2N5551UB [STMICROELECTRONICS]

160V, NPN, Si, SMALL SIGNAL TRANSISTOR, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, LCC-3;


型号：	2N5551UB
厂家：	ST
描述：	160V, NPN, Si, SMALL SIGNAL TRANSISTOR, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, LCC-3
文件：	总11页 (文件大小：275K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

2N5551HR

Hi-Rel NPN bipolar transistor 160 V, 0.5 A

Datasheet — production data

Features

BV_CEO

160 V

I_C(max)

0.5 A

> 80

_FEat 5 V - 10 mA

TO-18

LCC-3

Operating temperature range

-65 °C to +200 °C

■ Linear gain characteristics

■ ESCC qualified

■ European preferred part list - EPPL

■ 100 krad low dose rate

TO-39

■ Hermetic packages

Figure 1.

Internal schematic diagram

Description

The 2N5551HR is a silicon planar epitaxial NPN

transistor in TO-18, TO-39 and LCC-3 packages.

It is specifically designed for aerospace Hi-Rel

applications and ESCC qualified according to the

5201-019 specification. In case of conflict

between this datasheet and ESCC detailed

specification, the latter prevails.

Table 1.

Device summary

ESCC Part

number

Rad.

level

Mass

Order codes

Qual. Level

Packages

Lead Finish

(g)

EPPL

2N5551UB1

2N5551UB

SOC5551

Eng. Model

LCC-3UB

Gold

0.06

0.40

1.20

5201/019/08 or 09 ESCC Flight

Eng. Model

LCC-3UB Gold / Solder Dip ⁽¹⁾

LCC-3

TO-18

TO-39

Gold

SOC5551HRB 5201/019/04 or 05 ESCC Flight

Gold / Solder Dip ⁽¹⁾

SOC5551SW

2N5551/T1

2N5551HR

5201/019/05

ESCC Flight 100 krad

Eng. Model

Solder Dip

Gold

5201/019/01 or 02 ESCC Flight

Gold / Solder Dip ⁽¹⁾

2N5551SHR 5201/019/06 or 07 ESCC Flight

1. Depending ESCC part number mentioned on the purchase order.

November 2012

Doc ID 16935 Rev 4

1/11

This is information on a product in full production.

www.st.com

Electrical ratings

2N5551HR

Electrical ratings

Table 2.

Symbol

Absolute maximum ratings

Parameter

Value

Unit

V_CBO

V_CEO

V_EBO

Collector-base voltage (I_E= 0)

Collector-emitter voltage (I_B= 0)

Emitter-base voltage (I_C= 0)

180

160

Collector current

for 2N5551HR

I_C

0.6

0.5

for SOC5551HRB

Total dissipation at T_amb≤25 °C

for 2N5551HR

0.36

0.58

for SOC5551HRB

P_TOT

for SOC5551HRB ⁽¹⁾

Total dissipation at T_c≤25 °C

for 2N5551HR

1.2

-65 to 200

200

°C

T_STG

T_J

Storage temperature

Max. operating junction temperature

1. When mounted on a 8 x 10 x 0.6 mm ceramic substrate.

Table 3.

Symbol

Thermal data for through-hole package

Parameter

Value

146

Unit

°C/W

R_thJC

R_thJA

Thermal resistance junction-case

Thermal resistance junction-ambient

max

486

Table 4.

Symbol

Thermal data for SMD package

Parameter

Value

Unit

Thermal resistance junction-ambient __

Thermal resistance junction-ambient ⁽¹⁾__

max

486

302

°C/W

R_thJA

1. When mounted on a 8 x 10 x 0.6 mm ceramic substrate.

2/11

Doc ID 16935 Rev 4

2N5551HR

Electrical characteristics

T_case= 25 °C unless otherwise specified.

Table 5.

Symbol

Electrical characteristics

Parameter

Test conditions

Min. Typ. Max. Unit

V_CB= 120 V

µA

Collector-base cut-off

current (I_E= 0)

I_CBO

T_C= 150 °C

Emitter-base cut-off

current (I_C= 0)

I_EBO

V_EB= 4 V

Collector-base

breakdown voltage

V_(BR)CBO

I_C= 100 µA

180

160

(I_E= 0)

Collector-emitter

breakdown voltage

(1)

V_(BR)CEO

I_C= 1 mA

I_E= 10 µA

(I_B= 0)

Emitter-base

breakdown voltage

V_(BR)EBO

(I_C= 0)

I_C= 10 mA

I_C= 50 mA

I_B= 1 mA

I_B= 5 mA

0.15

0.2

Collector-emitter

saturation voltage

(1)

V_CE(sat)

I_C= 10 mA

I_C= 50 mA

I_B= 1 mA

I_B= 5 mA

Base-emitter

saturation voltage

(1)

V_BE(sat)

I_C= 1 mA

V_CE= 5 V

I_C= 10 mA

I_C= 50 mA

I_C= 10 mA

T_amb= - 55 °C

250

200

(1)

h_FE

DC current gain

V_CE= 10 V

f = 1 kHz

I_C= 1 mA

Small signal current

gain

h_fe

V_CE= 10 V

f > 100 MHz

I_C= 10 mA

Small signal current

gain

h_fe

Output capacitance

(I_E= 0)

C_obo

V_CB= 10 V

V_EB= 5 V

f = 1 MHz

Emitter-base

capacitance (I_C= 0)

C_ebo

1. Pulsed duration = 300 µs, duty cycle ≤1.5%

Doc ID 16935 Rev 4

3/11

Electrical characteristics

2N5551HR

2.1

Electrical characteristics (curves)

Figure 2.

h_FE@ V_CE= 5 V

Figure 3.

V_CE(sat)@ h_FE=10

AM16336v1

AM16337v1

1000

TJ=-55°C

-55°C

TJ=-40°C

TJ=25°C

-40°C

25°C

TJ=110°C

TJ=125°C

110°C

125°C

100

0.1

0.001

0.01

0.1

0.001

0.01

0.1

IC(A)

Figure 4.

V_BE(sat)@ h_FE=10

AM16338v1

0.9

0.8

0.7

0.6

0.5

-55°C

-40°C

25°C

110°C

125°C

0.4

0.001

0.01

0.1

IC(A)

4/11

Doc ID 16935 Rev 4

2N5551HR

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK^®packages, depending on their level of environmental compliance. ECOPACK^®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK^®is an ST trademark.

Doc ID 16935 Rev 4

5/11

Package mechanical data

2N5551HR

Table 6.

LCC-3 mechanical data

mm.

Typ.

Dim.

Min.

Max.

1.16

0.45

0.60

0.91

1.95

2.92

2.41

0.42

1.37

0.40

2.46

1.80

1.42

0.56

0.91

1.12

2.11

3.17

2.66

0.72

1.67

0.60

2.62

2.00

0.50

0.76

1.01

2.03

3.05

2.54

0.57

1.52

0.50

2.54

1.90

0.30

Figure 5.

LCC-3 drawings

6/11

Doc ID 16935 Rev 4

2N5551HR

Package mechanical data

Table 7.

TO-18 mechanical data

Dim.

mm.

Min.

Typ.

Max.

12.7

0.49

5.3

4.9

5.8

2.54

45°

1.2

1.16

Figure 6.

TO-18 drawings

Doc ID 16935 Rev 4

7/11

Package mechanical data

2N5551HR

Table 8.

Dim.

TO-39 mechanical data

Min.

Typ.

Max.

12.70

0.40

0.58

6.00

8.15

9.10

4.93

0.85

0.75

42°

14.20

0.49

0.74

6.40

8.25

9.20

5.23

0.95

0.85

48°

Figure 7.

TO-39 drawing

8/11

Doc ID 16935 Rev 4

2N5551HR

Order codes

Table 9.

Order codes

ESCC Part

number

Radiation

Order codes

Packages Lead Finish

Marking

EPPL

Packing

level

2N5551UB1

2N5551UB

LCC-3UB

LCC-3

Gold

2N5401UB1

520101908 or 09

SOC5551

Waffle Pack

5201/019/08 or

Gold / Solder

Dip ⁽¹⁾

SOC5551

Gold

5201/019/04 or

Gold / Solder

Dip ⁽¹⁾

SOC5551HRB

LCC-3

520101904 or 05

SOC5551SW

2N5551/T1

5201/019/05

100 krad

LCC-3

TO-18

Solder Dip 520101904 or 05

Waffle Pack

Strip Pack

Gold

2N5551/T1

5201/019/01 or

Gold / Solder

Dip ⁽¹⁾

2N5551HR

TO-18

TO-39

520101901 or 02

Strip Pack

5201/019/06 or

Gold / Solder

Dip ⁽¹⁾

2N5551SHR

520101906 or 07

1. Depending ESCC part number mentioned on the purchase order.

Contact ST sales office for information about the specific conditions for:

–

Products in die form

Tape and reel packing

Doc ID 16935 Rev 4

9/11

Revision history

2N5551HR

Revision history

Table 10. Document revision history

Date

Revision

Changes

04-Jan-2010

17-May-2010

12-Jul-2010

13-Nov-2012

Initial release

Modified: Table 1 on page 1 and Table 9 on page 9

Added:Section 2.1: Electrical characteristics (curves)

10/11

Doc ID 16935 Rev 4

2N5551HR

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Doc ID 16935 Rev 4

11/11

2N5551UB [STMICROELECTRONICS]

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