BAT30CKFILM [STMICROELECTRONICS]
Small signal Schotky diodes; 小信号二极管Schotky
| 型号： | BAT30CKFILM |
| 厂家： | 
ST |
| 描述： | Small signal Schotky diodes |
| 文件： | 总12页 (文件大小：158K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT30 Series
Small signal Schotky diodes
Main product characteristics
BAT30JFILM
(Single)
IF
300 mA
30 V
VRRM
SOD-323
C (typ)
Tj (max)
14 pF
150° C
BAT30KFILM
(Single)
Features and benefits
SOD-523
■ Very low conduction losses
■ Negligible switching losses
BAT30FILM
(Single)
■ Low forward and reverse recovery times
■ Extremely fast switching
BAT30AFILM
SOT-23
(Common anode)
■ Surface mount device
BAT30SFILM
(Series)
■ Low capacitance diode
Description
BAT30CFILM
The BAT30 series uses 30 V Schotky barrier
diodes encapsulated in a wide range of packages
such as SOD-323, SOD-523, SOT-23, SOT-323,
or SOT-666. This device is specially suited for
switching mode applications needing low forward
voltage drop diodes.
(Common cathode)
BAT30WFILM
(Single)
Order codes
BAT30CWFILM
(Common cathode)
SOT-323
Part Number
Marking
BAT30AWFILM
(Common anode)
BAT30FILM
BAT30SFILM
B30
S30
C30
A30
B30
S30
C30
A30
30
BAT30CFILM
BAT30AFILM
BAT30SWFILM
(Series)
BAT30WFILM
BAT30SWFILM
BAT30CWFILM
BAT30AWFILM
BAT30JFILM
BAT30-07P6FILM
(2 parallel diodes)
BAT30-09P6FILM
(2 opposite diodes)
SOT-666
BAT30KFILM
30
BAT30-07P6FILM
BAT30-09P6FILM
P3
Configurations in top view
Q3
July 2006
Rev 1
1/12
www.st.com
Characteristics
BAT30 Series
1
Characteristics
Table 1.
Symbol
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Parameter
Value
Unit
VRRM
IF
Repetitive peak reverse voltage
Continuous forward current
30
300
V
mA
A
IFSM
Tstg
Tj
Surge non repetitive forward current
tp = 10 ms Sinusoidal
1
Storage temperature range
-65 to +150
150
° C
° C
° C
Maximum operating junction temperature(1)
Maximum soldering temperature
TL
260
1. Pulse test: t = 5 ms, δ < 2 %
p
Table 2.
Symbol
Thermal parameters
Parameter
Value
Unit
SOT-23
SOT-323, SOD-323,
SOD-523, SOT-666
500
550
600
Rth(j-a)
Junction to ambient(1)
° C/W
1. On epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ
Max.
Unit
VR = 5 V
0.5
1
VR = 10 V
VR = 25 V
VR = 30 V
Tj = 25° C
0.65
3
(1)
IR
Reverse leakage current
µA
5
Tj = 70° C
Tj = 85° C
7
20
VR = 10 V
18
50
IF = 0.1 mA
IF = 1 mA
240
300
375
430
500
580
IF = 10 mA
IF = 30 mA
IF = 100 mA
IF = 200 mA
IF = 300 mA
(2)
VF
Forward voltage drop
Tj = 25° C
mV
530
1. Pulse test: t = 5 ms, δ < 2 %
p
2. Pulse test: t = 380 µs, δ < 2 %
p
2/12
BAT30 Series
Characteristics
Table 4.
Symbol
Dynamic characteristics
Parameter
Test conditions
VR = 0 V, F = 1 MHz
Min. Typ Max. Unit
22
C
Diode capacitance
VR = 1 V, F = 1 MHz
VR = 10 V, F = 1 MHz
14
6
pF
Figure 1.
Power dissipation versus average Figure 2.
forward current
Average forward current versus
ambient temperature (δ = 1)
IF(AV) (A)
P (W)
0.175
0.150
0.125
0.100
0.075
0.050
0.025
0.000
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
δ=1
δ=0.2
δ=0.5
δ=0.1
δ=0.05
T
T
tp
=tp/T
tp
=tp/T
δ
δ
IF(AV) (A)
0.20
Tamb (° C)
75
0.00
0.05
0.10
0.15
0.25
0.30
0.35
0
25
50
100
125
150
Figure 3.
Relative variation of thermal
Figure 4.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-23)
impedance junction to ambient
versus pulse duration
(SOT-323 / SOD-323)
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.E+00
1.E+00
1.E-01
1.E-02
1.E-03
Single pulse
SOT-23
Single pulse
SOT-323/SOD-323
1.E-01
Alumine substrate
10 x 8 x 0.5 mm
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
tP(s)
tP(s)
1.E-02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
3/12
Characteristics
BAT30 Series
Figure 5.
Relative variation of thermal
Figure 6.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-666)
impedance junction to ambient
versus pulse duration (SOD-523)
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.E+00
1.E+00
Single pulse
SOT-666
Single pulse
SOD-523
1.E-01
1.E-02
1.E-01
Epoxy FR4
eCU=35 µm
Epoxy FR4
eCU=35 µm
tP(s)
tP(s)
1.E-02
1.E-03
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E-02
1.E-01
1.E+00
1.E+01
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-323)
Figure 8.
Leakage current versus reverse
applied voltage (typical values)
IR (A)
Rth(j-a)(°C/W)
1.E-02
1.E-03
1.E-04
1.E-05
1.E-06
1.E-07
600
500
400
300
200
Epoxy FR4
eCU=35 µm
Tj=150°C
Tj=125°C
Tj=85°C
Tj=25°C
SCU(mm²)
VR (V)
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
Figure 9.
Relative variation of reverse
Figure 10. Junction capacitance versus
leakage current versus junction
temperature (typical values)
reverse applied voltage (typical
values)
IR[Tj] / IR[Tj=25°C]
C(pF)
100
10
1
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
VR=30 V
VR(V)
Tj(°C)
60
1
10
100
-40
-20
0
20
40
80
100
120
140
160
4/12
BAT30 Series
Ordering information scheme
Figure 11. Forward voltage drop versus
forward current (typical values)
Figure 12. Forward voltage drop versus
forward current (typical values)
IFM(A)
IFM(A)
1.E+01
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
1.E-04
1.E+00
Tj=150 °C
1.E-01
Tj=125 °C
Tj=85 °C
1.E-02
Tj=25 °C
Tj=-40 °C
1.E-03
VFM(V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
VFM(V)
1.E-04
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
2
Ordering information scheme
BAT30 xx xx FILM
Signal Schotky diodes
VRRM = 30 V
Configuration
Blank = Single diode
A = Common anode
C = Common cathode
S = Series diodes
07 = Parallel diodes
09 = Opposite diodes
Package
Blank = SOT-23
J = SOD-323
W = SOT-323
K = SOD-523
P6 = SOT-666
Packing
FILM = Tape and reel
5/12
Package information
BAT30 Series
3
Package information
Epoxy meets UL94, V0
Table 5.
SOD-323 dimensions
Dimensions
Millimeters Inches
Ref.
H
A1
Min.
Max.
Min.
Max.
b
A
A1
b
1.17
0.1
0.046
0.004
0.017
0.01
E
0
0
A
0.25
0.1
0.44
0.25
1.8
0.01
D
c
0.004
0.06
c
Q1
D
1.52
1.11
2.3
0.071
0.057
0.106
0.02
E
1.45
2.7
0.044
0.09
L
H
L
0.1
0.46
0.41
0.004
0.004
Q1
0.1
0.016
Figure 13. SOD-323 footprint (dimensions in mm)
3.20
0.30
1.06
1.08
1.06
6/12
BAT30 Series
Package information
Table 6.
SOD-523 dimensions
Dimensions
Millimeters
Typ. Max. Min.
Ref.
Inches
0.15
E1
M
C A B
E
B
Min.
Typ. Max.
2xb
D
A
E
0.50
1.50
1.10
0.70
0.25
0.07
0.15
0.10
0.60
1.60
1.20
0.80
0.70 0.020 0.024 0.028
1.70 0.059 0.063 0.067
1.30 0.043 0.047 0.051
0.90 0.028 0.031 0.035
0.20
M
C A B
A
8°
R0.1
E1
D
b
A
c
SEATING PLANE
7°
L
C
0.35 0.010
0.20 0.003
0.014
0.008
c
L1
L
0.20
0.25 0.006 0.008 0.010
0.20 0.004 0.008
L1
Figure 14. SOD-523 footprint (dimensions in mm)
0.7
0.3
2
7/12
Package information
Table 7.
BAT30 Series
SOT-23 dimensions
Dimensions
Millimeters
Min. Max.
Ref.
Inches
A
Min.
Max.
E
A
A1
B
0.89
0
1.4
0.1
0.035
0
0.055
0.004
0.02
e
0.3
0.51
0.18
3.04
1.05
2.1
0.012
0.003
0.108
0.033
0.067
0.047
0.083
B
D
e1
c
0.085
2.75
0.85
1.7
0.007
0.12
D
e
S
A1
0.041
0.083
0.063
0.108
e1
E
c
1.2
1.6
L
H
H
L
2.1
2.75
0.6 typ.
0.35
0.024 typ.
S
0.65
0.014
0.026
Figure 15. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
3.25
8/12
BAT30 Series
Package information
Table 8.
SOT-323 dimensions
Dimensions
Ref.
Millimeters
Inches
A
E
Min.
Typ. Max. Min.
Typ. Max.
A
A1
b
0.8
0.0
1.1
0.1
0.4
0.031
0.0
0.043
0.004
0.016
0.010
e
D
b
0.25
0.1
0.010
c
0.26 0.004
2.2
A1
D
E
e
1.8
2.0
1.25
0.65
2.1
0.071 0.079 0.086
1.15
1.35 0.045 0.049 0.053
0.026
c
θ
L
H
L
1.8
0.1
0
2.4
0.3
30°
0.071 0.083 0.094
0.004 0.008 0.012
H
0.2
q
0
30°
Figure 16. SOT-323 footprint (dimensions in mm)
0.95
1.0 2.9
0.8
0.50
9/12
Package information
Table 9.
BAT30 Series
SOT-666 dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
b1
Ref.
Inches
L1
A
0.45
0.60 0.018
0.18 0.003
0.34 0.007
0.024
0.007
0.013
L3
b
A3 0.08
0.17
b
D
E1
E
b1 0.19 0.27 0.34 0.007 0.011 0.013
D
E
1.50
1.50
1.70 0.059
1.70 0.059
1.30 0.043
0.067
0.067
0.051
A
L2
A3
E1 1.10
e
0.50
0.19
0.020
0.007
L1
L2 0.10
L3
0.30 0.004
0.012
e
0.10
0.004
Figure 17. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
10/12
BAT30 Series
Ordering information
Base qty Delivery mode
4
Ordering information
Part Number
Marking
Package
Weight
BAT30FILM
B30
S30
SOT-23 Single
SOT-23 Serial
10 mg
10 mg
3000
3000
Tape and reel
Tape and reel
BAT30SFILM
SOT-23
Common cathode
BAT30CFILM
BAT30AFILM
C30
A30
10 mg
10 mg
3000
3000
Tape and reel
Tape and reel
SOT-23
Common anode
BAT30WFILM
B30
S30
SOT-323 Single
SOT-323 Serial
6 mg
6 mg
3000
3000
Tape and reel
Tape and reel
BAT30SWFILM
SOT-323
Common cathode
BAT30CWFILM
BAT30AWFILM
C30
A30
6 mg
6 mg
3000
3000
Tape and reel
Tape and reel
SOT-323
Common anode
BAT30JFILM
BAT30KFILM
30
30
SOD-323
SOD-523
5 mg
3000
3000
5000
5000
Tape and reel
Tape and reel
Tape and reel
Tape and reel
1.4 mg
2.9 mg
2.9 mg
BAT30-07P6FILM
BAT30-09P6FILM
P3
Q3
SOT-666 Parallel
SOT-666 Opposite
5
Revision history
Date
Revision
Description of Changes
24-Jul-2006
1
First issue
11/12
BAT30 Series
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