SS8026 [SSC]

1.8V 1A Positive Voltage Regulator; 1.8V 1A正电压稳压器
SS8026
型号: SS8026
厂家: SILICON STANDARD CORP.    SILICON STANDARD CORP.
描述:

1.8V 1A Positive Voltage Regulator
1.8V 1A正电压稳压器

稳压器
文件: 总12页 (文件大小:283K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SS8026  
1.8V 1A Positive Voltage Regulator  
Features  
General Description  
Output current in excess of 1A  
The SS8026 positive 1.8V voltage regulator features  
the ability to source 1A of output current. The typical  
quiescent current is 0.48mA.  
Output voltage accuracy +2.5%/-2%  
Quiescent current typically 480µA  
Internal short-circuit current-limit  
Internal over-temperature protection  
Familiar regulator features such as over-temperature  
and over-current protection circuits are provided to  
prevent it from being damaged by abnormal operating  
conditions.  
Applications  
PC motherboard  
ADSL/Cable Modem  
Set-Top Box  
LAN switch/Hub  
Broadband/Router  
Ordering Information  
SS8026XXXXX  
Packing Type  
Pin Option  
Package Type  
PACKAGE TYPE  
T2 : SOT-89  
PIN OPTION  
PACKING  
TR : Tape & Reel  
TB : Tubes  
1
2
GND  
VIN  
3
T3 : TO 220  
1 : VOUT  
2 : VOUT  
3 : GND  
4 : GND  
5 : VIN  
VIN  
T4 : TO 252  
GND  
VIN  
T5 : TO-263  
VOUT  
VIN  
T6 : SOT-223  
VOUT  
VOUT  
GND  
GND  
VOUT  
6 : VIN  
Typical Application  
[Note 4] : Type of COUT  
Pin Configuration  
IO  
Top View  
VIN  
VOUT  
Top View  
Top View  
SS8026  
C1  
1µF  
COUT  
10µF  
IQ  
1
2
3
1
2
3
3
1
2
TO-220  
TO-252 and TO-263  
SOT-223 and SOT-89  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
1 of 12  
SS8026  
Absolute Maximum Ratings  
(Note 1)  
Input Voltage………………...................................................................……………………..…..…7V  
Power Dissipation Internally Limited…....................................................................  
Maximum Junction Temperature….......................................................……………............…..150°C  
Storage Temperature Rang…........................................................................................-65°C £ TJ £+150°C  
Lead Temperature, Time for Wave Soldering  
(Note 2)  
SOT 223 Package……………….…….......................................................................………..260°C, 4s  
Continuous Power Dissipation (TA = +25°C)  
SOT 89(1)……………………......................................................................………………..….…0.5W  
SOT 223(1)……………...................................................................………...……………….…....0.8W  
TO 252(1)……………………….................................................................................................................………………………………………………….1.0W  
Note (1): See Recommended Minimum Footprint  
Operating Conditions  
(Note 1)  
Input Voltage……………………........................................................................……………..2.7V~6.5V  
Temperature Range…………..........................................................................................…0°C £ TJ £125°C  
Electrical Characteristics  
VIN =3.3V, IO = 1A, C = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]  
IN  
PARAMETER  
Output Voltage  
Line Regulation  
Load Regulation  
Output Impedance  
Quiescent Current  
Ripple Rejection  
CONDITIONS  
MIN  
1.764  
TYP  
1.800  
3
30  
80  
MAX UNITS  
10mA < IO < 1A  
1.845  
V
3V < VIN < 6.5V, IO = 10mA  
10mA < IO < 1A  
200mA DC and 100mA AC, fo = 120Hz  
VIN = 3.3V  
30  
50  
mV  
mV  
mW  
µA  
480  
53  
fi = 120Hz,Vripple =1VP-P, Io = 100mA  
dB  
880  
895  
950  
1160  
IO = 0A  
IO = 100mA  
IO = 500mA  
IO = 1A  
Dropout Voltage  
mV  
Minimum footprint  
(0.0625 square inch)  
Mounted on 0.53  
square inch pcb area  
Mounted on 0.16  
square inch pcb area  
VIN = 3V(SOT 223)  
Continuous Test,  
660  
1
mA  
A
Output Current  
TA = 25°C, T 150°C,  
VIN = 3.3V(SOT 223)  
J
VOUT within ±2%  
VIN = 3.3V(SOT 89)  
0.5  
A
Short Circuit Current  
Over Temperature  
1.6  
150  
A
°C  
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions  
are conditions under which the device functions but the specifications might not be guaranteed. For guaran-  
teed specifications and test conditions see the Electrical Characteristics.  
The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal re-  
sistance, qJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-  
perature is Tjmax-TA / qJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the IC will  
go into thermal shutdown. For the SS8026 in SOT 89 package, qJA is 250°C/W. For the SS8026 in SOT 223  
package, qJA is 156°C/W; in TO 252 package, qJA is 125°C/W. (See recommend minimum footprint). The safe  
operation in SOT 89, SOT 223, TO 252 package, can be seen in “Typical Performance Characteristics” (Safe  
Operating Area).  
Note 1:  
Note2:  
Note3: Low duty pulse techniques are used during test to maintain junction temperatures as close to ambient as  
possible.  
Note4: The output capacitor should be a tantalum or aluminum type.  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
2 of 12  
SS8026  
Definitions  
Dropout Voltage  
Load Regulation  
The input/output voltage differential at which the regu-  
lator output no longer maintains regulation against fur-  
ther reductions in input voltage. Measured when the  
output drops 100mV below its nominal value. Dropout  
voltage is affected by junction temperature, load cur-  
rent and minimum input supply requirements.  
The change in output voltage for a change in load cur-  
rent at constant chip temperature. The measurement is  
made under conditions of low dissipation or by using  
pulse techniques such that the average chip temperature  
is not significantly affected.  
Maximum Power Dissipation  
Line Regulation  
The maximum total device dissipation under which the  
regulator will operate within specifications.  
The change in output voltage for a change in input volt-  
age. The measurement is made under conditions of  
low dissipation or by using pulse techniques such that  
the average chip temperature is not significantly affected.  
Quiescent Bias Current  
Current which is used to operate the regulator chip and  
is not delivered to the load.  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
3 of 12  
SS8026  
Typical Performance Characteristics  
(VIN= +3.3V, C =1µF, COUT=10µF, TA=25°C, unless otherwise noted.)  
IN  
Output Voltage vs. Load Current  
Dropout Voltage vs. Load Current  
1.900  
1.880  
1.860  
1.840  
1.820  
1.800  
1.780  
1.760  
1.740  
1.720  
1.700  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
0
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
Load Current (mA)  
Load Current (mA)  
Line Transient  
Ground Current vs. Load Current  
2.00  
1.80  
1.60  
1.40  
1.20  
1.00  
0.80  
0.60  
0.40  
0.20  
0.00  
0
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
Load Current (mA)  
Line Transient  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
4 of 12  
SS8026  
Typical Performance Characteristics (continued)  
Load Transient  
Load Transient  
Load Transient  
Load Transient  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
5 of 12  
SS8026  
Safe Operating Area of SOT 223  
Maximum Power Dissipation of SOT 223  
1200  
1100  
1000  
900  
1.0  
0.9  
0.8  
1oz Copper on SOT-223 Package  
A=25°C,Still Air  
T
Mounted on recommended mimimum footprint (R JA=156°C/W)  
£
c
1oz Copper on SOT-223 Package  
Mounted on recommended mimimum footprint (R£ cJA=156°C/W)  
0.7  
0.6  
A=25°C,Still Air  
T
800  
700  
600  
500  
400  
300  
200  
100  
0
0.5  
TA=25  
TA=55  
¢
J
0.4  
0.3  
¢
J
J
TA=85¢  
0.2  
0.1  
0.0  
25  
35  
45  
55  
65  
75  
85  
95  
105  
115  
125  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6  
Amibent Temperature TA (°C)  
Input-Output Voltage Differential VIN-VOUT (V)  
Note: VIN(max) <= 6.5V  
Safe Operating Area of SOT-89  
[Power Dissipation Limit]  
Maximum Power Dissipation of SOT-89  
700  
600  
0.7  
Maximum recommended output current  
TA=25¢  
J
0.6  
TA=55  
¢
¢
J
J
TA=85  
500  
400  
0.5  
0.4  
1oz Copper on SOT-89 Package  
Mounted on recommended mimimum  
footprint (R£ cJA=250°C/W)  
300  
200  
100  
0
0.3  
0.2  
0.1  
1oz Copper on SOT-89 Package  
Mounted on recommended mimimum footprint  
(R£ JcA=250°C/W)  
0
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
2.8  
3.2  
3.6  
4.0  
4.4  
4.8  
25  
35  
45  
55  
65  
75  
85  
95  
105  
115  
125  
Input-Output Voltage Differential VIN - VOUT (V)  
Note: VIN(max) <= 6.5V  
Ambient Temperature (°C)  
Safe Operating Area of SOT 223  
1100  
Mounted on 1 square inch, 1oz copper pcb area (R£ cJA=70°C/W)  
1000  
900  
800  
700  
600  
A=25°C,Still Air  
T
Mounted on 0.53 square inch, 1oz  
copper pcb area (R£ cJA=85°C/W)  
500  
400  
300  
200  
100  
0
Mounted on recommend minimum footprint, 1oz copper pcb area  
(See Recommend minimum footprint) (R£ cJA=156°C/W)  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
2.2 2.4 2.6 2.8  
3
3.2 3.4 3.6 3.8  
4
4.2 4.4 4.6  
Input-Output Voltage Differential (V)  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
6 of 12  
SS8026  
Safe Operating Area of TO 252  
Maximum Power Dissipation of TO 252  
1400  
1.4  
Maximum recommended output current  
TA=25°C,Still Air  
Still Air  
1200  
1000  
1.2  
1oz Copper on TO-252 Package  
1oz Copper on TO-252 Package  
Mounted on recommend mimimum footprint  
Mounted on recommended mimimum  
(R£ cJA=125°C/W)  
1.0  
0.8  
£
c
footprint (R JA=125°C/W)  
800  
600  
TA=25¢ J  
¢ J  
0.6  
0.4  
TA=55  
TA=85¢ J  
400  
200  
0.2  
0.0  
0
25  
35  
45  
55  
65  
75  
85  
95  
105 115 125  
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8  
A
Amibent Temperature T ( )  
¢ J  
Input-Output Voltaage Differential VIN-VOUT (V)  
IN(max)  
Note: V  
<= 6.5V  
Recommend Minimum Footprint  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
7 of 12  
SS8026  
Package Information  
D
D1  
POLISH  
E
HE  
A1  
e
C
MATTE FINISH  
A
b
b
b1  
POLISH  
SOT-89 (T2) Package  
DIMENSIONS IN INCHES  
DIMENSIONS IN MILLIMETERS  
SYMBOLS  
MIN  
NOM  
1.50  
1.04  
0.42  
0.47  
0.40  
4.50  
1.60  
-----  
MAX  
MIN  
0.055  
0.031  
0.014  
0.016  
0.014  
0.173  
0.055  
-----  
NOM  
0.059  
0.041  
0.016  
0.018  
0.015  
0.177  
0.062  
-----  
MAX  
0.063  
A
A1  
b
1.40  
0.80  
0.36  
0.41  
038  
1.60  
-----  
0.48  
0.53  
0.43  
4.60  
1.75  
4.25  
2.60  
3.10  
-----  
0.048  
0.020  
0.017  
0.181  
0.069  
0.167  
0.102  
0.122  
b1  
C
D
4.40  
1.40  
-----  
2.40  
2.90  
D1  
HE  
E
2.50  
3.00  
0.094  
0.114  
0.098  
0.118  
e
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
8 of 12  
SS8026  
E
A
E1  
E1  
R
F
d
D
D1  
I
L
e
C
A1  
b
b1  
e1  
TO-220 (T3) Package  
MILLIMETERS  
INCHES  
SYMBOLS  
MIN  
4.318  
2.46  
MAX  
4.826  
2.72  
MIN  
0.170  
0.097  
0.027  
0.045  
0.012  
0.135  
0.336  
0.103  
0.390  
0.112  
0.090  
0.190  
0.045  
0.136  
0.535  
MAX  
0.190  
0.107  
0.037  
0.055  
0.018  
0.145  
0.356  
0.113  
0.410  
0.202  
0.110  
0.210  
0.055  
0.156  
0.565  
A
A1  
b
0.69  
0.94  
b1  
C
1.143  
0.304  
3.429  
8.53  
1.397  
0.460  
3.683  
9.04  
D
D1  
d
2.62  
2.87  
E
9.906  
2.84  
10.40  
5.13  
E1  
e
2.29  
2.79  
e1  
F
4.83  
5.33  
1.143  
3.454  
13.589  
1.397  
3.962  
14.351  
I
L
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
9 of 12  
SS8026  
E
A
F
E1  
L1  
H
D
L2  
A1  
L3  
q
b
e
C
e1  
TO-252 (T4) Package  
MILLIMETERS  
INCHES  
SYMBOL  
MIN.  
2.19  
0.89  
0.64  
0.46  
5.97  
6.35  
5.21  
MAX.  
2.38  
1.27  
0.89  
0.58  
6.22  
6.73  
5.46  
MIN.  
0.086  
0.035  
0.025  
0.018  
0.235  
0.250  
0.205  
MAX.  
0.094  
0.050  
0.035  
0.023  
0.245  
0.265  
0.215  
A
A1  
b
C
D
E
E1  
e
2.26BSC  
0.09BSC  
e1  
F
3.96  
0.46  
0.89  
0.64  
2.40  
9.40  
0°  
5.18  
0.58  
2.03  
1.02  
2.80  
10.40  
4°  
0.156  
0.018  
0.035  
0.025  
0.095  
0.370  
0°  
0.204  
0.023  
0.080  
0.040  
0.110  
0.410  
4°  
L1  
L2  
L3  
H
q
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
10 of 12  
SS8026  
A
E
A1  
L3  
D
H
C
L1  
e
L
L2  
A2  
e1  
b
b1  
TO-263 (T5) Package  
MILLIMETERS  
INCHES  
SYMBOLS  
MIN  
MAX  
4.70  
1.32  
2.69  
0.94  
1.40  
0.56  
9.652  
10.54  
2.79  
5.33  
15.78  
5.84  
1.778  
2.84  
MIN  
0.169  
0.048  
0.104  
0.027  
0.048  
0.014  
0.340  
0.382  
0.090  
0.190  
0.575  
0.185  
0.047  
0.088  
MAX  
0.185  
0.055  
0.106  
0.037  
0.055  
0.022  
0.380  
0.415  
0.110  
0.210  
0.625  
0.230  
0.070  
0.111  
A
A1  
A2  
b
4.30  
1.22  
2.45  
0.69  
1.22  
0.36  
8.64  
9.70  
2.29  
4.83  
14.60  
4.70  
1.20  
2.24  
b1  
C
D
E
e
e1  
H
L
L1  
L2  
L3  
1.40MAX  
0.055MAX  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
11 of 12  
SS8026  
A
D
a
B1  
C
13°(4X)  
H
E
L
L2  
e
e1  
13 °(4 X)  
A1  
B
SOT-223 (T6) Package  
MILLIMETERS  
INCHES  
SYMBOLS  
MIN  
MAX  
MIN  
MAX  
A
A1  
B
1.55  
1.80  
0.061  
0.0008  
0.024  
0.114  
0.009  
0.248  
0.130  
0.071  
0.02  
0.60  
2.90  
0.24  
6.30  
3.30  
0.12  
0.80  
3.10  
0.32  
6.70  
3.70  
0.0047  
0.031  
0.122  
0.013  
0.264  
0.146  
B1  
C
D
E
e
2.30 BSC  
4.60 BSC  
0.090 BSC  
0.181 BSC  
e1  
H
6.70  
0º  
7.30  
10º  
0.264  
0º  
0.287  
10º  
L
0.90 MIN  
0.036 MIN  
L2  
a
0.06 BSC  
0.0024 BSC  
Package Orientation on tape  
Feed Direction  
SOT 89, SOT-223 Package Orientation  
Feed Direction  
TO-252, TO-263 Package Orientation  
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no  
guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no  
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its  
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including  
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to  
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of  
Silicon Standard Corporation or any third parties.  
Rev.2.02 12/06/2003  
www.SiliconStandard.com  
12 of 12  

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