BTA08-XXXBW [STMICROELECTRONICS]
8A TRIACS; 8A双向可控硅
| 型号： | BTA08-XXXBW |
| 厂家： | 
ST |
| 描述： | 8A TRIACS |
| 文件： | 总11页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BTA08, BTB08 and T8 Series
®
8A TRIACS
SNUBBERLESS™, LOGIC LEVEL & STANDARD
Table 1: Main Features
A2
Symbol
IT(RMS)
Value
Unit
8
A
G
A1
VDRM/VRRM
600 and 800
5 to 50
V
A2
A2
IGT (Q )
mA
1
A1
A2
A1
G
A2
G
DESCRIPTION
D2PAK
(T8-G)
Available either in through-hole or surface-mount
packages, the BTA08, BTB08 and T8 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applica-
tions such as static relays, heating regulation, in-
duction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers,...
IPAK
(T8-H)
A2
A1
A2
G
DPAK
(T8-B)
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances.
A2
Logic level versions are designed to interface
directly with low power drivers such as
microcontrollers.
A1
A2
A1
A2
G
G
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at
2500VRMS) complying with UL standards (file ref.:
E81734).
TO-220AB Insulated
(BTA08)
TO-220AB
(BTB08)
Table 2: Order Codes
Part Number
BTA08-xxxxxRG
BTB08-xxxxxRG
T8xx-xxxG
Marking
See page table 8 on
page 10
T8xx-xxxH
T8xx-xxxB
February 2006
REV. 6
1/11
BTA08, BTB08 and T8 Series
Table 3: Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
IPAK/D2PAK/
Tc = 110°C
Tc = 100°C
RMS on-state current (full sine
wave)
DPAK/TO-220AB
IT(RMS)
8
A
TO-220AB Ins.
F = 50 Hz
t = 20 ms
80
84
36
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25°C)
ITSM
A
F = 60 Hz
t = 16.7 ms
²
²
²
tp = 10 ms
I t
I t Value for fusing
A s
Critical rate of rise of on-state cur-
Tj = 125°C
dI/dt
F = 120 Hz
tp = 20 µs
50
A/µs
rent IG = 2 x IGT , tr ≤ 100 ns
IGM
Tj = 125°C
Tj = 125°C
Peak gate current
4
1
A
PG(AV)
Average gate power dissipation
W
Tstg
Tj
- 40 to + 150
- 40 to + 125
Storage junction temperature range
Operating junction temperature range
°C
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
■
SNUBBERLESS and Logic Level (3 quadrants)
Quad-
T8
BTA08 / BTB08
Symbol
Test Conditions
Unit
rant
T810 T835 TW SW CW BW
I
GT (1)
I - II - III MAX. 10
I - II - III MAX.
35
5
10
35
50 mA
V
VD = 12 V RL = 30 Ω
VGT
1.3
0.2
VD = VDRM RL = 3.3 kΩ
Tj = 125°C
VGD
I - II - III MIN.
MAX. 15
V
IH (2)
IT = 100 mA
35
50
60
10
10
15
15
25
30
35
50
60
50 mA
I - III
II
25
30
70
IL
IG = 1.2 IGT
MAX.
mA
80
VD = 67 %VDRM gate open
Tj = 125°C
dV/dt (2)
MIN. 40
400
20
40
400 1000 V/µs
(dV/dt)c = 0.1 V/µs Tj = 125°C
(dV/dt)c = 10 V/µs Tj = 125°C
5.4
MIN. 2.8
-
-
-
3.5 5.4
1.5 2.98
-
-
-
-
(dI/dt)c (2)
A/ms
Without snubber
Tj = 125°C
4.5
-
-
4.5
7
2/11
BTA08, BTB08 and T8 Series
■
Standard (4 quadrants)
Symbol Test Conditions
BTA08 / BTB08
Unit
Quadrant
C
B
I - II - III
IV
25
50
50
100
IGT (1)
MAX.
mA
VD = 12 V
RL = 30 Ω
VGT
VGD
ALL
ALL
MAX.
MIN.
1.3
0.2
V
V
VD = VDRM RL = 3.3 kΩ Tj = 125°C
IH (2)
IT = 500 mA
MAX.
25
40
50
50
mA
I - III - IV
II
IL
IG = 1.2 IGT
MAX.
mA
80
100
400
VD = 67 %VDRM gate open Tj = 125°C
dV/dt (2)
(dV/dt)c (2)
MIN.
MIN.
200
V/µs
V/µs
(dI/dt)c = 5.3 A/ms
Tj = 125°C
5
10
Table 5: Static Characteristics
Symbol
Test Conditions
Value
Unit
V
VT (2)
Vto (2)
Rd (2)
ITM = 11 A
tp = 380 µs
Tj = 25°C
MAX.
1.55
0.85
50
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Threshold voltage
Dynamic resistance
MAX.
MAX.
V
mΩ
µA
mA
5
IDRM
IRRM
VDRM = VRRM
MAX.
1
Note 1: minimum I
is guaranted at 5% of I
GT
max.
GT
Note 2: for both polarities of A2 referenced to A1.
Table 6: Thermal resistance
Symbol
Parameter
Value Unit
IPAK / D2PAK / DPAK / TO-220AB
TO-220AB Insulated
1.6
Rth(j-c)
Junction to case (AC)
°C/W
2.5
²
D2PAK
45
S = 1 cm
²
DPAK
70
S = 0.5 cm
Rth(j-a)
Junction to ambient
°C/W
TO-220AB / TO-220AB Insulated
IPAK
60
100
S = Copper surface under tab.
3/11
BTA08, BTB08 and T8 Series
Figure 1: Maximum power dissipation versus
RMS on-state current (full cycle)
Figure 2: RMS on-state current versus case
temperature (full cycle)
P(W)
I (A)
T(RMS)
10
10
9
9
8
7
6
5
4
3
2
1
BTB / T8
8
7
BTA
6
5
4
3
2
1
I (A)
T(RMS)
T (°C)
C
0
0
0
25
50
75
100
125
0
1
2
3
4
5
6
7
8
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 4: Relative variation of thermal
impedance versus pulse duration
I
(A)
T(RMS)
K=[Z /R
]
th th
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1E+0
1E-1
1E-2
1E-3
Z
th(j-c)
D2PAK
DPAK/IPAK
(S=1CM2
)
Z
th(j-a)
TO-220AB/D2PAK
Z
th(j-a)
DPAK
(S=0.5CM2
)
t (s)
p
T (°C)
C
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0
25
50
75
100
125
Figure 5: On-state characteristics (maximum
values)
Figure 6: Surge peak on-state current versus
number of cycles
I
(A)
TM
I (A)
TSM
100
90
80
70
60
50
40
30
20
10
0
Tj max.
Vto = 0.85V
Rd = 50 mΩ
Tj = Tj max.
t=20ms
One cycle
Non repetitive
Tj initial=25°C
10
Tj = 25°C.
Repetitive
TC=110°C
Number of cycles
V
(V)
TM
1
1
10
100
1000
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
4/11
BTA08, BTB08 and T8 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width tp < 10 ms
and corresponding value of I2t
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
(A), I2t (A2s)
I
,I ,I [T ] / I ,I ,I [T =25°C]
H L j GT H L j
GT
I
TSM
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
Tj initial=25°C
IGT
dI/dt limitation:
50A/µs
ITSM
IH & IL
I2t
T (°C)
j
t (ms)
p
-40
-20
0
20
40
60
80
100
120
140
0.01
0.10
1.00
10.00
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level
types)
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Standard types)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
2.2
TW
2.0
1.8
1.6
1.8
1.6
1.4
C
1.4
T835/CW/BW
1.2
1.2
B
1.0
1.0
0.8
0.8
T810/SW
0.6
0.4
0.6
0.2
(dV/dt)c (V/µs)
(dV/dt)c (V/µs)
0.0
0.4
0.1
1.0
10.0
100.0
0.1
1.0
10.0
100.0
Figure 11: Relative variation of critical rate of
decrease of main current versus junction
temperature
Figure 12: DPAK and D2PAK Thermal resistance
junction to ambient versus copper surface under
tab (printed circuit board FR4, copper thickness:
35 µm)
(dI/dt)c [T ] / (dI/dt)c [T specified]
R
(°C/W)
j
j
th(j-a)
6
5
4
3
2
100
90
80
70
60
50
40
30
20
10
0
DPAK
D2PAK
1
S(cm²)
T (°C)
j
0
0
4
8
12
16
20
24
28
32
36
40
0
25
50
75
100
125
5/11
BTA08, BTB08 and T8 Series
Figure 13: Ordering Information Scheme (BTA08 and BTB08 series)
BT A 08 - 600 BW (RG)
Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard
C = 25mA Standard
SW = 10mA Logic Level
BW = 50mA Snubberless
CW = 35mA Snubberless
TW = 5mA Logic Level
Packing mode
RG = Tube
Figure 14: Ordering Information Scheme (T8 series)
T 8 10 - 600 B (-TR)
Triac series
Current
8 = 8A
Sensitivity
10 = 10mA
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
B = DPAK
G = D2PAK
R = I2PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Table 7: Product Selector
Voltage (xxx)
Part Number
Sensitivity
Type
600 V
800 V
Package
BTA/BTB08-xxxB
BTA/BTB08-xxxBW
BTA/BTB08-xxxC
BTA/BTB08-xxxCW
BTA/BTB08-xxxSW
BTA/BTB08-xxxTW
T810-xxxG
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 mA
50 mA
25 mA
35 mA
10 mA
5 mA
Standard
TO-220AB
Snubberless TO-220AB
Standard TO-220AB
Snubberless TO-220AB
Logic level
Logic Level
Logic Level
Logic Level
Snubberless
Snubberless
Snubberless
TO-220AB
TO-220AB
D2PAK
IPAK
10 mA
10 mA
35 mA
35 mA
35 mA
T810-xxxH
T835-xxxB
DPAK
D2PAK
IPAK
T835-xxxG
T835-xxxH
BTB: non insulated TO-220AB package
6/11
BTA08, BTB08 and T8 Series
DIMENSIONS
Figure 15: D2PAK Package Mechanical Data
REF.
Millimeters
Inches
A
Min. Typ. Max. Min. Typ. Max.
E
A
A1
A2
B
4.30
2.49
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
C2
L2
0.03
D
0.70
L
B2
C
1.25 1.40
0.45
0.048 0.055
L3
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
A1
C2
D
1.21
B2
B
R
C
8.95
E
10.00
4.88
G
G
A2
L
15.00
1.27
2mm min.
FLAT ZONE
L2
L3
R
1.40
V2
0.40
0.016
V2
0°
8°
0°
8°
Figure 16: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/11
BTA08, BTB08 and T8 Series
Figure 17: DPAK Package Mechanical Data
DIMENSIONS
Millimeters Inches
Min. Min.
REF.
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
E
A
B2
C2
L2
B2
C
D
R
H
C2
D
L4
A1
R
B
E
G
C
G
H
A2
0.60 MIN.
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
V2
Figure 18: DPAK Foot Print Dimensions
(in millimeters)
1.6
6.7
3
3
2.3
2.3
6.7
1.6
8/11
BTA08, BTB08 and T8 Series
DIMENSIONS
Figure 19: TO-220AB Package Mechanical Data
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
C
B
A
15.20
15.90 0.598
0.625
Ø I
b2
a1
3.75
0.147
a2 13.00
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
L
F
B
b1
b2
C
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
A
I4
l3
l2
c2
c1
c2
e
a1
a2
F
M
ØI
c1
b1
I4 15.80 16.40 16.80 0.622 0.646 0.661
e
L
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
Figure 20: IPAK Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
A1
A3
B
B2
B3
B5
C
2.20
0.90
0.70
0.64
5.20
2.40 0.086
1.10 0.035
1.30 0.027
0.90 0.025
5.40 0.204
0.95
0.094
0.043
0.051
0.035
0.212
0.037
A
E
C2
B2
L2
0.30
0.035
D
0.45
0.48
6
0.60 0.017
0.60 0.019
6.20 0.236
6.60 0.252
0.023
0.023
0.244
0.260
C2
D
E
H
B3
L1
L
6.40
A1
B
e
G
H
L
L1
L2
V1
2.28
0.090
0.634
V1
4.40
4.60 0.173
0.181
16.10
B5
C
e
9
0.8
9.40 0.354
1.20 0.031
1
0.370
0.047
A3
G
0.80
10°
0.031 0.039
10°
9/11
BTA08, BTB08 and T8 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
Marking
Package
Weight Base qty Delivery mode
BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz
TO-220AB
2.3 g
50
50
Tube
Tube
T8yy-xxxG
T8yy-xxxG-TR
T8yy-xxxB
T8yyxx
T8yyxx
T8yyxx
T8yyxx
T8yyxx
D2PAK
1.5 g
1000
75
Tape & reel
Tube
DPAK
IPAK
0.3 g
0.4 g
T8yy-xxxB-TR
T8yy-xxxH
2500
75
Tape & reel
Tube
Note: xxx = voltage, yy = sensitivity, z = type
Table 9: Revision History
Date
Revision
Description of Changes
Apr-2002
5A
Last update.
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
13-Feb-2006
6
10/11
BTA08, BTB08 and T8 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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11/11
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