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元器件品牌
S71WS064JC0BFW2Y0
[SPANSION]
Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品（ MCP ）
元器件型号：
S71WS064JC0BFW2Y0
生产厂家：
SPANSION
描述和应用：
Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品（ MCP ）
PDF文件：
总186页 (文件大小：4364K)
下载文档：
下载PDF数据表文档文件
型号参数：S71WS064JC0BFW2Y0参数
查看货源
S71WS064JC0BFW2Y2
Stacked Multi-Chip Product (MCP)
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S71WS064JC0BFW2Y3
Stacked Multi-Chip Product (MCP)
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S71WS064JC0BFWAY0
Stacked Multi-Chip Product (MCP)
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S71WS064JC0BFWAY2
Stacked Multi-Chip Product (MCP)
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S71WS064JC0BFWAY3
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S71WS064JC0BFWTY0
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Stacked Multi-Chip Product (MCP)
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S71WS064JC0BFWTY3
Stacked Multi-Chip Product (MCP)
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S71WS128JA0
Stacked Multi-Chip Product (MCP)
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S71WS128JA0-AY
Stacked Multi-Chip Product (MCP)
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S71WS128JA0BAW2Y0
Stacked Multi-Chip Product (MCP)
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S71WS128JA0BAW2Y2
Stacked Multi-Chip Product (MCP)
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S71WS128JA0BAW2Y3
Stacked Multi-Chip Product (MCP)
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S71WS128JA0BAWAY0
Stacked Multi-Chip Product (MCP)
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S71WS128JA0BAWAY0
Memory Circuit, 8MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, FBGA-84
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