SFF3810Q [SSDI]

Power Field-Effect Transistor, 60A I(D), 75V, 0.003ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, MODIFIED TO-258, 3 PIN;
SFF3810Q
型号: SFF3810Q
厂家: SOLID STATES DEVICES, INC    SOLID STATES DEVICES, INC
描述:

Power Field-Effect Transistor, 60A I(D), 75V, 0.003ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, MODIFIED TO-258, 3 PIN

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SFF3810 Series  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
350 AMP , 75 Volts, 2.5 m  
Avalanche Rated N-channel  
TrenchFET  
DESIGNER’S DATA SHEET  
Part Number / Ordering Information 1/  
SFF3810 ___ ___ ___  
Screening 2/  
__ = Not Screened  
TX = TX Level  
TXV = TXV Level  
S = S Level  
Features:  
Rugged poly-Si gate  
Lowest ON-resistance in the industry  
Avalanche rated  
Hermetically Sealed, Isolated Package  
Low Total Gate Charge  
Fast Switching  
Lead Option 3/  
__ = Straight Leads  
DB = Down Bend  
UB = Up Bend  
Package 3/ 4/  
TX, TXV, S-Level screening available  
Improved (RDS(ON) QG) figure of merit  
Q = TO-258 modified  
E = MILPACK III  
Maximum Ratings5/  
Symbol  
VDSS  
Value  
Units  
V
Drain - Source Voltage  
75  
+ 20  
+ 30  
continuous  
transient  
Gate – Source Voltage  
VGS  
ID1  
V
A
A
Max. Continuous Drain Current (package  
limited)  
60  
@ TC = 25ºC  
@ TC = 25ºC  
@ TC = 125ºC  
ID2  
ID3  
350  
150  
Max. Instantaneous Drain Current (Tj limited)  
Max. Avalanche current  
@ L= 0.1 mH  
@ L= 0.1 mH  
@ TC = 25ºC  
IAR  
EAS  
200  
3000  
A
mJ  
W
Single and Repetitive Avalanche Energy  
Total Power Dissipation  
600  
PD  
Operating & Storage Temperature  
-55 to 175  
ºC  
TOP & TSTG  
Maximum Thermal Resistance  
(Junction to Case)  
RθJC  
0.5  
ºC/W  
NOTES:  
MILPACK III (E)  
TO-258 modified (Q)  
*Pulse Test: Pulse Width = 300µsec, Duty Cycle = 2%.  
1/ For ordering information, price, and availability - contact  
factory.  
2/ Screening based on MIL-PRF-19500. Screening flows  
available on request.  
3/ For lead bending options / pinout configurations - contact  
factory.  
4/ Maximum current limited by package configuration  
5/ Unless otherwise specified, all electrical characteristics  
@25oC.  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: FT0051A  
DOC  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
SFF3810 Series  
Electrical Characteristics5/  
Symbol Min  
Typ Max Units  
Drain to Source Breakdown Voltage  
V
GS = 0V, ID = 3 mA  
BVDSS  
75  
80  
––  
V
Drain to Source On State  
Resistance  
V
V
GS = 10V, ID = 125A, Tj= 25oC  
––  
––  
––  
2.5  
2
5
3
-
––  
GS = 15V, ID = 125A, Tj=25oC RDS(on)  
m  
VGS = 10V, ID = 125A, Tj= 175oC  
VDS = VGS, ID = 8.0mA, Tj= 25oC  
VDS = VGS, ID = 8.0mA, Tj= 125oC  
VDS = VGS, ID = 8.0mA, Tj= -55oC  
2.5  
1.5  
––  
3.6  
3.0  
5
5.0  
––  
6
Gate Threshold Voltage  
Gate to Source Leakage  
VGS(th)  
V
VGS = ±20V, Tj= 25oC  
––  
––  
10  
30  
±200  
––  
IGSS  
nA  
VGS = ±20V, Tj= 125oC  
VDS = 75V, VGS = 0V, Tj = 25oC  
VDS = 75V, VGS = 0V, Tj = 150oC  
––  
––  
0.06  
150  
25  
2000  
μA  
μA  
Zero Gate Voltage Drain Current  
Forward Transconductance  
IDSS  
gfs  
V
DS = 10V, ID = 60A, Tj = 25oC  
65  
100  
––  
Mho  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain Charge  
V
GS = 10V  
Qg  
Qgs  
Qgd  
––  
––  
––  
550  
180  
140  
––  
––  
––  
V
DS = 37.5V  
ID = 200A  
nC  
Turn on Delay Time  
Rise Time  
Turn off Delay Time  
Fall Time  
V
GS = 10V  
td(on)  
tr  
td(off)  
tf  
––  
––  
––  
––  
50  
40  
80  
40  
––  
––  
––  
––  
V
DS = 37.5V  
ID = 200A  
RG = 1.0, pw= 3us  
nsec  
V
Diode Forward Voltage  
IF = 100A, VGS = 0V  
VSD  
––  
0.90  
1.25  
trr1  
Irm1  
Qrr1  
––  
––  
––  
150  
7
360  
––  
––  
––  
nsec  
A
nC  
Diode Reverse Recovery Time  
Reverse Recovery Charge  
IF = 150A, di/dt = 100A/usec  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
V
V
GS = 0V  
DS = 25V  
f = 1 MHz  
Ciss  
Coss  
Crss  
––  
––  
––  
41  
4.15  
530  
––  
––  
––  
nF  
nF  
pF  
MILPACK III (E)  
TO-258 mod (Q)  
TOLERANCES: .XXX ± .010  
PIN ASSIGNMENT (Standard)  
Package  
TO-258 mod  
MILPACK III  
Drain  
Pin 1  
Pin 1  
Source  
Pin 2  
Pin 2  
Gate  
Pin 3  
Pin 3  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: FT0051A  
DOC  

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