BUZ72A [STMICROELECTRONICS]

N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTORS; N - 沟道增强型功率MOS晶体管
BUZ72A
型号: BUZ72A
厂家: ST    ST
描述:

N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTORS
N - 沟道增强型功率MOS晶体管

晶体 晶体管 功率场效应晶体管
文件: 总7页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BUZ72A  
N - CHANNEL ENHANCEMENT MODE  
POWER MOS TRANSISTORS  
TYPE  
BUZ72A  
VDSS  
RDS(on)  
< 0.25 Ω  
ID  
100 V  
11 A  
TYPICAL RDS(on) = 0.23 Ω  
AVALANCHE RUGGED TECHNOLOGY  
100% AVALANCHE TESTED  
REPETITIVE AVALANCHE DATA AT 100oC  
LOW GATE CHARGE  
3
HIGH CURRENT CAPABILITY  
2
1
175oC OPERATING TEMPERATURE  
APPLICATIONS  
TO-220  
HIGH CURRENT, HIGH SPEED SWITCHING  
SOLENOID AND RELAY DRIVERS  
REGULATORS  
DC-DC & DC-AC CONVERTERS  
MOTOR CONTROL, AUDIO AMPLIFIERS  
AUTOMOTIVE ENVIRONMENT (INJECTION,  
ABS, AIR-BAG, LAMPDRIVERS, Etc.)  
INTERNAL SCHEMATIC DIAGRAM  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
VDS  
VDG R  
VGS  
ID  
Parameter  
Value  
100  
Unit  
Drain-source Voltage (VGS = 0)  
Drain- gate Voltage (RGS = 20 k)  
Gate-source Voltage  
V
V
100  
± 20  
V
Drain Current (continuous) at Tc = 25 oC  
11  
A
IDM  
Drain Current (pulsed)  
44  
A
Ptot  
Total Dissipation at Tc = 25 oC  
Storage Temperature  
70  
W
oC  
oC  
Tstg  
Tj  
-65 to 175  
175  
Max. Operating Junction Temperature  
DIN Humidity Category (DIN 40040)  
IEC Climatic Category (DIN IEC 68-1)  
E
55/150/56  
1/7  
June 1993  
BUZ72A  
THERMAL DATA  
Rthj-case Thermal Resistance Junction-case  
Rthj-amb Thermal Resistance Junction-ambient  
Max  
Max  
2.14  
62.5  
oC/W  
oC/W  
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
IAR  
Avalanche Current, Repetitive or Not-Repetitive  
11  
A
(pulse width limited by Tj max, δ < 1%)  
EAS  
EAR  
IAR  
Single Pulse Avalanche Energy  
36  
9
mJ  
mJ  
A
(starting Tj = 25 oC, ID = IAR, VDD = 25 V)  
Repetitive Avalanche Energy  
(pulse width limited by Tj max, δ < 1%)  
Avalanche Current, Repetitive or Not-Repetitive  
7
(Tc = 100 oC, pulse width limited by Tj max, δ < 1%)  
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)  
OFF  
Symbol  
V(BR)DSS Drain-source  
Breakdown Voltage  
Zero Gate Voltage  
Drain Current (VGS = 0) VDS = Max Rating  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
ID = 250 µA VGS = 0  
100  
V
IDSS  
IGSS  
VDS = Max Rating  
250  
1000  
µA  
µA  
Tj = 125 oC  
Gate-body Leakage  
Current (VDS = 0)  
VGS = ± 20 V  
± 100  
nA  
ON ( )  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
2.9  
Max.  
4
Unit  
V
VGS(th)  
Gate Threshold Voltage VDS = VGS ID = 250 µA  
2
RDS(on) Static Drain-source On VGS = 10 V ID = 5 A  
Resistance  
0.23  
0.25  
DYNAMIC  
Symbol  
Parameter  
Forward  
Test Conditions  
VDS = 25 V ID = 5 A  
Min.  
Typ.  
Max.  
Unit  
gfs ( )  
2.7  
4.5  
S
Transconductance  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
VDS = 25 V f = 1 MHz VGS = 0  
330  
90  
25  
450  
120  
40  
pF  
pF  
pF  
SWITCHING  
Symbol  
Parameter  
Turn-on Time  
Rise Time  
Turn-off Delay Time  
Fall Time  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
td(on)  
tr  
td(off)  
tf  
VDD = 50 V  
ID = 5.5 A  
10  
50  
25  
20  
15  
75  
40  
30  
ns  
ns  
ns  
ns  
RGS = 4.7 Ω  
VGS = 10 V  
2/7  
BUZ72A  
ELECTRICAL CHARACTERISTICS (continued)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
ISD  
ISD M  
Source-drain Current  
Source-drain Current  
(pulsed)  
11  
44  
A
A
VSD ( ) Forward On Voltage  
ISD = 22 A VGS = 0  
1.6  
V
trr  
Reverse Recovery  
Time  
ISD = 11 A  
VDD = 20 V  
di/dt = 100 A/µs  
80  
ns  
Tj = 150 oC  
Qrr  
Reverse Recovery  
Charge  
0.22  
µC  
( ) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %  
Safe Operating Area  
Thermal Impedance  
Derating Curve  
Output Characteristics  
3/7  
BUZ72A  
Transfer Characteristics  
Transconductance  
Static Drain-Source On Resistance  
Maximum Drain Current vs Temperature  
Gate Charge vs Gate-Source Voltage  
Capacitance Variation  
4/7  
BUZ72A  
Normalized Gate Threshold Voltage vs  
Temperature  
Normalized On Resistance vs Temperature  
Source-Drain Diode Forward Characteristics  
5/7  
BUZ72A  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
6/7  
BUZ72A  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No  
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentioned  
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.  
SGS-THOMSON Microelectronicsproducts arenot authorizedfor use as criticalcomponents in life supportdevices or systems without express  
written approval of SGS-THOMSON Microelectonics.  
1994 SGS-THOMSON Microelectronics - All Rights Reserved  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A  
7/7  

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