AM29LV200BT-60RDRD [SPANSION]
Flash, 128KX16, 60ns, DIE-43;型号: | AM29LV200BT-60RDRD |
厂家: | SPANSION |
描述: | Flash, 128KX16, 60ns, DIE-43 |
文件: | 总11页 (文件大小:310K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SUPPLEMENT
Am29LV200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit)
CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revision 1
This product has been retired and is not recommended for designs. Please contact your Spansion representative
for alternates. Availability of this document is retained for reference and historical purposes only.
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
■ Embedded Algorithms
— 2.7 to 3.6 volt read and write operations for
battery-powered applications
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
■ Manufactured on 0.32 µm process technology
■ High performance
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
— 60R, 70, 90, 120 ns access time
■ Minimum 1,000,000 write cycle guarantee
■ Low power consumption (typical values at
per sector
5 MHz)
■ Compatibility with JEDEC standards
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 7 mA read current
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
— 15 mA program/erase current
■ Data# Polling and toggle bits
■ Flexible sector architecture
— Provides a software method of detecting program
or erase operation completion
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
seven 64 Kbyte sectors (byte mode)
■ Ready/Busy# pin (RY/BY#)
— One 8 Kword, two 4 Kword, one 16 Kword, and
seven 32 Kword sectors (word mode)
— Provides a hardware method of detecting
program or erase cycle completion
— Supports full chip erase
— Sector Protection features:
■ Erase Suspend/Erase Resume
A hardware method of locking a sector to prevent
any program or erase operations within that
sector
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
Sectors can be locked in-system or via
programming equipment
■ Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■ 20-year data retention at 125°C
■ Unlock Bypass Program Command
■ Tested to datasheet specifications at
— Reduces overall programming time when issuing
multiple program command sequences
temperature
■ Quality and reliability levels equivalent to
■ Top or Bottom boot block configuration
standard packaged components
■ 500 µm or 280 µm die thickness shipping options
Publication# 26014
Rev: A Amendment/4
Issue Date: February 24, 2009
S U P P L E M E N T
GENERAL DESCRIPTION
The Am29LV200B in Known Good Die (KGD) form is a
2 Mbit, 3.0 volt-only Flash memory. AMD defines KGD
as standard product in die form, tested for functionality
and speed. AMD KGD products have the same reliability
and quality as AMD products in packaged form.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data
or accept another command.
Am29LV200B Features
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
The Am29LV200B is an 2 Mbit, 3 volt-only Flash
memory organized as 262,144 bytes or 131,072 words.
The word-wide data (x16) appears on DQ15–DQ0; the
byte-wide (x8) data appears on DQ7–DQ0. To elimi-
nate bus contention the device has separate chip
enable (CE#), write enable (WE#) and output enable
(OE#) controls.
Hardware data protection measures include a low
V
detector that automatically inhibits write opera-
CC
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of
memory. This can be achieved in-system or via pro-
gramming equipment.
The device requires only a single 3 volt power supply
for both read and write functions. Internally generated
and regulated voltages are provided for the program
and erase operations. No V is required for program
PP
or erase operations. The device can also be pro-
grammed in standard EPROM programmers.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state-machine that con-
trols the erase and programming circuitry. Write cycles
also internally latch addresses and data needed for the
programming and erase operations. Reading data out
of the device is similar to reading from other Flash or
EPROM devices.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode. Power consumption is greatly reduced in both
these modes.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin. The Unlock Bypass mode facili-
tates faster programming times by requiring only two
write cycles to program data instead of four.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within
a sector simultaneously via Fowler-Nordheim tun-
neling. The data is programmed using hot electron injec-
tion.
Device erasure occurs by executing the erase
command sequence. This initiates the Embedded
Erase algorithm—an internal algorithm that automati-
cally preprograms the array (if it is not already pro-
grammed) before executing the erase operation.
During erase, the device automatically times the erase
pulse widths and verifies proper cell margin.
Electrical Specifications
Refer to the Am29LV200B data sheet, for full electrical
specifications on the Am29LV200B in KGD form.
2
Am29LV200B Known Good Die
February 24, 2009
S U P P L E M E N T
PRODUCT SELECTOR GUIDE
Family Part Number
Am29LV200B
70R
Regulated Voltage Range: V = 3.0–3.6 V
60R
CC
Speed Options
Full Voltage Range: V = 2.7–3.6 V
90
90
90
35
120
120
120
50
CC
Max access time, ns (t
)
60
60
30
70
70
30
ACC
Max CE# access time, ns (t
)
CE
Max OE# access time, ns (t
)
OE
DIE PHOTOGRAPH
DIE PAD LOCATIONS
9
8
7
6
5
4
3
2
1
43 42 41 40 39 38 37 36 35
10
34
11
12
33
32
AMD logo location
22
21
23
13 14 15 16 17 18 19 20
24 25 26 27 28 29 30 31
February 24, 2009
Am29LV200B Known Good Die
3
S U P P L E M E N T
PAD DESCRIPTION (RELATIVE TO DIE CENTER)
Pad Center (mils)
Pad Center (millimeters)
Pad
Signal
X
Y
X
Y
1
V
–0.90
–13.00
–18.90
–24.80
–30.70
–36.50
–42.40
–48.30
–54.20
–63.60
–63.60
–63.60
–63.30
–55.90
–50.50
–44.70
–39.30
–33.40
–28.00
–22.10
–16.60
–7.10
10.20
N/A
57.70
57.70
57.70
57.70
57.70
57.70
57.70
57.70
57.70
56.20
46.10
36.00
–54.80
–54.80
–54.80
–54.80
–54.80
–54.80
–54.60
–54.80
–54.80
–58.60
–58.60
N/A
–0.02
–0.33
–0.48
–0.63
–0.78
–0.93
–1.08
–1.23
–1.38
–1.62
–1.62
–1.62
–1.61
–1.42
–1.28
–1.14
–1.00
–0.85
–0.71
–0.56
–0.42
–0.18
0.26
1.47
CC
2
DQ4
DQ12
DQ5
1.47
3
1.47
4
1.47
5
DQ13
DQ6
1.47
6
1.47
7
DQ14
DQ7
1.47
8
1.47
9
DQ15/A–1
1.47
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
V
1.43
SS
BYTE#
1.17
A16
A15
0.91
–1.39
–1.39
–1.39
–1.39
–1.39
–1.39
–1.39
–1.39
–1.39
–1.49
–1.49
N/A
A14
A13
A12
A11
A10
A9
A8
WE#
RESET#
RY/BY#
Not Connected
A7
N/A
28.00
33.40
39.30
44.70
50.50
55.90
63.30
63.60
63.60
63.60
54.20
46.60
40.70
34.90
28.90
23.10
17.20
11.40
5.40
–54.80
–54.80
–54.80
–54.80
–54.80
–54.80
–54.80
35.80
45.90
56.00
58.60
57.70
57.70
57.70
57.70
57.70
57.70
57.70
57.70
0.71
–1.39
–1.39
–1.39
–1.39
–1.39
–1.39
–1.39
0.91
A6
0.85
A5
1.00
A4
1.14
A3
1.28
A2
1.42
A1
1.61
A0
1.62
CE#
1.62
1.17
V
1.62
1.42
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
1.38
1.49
1.18
1.47
1.03
1.47
0.89
1.47
0.73
1.47
0.59
1.47
0.44
1.47
0.29
1.47
0.14
1.47
4
Am29LV200B Known Good Die
February 24, 2009
S U P P L E M E N T
PAD DESCRIPTION (RELATIVE TO VCC
)
Pad Center (mils)
Pad Center (millimeters)
Pad
Signal
X
Y
X
Y
1
V
0.00
–12.10
–18.00
–23.90
–29.80
–35.60
–41.50
–47.40
–53.30
–62.70
–62.70
–62.70
–62.40
–55.00
–49.60
–43.80
–38.40
–32.50
–27.10
–21.20
–15.70
–6.20
11.10
N/A
0.00
0.00
0.00
CC
2
DQ4
DQ12
DQ5
0.00
–0.31
–0.46
–0.61
–0.76
–0.90
–1.05
–1.20
–1.35
–1.59
–1.59
–1.59
–1.58
–1.40
–1.26
–1.11
–0.98
–0.83
–0.69
–0.54
–0.40
–0.16
0.28
0.00
3
0.00
0.00
4
0.00
0.00
5
DQ13
DQ6
0.00
0.00
6
0.00
0.00
7
DQ14
DQ7
0.00
0.00
8
0.00
0.00
9
DQ15/A–1
0.00
0.00
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
V
–1.50
–11.60
–21.70
–112.50
–112.50
–112.50
–112.50
–112.50
–112.50
–112.30
–112.50
–112.50
–116.30
–116.30
N/A
–0.04
–0.29
–0.55
–2.86
–2.86
–2.86
–2.86
–2.86
–2.86
–2.85
–2.86
–2.86
–2.95
–2.95
N/A
SS
BYTE#
A16
A15
A14
A13
A12
A11
A10
A9
A8
WE#
RESET#
RY/BY#
Not Connected
A7
N/A
28.90
34.30
40.20
45.60
51.40
56.80
64.20
64.50
64.50
64.50
55.10
47.50
41.60
35.80
29.80
24.00
18.10
12.30
6.30
–112.50
–112.50
–112.50
–112.50
–112.50
–112.50
–112.50
–21.90
–11.80
–1.70
0.90
0.73
–2.86
–2.86
–2.86
–2.86
–2.86
–2.86
–2.86
–0.56
–0.30
–0.04
0.02
A6
0.87
A5
1.02
A4
1.16
A3
1.31
A2
1.44
A1
1.63
A0
1.64
CE#
1.64
V
1.64
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
1.40
0.00
1.21
0.00
0.00
1.06
0.00
0.00
0.91
0.00
0.00
0.76
0.00
0.00
0.61
0.00
0.00
0.46
0.00
0.00
0.31
0.00
0.00
0.16
0.00
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
February 24, 2009
Am29LV200B Known Good Die
5
S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29LV200B
T
-60
DP
C
1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
C
I
=
=
Commercial (0°C to +70°C)
Industrial (–40°C to +85°C)
Extended (–55°C to +125°C)
E
=
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP
DT
DR
DF
=
=
=
=
Waffle Pack, 500 µm thick die
245 die per 5 tray stack
Surftape™ (Tape and Reel), 500 µm thick die
2500 per 7-inch reel
Surftape™ (Tape and Reel), 280 µm thick die
2500 per 7-inch reel
Waffle Pack, 280 µm thick die
245 die per 5 tray stack
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
=
=
Top sector
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29LV200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory
3.0 Volt-only Program and Erase
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD
sales office to confirm availability of specific valid combinations and to check on newly released combinations.
Valid Combinations
AM29LV200BT-60R
AM29LV200BB-60R
AM29LV200BT-70,
AM29LV200BB-70
DRC, DRI, DFC, DFI
DPC, DPI, DTC,
AM29LV200BT-90,
AM29LV200BB-90
DTI
AM29LV200BT120,
AM29LV200BB-120
AM29LV200BT-70R
DFE, DRE, DPE, DTE
AM29LV200BB-70R
6
Am29LV200B Known Good Die
February 24, 2009
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
AMD logo location
Waffle Pack Packaging
Orientation relative to
top left corner of
Waffle Pack
cavity plate
AMD logo location
February 24, 2009
Am29LV200B Known Good Die
7
S U P P L E M E N T
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29LV200B product qualification database. AMD
implements quality assurance procedures throughout
the product test flow. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in. In addition, an off-line qualifica-
tion maintenance program (QMP) further guarantees
AMD quality standards are met on Known Good Die
products.
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 1
Data Retention
Bake
24 hours at 250°C
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 2
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 3
High Temperature
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Packaging for Shipment
Shipment
Figure 1. AMD KGD Product Test Flow
8
Am29LV200B Known Good Die
February 24, 2009
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
DC OPERATING CONDITIONS
Active Die dimensions .x = 3462.6 µm; y = 3277.8 µm
. . . . . . . . . . . . . . . . . . . x = 136.3 mils; y = 129.0 mils
V
(Supply Voltage) . . . . . . . . . . . . . . 2.7 V to 3.6 V
CC
Operating Temperature
Scribe width . . . . . . . . . . . . x = 87.4 µm; y = 232.2 µm
.. . . . . . . . . . . . . . . . . . . . . x = 3.44 mils; y = 9.03 mils
Industrial . . . . . . . . . . . . . . . . . . .–40°C to +85°C
Commercial . . . . . . . . . . . . . . . . . . .0°C to +70°C
Extended . . . . . . . . . . . . . . . . . .–55°C to +125°C
Step dimensions . . . . . . . . x = 3.56 mm; y = 3.51 mm
.. . . . . . . . . . . . . . . . . x = 139.76 mils; y = 138.19 mils
Die Thickness. . . . . . . . . . . . .500 µm = 483 +/–51 µm
.. . . . . . . . . . . . . . . . . . . . . . . 280 µm = 280 +/–15 µm
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia
Manufacturing ID (Top Boot) . . . . . . . . . . . . . 98488AK
(Bottom Boot) . . . . . . . . . . . . . . . . . . . . . . .98488ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Bond Pad Size . . . . . . . . . . . . . .115.9 µm x 115.9 µm
. . . . . . . . . . . . . . . . . . . . . . . . . . 4.69 mils x 4.69 mils
Minimum pad pitch . . . . . . . . . . . . . . . . . . . . 137.8 µm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.43 mils
Pad Area Free of Passivation . . . . . . . . . . 13.99 mils2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
. . . . . . . . . . . . . . . . . . . .Minimum thickness: 10500 Å
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded with Back-grind type finish (optional)
SPECIAL HANDLING INSTRUCTIONS
Processing
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
. . . . . . . . . . . . . . . . . . . .Minimum thickness: 14700 Å
Ink dot height . . . . . . . . . . . . . . . . . . . . . .0.8 mils max
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20.3 µm max
Ink dot diameter . . . . . . . . . . . . . . . . . . . . .15 mils min
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 µm min
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
February 24, 2009
Am29LV200B Known Good Die
9
S U P P L E M E N T
WITHOUT LIMITING THE FOREGOING, EXCEPT TO
TERMS AND CONDITIONS OF SALE FOR
AMD NON-VOLATILE MEMORY DIE
THE EXTENT THAT AMD EXPRESSLY WARRANTS
TO BUYER IN A SEPARATE AGREEMENT SIGNED
BY AMD, AMD MAKES NO WARRANTY WITH
RESPECT TO THE DIE’S PROCESSING OF DATE
DATA, AND SHALL HAVE NO LIABILITY FOR
DAMAGES OF ANY KIND, UNDER EQUITY, LAW, OR
ANY OTHER THEORY, DUE TO THE FAILURE OF
SUCH KNOWN GOOD DIE TO PROCESS ANY PAR-
TICULAR DATA CONTAINING DATES, INCLUDING
DATES IN AND AFTER THE YEAR 2000, WHETHER
OR NOT AMD RECEIVED NOTICE OF THE POSSI-
BILITY OF SUCH DAMAGES.
All transactions relating to unpackaged die under this
agreement shall be subject to AMD’s standard terms
and conditions of sale, or any revisions thereof, which
revisions AMD reserves the right to make at any time
and from time to time. In the event of conflict between
the provisions of AMD’s standard terms and conditions
of sale and this agreement, the terms of this agreement
shall be controlling.
AMD warrants unpackaged die of its manufacture
(“Known Good Die” or “Die”) against defective mate-
rials or workmanship for a period of one (1) year from
date of shipment. This warranty does not extend
beyond the first purchaser of said Die. Buyer assumes
full responsibility to ensure compliance with the
appropriate handling, assembly and processing of
Known Good Die (including but not limited to proper
Die preparation, Die attach, wire bonding and related
assembly and test activities), and compliance with all
guidelines set forth in AMD’s specifications for Known
Good Die, and AMD assumes no responsibility for envi-
ronmental effects on Known Good Die or for any
activity of Buyer or a third party that damages the Die
due to improper use, abuse, negligence, improper
installation, accident, loss, damage in transit, or unau-
thorized repair or alteration by a person or entity other
than AMD (“Warranty Exclusions”).
THIS WARRANTY IS EXPRESSED IN LIEU OF ALL
OTHER WARRANTIES, EXPRESSED OR IMPLIED,
INCLUDING THE IMPLIED WARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE, THE IMPLIED
WARRANTY OF MERCHANTABILITY AND OF ALL
OTHER OBLIGATIONS OR LIABILITIES ON AMD’s
PART, AND IT NEITHER ASSUMES NOR AUTHO-
RIZES ANY OTHER PERSON TO ASSUME FOR
AMD ANY OTHER LIABILITIES. THE FOREGOING
CONSTITUTES THE BUYER’S SOLE AND EXCLU-
SIVE REMEDY FOR THE FURNISHING OF DEFEC-
TIVE OR NON CONFORMING KNOWN GOOD DIE
AND AMD SHALL NOT IN ANY EVENT BE LIABLE
FOR INCREASED MANUFACTURING COSTS,
DOWNTIME COSTS, DAMAGES RELATING TO
BUYER’S PROCUREMENT OF SUBSTITUTE DIE
(i.e., “COST OF COVER”), LOSS OF PROFITS, REV-
ENUES OR GOODWILL, LOSS OF USE OF OR
DAMAGE TO ANY ASSOCIATED EQUIPMENT,
OR ANY OTHER INDIRECT, INCIDENTAL, SPECIAL
OR CONSEQUENTIAL DAMAGES BY REASON OF
THE FACT THAT SUCH KNOWN GOOD DIE SHALL
HAVE BEEN DETERMINED TO BE DEFECTIVE OR
NON CONFORMING.
The liability of AMD under this warranty is limited, at
AMD’s option, solely to repair the Die, to send replace-
ment Die, or to make an appropriate credit adjustment
or refund in an amount not to exceed the original pur-
chase price actually paid for the Die returned to AMD,
provided that: (a) AMD is promptly notified by Buyer in
writing during the applicable warranty period of any
defect or nonconformity in the Known Good Die; (b)
Buyer obtains authorization from AMD to return the
defective Die; (c) the defective Die is returned to AMD
by Buyer in accordance with AMD’s shipping instruc-
tions set forth below; and (d) Buyer shows to AMD’s
satisfaction that such alleged defect or nonconformity
actually exists and was not caused by any of the above-
referenced Warranty Exclusions. Buyer shall ship such
defective Die to AMD via AMD’s carrier, collect. Risk of
loss will transfer to AMD when the defective Die is pro-
vided to AMD’s carrier. If Buyer fails to adhere to these
warranty returns guidelines, Buyer shall assume all risk
of loss and shall pay for all freight to AMD’s specified
location. The aforementioned provisions do not extend
the original warranty period of any Known Good Die
that has either been repaired or replaced by AMD.
Buyer agrees that it will make no warranty representa-
tions to its customers which exceed those given by
AMD to Buyer unless and until Buyer shall agree to
indemnify AMD in writing for any claims which exceed
AMD’s warranty.
Known Good Die are not designed or authorized for
use as components in life support appliances, devices
or systems where malfunction of the Die can reason-
ably be expected to result in a personal injury. Buyer’s
use of Known Good Die for use in life support applica-
tions is at Buyer’s own risk and Buyer agrees to fully
indemnify AMD for any damages resulting in such use
or sale.
10
Am29LV200B Known Good Die
February 24, 2009
S U P P L E M E N T
REVISION SUMMARY
Revision A (February 4, 2002)
Initial release.
Revision A+2 (November 18, 2003)
Global
Added Extended Temperature and 280 µm die thick-
ness shipping option.
Revision A+1 (December 9, 2002)
Global
Revision A+3 (July 31, 2007)
Ordering Information
Added the 60R, 70, 90, and 120 speeds.
Valid Combinations
Removed the DW package type option.
Added package types to table.
Packaging Information
Ordering Information
Removed all references to Gel-Pak
Removed extended temperature range.
Revision A4 (February 24, 2009)
Global
Packaging Information
Added gelpack and waffle pack photo to section.
Added obsolescence information.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2002–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered
trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks
of their respective companies.
Copyright © 2006–2009 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™,
ORNAND2™, HD-SIM™, EcoRAM™ and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.
February 24, 2009
Am29LV200B Known Good Die
11
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