  
Symbol  
Minimum  
3.0  
Typical  
3.3  
Maximum  
Units  
3.6  
10  
Supply Voltage*  
VDD  
V
4.75  
5.0  
5.25  
11  
12  
13  
14  
15  
Pressure Output @ PMIN  
Pressure Output @ PMAX  
Full Scale Span  
OUTMIN  
OUTMAX  
FSP  
1,638  
14,745  
13,107  
14  
Counts  
Counts  
Counts  
Bits  
Resolution  
Accuracy (e, f, g)  
ACC  
-1  
+1  
%FS  
Calibrated Pressure Ranges  
No.  
16  
Device Type  
SM5221 Gauge  
PMIN (psi)  
PMAX (psi)  
+0.8 to +2.49  
+0.8 to +2.49  
-0.8 to +2.49  
Comment  
0
17  
SM5321 Differential  
SM5421 -- Asymmetric  
-2.49 to -0.8  
-2.49 to +0.8  
Absolute value of PMIN must match absolute value of PMAX  
Delta between PMAX and PMIN must be at least 0.8 psi  
18  
Notes:  
e. The accuracy specification applies over all operating conditions. This specification includes the combination of linearity, repeatability, and  
hysteresis errors over pressure, temperature, and voltage.  
f. Maximum lifetime zero pressure offset shift < ±1%FS based on 1000 hours of HTOL , TC and THB testing.  
g. For less demanding applications, devices with relaxed accuracy specifications are available  
*Custom calibration pressures and voltages are available to meet specific customer demands.  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 3  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
SM5221, SM5321 & SM5421 I2C Communications  
1. SCL Clock frequency:  
100kHz to 400kHz  
2. Slave Address  
For the Read_DF3 data fetch command (Data Fetch 3  
Bytes), the sensor returns three bytes in response to the  
master sending the slave address and the READ bit (1): two  
bytes of bridge data with the two status bits as the MSBs  
and then 1 byte of temperature data (8-bit accuracy). After  
receiving the required number of data bytes, the master  
sends the NACK and stop condition to terminate the read  
operation.  
The factory setting for the I2C slave address is 28HEX. The  
part will only respond to the set address.  
3. Read Operations  
For read operations, the I2C master command starts with  
the 7-bit slave address with the 8th bit = 1 (READ). The  
sensor as the slave sends an acknowledge (ACK) indicating  
success.  
For the Read_DF4 command, the master delays sending the  
NACK and continues reading an additional final byte to  
acquire the full corrected 11-bit temperature measurement.  
In this case, the last 5 bits of the final byte of the packet are  
undetermined and should be masked off in the application.  
The sensor has four I2C read commands: Read_DF2,  
Read_DF3, and Read_DF4. The following figures show the  
structure of the measurement packet for three of the four  
I2C read commands, which are further explained below.  
The Read_DF2 command is used if corrected temperature is  
not required. The master terminates the READ operation  
after the two bytes of bridge data.  
3.1 I2C Read_DF (Data Fetch):  
For the Data Fetch commands, the number of data bytes  
returned by the sensor is determined by when the master  
sends the NACK and stop condition.  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 4  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
Parameter  
Symbol Minimum Typical Maximum Units  
SCL Clock Frequency  
FSCL  
tHDSTA  
tLOW  
100  
0.1  
0.6  
0.6  
0.1  
0.0  
0.1  
0.1  
2.0  
400  
kHz  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
Start Condition Hold Time Relative to SCL Edge  
Minimum SCL Clock Low Width1  
Minimum SCL Clock High Width1  
tHIGH  
Start Condition Hold Time Relative to SCL Edge  
Data Hold Time on SDA Relative to SCL Edge  
Data Setup Time on SDA Relative to SCL Edge  
Stop Condition Setup Time on SCL  
tSUSTA  
tHIDDAT  
tSUDAT  
tSUSTO  
tBUS  
Bus Free Time Between Stop Condition and Start Condition  
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Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 5  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
5. Differences sensor I2C Protocol vs. Original I2C protocol  
Note: There are three differences in the sensor protocol  
compared with the original I2C protocol  
The restart condition - a falling SDA edge during data  
transmission when the CLK clock line is still high  
creates the same situation. The next communication  
fails, and an additional start condition must be sent  
for correct communication.  
-
Sending a start-stop condition without any transitions  
on the CLK line (no clock pulses in between) created a  
communication error for the next communication, even  
if the next start condition is correct and the clock pulse  
is applied. An additional start condition must be sent,  
which results in restoration of proper communication.  
A failing SDA edge is not allowed between the start  
condition and the first rising SCL edge. If using an I2C  
address with the first bit 0, SDA must be held low  
from the start condition though the first bit.  
6. Diagnostic Features Status Bits  
The sensor offers diagnostic features to ensure robust  
system operation. The diagnostic states are indicated by a  
transmission of the status of the 2 MSBs of the pressure  
high byte data.  
Status Bits (2 MSBs of Output Packet)  
Symbol  
Normal operation, good data packet  
00  
Device in Command Mode (not applicable for normal operation)  
Stale data: Data that has already been fetched since the last measurement cycle  
Diagnostic condition exists  
01  
10(1)  
11  
Note(1): If a data fetch is performed before or during the first measurement after power-on reset, then “stale” will be returned, but this  
data is actually invalid because the first measurement has not been completed.  
When the two MSBs are 11, one of the following faults listed  
below is indicated:  
All diagnostics are detected in the next measurement  
cycle and reported in the subsequent data fetch.  
Once a diagnostic is reported, the diagnostic status  
bits will not change unless both the cause of the  
diagnostic is fixed and a power-on-reset is performed.  
Invalid EEPROM signature  
Loss of bridge positive or negative  
Bridge input short  
Loss of bridge source  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 6  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
SOIC-16 (C) Vertical Package Dimensions  
All dimensions are in mm  
Notes:  
Moisture Sensitivity Level (MSL): Level 3  
Wetted materials: Silicon, glass, copper, silicone, epoxy, mold compound.  
Tolerance on all dimensions ±0.13 mm unless otherwise specified.  
[B] is tube connected to bottom side of sensor die.  
[T] is tube connected to top side of sensor die. Topside pressure is positive pressure. An increase in topside pressure will result in an  
increase in sensor output  
Lot Number Identification  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 7  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
SOIC-16 Horizontal (B) Package Dimensions  
All dimensions are in mm  
Qualification Standards  
REACH Compliant  
RoHS Compliant  
PFOS/PFOA Compliant  
For qualification specifications, please contact Sales at sales@si-micro.com  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 8  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
SM5221, SM5321 & SM5421 + Family Applications Circuit  
Package Labeling  
Pin No.  
1
Pin Function  
NC (No Connect)  
2
3
NC  
NC  
4
NC  
5
NC  
6
VSS  
VDD  
NC  
7
8
9
NC  
10  
11  
12  
13  
14  
15  
16  
SDA  
SCL  
NC  
NC  
NC  
NC  
NC  
NOTES:  
Do not connect to NC pins  
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Package Pin-Out  
DOC # 40DS5960.05  
Page 9  
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SM5221, SM5321 & SM5421 Series  
Ordering Information: : Specific part number information is provided on a separate tear sheet for each  
product. In the event that a tear sheet and the family datasheet do not agree, then the information in  
the specific tear sheet shall overrule the family datasheet. The general part number ordering  
information is provided below:  
Part Number Legend  
*Custom calibration pressures and voltages are available to meet specific customer demands. Dual vertical or dual horizontal ports available.  
+1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com  
Silicon Microstructures, Inc. 2001-2017. All rights reserved  
DOC # 40DS5960.05  
Page 10  
www.si-micro.com  
SM5221, SM5321 & SM5421 Series  
Silicon Microstructures Warranty and Disclaimer:  
Silicon Microstructures, Inc. reserves the right to make changes without further notice to any products herein and to amend  
the contents of this data sheet at any time and at its sole discretion.  
Information in this document is provided solely to enable software and system implementers to use Silicon Microstructures,  
Inc. products and/or services. No express or implied copyright licenses are granted hereunder to design or fabricate any  
silicon-based microstructures based on the information in this document.  
Silicon Microstructures, Inc. makes no warranty, representation, or guarantee regarding the suitability of its products for any  
particular purpose, nor does Silicon Microstructures, Inc. assume any liability arising out of the application or use of any  
product or silicon-based microstructure, and specifically disclaims any and all liability, including without limitation  
consequential or incidental damages. “Typical” parameters which may be provided in Silicon Microstructure’s data sheets  
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating  
parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Silicon  
Microstructures, Inc. does not convey any license under its patent rights nor the rights of others. Silicon Microstructures,  
Inc. makes no representation that the circuits are free of patent infringement. Silicon Microstructures, Inc. products are not  
designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applications intended to support or sustain life, or for any other application in which the failure of the Silicon  
Microstructures, Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or  
use Silicon Microstructures, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and  
hold Silicon Microstructures, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all  
claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of  
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Silicon  
Microstructures, Inc. was negligent regarding the design or manufacture of the part.  
Silicon Microstructures, Inc. warrants goods of its manufacture as being free of defective materials and faulty workmanship.  
Silicon Microstructures, Inc. standard product warranty applies unless agreed to otherwise by Silicon Microstructures, Inc. in  
writing; please refer to your order acknowledgement or contact Silicon Microstructures, Inc. directly for specific warranty  
details. If warranted goods are returned to Silicon Microstructures, Inc. during the period of coverage, Silicon  
Microstructures, Inc. will repair or replace, at its option, without charge those items it finds defective. The foregoing is  
buyer’s sole remedy and is in lieu of all warranties, expressed or implied, including those of merchantability and fitness for a  
particular purpose. In no event shall Silicon Microstructures, Inc. be liable for consequential, special, or indirect damages.  
While Silicon Microstructures, Inc. provides application assistance personally, through its literature and the Silicon  
Microstructures, Inc. website, it is up to the customer to determine the suitability of the product for its specific application.  
The information supplied by Silicon Microstructures, Inc. is believed to be accurate and reliable as of this printing. However,  
Silicon Microstructures, Inc. assumes no responsibility for its use. Silicon Microstructures, Inc. assumes no responsibility for  
any inaccuracies and/or errors in this publication and reserves the right to make changes without further notice to any  
products or specifications herein  
Silicon Microstructures, Inc.TM and the Silicon Microstructures, Inc. logo are trademarks of Silicon Microstructures, Inc. All  
other service or product names are the property of their respective owners.  
© Silicon Microstructures, Inc. 2001-2017. All rights reserved.  
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DOC # 40DS5960.05  
Page 11  

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