S71GL064A0ABFW0B3 [SPANSION]
Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56;
| 型号： | S71GL064A0ABFW0B3 |
| 厂家： | 
SPANSION |
| 描述： | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 静态存储器 内存集成电路 |
| 文件： | 总11页 (文件大小：487K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S71GL064A based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and
RAM 64 Megabit (4 M x 16-bit) CMOS 3.0 Volt-only Page
Mode Flash Memory and 16/8 Megabit (1M/512K x 16-bit)
Pseudo Static RAM / Static RAM
S71GL064A based MCPs Cover Sheet
Data Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S71GL064A_00
Revision A
Amendment 4
Issue Date September 6, 2007
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S71GL064A based MCPs
S71GL064A_00_A4 September 6, 2007
S71GL064A based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and
RAM 64 Megabit (4 M x 16-bit) CMOS 3.0 Volt-only Page
Mode Flash Memory and 16/8 Megabit (1M/512K x 16-bit)
Pseudo Static RAM / Static RAM
Data Sheet
Distinctive Characteristics
Packages
MCP Features
Power supply voltage of 2.7 to 3.1 volt
– 7 x 9 x 1.2 mm 56 ball FBGA (TLC056)
Operating Temperature
High performance
– –25°C to +85°C
– 100 ns access time (100 ns Flash, 70 ns pSRAM/SRAM)
– 25 ns page read times
General Description
The S71GL064A product series consists of S29GL064 Flash memory with pSRAM and SRAM combinations defined as:
Flash Memory Density
64Mb
8 Mb
16 Mb
32 Mb
S71GL064A80 (1) / S71GL064A08 (1)
S71GL064AA0 / S71GL064A0A (1)
S71GL064AB0
pSRAM / SRAM Density
Note
1. These MCPs are no longer offered, and customers are encouraged to migrate to the S71GL-N MCP product line. Please contact your local Spansion sales
representative for more details.
For detailed specifications, please refer to the individual data sheets.
Document
S29GL-A
Publication Identification Number (PID)
S29GL-A_00
8 Mb pSRAM Type 1
16 Mb pSRAM Type 7
32 Mb pSRAM Type 8
pSRAM_12 (2)
pSRAM_13
pSRAM_31
Notes
1. These MCPs are no longer offered, and customers are encouraged to migrate to the S71GL-N MCP product line. Please contact your local Spansion sales
representative for more details.
2. This pSRAM is no longer valid as the base MCP is not being offered as per Note 1.
Publication Number S71GL064A_00
Revision A
Amendment 4
Issue Date September 6, 2007
D a t a S h e e t
1. Product Selector Guide
1.1
64 Mb Flash Memory
Flash Access time
(ns)
(p)SRAM
density
(p)SRAM Access time
Device-Model# (Note)
(p)SRAM type Package
(ns)
S71GL064A80-0K
S71GL064A80-0P
S71GL064A08-0B
S71GL064A08-0F
S71GL064AA0-0K
S71GL064AA0-0P
S71GL064AA0-0U
S71GL064AA0-0Z
S71GL064A0A-0B
S71GL064A0A-0F
S71GL064AB0-0U
S71GL064AB0-0Z
Notes
8 M pSRAM
8 M SRAM
pSRAM1
SRAM1
pSRAM1
TLC056
pSRAM7
100
16 M pSRAM
70
16 M SRAM
SRAM1
32 M pSRAM
pSRAM 8
1. Please see the valid combinations table for the model# description.
2. Shaded products indicate MCPs that are no longer offered.
4
S71GL064A based MCPs
S71GL064A_00_A4 September 6, 2007
D a t a S h e e t
2. MCP Block Diagram
VCC
f
VCC
CE1#f
WP#/ACC
RESET#
Flash-only Address
Flash
Shared Address
OE#
WE#
RY/BY#
DQ15 to DQ0
VCCS
VCC
pSRAM/SRAM
IO15-IO0
CE1#s
UB#
CE#
UB#
LB#
LB#
CE2s
September 6, 2007 S71GL064A_00_A4
S71GL064A based MCPs
5
D a t a S h e e t
3. Connection Diagram (S71GL064A)
56-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
Legend
A2
A7
A3
LB#
B3
A4
WP/ACC
B4
A5
WE#
B5
A6
A8
A7
A11
B7
B1
A3
B2
B6
B8
A15
C8
Shared
(Note 1)
A6
UB#
C3
RST#f
C4
CE2s
C5
A19
C6
A12
C7
C1
C2
A2
A5
A18
D3
RY/BY#
A20
A9
A13
D7
A21
D8
Flash only
RAM only
D1
D2
D6
A1
A4
A17
E3
A10
E6
A14
E7
RFU
E8
E1
E2
A0
VSS
F2
DQ1
F3
DQ6
F6
RFU
F7
A16
F8
F1
F4
DQ3
G4
F5
DQ4
G5
Reserved for
Future Use
CE1#f
G1
OE#
G2
DQ0
H2
DQ9
G3
DQ13
G6
DQ15
G7
RFU
G8
CE1#s
DQ10
H3
VCCf
H4
VCCs
H5
DQ12
H6
DQ7
H7
VSS
DQ8
DQ2
DQ11
RFU
DQ5
DQ14
Note
1. May be shared depending on density.
- A19 is shared for the 16M pSRAM and above configurations.
- A18 is shared for the 8M (p)SRAM and above configurations.
MCP
Flash-only Addresses
A21
Shared Addresses
A20-A0
S71GL064AB0
S71GL064AA0
S71GL064A0A
S71GL064A80
S71GL064A08
A21-A20
A19-A0
A21-A20
A19-A0
A21-A19
A18-A0
A21-A19
A18-A0
3.1
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
6
S71GL064A based MCPs
S71GL064A_00_A4 September 6, 2007
D a t a S h e e t
4. Pin Description
Pin
A21–A0
DQ15–DQ0
CE1#f
Description
22 Address Inputs (Common and Flash only)
16 Data Inputs/Outputs (Common)
Chip Enable (Flash)
CE1#s
CE2s
Chip Enable 1 (pSRAM/SRAM)
Chip Enable 2 (pSRAM/SRAM)
Output Enable (Common)
OE#
WE#
Write Enable (Common)
RY/BY#
UB#
Ready/Busy Output (Flash 1)
Upper Byte Control (pSRAM/SRAM)
Lower Byte Control (pSRAM/SRAM)
Hardware Reset Pin, Active Low (Flash)
Hardware Write Protect/Acceleration Pin (Flash)
LB#
RESET#
WP#/ACC
Flash 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage
supply tolerances)
VCC
f
VCCS
VSS
NC
pSRAM/SRAM Power Supply
Device Ground (Common)
Pin Not Connected Internally
5. Logic Symbol
22
A21–A0
16
DQ15–DQ0
CE1#f
CE1#s
R Y/BY#
CE2s
OE#
WE#
WP#/ACC
RESET#
UB#
LB#
September 6, 2007 S71GL064A_00_A4
S71GL064A based MCPs
7
D a t a S h e e t
6. Ordering Information
The order number is formed by a valid combinations of the following:
S71GL
064
A
B0
BF
W
0
Z
0
PACKING TYPE
0
2
3
= Tray
= 7” Tape and Reel
= 13” Tape and Reel
MODEL NUMBER
See the Valid Combinations table.
PACKAGE MODIFIER
0
= 7 x 9 mm, 1.2 mm height, 56 balls (TLC056)
TEMPERATURE RANGE
= Wireless (-25°C to +85°C)
W
PACKAGE TYPE
BF = Fine-pitch BGA Lead (Pb)-free package
pSRAM / SRAM DENSITY
B0 = 32 Mb pSRAM
A0 = 16 Mb pSRAM
80 = 8 Mb pSRAM
PROCESS TECHNOLOGY
A
= 200 nm, MirrorBit Technology
FLASH DENSITY
064= 64Mb
PRODUCT FAMILY
S71GL Multi-chip Product (MCP)
3.0-volt Page Mode Flash Memory and RAM
S71GL064A Valid Combinations
(p)SRAM Type/
Access Time
(ns)
Speed Options (ns)/Boot
Package
Marking
Base Ordering
Part Number
Package &
PackageModifier/Model
Number
Sector Option
Packing Type
Temperature
S71GL064A80
S71GL064A80
S71GL064A08
S71GL064A08
S71GL064AA0
S71GL064AA0
S71GL064AA0
S71GL064AA0
S71GL064A0A
S71GL064A0A
S71GL064AB0
S71GL064AB0
0K
0P
0B
0F
0K
0P
0U
0Z
0B
0F
0U
0Z
100 / Bottom Boot Sector
100 / Top Boot Sector
100 / Bottom Boot Sector
100 / Top Boot Sector
100 / Bottom Boot Sector
100 / Top Boot Sector
100 / Bottom Boot Sector
100 / Top Boot Sector
100 / Bottom Boot Sector
100 / Top Boot Sector
100 / Bottom Boot Sector
100 / Top Boot Sector
pSRAM1/ 70
SRAM1 / 70
pSRAM1/ 70
pSRAM7 / 70
SRAM1 / 70
pSRAM8 / 70
BFW
0, 2, 3 (Note 1)
TLC056
Note
1. Type 0 is standard. Specify other options as required.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
8
S71GL064A based MCPs
S71GL064A_00_A4 September 6, 2007
D a t a S h e e t
7. Physical Dimensions
7.1
TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package
A
D1
D
eD
0.15
(2X)
C
8
7
6
5
4
3
2
1
SE
7
E
B
E1
eE
H
G
F
E
D
C
B
A
INDEX MARK
10
PIN A1
CORNER
PIN A1
CORNER
7
SD
0.15
(2X)
C
TOP VIEW
BOTTOM VIEW
0.20
0.08
C
C
A2
A
C
A1
SIDE VIEW
6
56X
b
0.15
M
C
C
A B
0.08
M
NOTES:
PACKAGE
TLC 056
N/A
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
JEDEC
2. ALL DIMENSIONS ARE IN MILLIMETERS.
D x E
9.00 mm x 7.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL
MIN
---
NOM
---
MAX
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
1.20
---
PROFILE
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
0.20
0.81
---
BALL HEIGHT
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
A2
---
0.97
BODY THICKNESS
BODY SIZE
D
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
8
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
E
BODY SIZE
D1
E1
MATRIX FOOTPRINT
MATRIX FOOTPRINT
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
MD
ME
n
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
8
56
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
φb
0.35
0.40
0.45
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
eE
0.80 BSC.
0.80 BSC
0.40 BSC.
BALL PITCH
eD
SD / SE
BALL PITCH
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8
DEPOPULATED SOLDER BALLS
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3348 \ 16-038.22a
September 6, 2007 S71GL064A_00_A4
S71GL064A based MCPs
9
D a t a S h e e t
8. Revision History
Section
Description
Revision A (October 28, 2004)
Initial release.
Revision A1 (December 7, 2004)
Global
Access speed updated.
Control signals updated.
Descriptions updated.
MCP Block Diagram
Pin Description
Ordering Information
Valid Combinations table
Revision A2 (February 8, 2005)
pSRAM Type 7
Package Modifiers and pSRAM densities updated.
Speed options updated.
Entire section updated.
Revision A3 (February 2, 2007)
Global
Modularized format
Global
Added the 32Mb pSRAM Type 8
Revision A4 (September 6, 2007)
Removed Industrial temperature ordering option
Global
Noted obsolescence for all listed products in this document except the S71GL064AA0 and
S71GL064AB0
10
S71GL064A based MCPs
S71GL064A_00_A4 September 6, 2007
D a t a S h e e t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2004-2007 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, HD-SIM™
and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes
only and may be trademarks of their respective owners.
September 6, 2007 S71GL064A_00_A4
S71GL064A based MCPs
11
相关型号：
S71GL064A0ABFW0F0
Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
SPANSION
S71GL064A0ABFW0F2
Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
SPANSION
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