ILX551AG [SONY]
Image Sensor, 2048 Horiz pixels, 1 Vert pixels, Through Hole Mount,;
| 型号： | ILX551AG |
| 厂家： | 
SONY CORPORATION |
| 描述： | Image Sensor, 2048 Horiz pixels, 1 Vert pixels, Through Hole Mount, CD |
| 文件： | 总10页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ILX551A
2048-pixel CCD Linear Sensor (B/W)
For the availability of this product, please contact the sales office.
Description
22 pin DIP (Cer-DIP)
The ILX551A is a reduction type CCD linear sensor
designed for facsimile, image scanner and OCR use.
This sensor reads B4 size documents at a density of
200DPI (Dot Per Inch). A built-in timing generator
and clock-drivers ensure direct drive at 5V logic for
easy use.
Features
• Number of effective pixels: 2048 pixels
• Pixel size: 14µm × 14µm (14µm pitch)
• Built-in timing generator and clock-drivers
• Ultra low lag
Block Diagram
• Maximum clock frequency: 5MHz
D 3 9
D 3 8
D 3 7
D 3 6
D 3 5
D 3 4
S 2 0 4 8
S 2 0 4 7
Absolute Maximum Ratings
• Supply voltage
VDD1
VDD2
11
6
V
V
• Operating temperature
• Storage temperature
–10 to +55 °C
–30 to +80 °C
Pin Configuration (Top View)
S 2
S 1
VOUT
VDD2
VDD2
VDD1
GND
NC
1
22
21
20
19
18
17
D 3 3
1
NC
2
NC
3
D 1 5
D 1 4
SHSW
4
φCLK
5
NC
6
GND
NC
VDD2
VDD2
NC
7
8
16 NC
15 NC
14 NC
13 NC
9
10
φROG 11
12
GND
2048
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
– 1 –
E00439-PS
ILX551A
Pin Description
Pin
Pin
No.
Symbol
No.
Description
Signal output
Symbol
Description
1
2
3
VOUT
NC
12 GND
13 NC
14 NC
GND
NC
NC
NC
NC
NC
with S/H → GND
without S/H → VDD2
4
SHSW
Switch
15 NC
NC
{
5
6
7
8
9
φCLK
NC
Clock pulse
16 NC
17 GND
18 NC
19 GND
NC
NC
GND
NC
NC
NC
VDD2
VDD2
5V power supply
5V power supply
NC
GND
20
21
22
VDD1
VDD2
VDD2
9V power supply
5V power supply
5V power supply
10 NC
11 φROG
Clock pulse
Recommended Supply Voltage
Item
Min.
8.5
Typ.
9.0
Max.
9.5
Unit
V
VDD1
VDD2
4.75
5.0
5.25
V
Note) Rules for raising and lowering power supply voltage
To raise power supply voltage, first raise VDD1 (9V) and then VDD2 (5V).
To lower voltage, first lower VDD2 (5V) and then VDD1 (9V).
Mode Description
Mode in use Pin condition
S/H
Yes
No
Pin 4 SHSW
GND
VDD2
Input Capacity of Pins
Item
Symbol
Min.
—
Typ.
10
Max.
—
Unit
pF
Input capacity of φCLK pin
Input capacity of φROG pin
CφCLK
CφROG
—
10
—
pF
Recommended Input Pulse Voltage
Typ.
5.0
—
Max.
Unit
Item
Input clock high level
Input clock low level
Min.
4.5
5.5
0.5
V
V
0.0
– 2 –
ILX551A
Electrooptical Characteristics
(Ta = 25°C, VDD1 = 9V, VDD2 = 5V, Clock frequency = 1MHz, Light source = 3200K, IR cut filter: CM-500S (t = 1.0mm))
Max.
50
Item
Symbol
R
Min.
30
—
Typ.
40
Unit
Remarks
Secsitivity
V/(lx · s) Note 1
PRNU
VSAT
VDRK
DSNU
IL
2.0
8.0
—
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
%
V
Note 2
—
1.5
—
1.8
0.3
2.0
3.0
—
mV
mV
%
Note 3
Note 3
Note 4
Note 5
Note 6
—
—
0.5
—
0.02
6000
0.045
4.0
DR
—
—
Dynamic range
—
SE
—
—
Saturation exposure
9V supply current
5V supply current
Total transfer efficiency
Output impedance
Offset level
lx · s
mA
mA
%
IVDD1
IVDD2
TTE
ZO
—
8.0
5.0
—
—
1.8
—
92.0
—
97.0
600
4.0
—
—
Ω
—
VOS
—
—
V
Note 7
Notes)
1. For the sensitivity test light is applied with a uniform intensity of illumination.
2. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1.
(VMAX – VMIN)/2
PRNU =
× 100 [%]
VAVE
The maximum output is set to VMAX, the minimum output to VMIN and the average output to VAVE.
3. Integration time is 10ms.
4. VOUT = 500mV
VSAT
5. DR =
VDRK
When optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in
proportion to optical accumulated time.
VSAT
6. SE =
R
7. Vos is defined as indicated below.
D31
D32
VOS
D33
S1
OS
GND
– 3 –
ILX551A
2
1
7 8 0 2
9 3 D
8 3 S
7 3 S
6 3 D
5 3 D
4 3 D
8 4 0 2 S
7 4 0 2 S
6 4 0 2 S
5 4 0 2 S
4 S
3 S
2 S
1 S
3 3 D
2 3 D
1 3 D
5 1 D
4 1 D
3 1 D
2 1 D
1 1 D
6 D
5 D
4
3
2
4 D
3 D
2 D
1
– 4 –
ILX551A
Fig. 2. φCLK, VOUT Timing
t1
t2
φCLK
t3
t4
t5
VOUT
t6
Item
Symbol
Min.
0
Typ.
Max.
—
Unit
ns
φCLK pulse rise/fall time
t1, t2
—
10
50
80
75
1
φCLK pulse duty
40
50
30
60
%
φCLK – VOUT 1
φCLK – VOUT 2
t5
110
120
ns
t6
ns
1
100 × t3/(t3 + t4)
Fig. 3. φROG, φCLK Timing
φROG
t8
t9
t10
φCLK
t7
t11
Item
Symbol
Min.
500
0
Typ.
1000
10
Max.
—
Unit
ns
φROG, φCLK pulse timing
φROG pulse rise/fall time
φROG pulse period
t7, t11
t8, t10
t9
—
ns
500
1000
—
ns
– 5 –
ILX551A
Example of Representative Characteristics
Spectral sensitivity characteristics
(Standard characteristics)
1.0
0.9
Ta = 25°C
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
500
600
700
800
900
1000
Wavelength [nm]
Dark signal voltage rate vs. Ambient temperature
(Standard characteristics)
VDD1, VDD2 supply current vs. Clock frequency
(Standard characteristics)
IVDD1
IVDD2
10
5
10
5
1
1
0.5
0.5
0.1
0.1
0.1M
0
10
20
30
40
50
60
1M
5M
Ta – Ambient temperature [°C]
Clock frequency [Hz]
– 6 –
ILX551A
) D ( D N G
C N
G O R φ
C N
C N
) D ( 2 D D V
) D ( 2 D D V
C N
C N
C N
) A ( D N G
C N
C N
K L C φ
W S H S
C N
) A ( D N G
) A ( 1 D D V
) D ( 2 D D V
) D ( 2 D D V
C N
T U O V
– 7 –
ILX551A
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Cer-DIP Packages
The following points should be observed when handling and installing cer DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface
(Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
29N
29N
39N
0.9Nm
Upper ceramic layer
Lower ceramic layer
Low-melting glass
(2)
(3)
(4)
(1)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after
it has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
– 8 –
ILX551A
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
– 9 –
ILX551A
° 9 o t ° 0
5 . 0 ± 5 3 . 4
5 6 . 3
5 . 0 ± 0 . 0 1
5 . 0 ± 0 . 5
5 . 0 ± 0 . 4
– 10 –
Sony Corporation
相关型号：
©2020 ICPDF网 联系我们和版权申明