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S71WS512ND0BAWAN3 [SPANSION]

Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品( MCP )
S71WS512ND0BAWAN3
型号: S71WS512ND0BAWAN3
厂家: SPANSION    SPANSION
描述:

Stacked Multi-Chip Product (MCP)
堆叠式多芯片产品( MCP )

文件: 总13页 (文件大小:334K)
中文:  中文翻译
下载:  下载PDF数据表文档文件

相关型号:

S71WS512ND0BAWAP0

Stacked Multi-Chip Product (MCP)

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6 SPANSION

S71WS512ND0BAWAP2

Stacked Multi-Chip Product (MCP)

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21 SPANSION

S71WS512ND0BAWAP3

Stacked Multi-Chip Product (MCP)

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5 SPANSION

S71WS512ND0BAWE20

Stacked Multi-Chip Product (MCP)

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4 SPANSION

S71WS512ND0BAWE22

Stacked Multi-Chip Product (MCP)

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16 SPANSION

S71WS512ND0BAWE23

Stacked Multi-Chip Product (MCP)

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10 SPANSION

S71WS512ND0BAWE3

Memory Circuit, 32MX16, CMOS, PBGA84, 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512ND0BAWE30

Stacked Multi-Chip Product (MCP)

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15 SPANSION

S71WS512ND0BAWE32

Stacked Multi-Chip Product (MCP)

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17 SPANSION

S71WS512ND0BAWE33

Stacked Multi-Chip Product (MCP)

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36 SPANSION

S71WS512ND0BAWE60

Stacked Multi-Chip Product (MCP)

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15 SPANSION

S71WS512ND0BAWE62

Stacked Multi-Chip Product (MCP)

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27 SPANSION

S71WS512ND0BAWE63

Stacked Multi-Chip Product (MCP)

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19 SPANSION

S71WS512ND0BAWE70

Stacked Multi-Chip Product (MCP)

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9 SPANSION

S71WS512ND0BAWE72

Stacked Multi-Chip Product (MCP)

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15 SPANSION

S71WS512ND0BAWE73

Stacked Multi-Chip Product (MCP)

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20 SPANSION

S71WS512ND0BAWEH

Memory Circuit, 32MX16, CMOS, PBGA84, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION

S71WS512ND0BAWEH2

Memory Circuit, Flash+PSRAM, 32MX16, CMOS, PBGA84, 12 X 9 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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0 SPANSION

S71WS512ND0BAWEH3

Memory Circuit, Flash+PSRAM, 32MX16, CMOS, PBGA84, 12 X 9 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84

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1 SPANSION

S71WS512ND0BAWEJ

Memory Circuit, 32MX16, CMOS, PBGA84, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

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0 SPANSION