ESDALC6V1P5 [STMICROELECTRONICS]

QUAD LOW CAPACITANCE TRANSIL ARRAY FOR ESD PROTECTION; 四路低电容TRANSIL阵列的ESD保护


型号：	ESDALC6V1P5
厂家：	ST
描述：	QUAD LOW CAPACITANCE TRANSIL ARRAY FOR ESD PROTECTION 四路低电容TRANSIL阵列的ESD保护瞬态抑制器二极管光电二极管 PC 局域网
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ESDALC6V1P5

QUAD LOW CAPACITANCE TRANSIL™

ARRAY FOR ESD PROTECTION

Application Specific Discretes

A.S.D.

MAIN APPLICATIONS

Where transient overvoltage protection in ESD

sensitive equipment is required, such as :

■

Computers

Printers

Communication systems and cellular phones

Video equipment

This device is particularly adapted to the protection

of symmetrical signals.

SOT665

(Jedec SC89-5L)

FEATURES

■

4 UNIDIRECTIONAL TRANSIL™ FUNCTIONS.

BREAKDOWN VOLTAGE V_BR= 6.1V MIN.

LOW DIODE CAPACITANCE (12pF @ 0V)

LOW LEAKAGE CURRENT < 100 nA

FUNCTIONAL DIAGRAM

VERY SMALL PCB AREA < 2.6 mm²

DESCRIPTION

The ESDALC6V1P5 is a monolithic array designed

to protect up to 4 lines against ESD transients.

This device is ideal for applications where both

reduced line capacitance and board space saving

are required.

BENEFITS

■

High ESD protection level.

High integration.

Suitable for high density boards.

ESD response to IEC61000-4-2 level 4 (15kV

contact)

COMPLIES WITH THE FOLLOWING STANDARDS :

■

IEC61000-4-2 level 4: 15 kV (air discharge)

8 kV (contact discharge)

■

MIL STD 883E-Method 3015-7: class 3

25kV HBM (Human Body Model)

February 2004 - Ed: 1

1/5

ESDALC6V1P5

ABSOLUTE RATINGS (T_amb= 25°C)

Symbol

Parameter

Test conditions

Value

Unit

V_PP

ESD discharge - IEC61000-4-2 air discharge

IEC61000-4-2 contact discharge

P_PP

T_j

Peak pulse power (8/20 µs) (see note 1)

Junction temperature

T_jinitial = Tamb

125

°C

T_stg

T_L

Storage temperature range

- 55 to + 150

260

Maximum lead temperature for soldering during 10s at N/A

Operating temperature range

T_op

- 40 to + 125

Note 1: for a surge greater than the maximum values, the diode will fail in short-circuit.

THERMAL RESISTANCES

Symbol

Parameter

Value

Unit

R_th(j-a)

Junction to ambient on printed circuit on recommended pad layout

220

°C/W

ELECTRICAL CHARACTERISTICS (T_amb= 25°C)

Symbol

V_RM

V_BR

V_CL

I_RM

I_PP

Parameter

Stand-off voltage

I_F

Breakdown voltage

Clamping voltage

V_F

Leakage current

V_CLV_BRV_RM

I_RM

Peak pulse current

Voltage tempature coefficient

Forward voltage drop

Capacitance per line

Dynamic resistance

αT

V_F

Slope: 1/R_d

I_PP

R_d

V_BR

I_R

I_RM

V_RM

αT

typ.

@ 0V

min.

max.

typ.

max.

Types

µA

Ω

10^-4/°C

4.5

ESDALC6V1P5

6.1

7.2

0.1

1.5

2/5

ESDALC6V1P5

Fig. 1: Relative variation of peak pulse power

versus initial junction temperature.

Fig. 2: Peak pulse power versus exponential pulse

duration.

P_PP[T_jinitial] / P_PP[T_jinitial=25°C)

1.1

P_PP(W)

1000

T_jinitial=25°C

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

100

0.1

T_j(°C)

T_p(µs)

0.0

100

125

150

100

Fig. 3: Clamping voltage versus peak pulse

current (typical values, rectangular waveform).

Fig. 4: Forward voltage drop versus peak forward

current (typical values).

I_FM(A)

I_PP(A)

100.0

1.E+00

t_p=2.5µs

T_jinitial=25°C

T_j=125°C

T_j=25°C

1.E-01

10.0

1.0

1.E-02

V_CL(V)

V_FM(V)

1.0

1.E-03

0.1

0.0

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

2.0

Fig. 5: Junction capacitance versus reverse

voltage applied (typical values).

Fig. 6: Relative variation of leakage current versus

junction temperature (typical values).

C(pF)

I_R[T_j] / I_R[T_j=25°C]

1000

F=1MHz

V_OSC=30mV_RMS

V_R=3V

T_j=25°C

100

(V)

T_j(°C)

100

125

3/5

ESDALC6V1P5

ORDER CODE

ESDA LC 6V1 P5

ESD ARRAY

LOW CAPACITANCE

PACKAGE: SOT665

V^BRmin

Ordering type

ESDALC6V1P5

Marking

Package

SOT665

Weight

Base qty

Delivery mode

Tape & reel

2.9 mg.

3000

4/5

ESDALC6V1P5

PACKAGE MECHANICAL DATA

SOT-665

DIMENSIONS

Millimeters Inches

Min.

REF.

Min.

Max.

0.60

0.27

0.18

1.70

1.30

Max.

0.024

0.011

0.007

0.067

0.051

0.50

0.17

0.08

1.50

1.10

0.020

0.007

0.003

0.060

0.043

1.00

0.50

0.040

0.020

0.059

0.004

1.50

0.10

1.70

0.30

0.067

0.012

FOOT PRINT (in millimeters)

0.5

0.3

REEL ORIENTATION

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not au-

thorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

All other names are the property of their respective owners.

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