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元器件品牌
S71WS256NC0BFWYJ3
[SPANSION]
Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品（ MCP ）
元器件型号：
S71WS256NC0BFWYJ3
生产厂家：
SPANSION
描述和应用：
Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品（ MCP ）
PDF文件：
总13页 (文件大小：334K)
下载文档：
下载PDF数据表文档文件
型号参数：S71WS256NC0BFWYJ3参数
查看货源
S71WS256NC0BFWYK0
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYK2
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYK3
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYN0
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYN2
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYN3
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYP0
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYP2
Stacked Multi-Chip Product (MCP)
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S71WS256NC0BFWYP3
Stacked Multi-Chip Product (MCP)
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S71WS256ND0
Stacked Multi-Chip Product (MCP)
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S71WS256ND0
Stacked Multi-Chip Product (MCP)
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S71WS256ND0BAIEK2
Memory Circuit, 16MX16, CMOS, PBGA84, 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84
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S71WS256ND0BAIEP2
Memory Circuit, 16MX16, CMOS, PBGA84, 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84
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S71WS256ND0BAWA20
Stacked Multi-Chip Product (MCP)
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S71WS256ND0BAWA22
Stacked Multi-Chip Product (MCP)
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