SS810-31GU [SSC]

3-Pin Microprocessor Reset Circuits; 3引脚微处理器复位电路
SS810-31GU
型号: SS810-31GU
厂家: SILICON STANDARD CORP.    SILICON STANDARD CORP.
描述:

3-Pin Microprocessor Reset Circuits
3引脚微处理器复位电路

微处理器 复位电路
文件: 总8页 (文件大小:307K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SS809/810G  
3-Pin Microprocessor Reset Circuits  
FEATURES  
DESCRIPTION  
Ultra-low supply current 1mA (typ.)  
Guaranteed reset valid to Vcc=0.9V  
Available in three output types:  
Open-drain active low (SS809N-xxGx)  
Push-pull active low (SS809-xxGx)  
Push-pull active high (SS810-xxGx)  
Power-on reset pulse width min. 140ms  
Internally fixed threshold 2.3V, 2.6V, 2.9V, 3.1V,  
4.0V, 4.4V, 4.6V  
The SS809G and SS810G are low-power microprocessor  
(µP) supervisory circuits used to monitor power supplies  
in µP and digital systems. They improve circuit reliability  
and reduce cost by eliminating external components.  
These devices provide valid signals in applications  
with Vcc ranging from 6.0V down to 0.9V. The reset  
signal lasts for a minimum period of 140mswhenever the  
VCC supply voltage falls below a preset threshold. Both  
the SS809G and SS810G were designed with a reset  
comparator to help identify invalid signals lasting less  
than 140ms. The only difference between the two  
devices is that one has an active-low RESET output  
and the other an active-high RESET output.  
Tight voltage threshold tolerance: 1.5%  
Packaged in RoHS-compliant SOT-23-3  
APPLICATIONS  
l Notebook Computers  
l Digital Still Cameras  
l PDAs  
l Critical Microprocessor Monitoring  
Low supply current (1mA) makes the SS809G and SS810G  
ideal for portable equipment. The devices are available in  
a SOT-23-3 package.  
TYPICAL APPLICATION CIRCUIT  
V
CC  
VCC  
VCC  
SS809G  
(SS810G)  
mP  
RESET  
INPUT  
RESET  
(RESET)  
GND  
GND  
Push-Pull Output  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
1 of 8  
SS809/810G  
ORDERING INFORMATION  
PIN CONFIGURATION  
SS809X-XXGU XX  
SS810 -XXGU XX  
SOT-23-3  
Packing type  
TR: Tape and reel  
TOP VIEW  
1: GND  
3
2: RESET (RESET)  
3: VCC  
1
2
Package type  
GU: RoHS-compliant Pb-free SOT-23-3  
Reset threshold voltage  
23: 2.3V  
26: 2.6V  
29: 2.9V  
31: 3.1V  
40: 4.0V  
44: 4.4V  
46: 4.6V  
Output type  
Default: Push-Pull type  
N: N-ch open-drain type  
Example: SS809-31GU TR  
à 3.1V, push-pull version in RoHS-compliant SOT-23-3 , shipped in tape and reel  
SOT-23 Part Marking  
Part No.  
Marking  
Part No.  
Marking  
Part No.  
Marking  
SS809-23GU  
SS809-26GU  
SS809-29GU  
SS809-31GU  
SS809-40GU  
SS809-44GU  
SS809-46GU  
RA23P  
RA26P  
SS809N-23GU  
SS809N-26GU  
SS809N-29GU  
SS809N-31GU  
SS809N-40GU  
SS809N-44GU  
SS809N-46GU  
RB23P  
RB26P  
SS810-23GU  
SS810-26GU  
SS810-29GU  
SS810-31GU  
SS810-40GU  
SS810-44GU  
SS810-46GU  
RD23P  
RD26P  
RA29P  
RA31P  
RA40P  
RA44P  
RA46P  
RB29P  
RB31P  
RB40P  
RB44P  
RB46P  
RD29P  
RD31P  
RD40P  
RD44P  
RD46P  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
2 of 8  
SS809/810G  
ABSOLUTE MAXIMUM RATINGS  
VCC  
-0.3V ~6.5V  
-0.3V ~ (VCC+0.3V)  
20mA  
RESET  
RESET,  
Input Current (VCC  
)
Output Current (RESET or RESET )  
Continuous Power Dissipation (TA = +70°C)  
Operating Junction Temperature Range  
Storage Temperature Range  
20mA  
320mW  
-40°C ~ 85°C  
- 65°C ~ 125°C  
260°C  
Lead Temperature (Soldering) 10 sec  
Note1: Any stress beyond the Absolute Maximum Ratings above may cause permanent damage to the device.  
TEST CIRCUIT  
3
2
Vin  
VCC  
RESET  
GND  
1
Iin  
SS809G  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
3 of 8  
SS809/810G  
ELECTRICAL CHARACTERISTICS  
(Typical values are at TA=25°C, unless otherwise specified.)  
PARAMETER  
TEST CONDITIONS  
MIN.  
TYP. MAX. UNIT  
SYMBOL  
VCC  
Operating Voltage Range  
Supply Current  
0.9  
6
V
ICC  
VCC = VTH +0.1V  
1
3
mA  
TA=+25°C  
2.265  
2.254  
2.561  
2.548  
2.857  
2.842  
3.054  
3.038  
3.940  
3.920  
4.334  
4.312  
4.531  
4.508  
2.3  
2.335  
2.346  
2.639  
2.652  
2.944  
2.958  
3.147  
3.162  
4.060  
4.080  
4.466  
4.488  
4.669  
4.692  
SS809-23  
SS809-26  
SS809-29  
TA= -40°C to +85°C  
TA=+25°C  
2.6  
2.9  
3.1  
4.0  
4.4  
4.6  
TA= -40°C to +85°C  
TA=+25°C  
TA= -40°C to +85°C  
TA=+25°C  
Reset Threshold  
VTH SS809-31  
SS809-40  
V
TA= -40°C to +85°C  
TA=+25°C  
TA= -40°C to +85°C  
TA=+25°C  
SS809-44  
TA= -40°C to +85°C  
TA=+25°C  
SS809-46  
TA=-40°C to +85°C  
VCC to Reset Delay  
TRD  
TRP  
VCC=VTH to (VTH -0.1V), VTH=3.1V  
20  
mS  
TA=+25°C  
VCC = VTH (MAX)  
140  
100  
230  
560  
Reset Active Timeout Period  
mS  
TA= -40°C to +85°C  
1030  
VOH VCC=VTH+0.1V, ISOURCE=1mA  
VOL VCC=VTH - 0.1V, ISINK=1mA  
0.8VCC  
RESET  
Output Voltage  
V
V
0.2Vcc  
0.2Vcc  
VOH  
VOL  
0.8VCC  
VCC=VTH-0.1V, ISOURCE=1mA  
VCC=VTH+0.1V, ISINK=1mA  
RESET Output Voltage  
RESET  
Note2:  
output is for the SS809G; RESET output is for the SS810G.  
Note3: Specifications for operating temperature ranges from -40°C to 85°C are guaranteed by Statistical Quality  
Controls (SQC), with no production testing.  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
4 of 8  
SS809/810G  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VTH=2.3V  
VTH=2.3V  
VOD=VTH-VCC  
VTH=3.1V  
VTH=4.6V  
VOD=50mV  
VOD=100mV  
VOD=200mV  
-40  
-20  
0
20  
40  
60  
80  
100  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
°
Temperature ( C)  
°
Temperature ( C)  
Fig 1 Supply Current vs. Temperature  
Fig 2 Power-Down Reset Delay vs. Temperature  
240  
220  
200  
180  
160  
140  
120  
100  
80  
VTH=3.1V  
VTH=4.6V  
VOD=50mV  
400  
300  
200  
100  
0
VOD=VTH-VCC  
VOD=VTH-VCC  
VOD=50mV  
VOD=100mV  
VOD=200mV  
60  
VOD=100mV  
VOD=200mV  
40  
20  
0
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
°
°
Temperature ( C)  
Temperature ( C)  
Fig 3 Power-Down Reset Delay vs. Temperature  
Fig 4 Power-Down Reset Delay vs. Temperature  
600  
500  
400  
300  
200  
100  
0
1.015  
1.010  
1.005  
1.000  
0.995  
0.990  
0.985  
VTH=4.6V  
VTH=3.1V  
VTH=4.6V  
VTH=3.1V  
VTH=2.3V  
VTH=2.3V  
-40  
-20  
0
20  
40  
60  
80  
100  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
°
°
Temperature ( C)  
Temperature ( C)  
Fig 5 Normalized Reset Threshold vs. Temperature  
Fig 6 Power-Up Reset Timeout vs. Temperature  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
5 of 8  
SS809/810G  
BLOCK DIAGRAM  
VCC  
R1  
R2  
Bandgap  
-
RESET  
+
Reset Generator  
NMOS  
GND  
N-ch Open-Drain Type  
VCC  
R1  
R2  
Bandgap  
-
Reset Generator  
RESET  
(RESET)  
+
GND  
Push-Pull Type  
PIN DESCRIPTIONS  
GND Pin  
:
Ground.  
RESET Pin (SS809G) : Active low output pin. RESET Output remains low while Vcc is below the reset  
RESET Pin (SS810G)  
:
:
Active high output pin. RESET output remains high while Vcc is below the reset threshold.  
Supply voltage.  
Vcc Pin  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
6 of 8  
SS809/810G  
DETAILED DESCRIPTIONS OF TECHNICAL TERMS  
threshold, and RESET remains low for the reset  
RESET OUTPUT  
timeout period.  
The µP will be activated at a valid reset state. These  
µP supervisory circuits assert reset to prevent code  
execution errors during power-up, power-down, or  
brownout conditions.  
BENEFITS OF HIGHLY ACCURATE RESET  
THRESHOLD  
The SS809G and SS810G with specified voltage as 5V±  
RESET is guaranteed to be a logic low for  
10% or 3V±10% are ideal for systems using a 5V±5%  
or 3V±5% power supply. The reset is guaranteed to  
assert after the power supply falls out of regulation,  
but before the power drops below the minimum  
specified operating voltage range of the system ICs.  
VTH>V >0.9V. Once V  
exceeds the reset  
CC  
CC  
threshold, an internal timer keeps RESET low for  
the reset timeout period; after this interval, RESET  
goes high.  
If a brownout condition occurs (V drops below the  
CC  
The pre-trimmed thresholds reduce the range over  
which an undesirable reset may occur.  
RESET  
reset threshold),  
goes low. Any time V  
CC  
goes below the reset threshold, the internal timer  
RESET  
resets to zero, and  
goes low. The internal  
timer is activated after V  
returns above the reset  
CC  
APPLICATION INFORMATION  
NEGATIVE-GOING VCC TRANSIENTS  
of 0.9V. However in applications where RESET  
In addition to issuing a reset to the µP during  
must be valid down to 0V, adding a pull-down resistor  
RESET  
to  
causes any leakage currents to flow to  
RESET  
power-up, power-down, and brownout conditions, the  
SS809G series are relatively resistant to short-duration  
negative-going VCC transients.  
ground, holding  
low.  
INTERFACING TO A MICROPROCESSOR WITH  
BIDIRECTIONAL RESET PINS  
ENSURING A VALID RESET OUTPUT DOWN TO  
VCC=0  
RESET  
The  
output on the SS809N is open drain,  
and this device interfaces easily with µPs that have  
bidirectional reset pins. Connecting the mP  
When VCC falls below 0.9V, the SS809G RESET  
output no longer sinks current; it becomes an open  
circuit. In this case, high-impedance CMOS logic  
RESET  
supervisor’s  
microcontroller’s  
output directly to the  
pin with a single pull-up  
RESET  
inputs connected to  
can drift to  
RESET  
undetermined voltages. Therefore, the SS809G/810G  
are perfect for most CMOS applications down to VCC  
resistor allows either device to assert reset.  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
7 of 8  
SS809/810G  
PHYSICAL DIMENSIONS  
SOT-23-3 (unit: mm)  
C
SYMBOL  
MIN  
1.00  
MAX  
D
A
A1  
A2  
b
1.30  
L
0.10  
0.70  
0.35  
0.10  
2.70  
1.40  
0.90  
E
H
0.50  
C
0.25  
q
1
e
D
3.10  
E
1.80  
A
e
1.90 (TYP)  
A2  
H
2.60  
0.37  
1°  
3.00  
A1  
L
b
q1  
9°  
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no  
guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no  
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its  
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including  
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to  
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of  
Silicon Standard Corporation or any third parties.  
9/20/2006 Rev.3.01  
www.SiliconStandard.com  
8 of 8  

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