EGP10B [SSC]

Glass Passivated Junction Fast Efficient Rectifiers; 玻璃钝化结快速高效整流器
EGP10B
型号: EGP10B
厂家: SILICON STANDARD CORP.    SILICON STANDARD CORP.
描述:

Glass Passivated Junction Fast Efficient Rectifiers
玻璃钝化结快速高效整流器

二极管
文件: 总3页 (文件大小:276K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
EGP10D  
Glass Passivated Junction  
Fast Efficient Rectifiers  
PRODUCT SUMMARY  
Reverse Voltage 50 to 400 Volts  
Forward Current 1.0 Ampere  
FEATURES  
Cavity-free glass-passivated junction  
Ultrafast reverse recovery time  
Low forward voltage drop  
Low leakage current  
Low switching losses, high efficiency  
High forward surge capability  
Solder Dip 260 °C, 40 seconds  
MECHANICAL DATA  
Case: DO-204AL, molded epoxy over glass body Epoxy meets  
UL-94V-0 Flammability rating  
Terminals: Matte tin plated leads, solderable per J-STD-002B  
and JESD22-B102D  
E3 suffix for commercial grade, HE3 suffix for high reliability  
grade (AEC Q101 qualified)  
Polarity: Color band denotes cathode end  
Weight: 0.012 ounce, 0.34 gram  
Pb-free; RoHS-compliant  
07/11/2007 Rev.1.00  
www.SiliconStandard.com  
1
EGP10D  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Rating at 25 oC ambient temperature unless otherwise specified.  
EGP  
10A  
EGP  
10B  
EGP  
10C  
EGP  
10D  
EGP  
10F  
EGP  
10G  
Parameter  
Symbol  
Unit  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
VRRM  
VRMS  
VDC  
50  
35  
50  
100  
70  
150  
105  
150  
200  
140  
200  
300  
210  
300  
400  
280  
400  
Volts  
Volts  
Volts  
Maximum DC blocking voltage  
100  
Maximum average forward rectified current  
0.375" (9.5mm) lead length at TA=55oC  
IF(AV)  
1.0  
Amp  
Peak forward surge current 8.3ms single half sine-wave  
superimposed on rated load (JEDEC Method)  
IFSM  
VF  
IR  
30.0  
Amps  
Volts  
uA  
Maximum instantaneous forward voltage at 1.0A  
0.95  
22.0  
1.25  
15.0  
Maximum DC reverse current  
at rated DC blocking voltage  
@TA=25oC  
5.0  
100  
@TA=125oC  
Maximum reverse recovery time at IF = 0.5 A, IR = 1.0 A,  
rr = 0.25 A  
nS  
trr  
50  
I
pF  
oC/W  
oC  
Typical junction capacitance at 4.0 V, 1 MHz  
Typical thermal resistance (Note 1)  
CJ  
RθJA  
50.0  
Operating junction and storage temperature range  
TJ, TSTG  
-55 to +150  
Notes:  
1. Thermal resistance from junction to ambient at 0.375"(9.5mm) lead length  
2. Pulse test: 300us pulse width, 1% duty cycle  
07/11/2007 Rev.1.00  
www.SiliconStandard.com  
2
EGP10D  
RATINGS AND CHARACTERISTIC CURVES  
(TA=25oC unless otherwise noted)  
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no  
guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no  
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its  
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including  
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to  
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of  
Silicon Standard Corporation or any third parties.  
07/11/2007 Rev.1.00  
www.SiliconStandard.com  
3

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