M27C4001-70XB6 [STMICROELECTRONICS]
4 Mbit (512Kb x 8) UV EPROM and OTP EPROM; 4兆位（ 512KB ×8） UV EPROM和OTP EPROM
| 型号： | M27C4001-70XB6 |
| 厂家： | 
ST |
| 描述： | 4 Mbit (512Kb x 8) UV EPROM and OTP EPROM |
| 文件： | 总24页 (文件大小：216K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M27C4001
4 Mbit (512Kb x 8) UV EPROM and OTP EPROM
Feature summary
■ 5V ± 10% supply voltage in Read operation
■ Access time: 35ns
■ Low power consumption:
– Active Current 30mA at 5MHz
– Standby Current 100µA
32
1
■ Programming voltage: 12.75V ± 0.25V
■ Programming time: 100µs/Word
FDIP32W (F)
■ Electronic signature
– Manufacturer Code: 20h
– Device Code: 41h
32
■ Packages
– ECOPACK® compliant versions
1
PDIP32 (B)
PLCC32 (C)
TSOP32 (N) 8 x 20 mm
March 2006
Rev 4
1/24
www.st.com
1
Contents
M27C4001
Contents
1
2
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3
4
5
6
7
2/24
M27C4001
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18
PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19
PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 21
Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M27C4001
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18
Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19
Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20
Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 21
4/24
M27C4001
Summary description
1
Summary description
The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organised as 524,288 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C4001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Logic Diagram
V
V
PP
CC
19
8
A0-A18
Q0-Q7
E
M27C4001
G
V
SS
AI00721B
Table 1.
Signal names
A0-A18
Address Inputs
Data Outputs
Chip Enable
Output Enable
Program Supply
Supply Voltage
Ground
Q0-Q7
E
G
VPP
VCC
VSS
5/25
Summary description
Figure 2.
M27C4001
DIP Connections
V
1
2
3
4
5
6
7
8
9
32
V
CC
PP
A16
A15
A12
A7
31 A18
30 A17
29 A14
28 A13
27 A8
A6
A5
26 A9
A4
25 A11
M27C4001
A3
24
23 A10
22
G
A2 10
A1 11
A0 12
Q0 13
Q1 14
Q2 15
E
21 Q7
20 Q6
19 Q5
18 Q4
17 Q3
V
16
SS
AI00722
Figure 3.
LCC Connections
1 32
M27C4001
17
A7
A6
A5
A4
A3
A2
A1
A0
Q0
A14
A13
A8
A9
9
25 A11
G
A10
E
Q7
AI00723
6/25
M27C4001
Summary description
Figure 4.
TSOP Connections
A11
A9
1
32
G
A10
E
A8
A13
A14
A17
A18
Q7
Q6
Q5
Q4
Q3
V
8
9
M27C4001 25
CC
(Normal)
V
24
V
SS
PP
A16
A15
A12
A7
Q2
Q1
Q0
A0
A1
A2
A3
A6
A5
A4
16
17
AI01155B
7/25
Device operation
M27C4001
2
Device operation
The operating modes of the M27C4001 are listed in the Operating Modes table. A single
power supply is required in the read mode. All inputs are TTL levels except for V and 12V
PP
on A9 for Electronic Signature.
2.1
Read Mode
The M27C4001 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (t
) is equal to the delay from E to output (t
). Data is
AVQV
ELQV
available at the output after a delay of t
from the falling edge of G, assuming that E has
GLQV
been low and the addresses have been stable for at least t
-t
.
AVQV GLQV
2.2
2.3
Standby Mode
The M27C4001 has a standby mode which reduces the supply current from 30mA to 100µA.
The M27C4001 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
the G input.
Two Line Output Control
Because EPROMs are usually used in larger memory arrays, this product features a 2 line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
a) the lowest possible memory power dissipation,
b) complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.
8/25
M27C4001
Device operation
2.4
System Considerations
The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, I , has three segments that are of interest to
CC
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between V and V . This should
CC
SS
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between V and V for every eight devices. The bulk capacitor should be located near the
CC
SS
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.
2.5
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C4001 are in the
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.
Although only '0's will be programmed, both '1's and '0's can be present in the data word.
The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The
M27C4001 is in the programming mode when V input is at 12.75V, G is at V and E is
PP
IH
pulsed to V . The data to be programmed is applied to 8 bits in parallel to the data output
IL
pins. The levels required for the address and data inputs are TTL. V is specified to be
CC
6.25V ± 0.25V.
2.6
PRESTO II Programming Algorithm
PRESTO II Programming Algorithm allows the whole array to be programmed with a
guaranteed margin, in a typical time of 52.5 seconds. Programming with PRESTO II
consists of applying a sequence of 100µs program pulses to each byte until a correct verify
occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is
automatically activated in order to guarantee that each cell is programmed with enough
margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the
necessary margin to each programmed cell.
9/25
Device operation
M27C4001
Figure 5.
Programming Flowchart
V
= 6.25V, V = 12.75V
PP
CC
n = 0
E = 100µs Pulse
NO
NO
++n
= 25
VERIFY
YES
++ Addr
YES
Last
Addr
NO
FAIL
YES
CHECK ALL BYTES
1st: V
2nd: V
= 6V
= 4.2V
CC
CC
AI00760B
2.7
Program Inhibit
Programming of multiple M27C4001s in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C4001 may be
common. A TTL low level pulse applied to a M27C4001's E input, with V at 12.75V, will
PP
program that M27C4001. A high level E input inhibits the other M27C4001s from being
programmed.
2.8
2.9
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with G at V , E at V , V at 12.75V and
IL
IH PP
V
at 6.25V.
CC
Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C4001. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C4001 with V = V = 5V. Two identifier bytes may then be sequenced from the
PP
CC
device outputs by toggling address line A0 from V to V . All other address lines must be
IL
IH
held at V during Electronic Signature mode. Byte 0 (A0 = V ) represents the manufacturer
IL
IL
code and byte 1 (A0 = V ) the device identifier code. For the STMicroelectronics
IH
M27C4001, these two identifier bytes are given in Table 3 and can be read-out on outputs
Q7 to Q0.
10/25
M27C4001
Device operation
2.10
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27C4001 are such that erasure begins when the cells
are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Data shows that constant exposure to room level fluorescent lighting could erase a
typical M27C4001 in about 3 years, while it would take approximately 1 week to cause
erasure when exposed to direct sunlight. If the M27C4001 is to be exposed to these types of
lighting conditions for extended periods of time, it is suggested that opaque labels be put
over the M27C4001 window to prevent unintentional erasure. The recommended erasure
procedure for the M27C4001 is exposure to short wave ultraviolet light which has
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
2
should be a minimum of 15 W-sec/cm . The erasure time with this dosage is approximately
2
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm power rating. The M27C4001
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.
(1)
Table 2.
Operating Modes
Mode
E
G
A9
Vpp
Q7 - Q0
Read
VIL
VIL
VIL
VIH
VIH
VIL
VIH
X
X
X
VCC or VSS
VCC or VSS
VPP
Data Out
Hi-Z
Output Disable
Program
V
IL Pulse
X
Data In
Data Out
Hi-Z
Verify
VIH
X
VPP
Program Inhibit
Standby
VIH
X
VPP
VIH
X
VCC or VSS
VCC
Hi-Z
Electronic Signature
VIL
VIL
VID
Codes
1. X = VIH or VIL, VID = 12V ± 0.5V.
Table 3.
Electronic Signature
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer’s
Code
VIL
0
0
1
0
0
0
0
0
0
20h
Electronic
Signature
VIH
0
1
0
0
0
0
1
41h
11/25
Maximum rating
M27C4001
3
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Symbol
Absolute Maximum Ratings
Parameter
Value
Unit
TA
Ambient Operating Temperature(1)
Temperature Under Bias
Storage Temperature
–40 to 125
–50 to 125
–65 to 150
–2 to 7
°C
°C
°C
V
TBIAS
TSTG
(2)
VIO
Input or Output Voltage (except A9)
Supply Voltage
VCC
–2 to 7
V
(2)
VA9
A9 Voltage
–2 to 13.5
–2 to 14
V
VPP
Program Supply Voltage
V
1. Depends on range.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period
less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC
+2V for a period less than 20ns.
12/25
M27C4001
DC and AC parameters
4
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 5.
AC Measurement Conditions
High Speed
Standard
Input Rise and Fall Times
≤10ns
0 to 3V
1.5V
≤20ns
Input Pulse Voltages
0.4 to 2.4V
0.8 and 2V
Input and Output Timing Ref. Voltages
Figure 6.
AC Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
2.0V
0.8V
0.4V
AI01822
Figure 7.
AC Testing Load Circuit
1.3V
1N914
3.3kΩ
DEVICE
UNDER
TEST
OUT
C
L
C
C
C
= 30pF for High Speed
= 100pF for Standard
includes JIG capacitance
L
L
L
AI01823B
13/25
DC and AC parameters
M27C4001
Unit
(1) (2)
Table 6.
Symbol
Capacitance
Parameter
Test Condition
Min
Max
CIN
Input Capacitance
Output Capacitance
VIN = 0V
6
pF
pF
COUT
VOUT = 0V
12
1. TA = 25 °C, f = 1 MHz.
2. Sampled only, not 100% tested.
.
(1) (2)
Table 7.
Read Mode DC Characteristics
Symbol
Parameter
Test Condition
Min
Max
Unit
ILI
Input Leakage Current
Output Leakage Current
0V ≤VIN ≤VCC
0V ≤VOUT ≤VCC
E = VIL, G = VIL,
±10
±10
µA
µA
ILO
ICC
ICC1
ICC2
Supply Current
30
1
mA
mA
µA
I
OUT = 0mA, f = 5MHz
Supply Current (Standby) TTL
E = VIH
Supply Current (Standby)
CMOS
E > VCC – 0.2V
VPP = VCC
100
IPP
VIL
Program Current
10
0.8
µA
V
Input Low Voltage
–0.3
2
(3)
VIH
Input High Voltage
VCC + 1
0.4
V
VOL
VOH
Output Low Voltage
Output High Voltage TTL
Output High Voltage CMOS
IOL = 2.1mA
IOH = –400µA
IOH = –100µA
V
2.4
V
VCC – 0.7V
V
1.
TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
.
3. Maximum DC voltage on Output is VCC +0.5V.
(1) (2)
Table 8.
Symbol
Programming Mode DC Characteristics
Parameter
Test Condition
Min
Max
Unit
ILI
ICC
IPP
Input Leakage Current
Supply Current
0 ≤VIN ≤VCC
±10
50
µA
mA
mA
V
Program Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage TTL
A9 Voltage
E = VIL
50
VIL
–0.3
2
0.8
VIH
VOL
VOH
VID
VCC + 0.5
0.4
V
IOL = 2.1mA
V
IOH = –400µA
2.4
V
11.5
12.5
V
1.
TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
.
14/25
M27C4001
DC and AC parameters
Figure 8. Read Mode AC Waveforms
VALID
VALID
tEHQZ
A0-A18
tAVQV
tAXQX
E
tGLQV
G
tGHQZ
tELQV
Hi-Z
Q0-Q7
AI00724B
(1) (2)
Table 9.
Read Mode AC Characteristics
M27C4001
-45(3)
Symbol Alt
Parameter
Test Condition
-35(3)
-55(3)
Unit
Min Max Min Max Min Max
Address Valid to
Output Valid
tAVQV tACC
E = VIL, G = VIL
G = VIL
35
35
20
30
30
45
45
25
30
30
55
55
30
30
30
ns
ns
ns
ns
ns
ns
Chip Enable Low to
Output Valid
tELQV
tGLQV
tCE
tOE
tDF
tDF
tOH
Output Enable Low
to Output Valid
E = VIL
Chip Enable High to
Output Hi-Z
(4)
tEHQZ
G = VIL
0
0
0
0
0
0
0
0
0
Output Enable High
to Output Hi-Z
(4)
tGHQZ
E = VIL
Address Transition
to Output Transition
tAXQX
E = VIL, G = VIL
1.
TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Speed obtained with High Speed AC measurement conditions.
4. Sampled only, not 100% tested.
15/25
DC and AC parameters
M27C4001
(1) (2)
Table 10. Read Mode AC Characteristics
M27C4001
-80/-90
Symbol Alt
Parameter
Test Condition
-70
-10/-12/-15 Unit
Min Max Min Max Min Max
Address Valid to
Output Valid
tAVQV
tELQV
tGLQV
tACC
tCE
tOE
tDF
E = VIL, G = VIL
G = VIL
70
70
35
30
30
80
80
40
30
30
100 ns
100 ns
Chip Enable Low to
Output Valid
Output Enable Low
to Output Valid
E = VIL
50
30
30
ns
ns
ns
ns
Chip Enable High to
Output Hi-Z
(3)
tEHQZ
G = VIL
0
0
0
0
0
0
0
0
0
Output Enable High
to Output Hi-Z
(3)
tGHQZ
tAXQX
tDF
E = VIL
Address Transition
to Output Transition
tOH
E = VIL, G = VIL
1.
TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Sampled only, not 100% tested.
.
16/25
M27C4001
DC and AC parameters
Figure 9.
Programming and Verify Modes AC Waveforms
VALID
A0-A18
tAVPL
Q0-Q7
DATA IN
DATA OUT
tQVEL
tVPHEL
tVCHEL
tEHQX
V
PP
tGLQV
tGHQZ
tGHAX
V
CC
E
tELEH
tQXGL
G
PROGRAM
VERIFY
AI00725
(1) (2) (3)
Table 11. Programming Mode AC Characteristics
Symbol
Alt
Parameter
Test Condition
Min
Max
Unit
tAVEL
tQVEL
tVPHEL
tVCHEL
tELEH
tEHQX
tQXGL
tGLQV
tGHQZ
tAS Address Valid to Chip Enable Low
tDS Input Valid to Chip Enable Low
tVPS VPP High to Chip Enable Low
2
2
µs
µs
µs
µs
µs
µs
µs
ns
ns
2
tVCS VCC High to Chip Enable Low
tPW Chip Enable Program Pulse Width
tDH Chip Enable High to Input Transition
tOES Input Transition to Output Enable Low
tOE Output Enable Low to Output Valid
tDFP Output Enable High to Output Hi-Z
2
95
2
105
2
100
130
0
0
Output Enable High to Address
Transition
tGHAX
tAH
ns
1.
TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Sampled only, not 100% tested.
.
17/25
Package mechanical
M27C4001
5
Package mechanical
Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline
A2
A3
A1
A
L
α
B1
B
e
C
eA
eB
D2
D
S
N
1
E1
E
FDIPW-a
1. Drawing is not to scale.
Table 12. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical
data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
A3
B
5.72
1.40
4.57
4.50
0.56
–
0.225
0.055
0.180
0.177
0.022
–
0.51
3.91
3.89
0.41
–
0.020
0.154
0.153
0.016
–
B1
C
1.45
0.057
0.23
41.73
–
0.30
42.04
–
0.009
1.643
–
0.012
1.655
–
D
D2
e
38.10
2.54
1.500
0.100
0.600
–
–
–
–
E
15.24
–
–
–
–
E1
eA
eB
L
13.06
–
13.36
–
0.514
–
0.526
–
14.99
0.590
16.18
3.18
18.03
4.10
0.637
0.125
0.710
0.161
N
32
32
S
1.52
–
2.49
–
0.060
–
0.098
–
Ø
7.11
0.280
α
4°
11°
4°
11°
18/25
M27C4001
Package mechanical
Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline
A2
A
L
A1
α
c
b1
b
e
eA
D2
D
S
N
1
E1
E
PDIP-C
1. Drawing is not to scale.
Table 13. PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
4.83
0.190
0.38
0.015
3.81
0.150
0.41
1.14
0.23
41.78
–
0.53
1.65
0.38
42.29
–
0.016
0.045
0.009
1.645
–
0.021
0.065
0.015
1.665
–
b1
c
D
eA
e
15.24
2.54
0.600
0.100
–
–
–
–
E
15.24
13.46
1.65
3.05
0°
15.88
13.97
2.21
3.56
15°
0.600
0.530
0.065
0.120
0°
0.625
0.550
0.087
0.140
15°
E1
S
L
α
N
32
32
19/25
Package mechanical
M27C4001
Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline
D
A1
A2
D1
1
N
B1
e
E2
E2
E3
E1 E
F
B
0.51 (.020)
1.14 (.045)
D3
A
R
CP
D2
D2
PLCC-A
1. Drawing is not to scale.
Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
B
3.18
1.53
0.38
0.33
0.66
3.56
2.41
–
0.125
0.060
0.015
0.013
0.026
0.140
0.095
–
0.53
0.81
0.10
12.57
11.51
5.66
–
0.021
0.032
0.004
0.495
0.453
0.223
–
B1
CP
D
12.32
11.35
4.78
–
0.485
0.447
0.188
–
D1
D2
D3
E
7.62
0.300
14.86
13.89
6.05
–
15.11
14.05
6.93
–
0.585
0.547
0.238
–
0.595
0.553
0.273
–
E1
E2
E3
e
10.16
1.27
0.400
0.050
–
–
–
–
F
0.00
–
0.13
–
0.000
–
0.005
–
R
0.89
32
0.035
32
N
20/25
M27C4001
Package mechanical
Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline
A2
1
N
e
E
B
N/2
D1
D
A
CP
DIE
C
TSOP-a
A1
α
L
1. Drawing is not to scale.
Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package
Mechanical Data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
B
1.200
0.150
1.050
0.250
0.210
0.100
20.200
18.500
–
0.0472
0.0059
0.0413
0.0098
0.0083
0.0039
0.7953
0.7283
–
0.050
0.950
0.170
0.100
0.0020
0.0374
0.0067
0.0039
C
CP
D
19.800
18.300
–
0.7795
0.7205
–
D1
e
0.500
32
0.0197
32
E
7.900
0.500
8.100
0.700
0.3110
0.0197
0.3189
0.0276
L
N
α
0°
5°
0°
5°
21/25
Part numbering
M27C4001
6
Part numbering
Table 16. Ordering Information Scheme
Example:
M27C4001
-45
X
C
1
Device Type
M27
Supply Voltage
C = 5V
Device Function
4001 = 4 Mbit (512Kb x 8)
Speed
-35(1) = 35 ns
-45(1) = 45 ns
-55(1) = 55 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
VCC Tolerance
blank = ± 10%
X = ± 5%
Package
F = FDIP32W
B = PDIP32
C = PLCC32
N = TSOP32: 8 x 20 mm
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
1. High Speed, see AC Characteristics section for further information.
For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/25
M27C4001
Revision history
7
Revision history
Table 17. Document revision history
Date
Revision
Changes
July 1998
09/25/00
11/29/00
1
2
3
First Issue
AN620 Reference removed
PLCC codification changed (Table 16.)
Document converted to new template (sections added, information
moved). LCCC32W package removed. Package specifications
updated (see Section 5: Package mechanical). Packages are
ECOPACK® compliant. X and TR options removed from Table 16:
Ordering Information Scheme.
28-Mar-2006
4
23/25
M27C4001
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