S75WS256NDFBAWNH [SPANSION]
Memory Circuit, 16MX16, CMOS, PBGA84, 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84;
| 型号： | S75WS256NDFBAWNH |
| 厂家： | 
SPANSION |
| 描述： | Memory Circuit, 16MX16, CMOS, PBGA84, 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84 |
| 文件： | 总10页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S73WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write,
Burst Mode Flash
Mobile SDRAM on Shared Bus
S73WS-P based MCP Products Cover Sheet
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S73WS-P_00 Revision A Amendment 0 Issue Date March 16, 2006
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
LLC therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion LLC.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion LLC reserves the right to change or discontinue work on this
proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion LLC applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion LLC deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical
or specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
ii
S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write,
Burst Mode Flash
Mobile SDRAM on Shared Bus
Data Sheet (Advance Information)
Features
Power supply voltage of 1.7 to 1.95V
Package:
– 9.0 x 12.0 mm MCP
Flash access time: 80 ns for NOR Flash
Flash burst frequencies: 66 MHz, 80 MHz, 108 MHz
Mobile SDRAM burst frequency: 104 MHz (SDR)
Operating Temperature
– –25°C to +85°C (wireless)
The S73WS series is a product line of stacked packages and consists of:
One NOR flash memory die
One Mobile SDRAM die on shared bus
The products covered by this document are listed in the table below.
DRAM Density
128Mb
Device
S29WS256P
S73WS256PD0 (MCP) (SDR)
Note:
For a full list of OPNs, please contact the local sales representative or refer to the Ordering Information valid combinations tables.
For detailed specifications, please refer to the individual data sheets.
Document
S29WS-P
Publication Identification Number (PID)
S29WS-P_00
128 Mb Mobile SDR-DRAM Type 5
SDRAM_08
Publication Number S73WS-P_00 Revision A Amendment 0 Issue Date March 16, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design
in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
1. Product Selector Guide
NOR Flash
Density
NOR Flash
Speed
DRAM
Density
Device
DRAM Speed
DRAM Supplier
Package
MCP
9 x 12 mm
S73WS512PD0HF64V
512 Mb
66 MHz
128 Mb
104 MHz (SDR)
Type 5
2. MCP Block Diagram
2.1
NOR Flash + DRAM MCPs
A0-Amax
A0-Amax
RDY
DQ15-DQ0
DQ15-DQ0
F-RDY
WS-P
NOR Flash
Memory
F-CLK
F-AVD#
F-CE#
CLK
AVD#
CE#
OE#
RESET#
ACC
F-OE#
F-RST#
F-ACC
F-WP#
F-WE#
VSS
VSSQ
F-VSS
F-VSSQ
WP#
WE#
VCC
F-VCC
VCCQ
F-VCCQ
D-RAS#
D-CAS#
D-BA0
D-BA1
D-CKE
D-WE#
D-CE#
RAS#
CAS#
BA0
BA1
CKE
WE#
CE#
A0-Amax
VCC
VCCQ
CLK
D-CLK
SDR
DRAM
MEMORY
LDQM
UDQM
D-DM0
D-DM1
DQ15-DQ0
VSS
VSSQ
D-VCC
D-VCCQ
D-VSS
D-VSSQ
2
S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
3. Connection Diagrams
3.1
512 Mb NOR Flash with 128 Mb SDR-DRAM
137-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
1
2
3
4
5
6
7
8
9
10
Legend
Shared
A
B
C
D
E
F
D-CKE D-CLK
RFU
RFU
D-VSS D-VCC RFU
RFU
RFU
RFU
A11
A12
A13
A14
A24
D-VSS D-CE#
RFU D-CAS#
D-RAS# D-WE# RFU
RFU F-AVD# VSS
RFU D-VSSQ D-VCCQ RFU
Do Not Use
NOR Flash Only
DRAM Only
F-CLK
RFU
F-VCC
RFU
A8
RFU
RFU
RFU
RFU
RFU F-WP#
D-VCCQ A3
A7
A6
D-DM0 F-ACC WE#
D-DM1 F-RST# DNU
A19
A9
A15 D-VCCQ
A21 D-VSSQ
Reserved for Future Use
D-VSSQ
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
A2
A1
A5
A18
A17
F-RDY
A20
A23
G
A4
A10
DQ6
A22
A16
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
H
J
A0
VSS
OE#
DQ0
DQ8
RFU
RFU
RFU
DQ1
DQ9
F-CE#
DNU
RFU
RFU
D-BA0
D-VSS
DQ3
DQ4
RFU
RFU
RFU
DQ13 DQ15
DNU
VSS
RFU
K
L
DQ10 F-VCC
DQ12
DQ5
DQ7
DQ2
VSS
DQ11
DQ14
M
N
F-VCC
DNU F-VCCQ DNU
RFU D-VSSQ D-VCCQ RFU
RFU
RFU
D-BA1
DNU
P
RFU
D-VSS D-VCC RFU
Note: DDR-only signals are RFUs in the case of the SDR DRAM-based solutions.
3.1.0.1
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150×C for prolonged periods of time.
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
3
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
3.2
NOR Flash and DRAM Input/Output Descriptions
Amax-A0
DQ15-DQ0
F-CE#
F-OE#
F-WE#
F-VCC
=
=
=
=
=
=
=
=
=
=
=
Address inputs, shared between NOR Flash and DRAM
Data input/output, shared between NOR Flash and DRAM
NOR Flash Chip-enable input. Asynchronous relative to CLK for Burst Mode.
NOR Flash Output Enable input. Asynchronous relative to CLK for Burst mode.
NOR Flash Write Enable input.
NOR Flash device power supply (1.7 V - 1.95V).
Input/Output Buffer power supply.
F-VCCQ
VSS
Ground
RFU
Reserved for Future Use
F-RDY
F-CLK
Flash ready output. Indicates the status of the Burst read. VOL = data valid.
NOR Flash Clock. The first rising edge of CLK in conjunction with AVD# low latches the address input
and activates burst mode operation. After the initial word is output, subsequent rising edges of CLK
increment the internal address counter. CLK should remain low during asynchronous access.
F-AVD#
=
NOR Flash Address Valid input. Indicates to device that the valid address is present on the address
inputs.
VIL = for asynchronous mode, indicates valid address; for burst mode, causes starting address to be
latched on rising edge of CLK.
VIH= device ignores address inputs
F-RST#
F-WP#
=
=
NOR Flash hardware reset input. VIL= device resets and returns to reading array data
NOR Flash hardware write protect input. VIL = disables program and erase functions in the four
outermost sectors.
F-ACC
=
NOR Flash accelerated input. At VHH, accelerates programming; automatically places device in unlock
bypass mode. At VIL, disables all program and erase functions. Should be at VIH for all other conditions.
D-CE#
D-CKE
=
=
=
=
=
=
=
=
=
=
=
SDRAM Chip Select
SDRAM Clock Enable
D-BA1-BA0
D-RAS#
D-CAS#
D-DM1-D-DM0
D-WE#
SDRAM Bank Select
SDRAM Row Address Strobe
SDRAM Column Address Strobe
SDRAM Data Input/Output Mask
SDRAM Write Enable input
SDRAM Ground
D-VSS
D-VSSQ
SDRAM Input/Output Buffer ground
SDRAM Input/Output Buffer power supply
SDRAM device power supply
D-VCCQ
D-VCC
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
4. Ordering Information
The order number is formed by a valid combinations of the following:
S73WS
512
P
D0
HF
6
4
V
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER 2
V = 66MHz/104MHz Speed
MODEL NUMBER 1
4 = SDR DRAM x16, Type 5
PACKAGE DESCRIPTOR
Depends on Character 12. For a more detailed description see Table 4.1.
PACKAGE TYPE & MATERIAL SET
HF = 1.2mm MCP FBGA, Pb-free
KF = 1.2mm POP FBGA, Pb-free
JF = 1.4mm MCP FBGA, Pb-free
DRAM & ORNAND FLASH DENSITY
D0 = 128 Mb DRAM, No Data Flash
PROCESS TECHNOLOGY
P = 90 nm, MirrorBitTM Technology
CODE FLASH DENSITY
512 = 512Mb
PRODUCT FAMILY
S73WS Stacked Products (MCP)
1.8 V NOR Flash and Mobile DRAM
Table 4.1 Character Position Descriptions (Sheet 1 of 2)
Character 14 Description
Character 12
Character 13
Package Area
7x9 mm
Package Ball Count
Raw Ball Size
0
1
2
3
4
5
6
7
8
9
56
80
7x9 mm
8x11.6 mm
8x11.6 mm
9x12 mm
9x12 mm
9x12 mm
11x13 mm
11x13 mm
11x13 mm
64
84
84
H, J, or G
0.35 mm
115
137
84
115
137
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
5
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
Table 4.1 Character Position Descriptions (Sheet 2 of 2)
Character 14 Description
Character 12
Character 13
Package Area
11x11 mm
11x11 mm
12x12 mm
12x12 mm
14x14 mm
14x14 mm
15x15 mm
15x15 mm
17x17 mm
17x17 mm
Package Ball Count
Raw Ball Size
0.45 mm
0.50 mm
0.45 mm
0.50 mm
0.45 mm
0.50 mm
0.45 mm
0.50 mm
0.45 mm
0.50 mm
A
B
D
F
112
112
128
128
152
152
160
160
192
192
G
H
J
K
K
L
M
4.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S72WS-P Valid Combinations
Package &
Base Ordering
Material
Set
Package
Descriptor
Model
Number
NOR Flash
Speed
DRAM
Supplier
Package
Markings
Number
Packing Type
DRAM Speed Package Type
9x12 mm
104 MHz
S73WS512PD0
HF
6
4V
0, 2, 3 (Note 1)
66 MHz
Type 5
(Note 2)
(MCP)
Notes:
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading S and packing type designator from ordering part number.
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
5. Physical Dimensions
5.1
TLD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 12.0 mm Package
A
D1
D
eD
0.15
(2X)
C
10
9
8
SE
7
7
6
E
B
E1
5
4
3
2
1
eE
J
H
G
F
E
D
C
B
A
P
N M L K
INDEX MARK
10
PIN A1
CORNER
PIN A1
CORNER
7
SD
0.15
(2X)
C
TOP VIEW
BOTTOM VIEW
0.20
0.08
C
C
A2
A
C
A1
SIDE VIEW
6
137X
b
0.15
0.08
M
C
C
A
B
M
NOTES:
PACKAGE
JEDEC
TLD 137
N/A
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
D x E
12.00 mm x 9.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL
MIN
---
NOM
---
MAX
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
1.20
---
PROFILE
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
0.17
0.81
---
BALL HEIGHT
BODY THICKNESS
BODY SIZE
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
A2
---
0.97
D
12.00 BSC.
9.00 BSC.
10.40 BSC.
7.20 BSC.
14
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
E
BODY SIZE
D1
E1
MATRIX FOOTPRINT
MATRIX FOOTPRINT
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
MD
ME
n
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
10
137
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
φb
0.35
0.40
0.45
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
eE
0.80 BSC.
0.80 BSC
0.40 BSC.
G5,H5,H6
BALL PITCH
eD
SD / SE
BALL PITCH
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3393\ 16-038.22a
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
7
D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
6. Revision History
6.1
Revision A (March 16, 2006)
Initial release.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2006 Spansion LLC. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof are
trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.
8
S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
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