CX1HGSM5-250.0M,100/50/-/C [STATEK]
Parallel - Fundamental Quartz Crystal, 250MHz Nom, LEAD FREE, HERMETIC SEALED, MINIATURE, LEADLESS, CERAMIC PACKAGE-2;
| 型号： | CX1HGSM5-250.0M,100/50/-/C |
| 厂家： | 
STATEK CORPORATION |
| 描述： | Parallel - Fundamental Quartz Crystal, 250MHz Nom, LEAD FREE, HERMETIC SEALED, MINIATURE, LEADLESS, CERAMIC PACKAGE-2 |
| 文件： | 总2页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CX1HGSM AT CRYSTAL
6 MHz to 250 MHz
High Shock Miniature Surface Mount AT Quartz Crystal
Fundamental Mode: 6 MHz - 250 MHz
DESCRIPTION
STATEK’s miniature CX1HGSM AT crystals in leadless
ceramic packages are designed for surface mounting on
printed circuit boards or hybrid substrates. These rugged
crystals are designed for applications requiring exceptional
shock and vibration survival.
X
X
X
X
S
glass lid
FEATURES
ceramic lid
High shock and vibration resistance
Designed for surface mount applications using
infrared, vapor phase, or epoxy mount techniques
PACKAGE DIMENSIONS
Low profile hermetically sealed ceramic package
Available with glass or ceramic lid
Custom designs available
D
TOP
BOTTOM
Full military testing available
A
Designed and manufactured in the USA
APPLICATIONS
E
D
Industrial
E
B
Down-hole Data Recorder
Process Control
C
Environmental Control
Engine Control
TYPICAL
MAXIMUM
Telemetry
DIM
A
inches
0.315
0.140
-
mm
8.00
3.56
-
inches
mm
8.38
3.94
Ruggedized Instrumentation
Automotive Control
Military & Aerospace
Smart Munitions
0.330
0.155
B
C
see below
D
0.045
0.060
1.14
1.52
0.055
0.070
1.40
1.78
E
Timing Devices (Fuzes)
Surveillance Devices
Missile Telemetry
THICKNESS (DIM C) MAXIMUM
Ruggedized Communications
Aviation Equipment
GLASS LID
CERAMIC LID
inches
mm
1.65
1.70
1.78
inches
0.070
0.072
0.075
mm
1.78
1.83
1.90
SM1
0.065
0.067
0.070
SM2/SM4
SM3/SM5
10108 - Rev C
E
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Designation Termination
SM1
SM2
SM3
SM4
SM5
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Fundamental Frequency
Motional Resistance R1 (
10 MHz 32 MHz 155.52 MHz
!)
30
5.5
100
2.2
25
6.2
30
15
4.0
30
Motional Capacitance C1 (fF)
Quality Factor Q (k)
Shunt Capacitance C0 (pF)
2.3
2.3
Max Process Temperature 260OC for 20 sec.
Calibration Tolerance1
Load Capacitance2
+_ 100 ppm, or tighter as required
20 pF for f " 50 MHz
SUGGESTED LAND PATTERN
10 pF for f > 50 MHz
0.070 (1.78)
Drive Level
500
µW MAX for f " 50 MHz
200
µ
W MAX for f > 50 MHz
+
+
_
Frequency-Temperature
Stability1,3
_ 50 ppm to 10 ppm (Commercial)
0.160 (4.06)
+
+
_
_ 100 ppm to 20 ppm (Industrial)
+
+
_
_ 100 ppm to 30 ppm (Military)
Aging, first year4
10 ppm MAX
inches (mm)
0.270 (6.86)
Shock, survival5
10,000 g, 0.2 ms, 1/2 sine
20 g, 10-2,000 Hz swept sine
Vibration, survival6
EQUIVALENT CIRCUIT
Operating Temp. Range
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
C0
-55OC to +125OC.
1
L1
C1
R1
2
Storage Temp. Range
Max Process Temperature 260OC for 20 sec.
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
1. Other tolerances available. Contact factory.
2. Unless specified otherwise.
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher
frequencies contact factory.
PACKAGING OPTIONS
5. Up to 100,000 g. Contact factory.
6. Per MIL-STD-202G, Method 204D, Condition E. Random vibration testing also available.
• Tray Pack
• 16mm tape, 7” or 13” reels
Per EIA 481 (see Tape and Reel data sheet 10109)
HOW TO ORDER CX1HGSM AT CRYSTALS
CX1
S
HG
C
SM1 – 32.0M , 100
/
100
/
—
/
I
O.T. = 3RD O.T. Mode
Blank = Fundamental
Mode
C = Ceramic Lid
Blank = Glass Lid
Operating Temp. Range:
C
Frequency
Stability over
Temp. Range
(in ppm)
Calibration
“S” if special or
custom design.
Blank if Std.
Frequency
M = MHz
= -10OC to +70OC
= -40OC to +85OC
Tolerance
@ 25OC
(in ppm)
I
M = -55OC to +125OC
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
S
= Customer Specified
OR
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
200
I
—
—
Total
Operating Temp. Range:
C
= -10OC to +70OC
= -40OC to +85OC
Frequency
Tolerance
(in ppm)
I
M = -55OC to +125OC
S
= Customer Specified
10108 - Rev C
E
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
相关型号：
CX1HGSM5-6.0M,100/50/-/C
Parallel - Fundamental Quartz Crystal, 6MHz Nom, LEAD FREE, HERMETIC SEALED, MINIATURE, LEADLESS, CERAMIC PACKAGE-2
STATEK
CX1HSM1-10.000K,100/I
Parallel - Fundamental Quartz Crystal, 0.01MHz Nom, LEAD FREE, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-2
STATEK
CX1HSM1-10.000K,100/M
Parallel - Fundamental Quartz Crystal, 0.01MHz Nom, LEAD FREE, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-2
STATEK
CX1HSM1-10.000K,1000/I
Parallel - Fundamental Quartz Crystal, 0.01MHz Nom, LEAD FREE, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-2
STATEK
©2020 ICPDF网 联系我们和版权申明