S71WS512NC0BAWAK0 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS512NC0BAWAK0
元器件型号: S71WS512NC0BAWAK0
生产厂家: SPANSION    SPANSION
描述和应用:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

内存集成电路 静态存储器
PDF文件: 总13页 (文件大小:334K)
下载文档:  下载PDF数据表文档文件
型号参数:S71WS512NC0BAWAK0参数

S71WS512NC0BAWAK2

Stacked Multi-Chip Product (MCP)

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6 SPANSION

S71WS512NC0BAWAK3

Stacked Multi-Chip Product (MCP)

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12 SPANSION

S71WS512NC0BAWAM

暂无描述

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0 SPANSION

S71WS512NC0BAWAM0

Memory Circuit, Flash+PSRAM, 32MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512NC0BAWAM2

Memory Circuit, Flash+PSRAM, 32MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512NC0BAWAN0

Stacked Multi-Chip Product (MCP)

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16 SPANSION

S71WS512NC0BAWAN2

Stacked Multi-Chip Product (MCP)

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5 SPANSION

S71WS512NC0BAWAN3

Stacked Multi-Chip Product (MCP)

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17 SPANSION

S71WS512NC0BAWAP0

Stacked Multi-Chip Product (MCP)

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14 SPANSION

S71WS512NC0BAWAP2

Stacked Multi-Chip Product (MCP)

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14 SPANSION

S71WS512NC0BAWAP3

Stacked Multi-Chip Product (MCP)

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9 SPANSION

S71WS512NC0BAWAY2

Memory Circuit, 32MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512NC0BAWAZ3

Memory Circuit, 32MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512NC0BAWE20

Stacked Multi-Chip Product (MCP)

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3 SPANSION

S71WS512NC0BAWE22

Stacked Multi-Chip Product (MCP)

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16 SPANSION