S71WS128PB0HH3RL3 [SPANSION]
Flash, 8MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84;
| 型号： | S71WS128PB0HH3RL3 |
| 厂家： | 
SPANSION |
| 描述： | Flash, 8MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84 静态存储器 内存集成电路 |
| 文件： | 总11页 (文件大小：307K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S71WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode
Flash Memory with CellularRAM
Data Sheet
S71WS-P based MCP Products Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S71WS-P_00
Revision A
Amendment 16
Issue Date November 11, 2010
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S71WS-P based MCP Products
S71WS-P_00_A16 November 11, 2010
S71WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode
Flash Memory with CellularRAM
Data Sheet
Features
Power supply voltage of 1.7 to 1.95V
Flash access time: 80 ns, 20 ns
pSRAM burst frequency: 66 MHz, 80 MHz, 104 MHz
Package:
– 8.0 x 11.6 mm MCP
Operating Temperature
– –25°C to +85°C (wireless)
Flash burst frequencies: 66 MHz, 80 MHz, 104 MHz
pSRAM Access time: 70 ns, 20 ns
The S71WS series is a product line of stacked packages and consists of:
One S29WS-P NOR flash memory die
CellularRAM die
The products covered by this document are listed in the table below.
CellularRAM Density (Mb)
Device
32 Mb
64 Mb
128 Mb
S29WS512P
S29WS256P
S29WS128P
S71WS512PD0
S71WS256PC0
S71WS128PB0
Note:
For a full list of OPNs, please contact the local sales representative or refer to the Ordering Information valid combinations tables.
For detailed specifications, please refer to the individual data sheets.
Document
Publication Identification Number (PID)
S29WS-P_00
S29WS-P
128M CellularRAM Type 5
CustComspec_00
64M CellularRAM PN: SWM064D133S1R
32M CellularRAM PN: SWM032D133S1R
SWM064D133S1R
SWM032D133S1R
Publication Number S71WS-P_00
Revision A
Amendment 16
Issue Date November 11, 2010
D a t a S h e e t
1. Product Selector Guide
Model
Number
Flash Density
(Mb)
CellularRAM
Density (Mb)
Flash Speed
(MHz)
CellularRAM
Speed (MHz)
Device
CellularRAM Supplier
Package
S71WS512PD0HH3
S71WS512PD0HH3
S71WS512PD0HH3
S71WS256PC0HH3
S71WS256PC0HH3
S71WS128PB0HH3
S71WS128PB0HH3
S71WS128PB0HH3
YL
YR
YV
YL
YR
RL
RR
RV
104
80
512
256
128
128
64
Type 5
66
104
80
84 ball MCP
8x11.6x1.2 mm
104
SWM064D133S1R
SWM032D133S1R
104
80
32
66
2. MCP Block Diagram
A0-Amax
AFlash
A0-Amax
AFlash
RDY
RDY
DQ0-DQ15
DQ0-DQ15
WS-P
Flash
Memory
CLK
CLK
AVD#
CE#
OE#
RESET#
ACC
AVD#
F-CE#
OE#
F-RST#
F-ACC
F-WP#
F-WE#
VSS
VSS
WP#
WE#
VCC
F-VCC
VCCQ
F-VCCQ
A0-Amax
WAIT
DQ0-DQ15
CLK
AVD#
CE#
OE#
R-CE#
pSRAM
Memory
R-LB#
R-UB#
LB#
UB#
WE#
CRE
R-CRE
VSS
VCC
R-VCC
VCCQ
4
S71WS-P based MCP Products
S71WS-P_00_A16 November 11, 2010
D a t a S h e e t
3. Connection Diagrams
1
2
3
4
5
6
7
8
9
10
A
DNU
DNU
B
C
D
E
F
AVD#
F-WP#
A3
VSS
A7
CLK
RFU
F-VCC
WE#
RFU
RFU
A8
RFU
A11
RFU
RFU
A15
A21
A22
A16
R-CRE
VSS
Legend
R-LB#
F-ACC
Reserved for
Future Use
A6
R-UB# F-RST#
A19
A9
A12
NOR Flash Only
pSRAM Only
A2
A5
A18
A17
DQ1
DQ9
DQ10
DQ2
VSS
RDY
RFU
A20
A23
RFU
A13
A1
A4
A10
DQ6
DQ13
DQ12
DQ5
RFU
A14
G
Flash & pSRAM
Shared Only
A0
VSS
OE#
DQ0
DQ8
RFU
RFU
A24
H
J
F-CE#
R-CE#
RFU
RFU
DQ3
DQ4
R-VCC
RFU
DQ15
DQ7
Do Not Use
F-VCC
DQ11
F-VCC
K
L
DQ14
F-VCCQ
RFU
DNU
RFU
M
DNU
DNU
Note:
1.
V
pins must ramp simultaneously.
CC
MCP
Flash-only Addresses
A24-A23
Shared Addresses
A22-A0
S71WS512PD0
S71WS256PC0
S71WS128PB0
A23-A22
A21-A0
A22-A21
A20-A0
3.1
3.2
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Look-ahead Ballout for Future Designs
Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note
(publication number: Design_Scalable_Wireless). Contact your local Spansion sales representative for more
details.
November 11, 2010 S71WS-P_00_A16
S71WS-P based MCP Products
5
D a t a S h e e t
3.3
NOR Flash and pSRAM Input/Output Descriptions
Signal
Amax-A0
DQ15-DQ0
F-CE#
Description
Flash
pSRAM
NOR Flash Address inputs
Flash Data input/output
X
X
X
X
X
X
X
X
X
X
NOR Flash Chip-enable input #1. Asynchronous relative to CLK for Burst Mode.
Output Enable input. Asynchronous relative to CLK for Burst mode.
Write Enable input.
OE#
X
X
WE#
F-V
NOR Flash device power supply (1.7 V - 1.95 V).
Input/Output Buffer power supply.
CC
CCQ
SS
F-V
V
Ground
X
RFU
Reserved for Future Use. No device internal signal is currently connected to the package
connector but there is potential future use for the connector for a signal. It is recommended
to not use RFU connectors for PCB routing channels so that the PCB may take advantage
of future enhanced features in compatible footprint devices.
RDY
CLK
Flash ready output. Indicates the status of the Burst read. V = data valid. The Flash RDY
OL
pin is shared with the WAIT pin of the pSRAM.
X
X
X
X
NOR Flash Clock, shared with CLK of burst-mode pSRAM.. The first rising edge of CLK in
conjunction with AVD# low latches the address input and activates burst mode operation.
After the initial word is output, subsequent rising edges of CLK increment the internal
address counter. CLK should remain low during asynchronous access.
AVD#
NOR Flash Address Valid input. Shared with AVD# of burst-mode pSRAM. Indicates to
device that the valid address is present on the address inputs.
V
= for asynchronous mode, indicates valid address; for burst mode, causes starting
X
X
IL
address to be latched on rising edge of CLK.
= device ignores address inputs
V
IH
F-RST#
F-WP#
NOR Flash hardware reset input. V = device resets and returns to reading array data
X
X
IL
NOR Flash hardware write protect input. V = disables program and erase functions in the
IL
four outermost sectors.
F-ACC
NOR Flash accelerated input. At V , accelerates programming; automatically places
HH
device in unlock bypass mode. At V , disables all program and erase functions. Should be
X
IL
at V for all other conditions.
IH
R-CE#
R-CRE
R-VCC
R-UB#
R-LB#
DNU
Chip-enable input for pSRAM
X
X
X
X
X
Control Register Enable (pSRAM). For CellularRAM only.
pSRAM Power Supply
Upper Byte Control (pSRAM)
Lower Byte Control (pSRAM)
Do Not Use. A device internal signal may be connected to the package connector. The
connection may be used by Spansion for test or other purposes and is not intended for
connection to any host system signal. Any DNU signal related function will be inactive
when the signal is at V . The signal has an internal pull-down resistor and may be left
IL
unconnected in the host system or may be tied to V . Do not use these connections for
SS
PCB signal routing channels. Do not connect any host system signal to these connections.
Note: Some customers prefer being able to tie DNU signals to V on the PCB.
SS
6
S71WS-P based MCP Products
S71WS-P_00_A16 November 11, 2010
D a t a S h e e t
4. Ordering Information
The order number is formed by a valid combinations of the following:
S71WS
256
P
C0
H
H
3
YL
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to Product Selector Guide on page 4
PACKAGE DESCRIPTOR
3 = 84-ball Fine-pitch BGA, 11.6 mm x 8 mm
MATERIAL SET
H = Low-Halogen, Pb-free
PACKAGE TYPE
H = 1.2 mm MCP FBGA
CellularRAM DENSITY
D0 = 128 Mb
C0 = 64 Mb
B0 = 32 Mb
PROCESS TECHNOLOGY
P = 90 nm, MirrorBit® Technology
CODE FLASH DENSITY
512 = 512 Mb
256 = 256 Mb
128 = 128 Mb
PRODUCT FAMILY
S71WS Stacked Products (MCP)
1.8 V NOR Flash with pSRAM
4.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Valid Combination
Package
Code Flash
Denisty (Mb) Technology
Process
CellularRAM
Density
Product Family
Type /
Material
Model Number Combo
Packing Type
128
B0
C0
D0
HH3
HH3
HH3
RL, RR, RV
YL, YR
S71WS
256
512
P
0, 2, 3 (Note 1)
YL, YR, YV
Notes:
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading S and packing type designator from ordering part number.
November 11, 2010 S71WS-P_00_A16
S71WS-P based MCP Products
7
D a t a S h e e t
5. Physical Dimensions
6. TLA084— 84-ball Fine Pitch Ball Grid Array (FBGA) 8 x 11.6 mm Package
A
D1
D
eD
0.15
(2X)
C
10
9
8
SE
7
7
6
E
B
E1
5
4
3
2
1
eE
J
H
G
F
E
D
C
B
A
M
L K
INDEX MARK
10
PIN A1
CORNER
PIN A1
CORNER
7
SD
0.15
(2X)
C
TOP VIEW
BOTTOM VIEW
0.20
C
C
A2
A
0.08
C
A1
SIDE VIEW
6
84X
b
0.15
0.08
M
C
C
A
B
M
NOTES:
PACKAGE
JEDEC
TLA 084
N/A
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
D x E
11.60 mm x 8.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL
MIN
---
NOM
---
MAX
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
1.20
---
PROFILE
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
0.17
0.81
---
BALL HEIGHT
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
A2
---
0.97
BODY THICKNESS
BODY SIZE
D
11.60 BSC.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
E
BODY SIZE
D1
MATRIX FOOTPRINT
MATRIX FOOTPRINT
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
E1
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
MD
ME
n
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
10
84
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
Ø b
eE
0.35
0.40
0.45
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
0.80 BSC.
0.80 BSC
0.40 BSC.
BALL PITCH
eD
BALL PITCH
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
SD / SE
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
B1,B10,C1,C10,D1,D10,
E1,E10,F1,F10,G1,G10,
H1,H10,J1,J10,K1,K10,L1,L10,
M2,M3,M4,M5,M6,M7,M8,M9
DEPOPULATED SOLDER BALLS
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3372-2 \ 16-038.22a
8
S71WS-P based MCP Products
S71WS-P_00_A16 November 11, 2010
D a t a S h e e t
7. Revision History
7.1
7.2
7.3
7.4
Revision A (February 21, 2006)
Initial release.
Revision A1 (April 12, 2006)
Added the S71WS512PC0
Revision A2 (August 21, 2006)
Added the S71WS512PD0 108MHz OPN
Revision A3 (November 7, 2006)
Added the S71WS256PD0 MCP
Added the S71WS256PC0 MCP
7.5
Revision A4 (December 8, 2006)
Added new CellularRAM Type 3
Revised Valid Combination table
Revised Product Selector Guide
7.6
7.7
7.8
7.9
Revision A5 (January 11, 2007)
Added S71WS128PC0 MCP offering
Revision A6 (February 5, 2007)
Added the S71WS512PD0JF4 OPN
Revision A7 (March 27, 2007)
Added the S71WS512PD0HF3SR OPN
Revision A8 (July 30, 2007)
Added 80 MHz S71WS128PC0 to Valid Combinations
7.10 Revision A9 (September 4, 2007)
Added 54 MHz and Asynchronous S71WS512PC0 MCP
Revised Valid Combinations
7.11 Revision A10 (October 19, 2007)
Add 104 MHz, 80 Mhz and 66 MHz S71WS256PC, S71WS256PD and S71WS128PC MCP products
Removed the S71WS512PD0JF MCP
November 11, 2010 S71WS-P_00_A16
S71WS-P based MCP Products
9
D a t a S h e e t
7.12 Revision A11 (March 14, 2008)
Added package TSB084
Added OPNs S71WS128PB0HF3SR/SV
Added low-Halogen options for S71WS128PB0, S71WS128PC0, S71WS256PC0, S71WS256PD0, and
S71WS512PD0
7.13 Revision A12 (April 8, 2008)
Added 64M CellularRAM Type 2
Updated 128M CellularRAM Type 2 PID
Removed 128M/64M CellularRAM Type 3 OPNs and PIDs
7.14 Revision A13 (June 13, 2008)
Added CellularRAM Type 3 and associated OPNs
Added CellularRAM PN: SWM128D104R1R and associated OPNs
Changed Flash Page Access time to 20 ns
In Features, changed max Flash burst frequency from 108 MHz to 104 MHz
Removed OPNs S71WS512PD0HH3HL, S71WS256PD0HH3HL, S71WS256PD0HH3HR
7.15 Revision A14 (May 7, 2010)
Added MCP OPNs S71WS256PC0HH3YR0/L0 and CellularRAM OPN SWM064D133S1R
7.16 Revision A15 (June 30, 2010)
Added MCP OPNs S71WS128PB0HH3RL0/RR0/RV0 for new 32 Mb CellularRAM OPN SWM032D133S1R
7.17 Revision A16 (November 11, 2010)
Removed all OPNs except S71WS512PD0HH3YL/YR/YV, S71WS256PC0HH3YR/YL and
S71WS128PB0HH3RL/RR/RV
Removed TSB084 drawing
10
S71WS-P based MCP Products
S71WS-P_00_A16 November 11, 2010
D a t a S h e e t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright ©2006- 2010 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™
and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.
November 11, 2010 S71WS-P_00_A16
S71WS-P based MCP Products
11
相关型号：
S71WS128PB0HH3RR0
Flash, 8MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84
SPANSION
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Flash, 8MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.2 MM HEIGHT, HALOGEN AND LEAD FREE, FBGA-84
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S71WS128PB0HH3RV0
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S71WS128PB0HH3RV3
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SPANSION
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