BTA26 [STMICROELECTRONICS]
25A TRIACS; 25A双向可控硅
ST 
BTA24, BTB24, BTA25, BTA26
and T25 series
Snuberrless™ and Standard
25 A Triacs
Main features
A2
Symbol
Value
Unit
G
IT(RMS)
25
A
A1
VDRM/VRRM
600 and 800
35 to 50
V
A2
IGT (Q )
mA
1
A1
A1
A2
A2
G
G
Description
TO-220AB Insulated
(BTA24)
TO-220AB
(BTB24)
Available either in through-hole or surface-mount
packages, the BTA24, BTB24, BTA25, BTA26
and T25 triac series is suitable for general
purpose AC switching. They can be used as an
ON/OFF function in applications such as static
relays, heating regulation, induction motor starting
circuits... or for phase control operation in light
dimmers, motor speed controllers, ...
A1
G
A2
A1
A2
G
RD91
(BTA25)
TOP3 Insulated
(BTA26)
The snubberless versions (BTA/BTB...W and T25
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab
(rated at 2500VRMS) complying with UL standards
(File ref.: E81734).
A2
A1
A2
G
2
D PAK
(T25-G)
Order codes
Part Number
Marking
BTA24-xxxxxRG
BTB24-xxxxxRG
BTA25-xxxxxRG
BTA26-xxxxxRG
T25xx-xxxG
See Table 6 on page 6
T25xx-xxxG-TR
TM: Snubberless is a trademark of STMicroelectronics
July 2006
Rev 9
1/12
www.st.com
12
Characteristics
BTA24, BTB24, BTA25, BTA26 and T25 series
1
Characteristics
Table 1.
Symbol
Absolute maximum ratings
Parameter
D2PAK /
Value
Unit
Tc = 100° C
Tc = 90° C
TO-220AB
IT(RMS)
RMS on-state current (full sine wave) RD91 /
25
A
TOP3 Ins.
TO-220AB Ins.
F = 50 Hz
Tc = 75° C
t = 20 ms
250
260
340
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25° C)
ITSM
A
F = 60 Hz
t = 16.7 ms
²
²
²
I t
I t Value for fusing
tp = 10 ms
A s
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns
dI/dt
F = 120 Hz
Tj = 125° C
Tj = 25° C
50
A/µs
V
Non repetitive surge peak off-state
voltage
VDSM/VRSM
+ 100
VDSM/VRSM
tp = 10 ms
tp = 20 µs
IGM
Peak gate current
Tj = 125° C
Tj = 125° C
4
1
A
PG(AV)
Average gate power dissipation
W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
° C
Table 2.
Symbol
Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless™ and
Logic Level (3 quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W
T25
BTA/BTB
Test Conditions
Quadrant
Unit
T2535
CW
BW
(1)
IGT
I - II - III
I - II - III
MAX.
MAX.
35
35
50
mA
V
VD = 12 V RL = 33 Ω
VGT
VGD
1.3
VD = VDRM RL = 3.3 kΩ
Tj = 125° C
I - II - III
MIN.
0.2
V
(2)
IH
IT = 500 mA
MAX.
50
70
50
70
75
80
mA
I - III
II
IL
IG = 1.2 IGT
MAX.
mA
80
80
100
1000
22
dV/dt (2)
VD = 67 %VDRM gate open
Tj = 125° C
Tj = 125° C
MIN.
MIN.
500
13
500
13
V/µs
(dI/dt)c (2) Without snubber
A/ms
1. minimum I is guaranted at 5% of I max.
GT
GT
2. for both polarities of A2 referenced to A1.
2/12
BTA24, BTB24, BTA25, BTA26 and T25 series
Characteristics
Table 3.
Symbol
Electrical characteristics (Tj = 25° C, unless otherwise specified),
Standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B
Test Conditions
Quadrant
Value
Unit
50
100
(1)
IGT
I - II - III - IV
MAX.
mA
VD = 12 V
RL = 33 Ω
VGT
ALL
ALL
MAX.
MIN.
1.3
0.2
80
V
V
VGD
VD = VDRM RL = 3.3 kΩ Tj = 125° C
(2)
IH
)
IT = 500 mA
MAX.
mA
I - III - IV
II
70
IL
dV/dt(2)
IG = 1.2 IGT
MAX.
mA
160
500
10
VD = 67 %VDRM gate open
Tj = 125° C
Tj = 125° C
MIN.
MIN.
V/µs
V/µs
(dV/dt)c (2) (dI/dt)c = 13.3 A/ms
1. minimum I is guaranted at 5% of I max.
GT
GT
2. for both polarities of A2 referenced to A1.
Table 4.
Symbol
Static characteristics
Test Conditions
Tj = 25° C
Value
Unit
(1)
(1)
(1)
VT
Vt0
Rd
ITM = 35 A
tp = 380 µs
MAX.
1.55
0.85
16
5
V
V
Threshold voltage
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
MAX.
MAX.
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
MAX.
3
1. for both polarities of A2 referenced to A1.
Table 5.
Symbol
Thermal resistance
Parameter
D2PAK / TO-220AB
Value
Unit
0.8
1.1
1.7
45
Rth(j-c)
Junction to case (AC)
Junction to ambient
RD91 (Insulated) / TOP3 Insulated
TO-220AB Insulated
D2PAK
° C/W
²
(1)S = 1 cm
Rth(j-a)
TOP3 Insulated
50
° C/W
TO-220AB / TO-220AB Insulated
60
1. S = Copper surface under tab.
3/12
Characteristics
BTA24, BTB24, BTA25, BTA26 and T25 series
Figure 1.
Maximum power dissipation versus Figure 2.
RMS on-state current (full cycle)
RMS on-state current versus case
temperature (full cycle)
P(W)
I (A)
T(RMS)
30
30
25
20
15
10
5
25
20
15
10
5
BTB / T25
BTA24
BTA25 / BTA26
T (°C)
C
I
(A)
T(RMS)
0
0
0
0
25
50
75
100
125
5
10
15
20
25
Figure 3.
D2PAK RMS on-state current versus Figure 4.
ambient temperature (printed
circuit board FR4, copper
Relative variation of thermal
impedance versus pulse
duration
thickness: 35µm) (full cycle)
I (A)
T(RMS)
K=[Z /R
]
th th
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1E+0
1E-1
1E-2
1E-3
D2PAK
Z
th(j-c)
(S=1cm2
)
Z
th(j-a)
BTA / BTB24 / T25
Z
th(j-a)
BTA26
t (s)
p
T (°C)
amb
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0
25
50
75
100
125
Figure 5.
On-state characteristics
(maximum values)
Figure 6.
Surge peak on-state current
versus number of cycles
I
(A)
TM
I (A)
TSM
300
100
300
250
200
150
100
50
Tj max.
Vto = 0.85V
Rd = 16 mΩ
Tj = Tj max.
t=20ms
One cycle
Non repetitive
Tj initial=25°C
Repetitive
TC=75°C
10
Tj = 25°C.
Number of cycles
V (V)
TM
0
1
1
10
100
1000
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
4/12
BTA24, BTB24, BTA25, BTA26 and T25 series
Characteristics
Figure 7.
Non-repetitive surge peak on-state Figure 8.
Relative variation of gate trigger
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
current, holding current and
latching current versus junction
temperature (typical values)
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT
H
L
j
GT
H
L
j
I
(A), I2t (A2s)
TSM
2.5
2.0
1.5
1.0
0.5
0.0
3000
1000
Tj initial=25°C
dI/dt limitation:
50A/µs
IGT
ITSM
I2t
IH & IL
T (°C)
j
t (ms)
p
100
-40
-20
0
20
40
60
80
100
120
140
0.01
0.10
1.00
10.00
Figure 9.
Relative variation of critical rate of Figure 10. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
decrease of main current versus
(dV/dt)c
(dI/dt)c [T ] / (dI/dt)c [T specified]
j
j
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
5
4
3
2
1
0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
T2535/CW/BW
B
(dV/dt)c (V/µs)
T (°C)
j
0.1
1.0
10.0
100.0
0
25
50
75
100
125
Figure 11. D2PAK Thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
R
(°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
D2PAK
S(cm²)
0
4
8
12
16
20
24
28
32
36
40
5/12
Ordering information scheme
BTA24, BTB24, BTA25, BTA26 and T25 series
2
Ordering information scheme
Figure 12. BTA and BTB series
BT
A 24 - 600 BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
24 = 25A in TO-220AB
25 = 25A in RD91
26 = 25A in TOP3
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard
BW = 50mA Snubberless
CW = 35mA Snubberless
Packing mode
RG = Tube
Figure 13. T25 series
T
25 35 - 600 G (-TR)
Triac series
Current
25 = 25A
Sensitivity
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
G = D2PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Table 6.
Product Selector
Voltage (xxx)
Part Numbers
Sensitivity
Type
Package
600 V
800 V
BTA24-xxxBRG
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 mA
50 mA
35 mA
50 mA
50 mA
35 mA
50 mA
50 mA
35 mA
35 mA
Standard
Snubberless
Snubberless
Standard
TO-220AB
TO-220AB
TO-220AB
RD91
BTA/BTB(1)24-xxxBWRG
BTA/BTB(1)24-xxxCWRG
BTA25-xxxBRG
BTA25-xxxBWRG
BTA25-xxxCWRG
BTA26-xxxBRG
Snubberless
Snubberless
Standard
RD91
RD91
TOP3 Ins.
TOP3 Ins.
TOP3 Ins.
D2PAK
BTA26-xxxBWRG
BTA26-xxxCWRG
T2535-xxxG
Snubberless
Snubberless
Snubberless
1. BTB: non insulated TO-220AB package
6/12
BTA24, BTB24, BTA25, BTA26 and T25 series
Package information
3
Package information
Table 7.
D2PAK Package dimensions
DIMENSIONS
Millimeters
Min. Typ. Max. Min. Typ. Max.
REF.
Inches
A
A1
A2
B
4.30
2.49
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
A
E
C2
L2
0.03
0.70
D
L
B2
C
1.25 1.40
0.45
0.048 0.055
L3
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
A1
B2
B
C2
D
1.21
R
C
8.95
G
E
10.00
4.88
A2
G
2mm min.
FLAT ZONE
L
15.00
1.27
V2
L2
L3
R
1.40
0.40
0.016
V2
0°
8°
0°
8°
Figure 14. D2PAK Foot Print Dimensions (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/12
Package information
Table 8.
BTA24, BTB24, BTA25, BTA26 and T25 series
DIMENSIONS
RD91 Package dimensions
REF.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
40.00
30.30
22.00
27.00
16.50
24.00
14.00
3.50
1.575
1.193
0.867
1.063
0.650
0.945
0.551
0.138
0.118
0.035
0.177
0.535
0.138
0.075
43°
A2
L2
L1
29.90
1.177
B2
B1
C
B1
B2
C
13.50
0.531
C2
C1
N1
A1
C1
C2
E3
F
N2
1.95
0.70
4.00
11.20
3.10
1.70
33°
3.00
0.077
0.027
0.157
0.441
0.122
0.067
33°
B
F
0.90
E3
4.50
I
A
I
13.60
3.50
L1
L2
N1
N2
1.90
43°
28°
38°
28°
38°
8/12
BTA24, BTB24, BTA25, BTA26 and T25 series
Package information
Table 9.
TOP3 Insulated package dimensions
DIMENSIONS
Millimeters
Min. Typ. Max. Min. Typ. Max.
REF.
Inches
H
A
A
B
4.4
1.45
14.35
0.5
4.6 0.173
1.55 0.057
15.60 0.565
0.7 0.020
2.9 0.106
16.5 0.622
21.1 0.815
15.5 0.594
5.65 0.213
3.65 0.134
4.17 0.161
1.40 0.047
0.181
0.061
0.614
0.028
0.114
0.650
0.831
0.610
0.222
0.144
0.164
0.055
R
B
ØL
C
D
E
K
G
C
F
2.7
F
15.8
20.4
15.1
5.4
G
H
J
P
D
J
J
E
K
3.4
ØL
P
4.08
1.20
R
4.60
0.181
9/12
Package information
BTA24, BTB24, BTA25, BTA26 and T25 series
Table 10. TO-220AB (Insulated and non-insulated) Package dimensions
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
a1
a2
B
15.20
15.90 0.598
0.625
3.75
0.147
C
B
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
Ø I
b2
L
F
b1
b2
C
A
I4
l3
c2
a1
c1
c2
e
l2
a2
M
c1
F
b1
e
ØI
I4
L
15.80 16.40 16.80 0.622 0.646 0.661
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
10/12
BTA24, BTB24, BTA25, BTA26 and T25 series
Ordering information
4
Ordering information
Ordering type
Marking
Package
Weight Base qty Delivery mode
BTA/BTB24-xxxyyzRG
BTA25-xxxyyzRG
BTA26-xxxyzRG
T2535-xxxG
BTA/BTB24xxxyyz TO-220AB
2.3 g
20 g
4.5 g
50
25
Tube
Bulk
BTA25-xxxyyz
BTA26-xxxyyz
T2535xxxG
RD91
TOP3 Ins.
30
Tube
50
Tube
D2PAK
1.5 g
T2535-xxxG-TR
T2535xxxG
1000
Tape and reel
Note: xxx = voltage, yy = sensitivity, z = type
5
Revision History
Date
Revision
Description of Changes
Previous update.
Oct-2002
6A
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
13-Feb-2006
31-May-2006
31-Jul-2006
7
8
9
Reformatted to current standard. Tc in figure 3 changed
to Tamb
Typing error corrected on page 1 (BTB124 instead of
BTB24)
11/12
BTA24, BTB24, BTA25, BTA26 and T25 series
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
12/12
相关型号：
©2020 ICPDF网 联系我们和版权申明