S71WS512NC0BAWEN3 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS512NC0BAWEN3
型号: S71WS512NC0BAWEN3
厂家: SPANSION    SPANSION
描述:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

文件: 总13页 (文件大小:334K)
下载:  下载PDF数据表文档文件

S71WS512NC0BAWEP0

Stacked Multi-Chip Product (MCP)

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5 SPANSION

S71WS512NC0BAWEP2

Stacked Multi-Chip Product (MCP)

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17 SPANSION

S71WS512NC0BAWEP3

Stacked Multi-Chip Product (MCP)

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12 SPANSION

S71WS512NC0BAWTE0

Memory Circuit, 32MX16, CMOS, PBGA84, 11.60 X 8 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512NC0BAWTH0

Memory Circuit, Flash+PSRAM, 32MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512NC0BAWTJ0

Stacked Multi-Chip Product (MCP)

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8 SPANSION

S71WS512NC0BAWTJ2

Stacked Multi-Chip Product (MCP)

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12 SPANSION

S71WS512NC0BAWTJ3

Stacked Multi-Chip Product (MCP)

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4 SPANSION

S71WS512NC0BAWTK0

Stacked Multi-Chip Product (MCP)

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8 SPANSION

S71WS512NC0BAWTK2

Stacked Multi-Chip Product (MCP)

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19 SPANSION

S71WS512NC0BAWTK3

Stacked Multi-Chip Product (MCP)

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13 SPANSION

S71WS512NC0BAWTN

Memory Circuit, 32MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS512NC0BAWTN

Memory Circuit, 32MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS512NC0BAWTN0

Stacked Multi-Chip Product (MCP)

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23 SPANSION

S71WS512NC0BAWTN2

Stacked Multi-Chip Product (MCP)

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4 SPANSION