S75PL256NBFJAWGZ2 [SPANSION]
Stacked Multi-Chip Product (MCP); 堆叠式多芯片产品（ MCP ）
| 型号： | S75PL256NBFJAWGZ2 |
| 厂家： | 
SPANSION |
| 描述： | Stacked Multi-Chip Product (MCP) |
| 文件： | 总8页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S75PL-N MirrorBit™ ORNAND™ MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND Interface)
3V pSRAM
S75PL-N MirrorBit™ ORNAND™ MCPs Cover Sheet
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S75PL-N_00
Revision 01E
Issue Date April 21, 2006
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
LLC therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion LLC.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion LLC reserves the right to change or discontinue work on this
proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion LLC applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion LLC deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical
or specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
ii
S75PL-N MirrorBit™ ORNAND™ MCPs
April 21, 2006 S75PL-N_00-01E
S75PL-N MirrorBit™ ORNAND™ MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND interface)
3V pSRAM
Data Sheet (Advance Information)
Features
Speed
107-Ball Fine-Pitch Ball Grid Array (FBGA)
– PL-N: 70 ns (initial access, 30 ns page access)
– 9 x 12 x 1.4mm for ML512P based MCP's
– 11 x 13 x 1.4mm for ML01GP based MCPs
– ML-P: 30 ns (page access)
– pSRAM: 70 ns
Operating Temperature Range
– Temperature Range of –25°C to +85°C
General Description
This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following
devices:
S29PL-N
S30ML-P
3 V pSRAM
Flash/RAM Combinations Table
pSRAM Density
S29PL127N +
S30ML512P
S30ML01GP
32 Mb
64 Mb
S75PL127NBF
Product Selector Guide
Device
pSRAM Density
pSRAM Type
S75PL127NBF
32 Mb
pSRAM Type 7
For detailed specifications, please refer to the individual data sheets:
Document
S29PL-N
Publication Identification Number (PID)
S29PL-N_M0
S30ML-P
S30ML-GP_00
32M pSRAM Type 7
pSRAM_29
Publication Number S75PL-N_00
Revision 01E
Issue Date April 21, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design
in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
1. Ordering Information
The ordering part number is formed by a valid combination of the following:
S75PL
127
N
B
F
JF
W
GZ
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations table below
TEMPERATURE RANGE
W = Wireless (–25°C to +85°C)
PACKAGE TYPE AND MATERIAL
JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package
JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY
F = S30ML512P
G = S30ML01GP
pSRAM DENSITY
B = 32 Mb pSRAM
C = 64 Mb pSRAM
D = 128 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm MirrorBit™ Technology
FLASH DENSITY
256 = 256 Mb
127 = 128 Mb (Single CE#)
DEVICE FAMILY
S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage
ORNAND and pSRAM
2
S75PL-N MirrorBit™ ORNAND™ MCPs
S75PL-N_00_01E April 21, 2006
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
1.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Valid Combinations
PL-N
ML-P Page
pSRAM
Base Ordering
Package &
Model
Packing pSRAM Linear Mode
Mode Access Linear Mode
Part Number (2) Temperature Number
Type
Type
Access Time
Time
Access Time Package Name
FMH107
9x12x1.4mm,
107 ball
0, 2, 3
(1), (2)
S75PL127NBF
JAW, JFW
GZ
Type 7
70 ns
30 ns
70 ns
Notes:
1. 7\SHꢀꢁꢀLVꢀVWDQGDUGꢂꢀ6SHFLI\ꢀRWKHUꢀRSWLRQVꢀDVꢀUHTXLUHGꢂ
2. BGA package marking omits leading “S” and packing type designator from ordering part number.
3. Contact factory for availability for any of the OPNs listed since RAM type availability may vary over time.
2. Block Diagram (S29PL-N and pSRAM on Bus 1, S30ML-P on Bus 2)
A0-A20
A0-A20
A21-A22
A21-A22
RY/BY#
RY/BY#
DQ0-DQ15
DQ0-DQ15
S29PL127N
F-CE#
CE#
OE#
OE#
F-RST#
F-ACC/WP#
RESET#
ACC/WP#
VSS
VSS
WE#
WE#
VCC
F-VCC
VCCQ
A0-A20
DQ0-DQ15
32Mb
pSRAM
Memory
R-CE#
CE#
OE#
R-LB#
R-UB#
LB#
UB#
WE#
R-CE2
R-CE2
VSS
VCC
R-VCC
VCCQ
I/O0-I/O7
I/O0-I/O7
RY/BY#
N-RY/BY#
VCC
FP#
N-VCC
S30ML512P
x8 ORNAND
N-CLE
N-CE#
N-ALE
CLE
CE#
ALE
I/O0-I/O7
VSS
I/O0-I/O7
N-VSS
N-RE#
N-WP#
N-WE#
RE#
WP#
WE#
N-PRE
PRE
S75PL-N_00_01E April 21, 2006
S75PL-N MirrorBit™ ORNAND™ MCPs
3
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
3. Connection Diagrams
3.1
S75PL-N Pinout
Figure 3.1 107-ball Fine-Pitch Ball Grid Array (S75PL127NBF)
1
2
3
4
5
6
7
8
9
10
A
B
DNU
DNU
RFU
DNU
RFU
RFU
A15
A21
A22
A16
RFU
VSS
I/O4
I/O3
DNU
DNU
RFU
RFU
RFU
RFU
VCCn
VSSn
I/O7
Index
No ball
C
D
E
F
VSS
A7
RFU
LB#
UB#
RFU
RFU
WE#
RFU
A8
RFU
A11
A12
A13
A14
RFU
N-RY/BY RFU
WP#/
ACC
Legend
Reserved for Future Use
DNU
N-RE#
N-CE#
N-VCC
N-VSS
A3
A2
A1
A0
A6
RST# R-CE2
A19
A9
A5
A18 RY/BY# A20
G
A4
A17
DQ1
DQ9
RFU
RFU
DQ3
RFU
RFU
DQ4
A10
DQ6
H
J
NOR Flash Only
ORNAND Flash Only
pSRAM Only
VSS
OE#
N-CLE F-CE#
DQ13 DQ15
K
L
N-ALE R-CE1# DQ0
N-WE# N-WP# DQ8
DQ10 F-VCC R-VCC DQ12
DQ7
DQ14
I/O2
I/O6
DQ2
VSS
DQ11
RFU
RFU
I/O0
DQ5
I/O1
I/O5
M
N
DNU
DNU
RFU
DNU
RFU
N-PRE
DNU
P
Note:
Top view—balls facing down. The addresses that are shared vary by MCP combination as shown in the table below:
PL-N Addresses
PL-N/pSRAM Addresses
A20:A0
S75PL127NBF
A22-A21
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
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S75PL-N MirrorBit™ ORNAND™ MCPs
S75PL-N_00_01E April 21, 2006
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
3.2
FMH107—107-Ball Fine Pitch Ball Grid Array (FBGA) 9 x 12 mm package
Figure 3.2 FMH107
A
D1
D
eD
0.15
(2X)
C
10
9
8
SE
7
7
6
E
B
E1
5
4
3
2
1
eE
J
H
G
F
E
D
C
B
A
M
L K
INDEX MARK
9
PIN A1
CORNER
PIN A1
CORNER
7
SD
0.15
(2X)
C
TOP VIEW
BOTTOM VIEW
0.20
0.08
C
C
A2
A
A1
C
6
SIDE VIEW
107X
0.15
b
M
C
C
A B
0.08
M
NOTES:
PACKAGE
JEDEC
FMH 107
N/A
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
D x E
12.00 mm x 9.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
SYMBOL
MIN
NOM
---
MAX
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
1.40
---
PROFILE
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
0.17
0.94
---
---
1.11
BODY THICKNESS
BODY SIZE
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
12.00 BSC.
9.00 BSC.
8.80 BSC.
7.20 BSC.
12
E
BODY SIZE
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
D1
E1
MD
ME
n
MATRIX FOOTPRINT
MATRIX FOOTPRINT
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
10
107
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
b
0.35
0.40
0.45
BALL DIAMETER
Ø
eE
eD
0.80 BSC.
0.80 BSC.
0.40 BSC.
BALL PITCH
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
A3,A4,A5,A6,A7,A8,
DEPOPULATED SOLDER BALLS
9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
B1,M3,M4,M5,M6,M7,M8
3512 \ 16-038.19 \ 8.9.05
S75PL-N_00_01E April 21, 2006
S75PL-N MirrorBit™ ORNAND™ MCPs
5
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
4. Revision History
4.1
Revision A (April 21, 2006)
Initial release.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2006 Spansion LLC. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof are
trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.
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S75PL-N MirrorBit™ ORNAND™ MCPs
S75PL-N_00_01E April 21, 2006
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