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S71WS256NC0BFWAP3 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS256NC0BFWAP3
型号: S71WS256NC0BFWAP3
厂家: SPANSION    SPANSION
描述:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

文件: 总13页 (文件大小:334K)
中文:  中文翻译
下载:  下载PDF数据表文档文件

相关型号:

S71WS256NC0BFWAT2

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAU

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAY0

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAY2

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAY3

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWAZ0

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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1 SPANSION

S71WS256NC0BFWAZ2

Memory Circuit, 16MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS256NC0BFWE20

Stacked Multi-Chip Product (MCP)

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23 SPANSION

S71WS256NC0BFWE22

Stacked Multi-Chip Product (MCP)

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14 SPANSION

S71WS256NC0BFWE23

Stacked Multi-Chip Product (MCP)

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28 SPANSION

S71WS256NC0BFWE30

Stacked Multi-Chip Product (MCP)

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29 SPANSION

S71WS256NC0BFWE32

Stacked Multi-Chip Product (MCP)

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28 SPANSION

S71WS256NC0BFWE33

Stacked Multi-Chip Product (MCP)

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29 SPANSION

S71WS256NC0BFWE60

Stacked Multi-Chip Product (MCP)

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15 SPANSION

S71WS256NC0BFWE62

Stacked Multi-Chip Product (MCP)

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21 SPANSION

S71WS256NC0BFWE63

Stacked Multi-Chip Product (MCP)

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21 SPANSION

S71WS256NC0BFWE70

Stacked Multi-Chip Product (MCP)

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29 SPANSION

S71WS256NC0BFWE72

Stacked Multi-Chip Product (MCP)

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28 SPANSION

S71WS256NC0BFWE73

Stacked Multi-Chip Product (MCP)

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36 SPANSION

S71WS256NC0BFWEJ0

Stacked Multi-Chip Product (MCP)

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8 SPANSION