S71WS256PC0JF3HL3 [SPANSION]

1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM; 1.8伏特，只有X16同步读/写，突发模式闪存的CellularRAM


型号：	S71WS256PC0JF3HL3
厂家：	SPANSION
描述：	1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM 1.8伏特，只有X16同步读/写，突发模式闪存的CellularRAM 闪存
文件：	总10页 (文件大小：274K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

S71WS-P based MCP Products

1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode

Flash Memory with CellularRAM

S71WS-P based MCP Products Cover Sheet

Data Sheet (Advance Information)

Notice to Readers: This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

Publication Number S71WS-P_00 Revision A Amendment 2 Issue Date August 21, 2006

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this

proposed product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V_IOrange. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.

S71WS-P based MCP Products

S71WS-P_00_A2 August 21, 2006

S71WS-P based MCP Products

1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode

Flash Memory with CellularRAM

Data Sheet (Advance Information)

Features

Power supply voltage of 1.7 to 1.95V

Flash access time: 80 ns, 25 ns

pSRAM burst frequency: 66 MHz, 80 MHz, 104 MHz

Package:

– 8.0 x 11.6 mm MCP

Flash burst frequencies: 66 MHz, 80 MHz, 108 MHz

pSRAM Access time: 70 ns, 20 ns

Operating Temperature

– –25°C to +85°C (wireless)

The S71WS series is a product line of stacked packages and consists of:

One or two S29WS-P NOR flash memory die

CellularRAM die

The products covered by this document are listed in the table below.

CellularRAM Density (Mb)

Device

64 Mb

128 Mb

S29WS512P

S71WS512PC0

S71WS512PD0

Note:

For a full list of OPNs, please contact the local sales representative or refer to the Ordering Information valid combinations tables.

For detailed specifications, please refer to the individual data sheets.

Document

S29WS-P

Publication Identification Number (PID)

S29WS-P_00

Cellram_04

Cellram_07

128 M CellularRAM Type 2

64 M CellularRAM Type 2

Publication Number S71WS-P_00 Revision A Amendment 2 Issue Date August 21, 2006

This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design

in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

1. Product Selector Guide

Model

Number

Flash

CellularRAM Flash Speed

CellularRAM

Speed (MHz)

CellularRAM

Supplier

Device

Density (Mb) Density (Mb)

(MHz)

Package

S71WS512PD0HF3

S71WS512PC0HF3

S71WS512PD0HF3

128

104

MCP

8 x 11.6 mm

512

Type 2

128

108

2. MCP Block Diagram

A0-Amax

AFlash

A0-Amax

AFlash

RDY

DQ0-DQ15

WS-P

Flash

Memory

CLK

AVD#

CE#

OE#

RESET#

ACC

AVD#

F-CE#

OE#

F-RST#

F-ACC

F-WP#

F-WE#

VSS

WP#

WE#

VCC

F-VCC

VCCQ

F-VCCQ

A0-Amax

WAIT#

DQ0-DQ15

CLK

AVD#

CE#

OE#

R-CE#

pSRAM

Memory

R-LB#

R-UB#

LB#

UB#

WE#

CRE

R-CRE

VSS

VCC

R-VCC

VCCQ

R-VCCQ

S71WS-P based MCP Products

S71WS-P_00_A2 August 21, 2006

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

3. Connection Diagrams

DNU

AVD#

F-WP#

VSS

CLK

RFU

F-VCC

WE#

RFU

A11

RFU

A15

A21

A22

A16

R-CRE

VSS

Legend

R-LB#

F-ACC

Reserved for

Future Use

R-UB# F-RST#

A19

A12

NOR Flash Only

pSRAM Only

A18

A17

DQ1

DQ9

DQ10

DQ2

VSS

RDY

RFU

A20

A23

RFU

A13

A10

DQ6

DQ13

DQ12

DQ5

RFU

A14

Flash & pSRAM

Shared Only

VSS

OE#

DQ0

DQ8

RFU

A24

F-CE#

R-CE#

RFU

DQ3

DQ4

R-VCC

RFU

DQ15

DQ7

Do Not Use

F-VCC

DQ11

F-VCC

DQ14

F-VCCQ

RFU

DNU

RFU

DNU

MCP

Flash-only Addresses

A24-A23

Shared Addresses

A22-A0

S71WS512PD0

S71WS512PC0

A24-A22

A21-A0

3.1

3.2

Special Handling Instructions For FBGA Package

Special handling is required for Flash Memory products in FBGA packages.

Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The

package and/or data integrity may be compromised if the package body is exposed to temperatures above

150×C for prolonged periods of time.

Look-ahead Ballout for Future Designs

Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note

(publication number: Design_Scalable_Wireless_A0_E). Contact your local Spansion sales representative for

more details.

S71WS-P_00_A2 August 21, 2006

S71WS-P based MCP Products

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

3.3

NOR Flash and pSRAM Input/Output Descriptions

Amax-A0

DQ15-DQ0

F-CE#

OE#

NOR Flash Address inputs

Flash Data input/output, shared between NOR and ORNAND Flash. DQ0-DQ7 shared for x8 ORNAND

NOR Flash Chip-enable input #1. Asynchronous relative to CLK for Burst Mode.

Output Enable input. Asynchronous relative to CLK for Burst mode.

Write Enable input.

WE#

F-V_CC

F-V_CCQ

V_SS

NOR Flash device power supply (1.7 V - 1.95V).

Input/Output Buffer power supply.

Ground

RFU

Reserved for Future Use

RDY

Flash ready output. Indicates the status of the Burst read. VOL = data valid. The Flash RDY pin is shared

with the WAIT pin of the pSRAM.

CLK

NOR Flash Clock, shared with CLK of burst-mode pSRAM.. The first rising edge of CLK in conjunction

with AVD# low latches the address input and activates burst mode operation. After the initial word is

output, subsequent rising edges of CLK increment the internal address counter. CLK should remain low

during asynchronous access.

AVD#

NOR Flash Address Valid input. Shared with AVD# of burst-mode pSRAM. Indicates to device that the

valid address is present on the address inputs.

VIL = for asynchronous mode, indicates valid address; for burst mode, causes starting address to be

latched on rising edge of CLK.

VIH= device ignores address inputs

F-RST#

F-WP#

NOR Flash hardware reset input. VIL= device resets and returns to reading array data

NOR Flash hardware write protect input. VIL = disables program and erase functions in the four

outermost sectors.

F-ACC

NOR Flash accelerated input. At VHH, accelerates programming; automatically places device in unlock

bypass mode. At VIL, disables all program and erase functions. Should be at VIH for all other conditions.

R-CE#

R-CRE

R-VCC

R-UB#

R-LB#

DNU

Chip-enable input for pSRAM

Control Register Enable (pSRAM). For CellularRAM only.

pSRAM Power Supply

Upper Byte Control (pSRAM)

Lower Byte Control (pSRAM)

Do Not Use

S71WS-P based MCP Products

S71WS-P_00_A2 August 21, 2006

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

4. Ordering Information

The order number is formed by a valid combinations of the following:

S71WS

512

PACKING TYPE

0 = Tray

2 = 7” Tape and Reel

3 = 13” Tape and Reel

MODEL NUMBER 2

R = 80 MHz Flash Speed

V = 66 MHz Flash Speed

L = 108 MHz Flash Speed

MODEL NUMBER 1

H = CellularRAM Type 2, DYB=1, PPB = 0

S = CellularRAM Type 2, DYB=1, PPB=1

PACKAGE DESCRIPTOR

Depends on Character 12. For a more detailed description see Table 4.1.

PACKAGE TYPE & MATERIAL SET

HF = 1.2mm MCP FBGA, Pb-free

KF = 1.2mm POP FBGA, Pb-free

JF = 1.4mm MCP FBGA, Pb-free

CellularRAM DENSITY

D0 = 128 Mb

C0 = 64 Mb

PROCESS TECHNOLOGY

P = 90 nm, MirrorBit^TMTechnology

CODE FLASH DENSITY

256 = 256 Mb

512 = 512 Mb

PRODUCT FAMILY

S71WS Stacked Products (MCP/PoP)

1.8 V NOR Flash with pSRAM

Table 4.1 Character Position Descriptions (Sheet 1 of 2)

Character 14 Description

Character 12

Character 14

Package Area

7x9 mm

Package Ball Count

Raw Ball Size

7x9 mm

8x11.6 mm

9x12 mm

H, J, or G

0.35 mm

9x12 mm

115

137

9x12 mm

11x13 mm

115

137

S71WS-P_00_A2 August 21, 2006

S71WS-P based MCP Products

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

Table 4.1 Character Position Descriptions (Sheet 2 of 2)

Character 14 Description

Character 12

Character 14

Package Area

11x11 mm

12x12 mm

14x14 mm

15x15 mm

17x17 mm

Package Ball Count

Raw Ball Size

0.45 mm

0.50 mm

0.45 mm

0.50 mm

0.45 mm

0.50 mm

0.45 mm

0.50 mm

0.45 mm

0.50 mm

112

128

152

160

192

4.1

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

S71WS-P Valid Combinations

Package &

Material Set

Package

Model

NOR Flash

CellularRAM

Speed (MHz)

CellularRAM

Supplier

Package

Package Type Markings

Device

Descriptor Number Packing Type Speed (MHz)

108

S71WS512PD0

S71WS512PC0

0, 2, 3 (Note 1)

104

Type 2

8 x 11.6 mm

(Note 2)

Notes:

1. Packing Type 0 is standard. Specify other options as required.

2. BGA package marking omits leading S and packing type designator from ordering part number.

S71WS-P based MCP Products

S71WS-P_00_A2 August 21, 2006

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

5. Physical Dimensions

5.1

TLA084— 84-ball Fine Pitch Ball Grid Array (FBGA) 8x11.6mm Package

0.15

(2X)

L K

INDEX MARK

PIN A1

CORNER

PIN A1

CORNER

0.15

(2X)

TOP VIEW

BOTTOM VIEW

0.20

0.08

SIDE VIEW

84X

0.15

0.08

NOTES:

PACKAGE

JEDEC

TLA 084

N/A

1. DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

D x E

11.60 mm x 8.00 mm

PACKAGE

3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.

SYMBOL

MIN

---

NOM

---

MAX

NOTE

e REPRESENTS THE SOLDER BALL GRID PITCH.

1.20

---

PROFILE

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

0.17

0.81

---

BALL HEIGHT

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

---

0.97

BODY THICKNESS

BODY SIZE

11.60 BSC.

8.00 BSC.

8.80 BSC.

7.20 BSC.

n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

BODY SIZE

MATRIX FOOTPRINT

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

Ø b

0.35

0.40

0.45

BALL DIAMETER

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

0.80 BSC.

0.80 BSC

0.40 BSC.

BALL PITCH

8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

SD / SE

SOLDER BALL PLACEMENT

A2,A3,A4,A5,A6,A7,A8,A9

B1,B10,C1,C10,D1,D10,

E1,E10,F1,F10,G1,G10,

H1,H10,J1,J10,K1,K10,L1,L10,

M2,M3,M4,M5,M6,M7,M8,M9

DEPOPULATED SOLDER BALLS

9. N/A

10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

3372-2 \ 16-038.22a

S71WS-P_00_A2 August 21, 2006

S71WS-P based MCP Products

D a t a S h e e t

( A d v a n c e I n f o r m a t i o n )

6. Revision History

6.1

6.2

6.3

Revision A (February 21, 2006)

Initial release.

Revision A1 (April 12, 2006)

Added the S71WS512PC0

Revision A2 (August 21, 2006)

Added the S71WS512PD0 108MHz OPN

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as

contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

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aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal

operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under

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the prior authorization by the respective government entity will be required for export of those products.

Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under

development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this

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damages of any kind arising out of the use of the information in this document.

trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

S71WS-P based MCP Products

S71WS-P_00_A2 August 21, 2006

S71WS256PC0JF3HL3 [SPANSION]

相关型号：

S71WS256PC0JF3HR0

S71WS256PC0JF3HR2

S71WS256PC0JF3HR3

S71WS256PC0JF3HV0

S71WS256PC0JF3HV2

S71WS256PC0JF3HV3

S71WS256PC0JF3SL0

S71WS256PC0JF3SL2

S71WS256PC0JF3SL3

S71WS256PC0JF3SR0

S71WS256PC0JF3SR2

S71WS256PC0JF3SR3