AB-54008L-175 [STMICROELECTRONICS]
2 stages RF power amp: PD84001-E + PD54008L-E + LPF N-Channel Enhancement-Mode Lateral MOSFETs; 2级RF功率放大器： PD84001 -E + PD54008L -E + LPF N沟道增强模式横向的MOSFET
| 型号： | AB-54008L-175 |
| 厂家： | 
ST |
| 描述： | 2 stages RF power amp: PD84001-E + PD54008L-E + LPF N-Channel Enhancement-Mode Lateral MOSFETs |
| 文件： | 总20页 (文件大小：666K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AB-54008L-175
2 stages RF power amp: PD84001-E + PD54008L-E + LPF
N-Channel Enhancement-Mode Lateral MOSFETs
Feature
■ Excellent thermal stability
■ Frequency: 135 - 175MHz
■ Supply voltage: 7.2V
■ Output power: 5W
■ Current < 1.5A
■ Input power < 10dBm
■ Harmonics level < -70dBc
■ Load mismatch 20:1
■ V
5V max
APC
■ Beo Free Amplifier
■ RoHS compliant
Mechanical specification:
L = 40 mm, W = 20 mm
Description
The AB-54008L-175 is a 2 stages RF power
amplifer including output Low Pass Filter for
harmonics rejection specifically designed for 2
Ways Comms VHF portable.
Order code
■ AB-54008L-175
April 2007
Rev2
1/20
www.st.com
20
Contents
AB-54008L-175
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
3
4
5
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1
PowerFLAT™ Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1.1
Mounting indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2
Thermal Pad and Via design SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.1
Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/20
AB-54008L-175
Electrical data
1
Electrical data
1.1
Maximum ratings
Table 1.
Symbol
VDD
ID
TCASE
TA
Absolute maximum ratings
Parameter
Value
Unit
Supply voltage
Drain current
15
2.5
V
A
Operating case temperature
Max. ambient temperature
-20 to +85
+55
°C
°C
2
Electrical characteristics
o
T = +25 C, V = 7.2 V, V
Adjusted
A
DD
APC
Table 2.
Symbol
Electrical specification
Test conditions
Frequency range
Min.
Typ.
Max.
175
Unit
FREQ
PIN
135
5
MHz
dBm
A
@ POUT = 5W
10
ITOTAL
PAE
@ POUT = 5W and PIN = 8dBm
@ POUT = 5W and PIN = 8dBm
@ POUT = 5W and PIN = 8dBm
1.5
47% - 52%
4
VAPC
5
V
Harmonics @ POUT = 5W
-70
dBc
3/20
Typical performance
AB-54008L-175
3
Typical performance
Figure 1.
Current vs frequency
Figure 2.
Efficiency vs frequency
1.35
70
68
66
64
62
60
58
56
54
52
1.3
1.25
1.2
1.15
1.1
Id (%) 5 dBm
Id (A) 8 dBm
Eff (A) 5 dBm
Eff (%) 8 dBm
1.05
1
50
135
140
145
150
155
160
165
170
175
135
140
145
150
155
160
165
170
175
Freq. (MHz)
Figure 3.
Gain vs frequency
33
32
31
30
29
Vdd = 7.2V
Pout = 5W
APC adjusted
V
28
130
140
150
160
170
180
Frequency (MHz)
Pin = 8dBm
Pin = 5dBm
4/20
AB-54008L-175
Typical performance
Figure 4.
Gain vs input power
Figure 5.
Gain vs input power
40
38
36
34
32
30
34
33
32
31
30
29
28
27
Vdd = 7.2V
Idq = 100mA
Vdd = 6V
Idq = 300mA
28
-4
26
-4
-2
0
2
4
6
8
10
-2
0
2
4
6
8
10
Input Power (dBm)
135 MHz 155 MHz
Input Power (dBm)
135 MHz 155 MHz
175 MHz
175 MHz
Figure 6.
Gain vs input power
34
33
32
31
30
29
28
27
26
25
24
Vdd = 5V
Idq = 300mA
-4
-2
0
2
4
6
8
10
Input Power (dBm)
135 MHz
155 MHz
175 MHz
Figure 7.
Drain current vs output power
Figure 8.
Drain current vs output power
2
1.6
1.2
0.8
0.4
0
2
1.6
1.2
0.8
0.4
0
Vdd = 6V
Idq = 300mA
Vdd = 5V
Idq = 300mA
26 27 28 29 30 31 32 33 34 35 36 37 38
26 27 28 29 30 31 32 33 34 35 36
Output Power (dBm)
Output Power (dBm)
135 MHz
155 MHz
175 MHz
135 MHz
155 MHz
175 MHz
5/20
Typical performance
Figure 9.
AB-54008L-175
S21 response - Low pass filter
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
500000000
1000000000
1500000000
2000000000
Frequency (Hz)
6/20
AB-54008L-175
Typical performance
Part Code
Table 3.
Part list
Designator
Manufacturer
Size
Value
Comment
C1, C5, C16
C6
Murata
Murata
Murata
0603
0603
0603
nc
Capacitor
Capacitor
Capacitor
1uF
C1F
3.3pF
GRM1885C1H3R3CZ01
GRM1885C1H391JA01
C2, C3, C4, C7,
C8, C9, C10
Murata
0603
330pF
Capacitor
C2F
C3F
Murata
Murata
0603
0603
18pF
12pF
22pF
27pF
15pF
56pF
33pF
100pF
39pF
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
DC connector
Inductor
GRM1885C1H180JA01
GRM1885C1H120JA01
GRM1885C1H220JA01
GRM1885C1H270JA01
GRM1885C1H150JA01
GRM1885C1H560JA01
GRM1885C1H330JA01
GRM1885C1H101JA01
GRM1885C1H390JA01
1725685
C4F, C6F
C5F, C12
C7F
Murata
0603
Murata
0603
Murata
0603
C11
Murata
0603
C13
Murata
0603
C14
Murata
0603
C15
Murata
0603
DC-CON1
L1
Phoenix Contact
Coilcraft
Coilcraft
Coilcraft
Coilcraft
Coilcraft
Coilcraft
Coilcraft
Coilcraft
2.54mm , 5 pole
1812
24nH
39nH
1812SMS-33NJ
L1F
1008
Inductor
1008CS-390NX_BW
1812SMS-33NJ
L2
1812
33nH
Inductor
L2F
1008
22nH
Inductor
1008CS-220NX_BW
1812SMS-22NJ
L3
1812
35.5nH
27nH
Inductor
L3F
1008
Inductor
1008CS-270NX_BW
0603HC-18NX_BW
A05T
L4
0603
18nH
Inductor
L5
Minispring A
18.5nH
Inductor
N-Channel
Enhancement
PD54008L-E STMicroelectronics
QFN 5x5
SOT89
0603
PD54003L
N-Channel
Enhancement
PD84001-E
STMicroelectronics
PD84001
Tyco/Electronics
Neohm
R1, R4
R2
62KΩ
430KΩ
240Ω
150KΩ
11Ω
Resistor
Resistor
Resistor
Resistor
Resistor
CRG Series Thick Film
CRG Series Thick Film
CRG Series Thick Film
CRG Series Thick Film
CRG Series Thick Film
Tyco/Electronics
Neohm
0603
Tyco/Electronics
Neohm
R3
0603
Tyco/Electronics
Neohm
R5
0603
Tyco/Electronics
Neohm
R6
0603
7/20
Typical performance
AB-54008L-175
Table 3.
Part list (continued)
Designator
Manufacturer
Size
Value
Comment
Part Code
RFin, RF OUT
Amplifier, RF
OUT Filter
Johnson
SMA
142-0701-801
H = 20mil ;
h = 2oz
Substrate
TL1
Substrate
FR-4
W = 0.92mm ;
L = 3mm
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
Z = 50Ω Transmission Line
W = 0.92mm ;
L = 7.2mm
TL2
W = 0.92mm ;
L = 6.23mm
TL3
W = 0.92mm ;
L = 6.62mm
TL4
W = 0.92mm ;
L = 5.8mm
TL5
W = 0.92mm ;
L = 2.2mm
TL6
W = 0.92mm ;
L = 11mm
TL7
W = 0.92mm ;
L = 12.4mm
TL8
W = 0.92mm ;
L = 2mm
TL9
8/20
AB-54008L-175
Circuit layout
4
Circuit layout
Figure 10. Test fixture component layout
Figure 11. test circuit photomaster
9/20
Circuit schematic
AB-54008L-175
5
Circuit schematic
Figure 12. Circuit schematic
Figure 13. Bias schematic
Figure 14. Filter schematic
10/20
AB-54008L-175
Figure 15. Input matching schematic
Circuit schematic
Figure 16. Inter matching schematic
Figure 17. Output matching schematic
11/20
Package mechanical data
AB-54008L-175
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
12/20
AB-54008L-175
Package mechanical data
6.1
PowerFLAT™ Mechanical data
Table 4.
Dim.
PowerFLAT™ Mechanical data
mm
inch
Min.
Typ.
Max.
Min.
Typ.
Max.
A
A1
A3
AA
b
0.90
0.02
0.24
0.25
0.51
0.71
5.00
0.30
5.00
2.57
1.27
3.37
0.74
0.21
1.00
0.05
0.035
0.001
0.009
0.01
0.039
0.002
0.15
0.43
0.64
0.35
0.58
0.79
0.006
0.017
0.025
0.014
0.023
0.031
0.020
0.028
0.197
0.011
0.197
0.101
0.050
0.132
0.03
c
D
d
E
E2
e
2.49
2.64
0.098
0.104
f
g
h
0.008
Figure 18. PowerFLAT™ Package dimensions
13/20
Package mechanical data
AB-54008L-175
Table 5.
Dim.
PowerFLAT™ Tape & reel dimensions
mm.
inch
Typ
Min.
Typ
Max.
Min.
Max.
Ao
Bo
Ko
5.15
5.15
1.0
5.25
5.25
1.1
5.35
5.35
1.2
0.12
0.12
0.02
0.13
0.13
0.02
0.13
0.13
0.02
Figure 19. PowerFLAT™ Tape & reel
14/20
AB-54008L-175
Package mechanical data
6.1.1
Mounting indications
Figure 20. Standard SMD mounting
15/20
Package mechanical data
AB-54008L-175
6.2
Thermal Pad and Via design SOT-89
Thernal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025 plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar
results.
Figure 21. Pad layout details
16/20
AB-54008L-175
Package mechanical data
6.2.1
Soldering profile
Figure 22 shows the recommeded solder for devices that have Pb-free terminal plating and
where a Pb-free solder is used.
Figure 22. Recommended solder profile
Figure 23 shows the recommeded solder for devices with Pb-free terminal plating used with
leaded solder, or for devices with leaded terminal plating used with a leaded solder.
Figure 23. Recommended solder profile for leaded devices
17/20
Package mechanical data
Figure 24. Reel information
AB-54008L-175
18/20
AB-54008L-175
Revision history
7
Revision history
Table 6.
Date
Revision history
Revision
Changes
21-Nov-2006
23-Apr-2007
1
2
Initial release.
Updated component part list
19/20
AB-54008L-175
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