CX2SM3-1.0M,10000/I [STATEK]
Parallel - Fundamental Quartz Crystal, 1MHz Nom, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-3;型号: | CX2SM3-1.0M,10000/I |
厂家: | STATEK CORPORATION |
描述: | Parallel - Fundamental Quartz Crystal, 1MHz Nom, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-3 |
文件: | 总2页 (文件大小:171K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CX2SM CRYSTAL
760 kHz to 1.35 MHz
Low Profile Miniature Surface Mount Quartz Crystal
DESCRIPTION
actual size
side view
The CX2SM quartz crystals are leadless devices designed
for surface mounting on printed circuit boards or hybrid
substrates. They are hermetically sealed in a rugged,
miniature ceramic package. They are manufactured using
the STATEK-developed photolithographic process, and
were designed utilizing the experience acquired by
producing millions of crystals for industrial, commercial,
military and medical applications. Maximum process
temperature should not exceed 260OC.
Glass Lid Shown
PACKAGE DIMENSIONS
B
1
FEATURES
Extensional mode
2
A
Ideal for use with microprocessors
Designed for low power applications
Compatible with hybrid or PC board
Low aging
I
H
G
F
3
D
Full military testing available
Ideal for battery operated applications
Designed and manufactured in the USA
E
C
TYP.
MAX.
EQUIVALENT CIRCUIT
DIM
A
inches
mm
6.60
2.39
-
inches
mm
C0
0.260
0.094
-
0.275
0.108
6.99
2.74
B
C
D
E
see below
1
L1
C1
R1
2
0.035
0.059
0.050
0.105
0.155
0.210
0.89
1.50
1.27
2.67
3.94
5.33
0.045
1.14
1.75
1.52
2.92
4.19
5.59
0.069
0.060
0.115
0.165
0.220
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
F
G
H
I
SUGGESTED LAND PATTERN
DIM “C”
MAX
GLASS LID
CERAMIC LID
inches
mm
1.65
1.70
1.78
inches
mm
1.91
1.96
2.03
0.105 (2.67)
SM1
0.065
0.067
0.070
0.075
0.077
0.080
SM2/SM4
SM3/SM5
GRID
COURTYARD
0.113
(2.87)
Note: Terminal 1 is electrically connected internally to terminal 3
1
2
0.060 (1.52)
inches (mm)
0.060 (1.52)
10135 - Rev C
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
TYPICAL APPLICATION
FOR A PIERCE OSCILLATOR
SPECIFICATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
The low profile CX miniature surface mount crystal is ideal
for small, high density, battery operated portable products.
The CX crystal designed in a Pierce oscillator (single
inverter) circuit provides very low current consumption and
high stability. A conventional CMOS Pierce oscillator
circuit is shown below. The crystal is effectively inductive
and in a PI-network circuit with CD and CG provides the
additional phase shift necessary to sustain oscillation. The
oscillation frequency (f0) is 15 to 150 ppm above the
crystal’s series resonant frequency (fS).
Frequency Range
Functional Mode
760 kHz - 1.35 MHz
Extensional
+_ 500 ppm (0.05%)
+_ 1000 ppm (0.1%)
+_ 10000 ppm (1.0%)
7 pF
Calibration Tolerance1
Load Capacitance
Motional Resistance (R1)
5 kΩ MAX
Drive Level
Motional Capacitance (C1) 1.2fF
RA is used to limit the crystal’s drive level by forming a
voltage divider between RA and CD. RA also stabilizes the
oscillator against changes in the amplifiers output
resistance (R0). RA should be increased for higher
voltage operation.
Quality Factor (Q)
Shunt Capacitance (C0)
Drive Level
150 k
1.0 pF
W MAX
35OC
3
µ
Turning Point (T )2
0
Temperature Coefficient (k) -0.035 ppm/OC2
Aging, first year
Shock, survival
Vibration, survival
Operating Temp. Range
Load Capacitance
5 ppm MAX
1000 g, 0.3 ms,1/2 sine
10 g RMS, 20-1,000 Hz random
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
-55OC to +125OC
The CX crystal calibration tolerance is influenced by the
effective circuit capacitances, specified as the load
capacitance (CL). CL is approximately equal to:
CD x CG
=
+
(1)
CL
CS
CD + CG
NOTE: CD and CG include stray layout to ground and CS
is the stray shunt capacitance between the crystal
terminal. In practice, the effective value of CL will be less
than that calculated from CD, CG and CS values because
of the effect of the amplifier output resistance. CS should
be minimized.
Storage Temp. Range
Max Process Temperature 260OC for 20 sec.
Note: Frequency f at temperature T is related to frequency f0
at turning point temperature T0 by:
2
f-f0
f0
=
k(T-T )
0
The oscillation frequency (f0) is approximately equal to:
1. Tighter frequency calibration available.
2. Other turning points available.
TERMINATIONS
C1
=
+
(2)
f0 fS
1
[
]
2(C0 + CL)
Designation
SM1
SM2
SM3
SM4
Termination
Where
= Series resonant frequency of the crystal
= Motional Capacitance
= Shunt Capacitance
fS
C1
C0
Gold Plated
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
CONVENTIONAL CMOS
PIERCE OSCILLATOR CIRCUIT
SM5
Rf
PACKAGING OPTIONS
CX2SM - Tray Pack
BUFFER
-16mm tape, 7” or 13” reels
(Reference tape and reel data sheet 10109)
OSC
Freq (fO)
RA
AMPLIFIER
CX2
HOW TO ORDER CX2SM CRYSTALS
CX2
S
C
SM1
1.0M
,
500
/
I
Frequency
K = kHz
M = MHz
Blank = Glass Lid
C = Ceramic Lid
Operating Temp. Range:
C
I
M
S
=
=
=
=
-10OC to +70OC
-40OC to +85OC
-55OC to +125OC
Customer Specified
CG
CD
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
Calibration
Tolerance
@ 25OC
“S” if special or
custom design.
Blank if Std.
SM3 = Solder Dipped
(in ppm)
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
10135 - Rev C
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
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