SS19 [SSC]

Schottky Barrier Rectifiers; 肖特基势垒整流器器
SS19
型号: SS19
厂家: SILICON STANDARD CORP.    SILICON STANDARD CORP.
描述:

Schottky Barrier Rectifiers
肖特基势垒整流器器

二极管
文件: 总3页 (文件大小:193K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SS12 thru SS115  
Schottky Barrier Rectifiers  
PRODUCT SUMMARY  
1.0AMP Surface Mount  
SMA/DO-214AC  
FEATURES  
For surface mounted application  
Easy pick and place ꢀ  
Metal to silicon rectifier, majority carrier conduction ꢀ  
Low power loss, high efficiency ꢀ  
High current capability, low VF ꢀ  
High surge current capability ꢀ  
Plastic material used carriers Underwriters  
Laboratory Classification 94V-0 ꢀ  
Epitaxial construction ꢀ  
High temperature soldering:  
260 oC / 10 seconds at terminals  
Dimensions in inches and (millimeters)  
MECANICAL DATA  
Case: JEDEC SMA/DO-214AC Molded plastic ꢀ  
Terminals: Pure tin plated, lead free ꢀ  
Polarity: Indicated by cathode band ꢀ  
Packaging: 12mm tape per EIA STD RS-481 ꢀ  
Weight: 0.066 gram  
Pb-free; RoHS-compliant  
12/12/2007 Rev.1.00  
www.SiliconStandard.com  
1
SS12 thru SS115  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
o
Ratings at 25 C ambient temperature unless otherwise specified.  
Single phase, half wave, 60 Hz, resistive or inductive load.  
For capacitive load, derate current by 20%  
Symbol SS SS SS SS SS SS SS SS  
Type Number  
Units  
12  
20  
14  
20  
13  
30  
21  
30  
14  
40  
28  
40  
15  
50  
35  
50  
16  
60  
42  
60  
19 110 115  
90 100 150  
Maximum Recurrent Peak Reverse Voltage  
Maximum RMS Voltage  
V
V
V
VRRM  
VRMS  
VDC  
63  
70 105  
Maximum DC Blocking Voltage  
90 100 150  
Maximum Average Forward Rectified Current  
at TL(See Fig. 1)  
Peak Forward Surge Current, 8.3 ms Single  
Half Sine-wave Superimposed on Rated  
Load (JEDEC method )  
1.0  
30  
A
I(AV)  
A
IFSM  
Maximum Instantaneous Forward Voltage  
(Note 1)  
IF= 1.0A @ 25oC  
@ 100oC  
0.5  
0.4  
0.75  
0.65  
0.80  
0.70  
0.1  
2.0  
5.0  
0.95  
0.85  
VF  
IR  
V
Maximum DC Reverse Current @ TA =25 oC at  
Rated DC Blocking Voltage @ TA=125 oC  
0.4  
mA  
mA  
10  
5.0  
Maximum DC Reverse Current at VR=33V  
& TA=50 oC  
Typical Junction Capacitance (Note 3)  
-
uA  
pF  
HTIR  
Cj  
50  
Typical Thermal Resistance ( Note 2 )  
R
28  
88  
oC/W  
ΘJL  
R
θJA  
TJ  
Operating Temperature Range  
Storage Temperature Range  
-65 to +125  
-65 to +150  
-65 to +150  
oC  
oC  
TSTG  
Notes:  
1. Pulse Test with PW=300 usec, 1% Duty Cycle  
2. Measured on P.C.Board with 0.2” x 0.2” (5.0mm x 5.0mm) Copper Pad Areas.  
3. Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.  
12/12/2007 Rev.1.00  
www.SiliconStandard.com  
2
SS12 thru SS115  
RATINGS AND CHARACTERISTIC CURVES  
FIG.1- MAXIMUM FORWARD CURRENT DERATING  
CURVE  
FIG.2- MAXIMUM NON-REPETITIVE FORWARD  
SURGE CURRENT  
1.0  
0.5  
0
50  
40  
RESISTIVE OR  
INDUCTIVE LOAD  
AT RATED TL  
8.3ms Single Half Sine Wave  
JEDEC Method  
SS12- SS14  
SS15-SS115  
30  
20  
10  
0
PCB MOUNTED ON 0.2X0.2"  
(5.0X5.0mm) COPPER PAD AREAS  
1
10  
NUMBER OF CYCLES AT 60Hz  
100  
50  
60  
70  
80  
90 100 110 120 130 140 150 160 170  
LEAD TEMPERATURE. (oC)  
FIG.4- TYPICAL REVERSE CHARACTERISTICS  
FIG.3- TYPICAL FORWARD CHARACTERISTICS  
SS19-SS110  
100  
50  
10  
SS12-SS14  
SS15-SS115  
SS15-SS16  
SS12-SS14  
10  
1
Tj=1250C  
1
SS115  
Tj=750C  
0.1  
0.01  
0.1  
Tj=25OC  
PULSE WIDTH=300  
1% DUTY CYCLE  
S
0.001  
0.01  
0
20  
40  
60  
80  
100  
120  
140  
0
.2  
.4  
.6  
.8  
1.0  
1.2  
1.4  
1.6  
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)  
FORWARD VOLTAGE. (V)  
FIG.6- TYPICAL TRANSIENT THERMAL  
CHARACTERISTICS  
FIG.5- TYPICAL JUNCTION CAPACITANCE  
100  
10  
1
400  
100  
Tj=250C  
f=1.0MHz  
Vsig=50mVp-p  
SS12-SS14  
SS15-SS16  
SS19-SS115  
10  
0.1  
0.1  
1.0  
10  
100  
1
0.01  
0.1  
10  
100  
REVERSE VOLTAGE. (V)  
T, PULSE DURATION. (sec)  
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no  
guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no  
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its  
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including  
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to  
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of  
Silicon Standard Corporation or any third parties.  
12/12/2007 Rev.1.00  
www.SiliconStandard.com  
3

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