M27C1001-15XCTR [STMICROELECTRONICS]

1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM; 1兆位( 128千位×8) UV EPROM和OTP EPROM
M27C1001-15XCTR
型号: M27C1001-15XCTR
厂家: ST    ST
描述:

1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM
1兆位( 128千位×8) UV EPROM和OTP EPROM

可编程只读存储器 电动程控只读存储器
文件: 总24页 (文件大小:219K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
M27C1001  
1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM  
Features  
5v ± 10% Supply Voltage in Read Operation  
Access Time: 35ns  
32  
32  
Low Power Consumption:  
– Active Current: 30 mA at 5 MHz  
– Standby Current: 100 µA  
1
1
FDIP32W (F)  
PDIP32 (B)  
Programming Voltage: 12.75V ± 0.25V  
Programming Time: 100 µs/word  
Electronic Signature  
– Manufacturer Code: 20h  
– Device Code: 05h  
PLCC32 (C)  
TSOP32 (N)  
8 x 20 mm  
ECOPACK® packages available  
April 2006  
Rev 5  
1/24  
www.st.com  
1
Contents  
M27C1001  
Contents  
1
2
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11  
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
3
4
5
5.1  
5.2  
5.3  
5.4  
32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18  
32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19  
32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20  
32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21  
6
7
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
2/24  
M27C1001  
List of tables  
List of tables  
Table 1.  
Table 2.  
Table 3.  
Table 4.  
Table 5.  
Table 6.  
Table 7.  
Table 8.  
Table 9.  
Table 10.  
Table 11.  
Table 12.  
Table 13.  
Table 14.  
Table 15.  
Table 16.  
Table 17.  
Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
3/24  
List of figures  
M27C1001  
List of figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Figure 9.  
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Figure 10. FDIP32WA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Figure 11. PDIP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Figure 12. PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Figure 13. TSOP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
4/24  
M27C1001  
Summary description  
1
Summary description  
The M27C1001 is a 1 Mbit EPROM offered in the two ranges: UV (ultra violet erase) and  
OTP (one time programmable). It is ideally suited for microprocessor systems requiring  
large programs and is organized as 131,072 words of 8 bits.  
The FDIP32W (window ceramic frit-seal package) has a transparent lid that enables the  
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be  
written to the device by following the programming procedure.  
For applications where the content is programmed only one time and erasure is not  
required, the M27C1001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.  
In order to meet environmental requirements, ST offers the M27C1001 in ECOPACK®  
packages. ECOPACK packages are Lead-free. The category of second Level Interconnect  
is marked on the package and on the inner box label, in compliance with JEDEC Standard  
JESD97. The maximum ratings related to soldering conditions are also marked on the inner  
box label.  
ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com.  
See Figure 1: Logic Diagram and Table 1: Signal Descriptions for a brief overview of the  
signals connected to this device.  
Figure 1.  
Logic Diagram  
V
V
PP  
CC  
17  
8
A0-A16  
Q0-Q7  
P
E
M27C1001  
G
V
SS  
AI00710B  
5/24  
Summary description  
Table 1.  
M27C1001  
Signal Descriptions  
Signal  
Description  
A0-A16  
Q0-Q7  
E
Address Inputs  
Data Outputs  
Chip Enable  
G
Output Enable  
Program  
P
VPP  
VCC  
VSS  
NC  
Program Supply  
Supply Voltage  
Ground  
Not Connected Internally  
Figure 2.  
DIP Connections  
V
1
2
3
4
5
6
7
8
9
32  
31  
V
CC  
P
PP  
A16  
A15  
A12  
A7  
30 NC  
29 A14  
28 A13  
27 A8  
26 A9  
25 A11  
A6  
A5  
A4  
M27C1001  
A3  
24  
23 A10  
22  
G
A2 10  
A1 11  
A0 12  
Q0 13  
Q1 14  
Q2 15  
E
21 Q7  
20 Q6  
19 Q5  
18 Q4  
17 Q3  
V
16  
SS  
AI00711  
6/24  
M27C1001  
Summary description  
Figure 3.  
LCC Connections  
1 32  
M27C1001  
17  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
Q0  
A14  
A13  
A8  
A9  
9
25 A11  
G
A10  
E
Q7  
AI00712  
Figure 4.  
TSOP Connections  
A11  
A9  
1
32  
G
A10  
E
A8  
A13  
A14  
NC  
P
Q7  
Q6  
Q5  
Q4  
Q3  
V
8
9
M27C1001 25  
CC  
(Normal)  
V
24  
V
SS  
PP  
A16  
A15  
A12  
A7  
Q2  
Q1  
Q0  
A0  
A1  
A2  
A3  
A6  
A5  
A4  
16  
17  
AI01151B  
7/24  
Device description  
M27C1001  
2
Device description  
Table 2 lists the operating modes of the M27C1001. A single power supply is required in  
Read mode. All inputs are TTL levels except for V and 12V on A9 for Electronic Signature.  
PP  
Table 2.  
Operating Modes  
Mode  
E
G
P
A9  
VPP  
Q7-Q0  
Read  
VIL  
VIL  
VIL  
VIL  
VIH  
VIH  
VIL  
VIL  
VIH  
VIH  
VIL  
X
X
X
X
VCC or VSS Data Out  
Output Disable  
Program  
X
VCC or VSS  
VPP  
Hi-Z  
Data In  
Data Out  
Hi-Z  
VIL Pulse  
X
Verify  
VIH  
X
X
VPP  
Program Inhibit  
Standby  
X
VPP  
X
X
X
VCC or VSS  
VCC  
Hi-Z  
Electronic Signature  
VIL  
VIH  
VID  
Codes  
Note:  
X = VIH or VIL, VID = 12V ± 0.5V.  
2.1  
Read mode  
The M27C1001 has two control functions, both of which must be logically active in order to  
obtain data at the outputs. Chip Enable (E) is the power control and should be used for  
device selection. Output Enable (G) is the output control and should be used to gate data to  
the output pins, independent of device selection. Assuming that the addresses are stable,  
the address access time (t  
) is equal to the delay from E to output (t  
). Data is  
AVQV  
ELQV  
available at the output after a delay of t  
from the falling edge of G, assuming that E has  
GLQV  
been low and the addresses have been stable for at least t  
-t  
.
AVQV GLQV  
2.2  
2.3  
Standby mode  
The M27C1001 has a standby mode which reduces the supply current from 30mA to 100µA.  
The M27C1001 is placed in the standby mode by applying a CMOS high signal to the E  
input. When in the standby mode, the outputs are in a high impedance state, independent of  
the G input.  
Two-line output control  
Because EPROMs are usually used in larger memory arrays, this product features a 2-line  
control function which accommodates the use of multiple memory connection. The two line  
control function allows:  
the lowest possible memory power dissipation,  
complete assurance that output bus contention will not occur.  
For the most efficient use of these two control lines, E should be decoded and used as the  
primary device selecting function, while G should be made a common connection to all  
devices in the array and connected to the READ line from the system control bus. This  
8/24  
M27C1001  
Device description  
ensures that all deselected memory devices are in their low power standby mode and that  
the output pins are only active when data is required from a particular memory device.  
2.4  
System considerations  
The power switching characteristics of Advanced CMOS EPROMs require careful  
decoupling of the devices. The supply current, I , has three segments that are of interest to  
CC  
the system designer: the standby current level, the active current level, and transient current  
peaks that are produced by the falling and rising edges of E. The magnitude of the transient  
current peaks is dependent on the capacitive and inductive loading of the device at the  
output. The associated transient voltage peaks can be suppressed by complying with the  
two line output control and by properly selected decoupling capacitors. It is recommended  
that a 0.1µF ceramic capacitor be used on every device between V and V . This should  
CC  
SS  
be a high frequency capacitor of low inherent inductance and should be placed as close to  
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used  
between V and V for every eight devices. The bulk capacitor should be located near the  
CC  
SS  
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage  
drop caused by the inductive effects of PCB traces.  
2.5  
Programming  
When delivered (and after each erasure for UV EPROM), all bits of the M27C1001 are in the  
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.  
Although only '0's will be programmed, both '1's and '0's can be present in the data word.  
The only way to change a '0' to a '1' is by die exposition to ultraviolet light (UV EPROM). The  
M27C1001 is in the programming mode when V input is at 12.75V, E is at V and P is  
PP  
IL  
pulsed to V . The data to be programmed is applied to 8 bits in parallel to the data output  
IL  
pins. The levels required for the address and data inputs are TTL. V is specified to be  
CC  
6.25V ± 0.25V.  
2.6  
Presto II programming algorithm  
Presto II Programming Algorithm allows the whole array to be programmed, with a  
guaranteed margin, in a typical time of 13 seconds. Programming with Presto II involves in  
applying a sequence of 100µs program pulses to each byte until a correct verify occurs (see  
Figure 5). During programming and verify operation, a Margin mode circuit is automatically  
activated in order to guarantee that each cell is programmed with enough margin. No  
overprogram pulse is applied since the verify in Margin mode provides necessary margin to  
each programmed cell.  
9/24  
Device description  
Figure 5.  
M27C1001  
Programming Flowchart  
V
= 6.25V, V = 12.75V  
PP  
CC  
n = 0  
P = 100µs Pulse  
NO  
NO  
++n  
= 25  
VERIFY  
YES  
++ Addr  
YES  
Last  
Addr  
NO  
FAIL  
YES  
CHECK ALL BYTES  
1st: V  
2nd: V  
= 6V  
= 4.2V  
CC  
CC  
AI00715C  
2.7  
Program Inhibit  
Programming of multiple M27C1001s in parallel with different data is also easily  
accomplished. Except for E, all like inputs including G of the parallel M27C1001 may be  
common. A TTL low level pulse applied to a M27C1001's P input, with E low and V at  
PP  
12.75V, will program that M27C1001. A high level E input inhibits the other M27C1001s from  
being programmed.  
2.8  
2.9  
Program Verify  
A verify (read) should be performed on the programmed bits to determine that they were  
correctly programmed. The verify is accomplished with E and G at V , P at V , V at  
IL  
IH  
PP  
12.75V and V at 6.25V.  
CC  
Electronic Signature  
The Electronic Signature (ES) mode enables the reading out of a binary code from an  
EPROM that will identify its manufacturer and type. This mode is intended for use by  
programming equipment to automatically match the device to be programmed with its  
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C  
ambient temperature range that is required when programming the M27C1001. To activate  
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of  
the M27C1001, with V = V = 5V. Two identifier bytes may then be sequenced from the  
PP  
CC  
device outputs by toggling address line A0 from V to V . All other address lines must be  
IL  
IH  
held at V during Electronic Signature mode.  
IL  
10/24  
M27C1001  
Device description  
Byte 0 (A0 = V ) represents the manufacturer code and byte 1 (A0 = V ) the device  
IL  
IH  
identifier code. For the STMicroelectronics M27C1001, these two identifier bytes are given  
in Table 3 and can be read-out on outputs Q7 to Q0.  
Table 3.  
Electronic Signature  
Identifier  
A0  
Q7  
Q6  
Q5  
Q4  
Q3  
Q2  
Q1  
Q0 Hex Data  
Manufacturer’s Code  
Device Code  
VIL  
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
1
20h  
05h  
VIH  
2.10  
Erasure operation (applies to UV EPROM)  
The erasure characteristics of the M27C1001 is such that erasure begins when the cells are  
exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted  
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å  
range. Research shows that constant exposure to room level fluorescent lighting could  
erase a typical M27C1001 in about 3 years, while it would take approximately 1 week to  
cause erasure when exposed to direct sunlight. If the M27C1001 is to be exposed to these  
types of lighting conditions for extended periods of time, it is suggested that opaque labels  
be put over the M27C1001 window to prevent unintentional erasure. The recommended  
erasure procedure for the M27C1001 is exposure to short wave ultraviolet light which has a  
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure  
2
should be a minimum of 15 W-sec/cm . The erasure time with this dosage is approximately  
2
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm power rating. The M27C1001  
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps  
have a filter on their tubes which should be removed before erasure.  
11/24  
Maximum ratings  
M27C1001  
3
Maximum ratings  
(1)  
Table 4.  
Symbol  
Absolute Maximum Ratings  
Parameter  
Value  
Unit  
TA  
Ambient Operating Temperature (2)  
Temperature Under Bias  
Storage Temperature  
–40 to 125  
–50 to 125  
–65 to 150  
–2 to 7  
°C  
°C  
°C  
V
TBIAS  
TSTG  
(3)  
VIO  
Input or Output Voltage (except A9)  
Supply Voltage  
VCC  
–2 to 7  
V
(3)  
VA9  
A9 Voltage  
–2 to 13.5  
–2 to 14  
V
VPP  
Program Supply Voltage  
V
1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute  
Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or any other conditions above those indicated in the Operating sections of  
this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods  
may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality  
documents.  
2. Depends on range.  
3. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than  
20ns.  
Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than  
20ns.  
12/24  
M27C1001  
DC and AC characteristics  
4
DC and AC characteristics  
T = 0 to 70°C, –40 to 85°C or –40 to 125°C; V = 5V ± 5% or 5V ± 10%; V = V  
A
CC  
PP  
CC  
(1)  
Table 5.  
Symbol  
Read Mode DC Characteristics  
Parameter  
Test Condition  
Min.  
Max.  
Unit  
ILI  
Input Leakage Current  
Output Leakage Current  
0V VIN VCC  
±10  
±10  
µA  
µA  
ILO  
0V VOUT VCC  
E = VIL, G = VIL,  
IOUT = 0mA, f = 5MHz  
ICC  
Supply Current  
30  
mA  
ICC1  
ICC2  
IPP  
Supply Current (Standby) TTL  
E = VIH  
1
100  
mA  
µA  
µA  
V
Supply Current (Standby) CMOS E > VCC – 0.2V  
Program Current  
VPP = VCC  
10  
VIL  
Input Low Voltage  
–0.3  
2
0.8  
(2)  
VIH  
Input High Voltage  
VCC + 1  
0.4  
V
VOL  
VOH  
Output Low Voltage  
Output High Voltage TTL  
Output High Voltage CMOS  
IOL = 2.1mA  
IOH = –400µA  
IOH = –100µA  
V
2.4  
V
VCC – 0.7V  
V
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP  
2. Maximum DC voltage on Output is VCC +0.5V.  
.
T = 25 °C; V = 6.25V ± 0.25V; V = 12.75V ± 0.25V  
A
CC  
PP  
(1)  
Table 6.  
Symbol  
Programming Mode DC Characteristics  
Parameter  
Test Condition  
IL VIN VIH  
Min.  
Max.  
Unit  
ILI  
ICC  
IPP  
Input Leakage Current  
Supply Current  
V
±10  
50  
µA  
mA  
mA  
V
Program Current  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage TTL  
A9 Voltage  
E = VIL  
50  
VIL  
–0.3  
2
0.8  
VIH  
VOL  
VOH  
VID  
VCC + 0.5  
0.4  
V
IOL = 2.1mA  
V
IOH = –400µA  
2.4  
V
11.5  
12.5  
V
1.  
VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.  
13/24  
DC and AC characteristics  
M27C1001  
T = 25 °C, f = 1 MHz  
A
(1)  
Table 7.  
Symbol  
Capacitance  
Parameter  
Input Capacitance  
Output Capacitance  
Test Condition  
Min  
Max  
Unit  
CIN  
VIN = 0V  
6
pF  
pF  
COUT  
VOUT = 0V  
12  
1. Sampled only, not 100% tested.  
Table 8.  
AC Measurement Conditions  
Parameter  
High Speed  
Standard  
Input Rise and Fall Times  
10ns  
0 to 3V  
1.5V  
20ns  
Input Pulse Voltages  
0.4V to 2.4V  
0.8V and 2V  
Input and Output Timing Ref. Voltages  
Figure 6.  
AC Testing Input Output Waveform  
High Speed  
3V  
1.5V  
0V  
Standard  
2.4V  
2.0V  
0.8V  
0.4V  
AI01822  
Figure 7.  
AC Testing Load Circuit  
1.3V  
1N914  
3.3kΩ  
DEVICE  
UNDER  
TEST  
OUT  
C
L
C
C
C
= 30pF for High Speed  
= 100pF for Standard  
includes JIG capacitance  
L
L
L
AI01823B  
14/24  
M27C1001  
DC and AC characteristics  
T = 0 to 70°C, –40 to 85°C or –40 to 125°C; V = 5V ± 5% or 5V ± 10%; V = V  
A
CC  
PP  
CC  
(1)  
Table 9.  
Read Mode AC Characteristics  
M27C1001  
-45 -60  
Min. Max. Min. Max. Min. Max. Min. Max.  
Test  
Condition  
Symbol Alt  
Parameter  
-35 (2)  
-70  
Unit  
Address Valid to E = VIL,  
tAVQV tACC  
35  
35  
45  
45  
60  
60  
70  
70  
ns  
ns  
Output Valid  
G = VIL  
Chip Enable Low  
to Output Valid  
tELQV  
tCE  
G = VIL  
Output Enable  
tGLQV  
tOE Low to Output  
Valid  
E = VIL  
G = VIL  
25  
25  
25  
25  
25  
25  
30  
30  
30  
35  
30  
30  
ns  
ns  
ns  
Chip Enable High  
tDF  
(3)  
tEHQZ  
0
0
0
0
0
0
0
0
to Output Hi-Z  
Output Enable  
tDF High to Output Hi- E = VIL  
Z
tGHQZ  
(3)  
AddressTransition  
E = VIL,  
tAXQX  
tOH to Output  
G = VIL  
0
0
0
0
ns  
Transition  
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP  
2. Speed obtained with High Speed AC measurement conditions.  
3. Sampled only, not 100% tested.  
.
15/24  
DC and AC characteristics  
M27C1001  
T = 0 to 70°C, –40 to 85°C or –40 to 125°C; V = 5V ± 5% or 5V ± 10%; V = V  
A
CC  
PP  
CC  
(1)  
Table 10. Read Mode AC Characteristics  
M27C1001  
-90 -10  
Test  
Condition  
-12/-15/  
-20/-25  
Symbol Alt  
Parameter  
-80  
Unit  
Min Max Min Max Min Max Min Max  
Address Valid to E = VIL, G =  
tAVQV  
tELQV  
tACC  
80  
80  
90  
90  
100  
100  
120 ns  
120 ns  
Output Valid  
VIL  
Chip Enable Low  
to Output Valid  
tCE  
G = VIL  
Output Enable  
tGLQV  
tOE Low to Output  
Valid  
E = VIL  
G = VIL  
E = VIL  
40  
30  
30  
45  
30  
30  
50  
30  
30  
60  
40  
40  
ns  
ns  
ns  
Chip Enable High  
tDF  
(2)  
tEHQZ  
0
0
0
0
0
0
0
0
to Output Hi-Z  
Output Enable  
tDF High to Output  
Hi-Z  
tGHQZ  
(2)  
Address  
tOH Transition to  
Output Transition  
E = VIL, G =  
VIL  
tAXQX  
0
0
0
0
ns  
1.  
VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.  
2. Sampled only, not 100% tested.  
Figure 8.  
Read Mode AC Waveforms  
VALID  
tAVQV  
VALID  
A0-A16  
tAXQX  
E
tEHQZ  
tGHQZ  
tGLQV  
G
tELQV  
Hi-Z  
Q0-Q7  
AI00713B  
16/24  
M27C1001  
DC and AC characteristics  
T = 25 °C; V = 6.25V ± 0.25V; V = 12.75V ± 0.25V  
A
CC  
PP  
(1)  
Table 11. Programming Mode AC Characteristics  
Symbol  
Alt  
Parameter  
Test Condition Min.  
Max.  
Unit  
tAVPL  
tQVPL  
tVPHPL  
tVCHPL  
tELPL  
tAS Address Valid to Program Low  
tDS Input Valid to Program Low  
2
2
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
tVPS VPP High to Program Low  
2
tVCS VCC High to Program Low  
2
tCES Chip Enable Low to Program Low  
tPW Program Pulse Width  
2
tPLPH  
tPHQX  
tQXGL  
tGLQV  
95  
2
105  
tDH Program High to Input Transition  
tOES Input Transition to Output Enable Low  
tOE Output Enable Low to Output Valid  
tDFP Output Enable High to Output Hi-Z  
2
100  
130  
(2)  
tGHQZ  
0
0
Output Enable High to Address  
Transition  
tGHAX  
tAH  
ns  
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP  
2. Sampled only, not 100% tested.  
.
Figure 9.  
Programming and Verify Modes AC Waveforms  
VALID  
A0-A16  
tAVPL  
Q0-Q7  
DATA IN  
DATA OUT  
tQVPL  
tVPHPL  
tVCHPL  
tPHQX  
V
PP  
tGLQV  
tGHQZ  
tGHAX  
V
CC  
E
tELPL  
tPLPH  
P
tQXGL  
G
PROGRAM  
VERIFY  
AI00714  
17/24  
Package mechanical data  
M27C1001  
5
Package mechanical data  
5.1  
32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA)  
Figure 10. FDIP32WA package outline  
A2  
A3  
A1  
A
L
α
B1  
B
e
C
eA  
eB  
D2  
D
S
N
1
E1  
E
FDIPW-a  
Table 12. FDIP32WA package mechanical data  
millimeters  
Symbol  
inches  
Min  
Typ  
Max  
Min  
Typ  
Max  
A
A1  
A2  
A3  
B
5.72  
1.40  
4.57  
4.50  
0.56  
0.225  
0.055  
0.180  
0.177  
0.022  
0.51  
3.91  
3.89  
0.41  
0.020  
0.154  
0.153  
0.016  
B1  
C
1.45  
0.057  
0.23  
0.30  
0.009  
1.643  
0.012  
1.655  
D
41.73  
42.04  
D2  
e
38.10  
2.54  
1.500  
0.100  
0.600  
E
15.24  
E1  
eA  
eB  
L
13.06  
13.36  
0.514  
0.526  
14.99  
0.590  
16.18  
3.18  
18.03  
4.10  
0.637  
0.125  
0.710  
0.161  
N
32  
32  
S
1.52  
4°  
2.49  
11°  
0.060  
4°  
0.098  
11°  
Ø
7.11  
0.280  
α
18/24  
M27C1001  
Package mechanical data  
5.2  
32-pin Plastic DIP, 600 mils width (PDIP32)  
Figure 11. PDIP32 package outline  
A2  
A1  
A
L
α
c
b1  
b
e
eA  
D2  
D
S
N
1
E1  
E
PDIP-C  
Table 13. PDIP32 package mechanical data  
millimeters  
Symbol  
inches  
Min  
Typ  
Max  
Min  
Typ  
Max  
A
A1  
A2  
b
4.83  
0.190  
0.38  
0.015  
3.81  
0.150  
0.41  
1.14  
0.53  
1.65  
0.016  
0.045  
0.009  
1.645  
0.021  
0.065  
0.015  
1.665  
b1  
c
0.23  
0.38  
D
41.78  
42.29  
D2  
eA  
e
38.10  
15.24  
2.54  
1.500  
0.600  
0.100  
E
15.24  
13.46  
1.65  
3.05  
0°  
15.88  
13.97  
2.21  
3.56  
15°  
0.600  
0.530  
0.065  
0.120  
0°  
0.625  
0.550  
0.087  
0.140  
15°  
E1  
S
L
α
N
32  
32  
19/24  
Package mechanical data  
M27C1001  
5.3  
32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32)  
Figure 12. PLCC32 package outline  
D
A1  
A2  
D1  
1
N
B1  
e
E2  
E2  
E3  
E1 E  
F
B
0.51 (.020)  
1.14 (.045)  
D3  
A
R
CP  
D2  
D2  
PLCC-A  
Table 14. PLCC32 package mechanical data  
millimeters  
Symbol  
inches  
Typ  
Min  
Typ  
Max  
Min  
Max  
A
A1  
A2  
B
3.18  
1.53  
0.38  
0.33  
0.66  
3.56  
2.41  
0.125  
0.060  
0.015  
0.013  
0.026  
0.140  
0.095  
0.53  
0.81  
0.021  
0.032  
0.004  
0.495  
0.453  
0.223  
B1  
CP  
D
0.10  
12.32  
11.35  
4.78  
12.57  
11.51  
5.66  
0.485  
0.447  
0.188  
D1  
D2  
D3  
E
7.62  
0.300  
14.86  
13.89  
6.05  
15.11  
14.05  
6.93  
0.585  
0.547  
0.238  
0.595  
0.553  
0.273  
E1  
E2  
E3  
e
10.16  
1.27  
0.400  
0.050  
F
0.00  
0.13  
0.000  
0.005  
R
0.89  
32  
0.035  
32  
N
20/24  
M27C1001  
Package mechanical data  
5.4  
32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32)  
Figure 13. TSOP32 package outline  
A2  
1
N
e
E
B
N/2  
D1  
D
A
CP  
DIE  
C
TSOP-a  
A1  
α
L
Table 15. TSOP32 package mechanical data  
millimeters  
Symbol  
inches  
Typ  
Min  
Typ  
Max  
Min  
Max  
A
A1  
A2  
B
1.200  
0.150  
1.050  
0.250  
0.210  
0.100  
20.200  
18.500  
0.0472  
0.0059  
0.0413  
0.0098  
0.0083  
0.0039  
0.7953  
0.7283  
0.050  
0.950  
0.170  
0.100  
0.0020  
0.0374  
0.0067  
0.0039  
C
CP  
D
19.800  
18.300  
0.7795  
0.7205  
D1  
e
0.500  
32  
0.0197  
32  
E
7.900  
0.500  
8.100  
0.700  
0.3110  
0.0197  
0.3189  
0.0276  
L
N
α
0°  
5°  
0°  
5°  
21/24  
Part numbering  
M27C1001  
6
Part numbering  
Table 16. Ordering information scheme  
Example:  
M27C1001  
-35  
X
C
1
TR  
Device Type  
M27  
Supply Voltage  
C = 5V  
Device Function  
1001 = 1 Mbit (128Kb x 8)  
Speed  
-35 (1) = 35 ns  
-45 = 45 ns  
-60 = 60 ns  
-70 = 70 ns  
-80 = 80 ns  
-90 = 90 ns  
-10 = 100 ns  
-12 = 120 ns  
-15 = 150 ns  
-20 = 200 ns  
-25 = 250 ns  
VCC Tolerance  
blank = ± 10%  
X = ± 5%  
Package  
F = FDIP32W  
B = PDIP32  
C = PLCC32  
N = TSOP32: 8 x 20 mm  
Temperature Range  
1 = 0 to 70 °C  
3 = –40 to 125 °C  
6 = –40 to 85 °C  
Options  
TR = ECOPACK® package, Tape & Reel Packing  
1. High Speed, see AC Characteristics section for further information.  
For a list of available options (Speed, Package, etc...) or for further information on any  
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.  
22/24  
M27C1001  
Revision history  
7
Revision history  
Table 17. Document revision history  
Date  
Revision  
Changes  
September 1998  
24-Jan-2000  
1
2
3
First Issue  
35ns speed class addes (Table 8A, Table 16)  
20-Sep-2000  
AN620 Reference removed  
PLCC32 Package mechanical data and drawing clarified  
(Table 14 and Figure 12)  
04-Jun-2002  
12-Apr-2006  
4
5
TSOP32 Package mechanical data clarified (Table 15)  
Removed LCC32W package and Additional Burn-in option.  
Converted to new template. Added ECOPACK® information.  
23/24  
M27C1001  
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24/24  

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