W137 [SPECTRALINEAR]
FTG for Mobile 440BX & Transmeta’s Crusoe CPU; FTG移动440BX和全美达的Crusoe CPU
| 型号： | W137 |
| 厂家： | 
SPECTRALINEAR INC |
| 描述： | FTG for Mobile 440BX & Transmeta’s Crusoe CPU |
| 文件： | 总8页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
W137
FTG for Mobile 440BX & Transmeta’s Crusoe CPU
CPU0:1 Cycle to Cycle Jitter: ..................................... 200 ps
PCI_F, PCI1:± Output to Output Skew:....................... ±00 ps
Features
• Maximized EMI suppression using Cypress’s Spread
Spectrum Technology
PCI_F, PCI1:± Cycle to Cycle Jitter: .......................... 2±0 ps
CPU to PCI Output Skew:................1.±–4.0 ns (CPU Leads)
Output Duty Cycle:.....................................................4±/±±%
PCI_F, PCI Edge Rate:..............................................>1 V/ns
• Two copies of CPU output
• Six copies of PCI output (Synchronous w/CPU output)
• One 48-MHz output for USB support
• One selectable 24 /48 MHz output
CPU_STOP#, OE, SPREAD#, SEL48#, PCI_STOP#,
PWR_DWN# all have a 2±0-kW pull-up resistor.
• Two Buffered copies of 14.318 MHz input reference
signal
Table 1. Pin Selectable Frequency
• Supports 100 MHz or 66 MHz CPU operation
• Power management control input pins
SEL100/66#
OE
0
CPU
Hi-Z
PCI
Hi-Z
33.3
33.3
Spread%
Don’t Care
See Table 2
See Table 2
0/1
0
• Available in 28-pin SSOP (209 mils) and 28-pin TSSO
(173 mils)
1
66.6 MHz
100 MHz
1
1
• SS function can be disabled
• See W40S11-02 for 2 SDRAM DIMM support
Table 2. Spread Spectrum Feature
Key Specifications
SPREAD#
Spread Profile
Supply Voltages:........................................VDDQ3 = 3.3V±±%
0
1
–0.±% (down spread)
0% (spread disabled)
VDDQ2 = 2.±V±±%
CPU0:1 Output to Output Skew: .................................17± ps
Block Diagram
Pin Configuration
Rev 1.0, November 24, 2006
Page 1 of 8
2200 Laurelwood Road, Santa Clara, CA 95054
Tel:(408) 855-0555 Fax:(408) 855-0550
www.SpectraLinear.com
W137
Pin Definitions
Pin
Type
Pin Name
Pin No.
Pin Description
CPU0:1
24, 23
O
O
O
I
CPU Clock Outputs 0 and 1. These two CPU clock outputs are controlled by the
CPU_STOP# control pin. Output voltage swing is controlled by voltage applied to
VDDQ2. Frequency is selected per Table 1.
PCI1:±
±, 6, 9, 10, 11
PCI Bus Clock Outputs 1 through ±. These five PCI clock outputs are controlled by
the PCI_STOP# control pin. Output voltage swing is controlled by voltage applied to
VDDQ3. Frequency is selected per Table 1.
PCI_F
4
Fixed PCI Clock Output. Unlike PCI1:± outputs, this output is not controlled by the
PCI_STOP# control pin; it cannot be forced LOW by PCI_STOP#. Output voltage
swing is controlled by voltage applied to VDDQ3. Frequency is selected per Table 1.
CPU_STOP#
PCI_STOP#
REF0/SEL48#
18
20
27
CPU_STOP# Input. When brought LOW, clock outputs CPU0:1 are stopped LOW
after completing a full clock cycle (2–3 CPU clock latency). When brought HIGH,
clock outputs CPU0:1 start with a full clock cycle (2–3 CPU clock latency).
I
PCI_STOP# Input. The PCI_STOP# input enables the PCI1:± outputs when HIGH
and causes them to remain at logic 0 when LOW. The PCI_STOP# signal is latched
on the rising edge of PCI_F. Its effect takes place on the next PCI_F clock cycle.
I/O I/O Dual-Function REF0 and SEL48# Pin. Upon power-up, the state of SEL48# is
latched. The state is set by either a 10K resistor to GND or to VDD. A 10K resistor to
GND causes pin 14 to provide a 48-MHz clock. If the pin is strapped to VDD, pin 14
will provide a 24-MHz clock. After 2 ms, the pin becomes a high-drive output that
produces a copy of 14.318 MHz.
REF1/SPREAD#
24/48MHz/OE
26
14
I/O I/O Dual-Function REF1 and SPREAD# Pin. Upon power-up, the state of SPREAD#
is latched. The state is set by either a 10K resistor to GND or to VDD. A 10K resistor
to GND enables Spread Spectrum function. If the pin is strapped to VDD, Spread
Spectrum is disabled. After 2 ms, the pin becomes a high-drive output that produces
a copy of 14.318 MHz.
I/O I/O Dual-Function 24 MHz or 48 MHz Output and Output Enable Input. Upon
power-up, the state of pin 14 is latched. The state is set by either a 10K resistor to
GND or to VDD. A 10K resistor to GND latches OE LOW, and all outputs are tri-stated.
If the pin is strapped to VDD, OE is latched HIGH and all outputs are active. After 2
ms, the pin becomes an output whose frequency is set by the state of pin 27 on
power-up.
48MHz
SEL100/66#
X1
13
16
2
O
48 MHz Output. Fixed 48 MHz USB output. Output voltage swing is controlled by
voltage applied to VDDQ3.
I
Frequency Selection Input. Select power-up default CPU clock frequency as shown
in Table 1.
I
Crystal Connection or External Reference Frequency Input. This pin can either be
used as a connection to a crystal or to a reference signal.
X2
3
I
Crystal Connection. An input connection for an external 14.318 MHz crystal. If using
an external reference, this pin must be left unconnected.
PWR_DWN#
17
I
Power Down Control. When this input is LOW, device goes into a low-power standby
condition. All outputs are held LOW. CPU and PCI clock outputs are stopped LOW
after completing a full clock cycle (2–3 CPU clock cycle latency). When brought
HIGH, CPU and PCI outputs start with a full clock cycle at full operating frequency
(3 ms maximum latency).
VDDQ3
VDDQ2
GND
8, 12, 19, 28
2±
P
P
G
Power Connection. Connected to 3.3V.
Power Connection. Power supply for CPU0:1 output buffers. Connected to 2.±V.
Ground Connection. Connect all ground pins to the common system ground plane.
1, 7, 1±, 21, 22
Rev 1.0,November 24, 2006
Page 2 of 8
W137
Upon W137 power-up, the first 2 ms of operation are used for
input logic selection. During this period the output buffers are
tri-stated, allowing the output strapping resistor on each l/O pin
to pull the pin and its associated capacitive clock load to either
a logic HIGH or logic LOW state. At the end of the 2-ms period,
the established logic 0 or 1 condition of each l/O pin is then
latched. Next, the output buffers are enabled, which converts
both l/O pins into operating clock outputs. The 2-ms timer is
started when VDD reaches 2.0V. The input latches can only be
reset by turning VDD off and then back on again.
Overview
The W137 was developed to meet the Intel® Mobile Clock
specification for the BX chipset, including Super I/O and USB
support. The W40S11-02 is the Intel-defined companion part
used for driving 2 SDRAM DIMM modules. Please see that
data sheet for additional information.
Cypress’s proprietary spread spectrum frequency synthesis
technique is a feature of the CPU and PCI outputs. When
enabled, this feature reduces the peak EMI measurements of
not only the output signals and their harmonics, but also of any
other clock signals that are properly synchronized to them.
The –0.±% modulation profile matches that defined as
acceptable in Intel’s clock specification.
It should be noted that the strapping resistors have no signif-
icant effect on clock output signal integrity. The drive
impedance of the clock output is <40: (nominal) which is
minimally affected by the 10-k: strap to ground or VDD. As with
the series termination resistor, the output strapping resistor
should be placed as close to the l/O pin as possible in order to
keep the interconnecting trace short. The trace from the
resistor to ground or VDD should be kept less than two inches
in length to prevent system noise coupling during input logic
sampling.
Functional Description
I/O Pin Operation
Pins 14, 26, and 27 are dual-purpose l/O pins. Upon power-up
these pins act as logic inputs, allowing the determination of
assigned device functions. A short time after power-up, the
logic state of each pin is latched and the pins then become
clock outputs. This feature reduces device pin count by
combining clock outputs with input select pins.
When the clock outputs are enabled following the 2-ms input
period, target (normal) output frequency is delivered assuming
that VDD has stabilized. If VDD has not yet reached full value,
output frequency initially may be below target but will increase
to target once VDD voltage has stabilized. In either case, a
short output clock cycle may be produced from the CPU clock
outputs when the outputs are enabled.
An external 10-k: “strapping” resistor is connected between
each l/O pin and ground or VDD. Connection to ground sets a
latch to “0,” connection to VDD sets a latch to “1.” Figure 1 and
Figure 2 show two suggested methods for strapping resistor
connection.
Figure 1. Input Logic Selection Through Resistor Load Option
Figure 2. Input Logic Selection Through Jumper Option
Rev 1.0,November 24, 2006
Page 3 of 8
W137
The output clock is modulated with a waveform depicted in
Figure 4. This waveform, as discussed in “Spread Spectrum
Clock Generation for the Reduction of Radiated Emissions” by
Bush, Fessler, and Hardin, produces the maximum reduction
in the amplitude of radiated electromagnetic emissions. The
deviation selected for this chip is –0.±% of the selected
frequency. Figure 4 details the Cypress spreading pattern.
Cypress does offer options with more spread and greater EMI
reduction. Contact your local Sales representative for details
on these devices.
Spread Spectrum Clocking
The device generates a clock that is frequency modulated in
order to increase the bandwidth that it occupies. By increasing
the bandwidth of the fundamental and its harmonics, the
amplitudes of the radiated electromagnetic emissions are
reduced. This effect is depicted in Figure 3.
As shown in Figure 3, a harmonic of a modulated clock has a
much lower amplitude than that of an unmodulated signal. The
reduction in amplitude is dependent on the harmonic number
and the frequency deviation or spread. The equation for the
reduction is
Spread Spectrum clocking is activated or deactivated through
I/O pin #26.
dB = 6.5 + 9*log10(P) + 9*log10(F)
Where P is the percentage of deviation and F is the frequency
in MHz where the reduction is measured.
Figure 3. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation
Figure 4. Typical Modulation Profile
Rev 1.0,November 24, 2006
Page 4 of 8
W137
rating only. Operation of the device at these or any other condi-
tions above those specified in the operating sections of this
specification is not implied. Maximum conditions for extended
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause
permanent damage to the device. These represent a stress
periods may affect reliability.
.
Parameter
VDD, VIN
TSTG
TA
Description
Rating
Unit
Voltage on any pin with respect to GND
–0.± to +7.0
V
Storage Temperature
–6± to +1±0
0 to +70
°C
°C
°C
kV
Operating Temperature
Ambient Temperature under Bias
Input ESD Protection
TB
–±± to +12±
2 (min.)
ESDPROT
DC Electrical Characteristics:
TA = 0°C to +70°C; VDDQ3 = 3.3V±±%; VDDQ2 = 2.±V±±%; CPU0:1 = 66.6/100 MHz
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Supply Current
IDD3PD
IDD3
3.3V Supply Current in Power-down mode
3.3V Supply Current
PWR_DWN# = 0
Outputs Loaded[1]
Outputs Loaded[1]
PWR_DWN# = 0
1
80
±
100
4±
1
mA
mA
mA
mA
IDD2
2.±V Supply Current
30
IDD2PD
2.±V Supply Current in Power-down mode
0.2 µA
Logic Inputs
VIL
Input Low Voltage
GND – 0.3
2.0
0.8
VDD + 0.3
–2±
V
VIH
IIL
Input High Voltage
V
Input Low Current[2]
µA
µA
µA
µA
IIH
IIL
Input High Current[2]
10
Input Low Current (SEL100/66#)
Input High Current (SEL100/66#)
–±
IIH
+±
Clock Outputs
VOL
VOH
Output Low Voltage
Output High Voltage
IOL = 1 mA
±0
mV
V
PCI_F, PCI1:±,
REF0:1
IOH = –1 mA
3.1
VOH
IOL
Output High Voltage
Output Low Current:
CPU0:1
IOH = –1 mA
VOL = 1.2±V
VOL = 1.±V
VOL = 1.±V
VOH = 1.2±V
VOH = 1.±V
VOH = 1.±V
2.2
80
70
±0
80
70
±0
V
CPU0:1
120
110
70
180
140
90
mA
mA
mA
mA
mA
mA
PCI_F, PCI1:±
REF0:1
IOH
Output High Current
CPU0:1
120
110
70
180
140
90
PCI_F, PCI1:±
REF0:1
Crystal Oscillator
VTH
X1 Input Threshold Voltage[3]
CLOAD
VDDQ3 = 3.3V
1.6±
14
V
Load Capacitance, As Seen by External Crystal[4]
X1 Input Capacitance[±]
pF
pF
CIN,X1
Pin X2 unconnected
28
Notes:
1. All clock outputs loaded with 6" 60: transmission lines with 20-pF capacitors.
2. CPU_STOP#, PCI_STOP#, PWR_DWN#, SPREAD#, and SEL48# logic inputs have internal pull-up resistors (not CMOS level).
3. X1 input threshold voltage (typical) is V /2.
DD
Rev 1.0,November 24, 2006
Page ± of 8
W137
DC Electrical Characteristics: (continued)
TA = 0°C to +70°C; VDDQ3 = 3.3V±±%; VDDQ2 = 2.±V±±%; CPU0:1 = 66.6/100 MHz
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Pin Capacitance/Inductance
CIN
Input Pin Capacitance
Except X1 and X2
±
6
7
pF
pF
nH
COUT
LIN
Output Pin Capacitance
Input Pin Inductance
AC Electrical Characteristics
TA = 0°C to +70°C; VDDQ3 = 3.3V 5%; VDDQ2 = 2.5V 5%; fXTL = 14.31818 MHz
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the
clock output.
CPU Clock Outputs, CPU0:1 (Lump Capacitance Test Load = 20 pF)
CPU = 66.6 MHz
CPU = 100 MHz
Parameter
tP
Description
Period
Test Condition/Comments
Measured on rising edge at 1.2±V
Duration of clock cycle above 2.0V
Duration of clock cycle below 0.4V
Min. Typ. Max. Min.
Typ. Max. Unit
1±
±.2
±.0
1
1±.±
10
3.0
2.8
1
10.± ns
tH
tL
High Time
Low Time
ns
ns
tR
tF
tD
OutputRiseEdgeRate Measured from 0.4V to 2.0V
Output Fall Edge Rate Measured from 2.0V to 0.4V
4
4
4
4
V/ns
V/ns
%
1
1
Duty Cycle
Measured on rising and falling edge at 4±
1.2±V
±±
4±
±±
tJC
Jitter, Cycle-to-Cycle Measured on rising edge at 1.2±V.
Maximum difference of cycle time
between two adjacent cycles.
200
200
ps
tSK
fST
Output Skew
Measured on rising edge at 1.2±V
17±
3
17±
3
ps
Frequency Stabili-
Assumes full supply voltage reached
ms
zation from Power-up within1msfrompower-up. Shortcycles
(cold start) exist prior to frequency stabilization.
Zo
AC Output Impedance Average value during switching
transition. Used for determining series
termination value.
13.±
13.±
:
Notes:
4. The W137 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is 14 pF;
this includes typical stray capacitance of short PCB traces to crystal.
±. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
Rev 1.0,November 24, 2006
Page 6 of 8
W137
PCI Clock Outputs, PCI1:5 and PCI_F (Lump Capacitance Test Load = 30 pF)
CPU = 66.6/100 MHz
Parameter
tP
Description
Period
Test Condition/Comments
Measured on rising edge at 1.±V
Min.
Typ.
Max.
Unit
30
ns
tH
tL
tR
tF
tD
tJC
tSK
tO
fST
High Time
Low Time
Duration of clock cycle above 2.4V
Duration of clock cycle below 0.4V
12.0
12.0
1
ns
ns
Output Rise Edge Rate Measured from 0.4V to 2.4V
Output Fall Edge Rate Measured from 2.4V to 0.4V
4
4
V/ns
V/ns
%
1
Duty Cycle
Measured on rising and falling edge at 1.±V
4±
±±
2±0
Jitter, Cycle-to-Cycle
Measured on rising edge at 1.±V. Maximum difference
of cycle time between two adjacent cycles.
ps
Output Skew
Measured on rising edge at 1.±V
±00
4.0
ps
ns
CPU to PCI Clock Offset Covers all CPU/PCI outputs. Measured on rising edge
at 1.±V. CPU leads PCI output.
1.±
Frequency Stabilization Assumes full supply voltage reached within 1 ms from
power-up. Short cycles exist prior to frequency stabili-
zation.
3
ms
from Power-up (cold
start)
Zo
AC Output Impedance Average value during switching transition. Used for
determining series termination value.
20
:
REF0:1 Clock Output (Lump Capacitance Test Load = 20 pF)
CPU = 66.6/100 MHz
Parameter
Description
Frequency, Actual
Output Rise Edge Rate
Output Fall Edge Rate
Duty Cycle
Test Condition/Comments
Determined by crystal oscillator frequency
Measured from 0.4V to 2.4V
Min.
14.318
0.±
Max.
Typ.
Unit
MHz
V/ns
V/ns
%
f
tR
2
2
tF
Measured from 2.4V to 0.4V
0.±
tD
Measured on rising and falling edge at 1.±V
4±
±±
3
fST
Frequency Stabilization from Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to
frequency stabilization.
ms
Power-up (cold start)
Zo
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
2±
:
48 MHz and 24 MHz Clock Outputs (Lump Capacitance Test Load = 20 pF)
CPU = 66.6/100 MHz
Parameter
Description
Test Condition/Comments
Min.
Typ.
Max. Unit
f
Frequency, Actual
Determined by PLL divider ratio (see n/m below)
48.008
24.004
MHz
fD
Deviation from 48 MHz
PLL Ratio
(48.008 – 48)/48
+167
ppm
m/n
tR
(14.31818 MHz x ±7/17 = 48.008 MHz)
Measured from 0.4V to 2.4V
±7/17, ±7/34
Output Rise Edge Rate
Output Fall Edge Rate
Duty Cycle
0.±
0.±
4±
2
2
V/ns
V/ns
%
tF
Measured from 2.4V to 0.4V
tD
Measured on rising and falling edge at 1.±V
±±
3
fST
FrequencyStabilizationfrom Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to frequency
stabilization.
ms
Power-up (cold start)
Zo
AC Output Impedance
Average value during switching transition. Used for
determining series termination value.
2±
:
Rev 1.0,November 24, 2006
Page 7 of 8
W137
Ordering Information
Part Number
W137H
Type
Production Flow
Commercial, 0 to 70°C
Commercial, 0 to 70°C
28-pin SSOP
W137HT
28-pin SSOP -Tape and Reel
Lead-Free
CYW137OXC
CYW137OXCT
28-pin SSOP
Commercial, 0 to 70°C
Commercial, 0 to 70°C
28-pin SSOP -Tape and Reel
Package Diagrams
28-Lead (5.3 mm) Shrunk Small Outline Package O28
1.14 DIA.
PIN 1 ID.
1.14
1
14
1.14
7.50
8.10
DIMENSIONS IN MILLIMETERS MIN.
MAX.
15
28
10.00
10.40
SEATING PLANE
.235 MIN.
GAUGE PLANE
0° MIN.
0.65 BSC.
2.00
MAX.
1.65
1.85
0.25
0.10
0.05
5.00
5.60
0°-8°
0.21
0.22
0.38
1.25 REF.
0.55
0.95
While SLI has reviewed all information herein for accuracy and reliability, Spectra Linear Inc. assumes no responsibility for the use of any cir-
cuitry or for the infringement of any patents or other rights of third parties which would result from each use. This product is intended for use in
normal commercial applications and is not warranted nor is it intended for use in life support, critical medical instruments, or any other applica-
tion requiring extended temperature range, high reliability, or any other extraordinary environmental requirements unless pursuant to additional
processing by Spectra Linear Inc., and expressed written agreement by Spectra Linear Inc. Spectra Linear Inc. reserves the right to change any
circuitry or specification without notice.
Rev 1.0, November 24, 2006
Page 8 of 8
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