AM29F200BB-55WJK1 [SPANSION]
Flash, 128KX16, 55ns, DIE-42;
| 型号： | AM29F200BB-55WJK1 |
| 厂家： | 
SPANSION |
| 描述： | Flash, 128KX16, 55ns, DIE-42 |
| 文件： | 总10页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Am29F200B
Known Good Wafer
Data Sheet
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For More Information
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SUPPLEMENT
Am29F200B Known Good Wafer
2 Megabit (256 K x 8-Bit/128 K x 16-Bit)
CMOS 5.0 Volt-only, Boot Sector Flash Memory, Die Revision 1
Note: This supplement contains information on the Am29F200B in Known Good Wafer form. Refer to the
Am29F200B standard datasheet (publication 21526) for full electrical specifications.
■ Quality and reliability levels equivalent to
DISTINCTIVE CHARACTERISTICS
standard packaged components
■ Top or bottom boot block configurations
■ Complies with JEDEC standards for wafer
available
shipments
■ Minimum 1,000,000 write cycle guarantee
per sector
■ 20-year data retention at 125°C
■ Tested to datasheet specifications at
temperature
GENERAL DESCRIPTION
The Am29F200B in Known Good Wafer (KGW) form is
an 2 Mbit, 5.0 volt-only Flash memory. AMD defines
KGW as standard product in wafer form, tested for func-
tionality and speed. AMD KGW products have the same
reliability and quality as AMD products in packaged form.
Electrical Specifications
Refer to the Am29F200B data sheet, publication
number 21526, for full electrical specifications on the
Am29F200B in KGW form.
Publication# 30332 Rev: A Amendment/0
Issue Date: April 22, 2003
S U P P L E M E N T
PRODUCT SELECTOR GUIDE
Family Part Number
Am29F200B KGW
-55 (V
= 5.0 V ± -75 (V
5%)
= 5.0 V ±
5%)
CC
CC
Speed Option (V
= 5.0 V ± 10%)
CC
-90
90
90
35
-120
120
120
50
Max access time, ns (tACC
Max CE# access time, ns (tCE
Max OE# access time, ns (tOE
)
55
55
30
70
)
70
)
30
Note: Refer to “Test Conditions” for additional information related to speed options.
DIE PHOTOGRAPH
DIE PAD LOCATIONS
37 36
3 2 1 42 41 40 39 38
7 6 5 4
35 34
9
8
33
32
10
11
31
12
Y
X
AMD logo location
13 14 15 16 17 1819 20 21
22 23
24 25 262728 29 30
2
Am29F200B Known Good Wafer
April 22, 2003
S U P P L E M E N T
PAD DESCRIPTION
Pad locations relative to VCC
.
Pad Center (mils)
Pad Center (millimeters)
Pad
Signal
X
Y
0.00
X
Y
1
VCC
DQ4
DQ12
DQ5
DQ13
DQ6
DQ14
DQ7
DQ15/A-1
VSS
0.00
0.0000
–0.1727
–0.3251
–0.4724
–0.6223
–0.7696
–0.9220
–1.0693
–1.2192
–1.4148
–1.4605
–1.4605
–1.4503
–1.3030
–1.1659
–1.0160
–0.8788
–0.7315
–0.5918
–0.4420
–0.3048
–0.0610
0.2413
0.7696
0.9093
1.0566
1.1938
1.3437
1.4808
1.6281
1.6383
1.6383
1.6383
1.3970
1.2040
1.0541
0.9042
0.7544
0.6071
0.4572
0.3073
0.1575
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0356
–0.1651
–0.4572
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1648
–3.1725
–3.1725
–3.2664
–3.2664
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–3.1725
–0.4572
–0.1651
0.0965
0.0584
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
0.0000
2
–6.80
–12.80
–18.60
–24.50
–30.30
–36.30
–42.10
–48.00
–55.70
–57.50
–57.50
–57.10
–51.30
–45.90
–40.00
–34.60
–28.80
–23.30
–17.40
–12.00
–2.40
9.50
0.00
3
0.00
4
0.00
5
0.00
6
0.00
7
0.00
8
0.00
9
0.00
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
1.40
BYTE#
A16
–6.50
–18.00
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–124.60
–124.90
–124.90
–128.60
–128.60
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–124.90
–18.00
–6.50
3.80
A15
A14
A13
A12
A11
A10
A9
A8
WE#
RESET#
RY/BY#
A7
30.30
35.80
41.60
47.00
52.90
58.30
64.10
64.50
64.50
64.50
55.00
47.40
41.50
35.60
29.70
23.90
18.00
12.10
6.20
A6
A5
A4
A3
A2
A1
A0
CE#
VSS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
2.30
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
Note: The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
April 22, 2003
Am29F200B Known Good Wafer
3
S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29F200B
T
-75
WJ
C
1
DIE REVISION
This number refers to the specific AMD manufacturing process and product
technology reflected in this document. It is entered in the revision field of AMD
standard product nomenclature.
TEMPERATURE RANGE
C
I
E
= Commercial (0°C to +70°C)
= Industrial (–40°C to +85°C)
= Extended (–55°C to +125°C)
Contact AMD for higher temperature range devices.
PACKAGE TYPE
WJ = Wafer Jar (Contact factory for availability)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
= Top sector
= Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29F200B Known Good Wafer
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory
5.0 Volt-only Program and Erase
Valid Combinations
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
AM29F200BT-55,
AM29F200BB-55
(55 ns, VCC = 5.0 V ±5%)
AM29F200BT-75,
AM29F200BB-75
(70 ns, VCC = 5.0 V ±5%)
WJC1, WJI1, WJE1
AM29F200BT-90,
AM29F200BB-90
AM29F200BT-120,
AM29F200BB-120
4
Am29F200B Known Good Wafer
April 22, 2003
S U P P L E M E N T
WAFER JAR DIAGRAM
1
Foam Pad(s)
Wafer (1X) (circuitry face-DOWN)
Max. 25 wafers in a jar
Filter paper (1X)
Foam Pad(s)
2
Standard KGD Label
April 22, 2003
Am29F200B Known Good Wafer
5
S U P P L E M E N T
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Wafer test flow. For more detailed information, refer to
the Am29F200B product qualification database. AMD
implements quality assurance procedures throughout
the product test flow. These QA procedures also allow
AMD to produce KGW products without requiring or
implementing burn-in. In addition, an off-line qualifica-
tion maintenance program (QMP) guarantees AMD
quality standards are met on Known Good Wafer prod-
ucts.
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 1
Data Retention
Bake
24 hours at 250°C
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 2
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 3
High Temperature
Speed
Incoming Inspection
100% Visual Inspection
Wafer Pack
Packaging for Shipment
Shipment
Figure 1. AMD KGW Product Test Flow
6
Am29F200B Known Good Wafer
April 22, 2003
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
MANUFACTURING INFORMATION
Wafer Size . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mm
Active Die. . . . . . . . . . .x = 3328.8 µm; y = 3594.8 µm
. . . . . . . . . . . . . . . . . . . . x = 131 mils; y = 141.5 mils
Scribe width . . . . . . . . . . . .x = 91.2 µm; y = 225.2 µm
. . . . . . . . . . . . . . . . . . . . . x = 3.59 mils; y = 8.87 mils
Step . . . . . . . . . . . . . . . . . .x = 3.42 mm; y = 3.82 mm
. . . . . . . . . . . . . . . . . . . x = 134.6 mils; y = 150.4 mils
Wafer Thickness . . . . . . . . . . . . . . . . . .483 +/–51 µm
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia
Manufacturing ID (Top Boot). . . . . . . . . . . . . 98480AK
(Bottom Boot). . . . . . . . .98480ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Bond Pad Size . . . . . . . . . . . . . . 3.74 mils x 3.74 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 µm x 95 µm
SPECIAL HANDLING INSTRUCTIONS
Processing
Minimum pad pitch. . . . . . . . . . . . . . . . . . . . 137.8 µm
Do not expose KGW products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.42 mils
Pad Area Free of Passivation . . . . . . . . . .13.99 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
. . . . . . . . . . . . . . . . . . . Minimum thickness: 10500 Å
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded with Back-grind type finish (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
. . . . . . . . . . . . . . . . . . . Minimum thickness: 14700 Å
Ink dot height . . . . . . . . . . . . . . . . . . . . . .0.8 mils max
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20.3 µm max
Ink dot diameter . . . . . . . . . . . . . . . . . . . . .15 mils min
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 µm min
Edge die Inked . . . . . . . . . . . . . . . . . . . . . . . . . . . .Yes
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias:
Commercial, Industrial, and
Extended Temperature Range. . . . .TJ (max) = 130°C
Operating Temperature
Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
Contact AMD for higher temperature range devices.
April 22, 2003
Am29F200B Known Good Wafer
7
S U P P L E M E N T
specified location. The aforementioned provisions do
not extend the original limited warranty period of any
Die or Wafer(s) that has either been replaced by AMD.
TERMS AND CONDITIONS OF SALE FOR
AMD NON-VOLATILE MEMORY DIE
All transactions relating to unpackaged die or unpack-
aged wafer(s) under this agreement shall be subject to
AMD’s standard terms and conditions of sale, or any
revisions thereof, which revisions AMD reserves the
right to make at any time and from time to time. In the
event of conflict between the provisions of AMD’s stan-
dard terms and conditions of sale and this agreement,
the terms of this agreement shall be controlling.
THIS LIMITED WARRANTY IS EXPRESSED IN LIEU
OF ALL OTHER WARRANTIES, EXPRESSED OR
IMPLIED, INCLUDING THE IMPLIED WARRANTY OF
FITNESS FOR A PARTICULAR PURPOSE, THE
IMPLIED WARRANTY OF MERCHANTABILITY OR
NONINFRINGEMENT AND OF ALL OTHER OBLIGA-
TIONS OR LIABILITIES ON AMD's PART, AND IT
NEITHER ASSUMES NOR AUTHORIZES ANY
OTHER PERSON TO ASSUME FOR AMD ANY
OTHER LIABILITIES. THE FOREGOING CONSTI-
TUTES THE BUYER'S SOLE AND EXCLUSIVE
REMEDY FOR THE FURNISHING OF DEFECTIVE
OR NON CONFORMING KNOWN GOOD DIE OR
KNOWN GOOD WAFER(S) AND AMD SHALL NOT IN
ANY EVENT BE LIABLE FOR INCREASED MANU-
FACTURING COSTS, DOWNTIME COSTS,
DAMAGES RELATING TO BUYER'S PROCURE-
MENT OF SUBSTITUTE DIE OR WAFER(S) (i.e.,
"COST OF COVER"), LOSS OF PROFITS, REVE-
NUES OR GOODWILL, LOSS OF USE OF
ORDAMAGE TO ANY ASSOCIATED EQUIPMENT,
OR ANY OTHER INDIRECT, INCIDENTAL, SPECIAL
OR CONSEQUENTIAL DAMAGES BY REASON OF
THE FACT THAT SUCH KNOWN GOOD DIE OR
KNOWN GOOD WAFER(S) SHALL HAVE BEEN
DETERMINED TO BE DEFECTIVE OR NON CON-
FORMING.
AMD warrants its manufactured unpackaged die
whether shipped to customer in individual dice or wafer
form ("Known Good Die," "KGD", "Die," "Known Good
Wafer", "KGW", or Wafer(s)) will meet AMD's published
specifications and against defective materials or work-
manship for a period of one (1) year from date of ship-
ment.
This limited warranty does not extend beyond the first
purchaser of said Die or Wafer(s).
Buyer assumes full responsibility to ensure compliance
with the appropriate handling, assembly and pro-
cessing of KGD or KGW (including but not limited to
proper Die preparation, Die attach, backgrinding, sin-
gulation, wire bonding and related assembly and test
activities), and compliance with all guidelines set forth
in AMD's specifications for KGD or KGW, and AMD
assumes no responsibility for environmental effects on
KGD or KGW or for any activity of Buyer or a third party
that damages the Die or Wafer(s) due to improper use,
abuse, negligence, improper installation, improper
backgrinding, improper singulation, accident, loss,
damage in transit, or unauthorized repair or alteration
by a person or entity other than AMD ("Limited War-
ranty Exclusions")
Buyer agrees that it will make no warranty representa-
tions to its customers which exceed those given by
AMD to Buyer unless and until Buyer shall agree to
indemnify AMD in writing for any claims which exceed
AMD's limited warranty. Known Good Die or Known
Good Wafer(s) are not designed or authorized for use
as components in life support appliances, devices or
systems where malfunction of the Die or Wafer(s) can
reasonably be expected to result in a personal injury.
Buyer's use of Known Good Die or Known Good
Wafer(s) for use in life support applications is at Buyer's
own risk and Buyer agrees to fully indemnify AMD for
any damages resulting in such use or sale.
The liability of AMD under this limited warranty is lim-
ited, at AMD's option, solely to repair the Die or
Wafer(s), to send replacement Die or Wafer(s), or to
make an appropriate credit adjustment or refund in an
amount not to exceed the original purchase price actu-
ally paid for the Die or Wafer(s) returned to AMD, pro-
vided that: (a) AMD is promptly notified by Buyer in
writing during the applicable warranty period of any
defect or nonconformity in the Die or Wafer(s); (b)
Buyer obtains authorization from AMD to return the
defective Die or Wafer(s); (c) the defective Die or
Wafer(s) is returned to AMD by Buyer in accordance
with AMD's shipping instructions set forth below; and
(d) Buyer shows to AMD's satisfaction that such
alleged defect or nonconformity actually exists and was
not caused by any of the above-referenced Warranty
Exclusions. Buyer shall ship such defective Die or
Wafer(s) to AMD via AMD's carrier, collect. Risk of loss
will transfer to AMD when the defective Die or Wafer(s)
is provided to AMD's carrier. If Buyer fails to adhere to
these warranty returns guidelines, Buyer shall assume
all risk of loss and shall pay for all freight to AMD's
Known Good Die or Known Good Wafer are not
designed or authorized for use as components in life
support appliances, devices or systems where mal-
function of the die or wafer can reasonably be expected
to result in a personal injury. Buyer's use of Known
Good Die or Known Good Wafer for use in life support
applications is at Buyer's own risk and Buyer agrees to
fully indemnify AMD for any damages resulting in such
use or sale.
8
Am29F200B Known Good Wafer
April 22, 2003
S U P P L E M E N T
REVISION SUMMARY
Revision A (April 22, 2003)
Initial release.
Trademarks
Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
April 22, 2003
Am29F200B Known Good Wafer
9
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