HCF40108M013TR [STMICROELECTRONICS]
SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, SO-24;
| 型号： | HCF40108M013TR |
| 厂家： | 
ST |
| 描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, SO-24 光电二极管 外围集成电路 |
| 文件： | 总14页 (文件大小：326K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HCC40108B
HCF40108B
4 x 4 MULTIPORT REGISTER
.
.
.
FOUR 4-BIT REGISTERS
no new data is netered. In either case, the contents
of any word may be accessed via the read address
lines independent of the state of the CLOCK input.
ONE INPUT AND TWO OUTPUT BUSES
UNLIMITED EXPANSION IN BIT AND WORD
DIRECTION
DATA LINES HAVE LATCHED INPUTS
3-STATE OUTPUTS
SEPARATE CONTROL OF EACH BUS,
ALLOWING SIMULTANEOUS INDEPENDET
READING AND ANY OF FOUR REGISTERS
ON BUS A AND BUS B AND INDEPENDENT
WRITING INTO ANY ANY OF THE FOUR REG-
ISTERS
.
.
.
EY
F
(Plastic Package)
(Ceramic Package)
.
.
.
40108B IS PINCOMPATIBLE WITH INDUSTRY
TYPE MC14580
STANDARDIZED, SYMMETRICAL OUTPUT
CHARACTERISTICS
QUIESCENT CURRENT SPECIFIED AT 20V
FOR HCC DEVICE
5V, 10V AND 15V PARAMETRIC RATINGS
INPUT CURRENTOF 100nA AT18VAND 25oC
FOR HCC DEVICE
100% TESTED FOR QUIESCENT CURRENT
MEETS ALLREQUIREMENTS OF JEDECTEN-
TATIVE STANDARD No 13a, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF B
SERIES CMOS DEVICES”
M1
C1
(Micro Package)
(Chip Carrier)
.
.
ORDER CODES :
HCC40108BF
HCF40108BEY
HCF40108BM1
HCF40108BC1
.
.
PIN CONNECTIONS
DESCRIPTION
The HCC40108B (extended temperature range)
and HCF40108B (intermediate temperature range)
are monolithic integrated circuits, available in 24
lead dualin line plastic or ceramicpackageand plas-
tic micropackage. The HCC/HCF40108B is a 4 X 4
multiport register containing four 4-bit register, write
address decoder, two separate read address
decoders, and two 3-state output buses. When the
ENABLE input is low, the corresponding output bus
is switched, independently of the clock, to a high im-
pedance state. The high impedance third state pro-
vides the outputs with the capability of being
connected to the bus lines in a bus organized sys-
tem without the need for interface or pull-up compo-
nents. When the WRITE ENABLE input is high, all
data input lines are latched on the positive transition
of the CLOCK and the data is entered into the word
selected by the write address lines. When WRITE
ENABLE is low, the CLOCK is inhibited and
September 1988
1/14
HCC/HCF40108
FUNCTIONAL DIAGRAM
LOGIC DIAGRAM
2/14
HCC/HCF40108
ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Value
Unit
VDD
*
Supply Voltage: HCC Types
HCF Types
-0.5 to +20
-0.5 to +18
V
V
Vi
II
Input Voltage
-0.5 to VDD + 0.5
V
DC Input Current (any one input)
± 10
mA
mW
Ptot
Total Power Dissipation (per package)
Dissipation per Output Transistor
200
for Top = Full Package Temperature Range
100
mW
Top
Operating Temperature: HCC Types
HCF Types
-55 to +125
-40 to +85
oC
oC
oC
Tstg
Storage Temperature
-65 to +150
Stressesabove those listedunder ”Absolute Maximum Ratings” may cause permanent damage to thedevice. This isa stress ratingonly and functional
operation of the device at these or any other conditions above those indicated in theoperational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for external periods may affect device reliability.
* All voltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage: HCC Types
HCF Types
Value
Unit
VDD
3 to 18
3 to 15
V
V
VI
Input Voltage
0 to VDD
V
Top
Operating Temperature: HCC Types
HCF Types
-55 to +125
-40 to +85
oC
oC
TRUTH TABLE
Write
CLOCK
Write
1
Write
2
Read
1A
Read
0A
Read
1B
Read Enable Enable
Dn
QnA
QnB
Enable
0B
A
B
1
1
S1
S1
X
S2
S2
X
S1
S1
X
S2
S2
X
S1
S1
X
S2
1
1
1
0
1
0
1
0
Z
S2
X
1
0
0
X
X
1
X
Z
Z
Dn to
word 0 1 Out
Word
Word
2 Out
0
0
0
0
0
0
1
1
1
1
0
0
1
1
1
1
Word
0 not
Word
1 Out
Word
2 Out
0
altered
Word
2 Out
Word
1 Out
X
X
X
X
X
X
X
1
0
0
1
1
1
X
1
X
X
X
X
X
X
NC
NC
1 = HIGH LEVEL, 0 = LOW LEVEL, X = DON’T CARE, Z = HIGH IMPEDANCE
S1 and S2 refer to input strates of either 1 or 0
3/14
HCC/HCF40108
SCHEMATIC DIAGRAM
4/14
HCC/HCF40108
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditios
Value
o
Symbol
Parameter
Unit
VI
VO
|IO| VDD
TLOW
*
25 C
THIGH *
(V)
(V)
(µA) (V)
Min. Max. Min. Typ. Max. Min. Max.
IL
Quiescent
Current
0/5
0/10
0/15
0/20
0/5
5
5
10
20
100
20
40
80
0.04
0.04
0.04
5
150
300
600
3000
150
300
600
HCC
Types
10
15
20
5
10
20
µA
0.08 100
0.04
0.04
0.04
20
40
80
HCF
Types
0/10
0/15
0/5
10
15
VOH
VOL
VIH
VIL
Output High
Voltage
< 1
5
4.95
4.95
9.95
4.95
9.95
V
V
V
V
0/10
0/15
5/0
< 1 10 9.95
< 1 15 14.95
14.95
14.95
Output Low
Voltage
< 1
5
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
10/0
15/0
< 1 10
< 1 15
Input High
Voltage
0.5/4.5 < 1
1/9 < 1 10
1.5/13.5 < 1 15
4.5/0.5 < 1
9/1 < 1 10
13.5/1.5 < 1 15
5
3.5
7
3.5
7
3.5
7
11
11
11
Input Low
Voltage
5
1.5
3
1.5
3
1.5
3
4
4
4
IOH
Output
Drive
Current
0/5
0/5
2.5
4.6
9.5
13.5
2.5
4.6
9.5
13.5
0.4
0.5
1.5
0.4
0.5
1.5
5
5
-2
-1.6 -3.2
-0.51 -1
-1.3 -2.6
-3.4 -6.8
-1.36 -3.2
-0.44 -1
-1.1 -2.6
-3.0 -6.8
-1.15
-0.36
-0.9
-2.4
-1.1
-0.36
-0.9
-2.4
0.36
0.9
HCC
Types
-0.64
0/10
0/15
0/5
10 -1.6
15 -4.2
mA
5
5
-1.53
-0.52
HCF
Types
0/5
0/10
0/15
0/5
10 -1.3
15 -3.6
IOL
Output
Sink
Current
5
0.64
1.6
0.51
1.3
1
HCC
Types
0/10
0/15
0/5
10
15
5
2.6
6.8
1
4.2
3.4
2.4
mA
0.52
1.3
0.44
1.1
0.36
0.9
HCF
Types
0/10
0/15
10
15
2.6
6.8
3.6
3.0
2.4
IIH, I
Input
Leakage
Current
HCC
Types
IL
0/18
0/15
0/18
0/15
18
15
18
15
±0.1
±0.3
±0.4
±1.0
±10-5 ±0.1
±10-5 ±0.3
±10-4 ±0.4
±10-4 ±1.0
±1
±1
Any Input
0/18
µA
HCF
Types
IOH, IOL 3-Sate
HCC
Types
±12
±7.5
**
Output
Leakage
Current
µA
HCF
Types
0/15
CI
Input Capacitance
Any Input
5
7.5
pF
* TLOW = -55 oC forHCC device: -40 oC for HCF device.
* THIGH =+125 oC for HCC device: +85 oC for HCF device.
The Noise Margin for both ”1” and ”0” level is: 1V min. with VDD = 5 V, 2 V min. with VDD =10 V, 2.5 V min. withVDD = 15 V
** Forced output disable
5/14
HCC/HCF40108
o
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 C, CL = 50 pF, RL = 200 KΩ,
typical temperature coefficent for all VDD values is 03 %/oC, all input rise and fall times= 20 ns)
Test Conditions
VDD (V) Min.
Value
Typ.
360
140
100
300
120
85
Symbol
Parameter
Propagation Delay Time
Unit
Max.
720
280
200
600
240
170
200
100
80
tPLH
tPHL
5
Clock or Write Enable to Q
10
15
5
ns
Propagation Delay Time
Read or Write Address to Q
10
15
5
tPZH
tPHZ
3-State Disable Delay Time
3-State Display Delay Time
Output Transition Time
100
50
ns
ns
ns
10
15
5
40
tPZL
tPLZ
130
60
260
120
100
200
100
80
10
15
5
50
tTLH
tTHL
100
50
10
15
5
40
tsetup
Setup Time
Data to Clock ts(D)
0
-95
-35
-20
125
50
10
15
5
0
0
Setup Time
Write Enable to Clock ts(WE)
250
100
70
ns
10
15
5
35
Setup Time
Write Address to Clock ts(WA)
250
100
70
125
50
10
15
5
35
tr, ts
Clock Rise and Fall Time
15
5
µs
10
15
5
5
thold
Hold Time
Data to Clock ts(D)
220
100
80
110
50
40
135
65
40
165
70
45
175
65
45
150
75
45
3
10
15
5
Hold Time
Write Enable to Clock ts(WE)
270
130
80
ns
10
15
5
Hold Time
Write Address to Clock ts(WA)
330
140
90
10
15
5
tW
Clock Pulse Width
Clock or Write Enable tW(CL)
350
130
90
10
15
5
ns
Clock Pulse Width
Write Address tW(WA)
300
150
90
10
15
5
fCL
Maximum Clock Input Frequency
1.5
3.5
4.5
MHz
10
15
7
9
6/14
HCC/HCF40108
Output Low (sink) Current Characteristics
Output High (source) Current Characteristics
Typical Propagation Delay Time vs Load Capa-
citance (CL or WE to Q)
Typical Transition Time vs Load Capacitance
Typical Dynamic Power Dissipation vs Input Fre-
quency
7/14
HCC/HCF40108
TIMING DIAGRAM
TEST CIRCUITS
Output Enable Delay Times and Waveforms
8/14
HCC/HCF40108
Power Dissipation and Waveforms
Quiescent Device Current.
Noise Immunity.
Input Leakage Current.
9/14
HCC/HCF40108
Plastic DIP24 (0.25) MECHANICAL DATA
mm
inch
TYP.
0.025
0.018
DIM.
MIN.
0.23
15.2
TYP.
0.63
0.45
MAX.
MIN.
0.009
0.598
MAX.
a1
b
b1
b2
D
E
0.31
0.012
1.27
0.050
32.2
1.268
0.657
16.68
e
2.54
0.100
1.100
e3
F
27.94
14.1
0.555
I
4.445
3.3
0.175
0.130
L
P043A
10/14
HCC/HCF40108
Ceramic DIP24 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
TYP.
MAX.
32.3
MIN.
MAX.
1.272
0.526
0.200
A
B
C
D
E
e3
F
13.05
3.9
3
13.36
5.08
0.514
0.154
0.118
0.020
0.5
1.78
0.070
27.94
1.100
2.29
0.4
2.79
0.55
1.52
0.31
2.49
0.090
0.016
0.046
0.009
0.060
0.110
0.022
0.060
0.012
0.098
G
I
1.17
0.22
1.52
L
M
N1
4° (min.), 15° (max.)
P
15.4
15.8
5.71
0.606
0.622
0.225
Q
P058C
11/14
HCC/HCF40108
SO24 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
TYP.
MAX.
2.65
0.20
2.45
0.49
0.32
MIN.
MAX.
0.104
0.007
0.096
0.019
0.012
A
a1
a2
b
0.10
0.004
0.35
0.23
0.013
0.009
b1
C
0.50
0.020
c1
D
45° (typ.)
15.20
10.00
15.60
10.65
0.598
0.393
0.614
0.420
E
e
1.27
0.05
0.55
e3
F
13.97
7.40
0.50
7.60
1.27
0.291
0.19
0.299
0.050
L
S
8° (max.)
L
c1
b
e
s
e3
E
D
24
13
1
12
12/14
HCC/HCF40108
PLCC20 MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
9.78
8.89
4.2
TYP.
MAX.
10.03
9.04
MIN.
0.385
0.350
0.165
MAX.
0.395
0.356
0.180
A
B
D
4.57
d1
d2
E
2.54
0.56
0.100
0.022
7.37
8.38
0.290
0.330
0.004
e
1.27
5.08
0.38
0.050
0.200
0.015
e3
F
G
0.101
M
M1
1.27
1.14
0.050
0.045
P027A
13/14
HCC/HCF40108
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
14/14
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