M27W801-120N6 [STMICROELECTRONICS]
1MX8 OTPROM, 120ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32;
| 型号： | M27W801-120N6 |
| 厂家： | 
ST |
| 描述： | 1MX8 OTPROM, 120ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32 可编程只读存储器 光电二极管 |
| 文件： | 总24页 (文件大小：264K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M27W801
8 Mbit (1Mb x8) low voltage UV EPROM and OTP EPROM
Feature summary
■ 2.7V to 3.6V supply voltage in READ operation
■ Access time:
32
– 80ns at V = 3.0V to 3.6V
CC
– 100ns at V = 2.7V to 3.6V
CC
1
■ Pin compatible with M27C801
FDIP32W (F)
■ Low power consumption:
– 30µA max Standby Current
– 15mA max Active Current at 5MHz
■ Programming time 50µs/Byte
■ High reliability CMOS technology
– 2,000V ESD Protection
32
– 200mA Latchup Protection Immunity
■ Electronic signature
– Manufacturer Code: 20h
– Device Code: 42h
1
PDIP32 (B)
■ ECOPACK® packages available
PLCC32 (K)
TSOP32 (N)
8 x 20 mm
May 2006
Rev 2
1/24
www.st.com
1
Contents
M27W801
Contents
1
2
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PRESTO IIB programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3
4
5
6
7
2/24
M27W801
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Programming mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Margin mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP32WC - 32 pin Ceramic Frit-seal DIP, with window (0.260" x 0.420"),
package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PDIP32 – 32 pin Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . . 19
PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package mechanical data . . . . 21
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
3/24
List of figures
M27W801
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
PLCC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
TSOP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Programming flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
AC testing input output waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AC testing load circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Margin mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. Programming and Verify modes AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package outline . . . . . . . . . . . . . . 18
Figure 12. PDIP32 - 32 pin Plastic DIP, 600 mils width, package outline . . . . . . . . . . . . . . . . . . . . . . 19
Figure 13. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package outline . . . . . . . . . . . . . . . . . . . . 20
Figure 14. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package outline . . . . . . . . . . . . 21
4/24
M27W801
Summary description
1
Summary description
The M27W801 is a low voltage 8 Mbit EPROM offered in the two ranges UV (ultra violet
erase) and OTP (one time programmable). It is ideally suited for microprocessor systems
requiring large data or program storage and is organized as 1,048,576 by 8 bits.
The M27W801 operates in the read mode with a supply voltage as low as 2.7V at –40 to
85°C temperature range. The decrease in operating power allows either a reduction of the
size of the battery or an increase in the time between battery recharges.
The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27W801 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27W801 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Logic diagram
V
CC
20
8
A0-A19
Q0-Q7
E
M27W801
GV
PP
V
SS
AI02363
Table 1.
Signal names
A0-A19
Address Inputs
Data Outputs
Chip Enable
Q0-Q7
E
GVPP
VCC
VSS
Output Enable / Program Supply
Supply Voltage
Ground
5/24
Summary description
Figure 2.
M27W801
DIP connections
A19
A16
A15
A12
A7
1
2
3
4
5
6
7
8
9
32
V
CC
31 A18
30 A17
29 A14
28 A13
27 A8
A6
A5
26 A9
A4
25 A11
M27W801
A3
24 GV
PP
23 A10
22
A2 10
A1 11
A0 12
Q0 13
Q1 14
Q2 15
E
21 Q7
20 Q6
19 Q5
18 Q4
17 Q3
V
16
SS
AI02671
Figure 3.
PLCC connections
1 32
M27W801
17
A7
A6
A5
A4
A3
A2
A1
A0
Q0
A14
A13
A8
A9
9
25 A11
GV
PP
A10
E
Q7
AI02365
6/24
M27W801
Summary description
Figure 4.
TSOP connections
A11
A9
1
32
GV
PP
A10
A8
E
A13
A14
A17
A18
Q7
Q6
Q5
Q4
Q3
V
8
9
M27W801
(Normal)
25
24
CC
A19
A16
A15
A12
A7
V
SS
Q2
Q1
Q0
A0
A1
A2
A3
A6
A5
A4
16
17
AI02366
7/24
Device operation
M27W801
2
Device operation
The operating modes of the M27W801 are listed in the Operating Modes table. A single
power supply is required in the read mode. All inputs are TTL levels except for GV and
PP
12V on A9 for Electronic Signature and Margin Mode Set or Reset.
2.1
Read mode
The M27W801 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (t
) is equal to the delay from E to output (t
). Data is
AVQV
ELQV
available at the output after a delay of t
from the falling edge of G, assuming that E has
GLQV
been low and the addresses have been stable for at least t
-t
.
AVQV GLQV
2.2
2.3
Standby mode
The M27W801 has a standby mode which reduces the supply current from 15mA to 20µA
with low voltage operation V ≤3.6V, see Read Mode DC Characteristics table for details.
The M27W801 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
CC
the GV input.
PP
Two Line Output Control
Because EPROMs are usually used in larger memory arrays, the product features a 2 line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
■
■
the lowest possible memory power dissipation
complete assurance that output bus contention will not occur
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.
8/24
M27W801
Device operation
2.4
System considerations
The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, I , has three segments that are of interest to
CC
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between V and V . This should
CC
SS
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between V and V for every eight devices. The bulk capacitor should be located near the
CC
SS
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.
2.5
Programming
The M27W801 has been designed to be fully compatible with the M27C801 and has the
same electronic signature. As a result the M27W801 can be programmed as the M27C801
on the same programming equipment applying 12.75V on V and 6.25V on V by the use
PP
CC
of the same PRESTO IIB algorithm. When delivered (and after each ‘1’s erasure for UV
EPROM), all bits of the M27W801 are in the "1" state. Data is introduced by selectively
programming "0"s into the desired bit locations.Although only '0' will be programmed, both
"1" and "0" can be present in the data word. The only way to change a ‘0’ to a ‘1’ is by die
exposure to ultraviolet light (UV EPROM). The M27W801 is in the programming mode when
V
input is at 12.75V and E is pulsed to V . The data to be programmed is applied to 8 bits
PP
IL
in parallel to the data output pins. The levels required for the address and data inputs are
TTL. V is specified to be 6.25V ± 0.25V.
CC
2.6
PRESTO IIB programming algorithm
PRESTO IIB Programming Algorithm allows the whole array to be programmed with a
guaranteed margin, in a typical time of 52.5 seconds. This can be achieved with
STMicroelectronics M27W801 due to several design innovations to improve programming
efficiency and to provide adequate margin for reliability. Before starting the programming the
internal MARGIN MODE circuit must be set in order to guarantee that each cell is
programmed with enough margin. Then a sequence of 50µs program pulses are applied to
each byte until a correct verify occurs (see Figure 5). No overprogram pulses are applied
since the verify in MARGIN MODE at V much higher than 3.6V, provides the necessary
CC
margin.
9/24
Device operation
M27W801
Figure 5.
Programming flowchart
V
= 6.25V, V = 12.75V
PP
CC
SET MARGIN MODE
n = 0
E = 50µs Pulse
NO
NO
++n
= 25
VERIFY
++ Addr
YES
YES
Last
Addr
NO
FAIL
YES
RESET MARGIN MODE
CHECK ALL BYTES
1st: V
2nd: V
= 5V
= 2.7V
CC
CC
AI01271C
2.7
2.8
Program Inhibit
Programming of multiple M27W801s in parallel with different data is also easily
accomplished. Except for E, all like inputs including GV of the parallel M27W801 may be
common. A TTL low level pulse applied to a M27W801's E input, with V at 12.75V, will
program that M27W801. A high level E input inhibits the other M27W801s from being
programmed.
PP
PP
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with G at V . Data should be verified with
IL
t
after the falling edge of E.
ELQV
10/24
M27W801
Device operation
2.9
Electronic signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27W801. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27W801. Two identifier bytes may then be sequenced from the device outputs by
toggling address line A0 from V to V . All other address lines must be held at V during
IL
IH
IL
Electronic Signature mode.
Byte 0 (A0 = V ) represents the manufacturer code and byte 1 (A0 = V ) the device
IL
IH
identifier code. For the STMicroelectronics M27W801, these two identifier bytes are given in
Table 3 and can be read-out on outputs Q7 to Q0.
Note that the M27W801 and M27C801 have the same identifier byte.
2.10
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27W801 is such that erasure begins when the cells are
exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range.
Research shows that constant exposure to room level fluorescent lighting could erase a
typical M27W801 in about 3 years, while it would take approximately 1 week to cause
erasure when exposed to direct sunlight. If the M27W801 is to be exposed to these types of
lighting conditions for extended periods of time, it is suggested that opaque labels be put
over the M27W801 window to prevent unintentional erasure. The recommended erasure
procedure for the M27W801 is exposure to short wave ultraviolet light which has wavelength
2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a
2
minimum of 30 W-sec/cm . The erasure time with this dosage is approximately 30 to 40
2
minutes using an ultraviolet lamp with 12000 µW/cm power rating. The M27W801 should
be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a
filter on their tubes which should be removed before erasure.
(1)
Table 2.
Operating modes
Mode
E
GVPP
A9
Q7-Q0
Read
VIL
VIL
VIL
VIH
VPP
VPP
X
X
X
Data Out
Hi-Z
Output Disable
Program
VIL Pulse
VIH
X
Data In
Hi-Z
Program Inhibit
Standby
X
VIH
X
Hi-Z
Electronic Signature
1. X = VIH or VIL, VID = 12V ± 0.5V.
VIL
VIL
VID
Codes
11/24
Maximum rating
M27W801
Table 3.
Electronic signature
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0 Hex Data
Manufacturer’s Code
Device Code
VIL
0
0
0
1
1
0
0
0
0
0
0
0
0
1
0
0
20h
42h
VIH
3
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
TA
Ambient Operating Temperature(1)
Temperature Under Bias
Storage Temperature
–40 to 125
–50 to 125
–65 to 150
–2 to 7
°C
°C
°C
V
TBIAS
TSTG
(2)
VIO
Input or Output Voltage (except A9)
Supply Voltage
VCC
–2 to 7
V
(2)
VA9
A9 Voltage
–2 to 13.5
–2 to 14
V
VPP
Program Supply Voltage
V
1. Depends on range.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than
20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less
than 20ns.
12/24
M27W801
DC and AC parameters
4
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 5.
AC measurement conditions
High Speed
Standard
Input Rise and Fall Times
≤10ns
0 to 3V
1.5V
≤20ns (10% to 90%)
0.4V to 2.4V
Input Pulse Voltages
Input and Output Timing Ref. Voltages
0.8V and 2V
Figure 6.
AC testing input output waveform
High Speed
3V
1.5V
0V
Standard
2.4V
2.0V
0.8V
0.4V
AI01822
Figure 7.
AC testing load circuit
1.3V
1N914
3.3kΩ
DEVICE
UNDER
TEST
OUT
C
L
C
C
C
= 30pF for High Speed
= 100pF for Standard
includes JIG capacitance
L
L
L
AI01823B
13/24
DC and AC parameters
M27W801
Unit
(1) (2)
Table 6.
Symbol
Capacitance
Parameter
Test Condition
Min
Max
CIN
Input Capacitance
Output Capacitance
VIN = 0V
6
pF
pF
COUT
VOUT = 0V
12
1. TA = 25 °C, f = 1 MHz
2. Sampled only, not 100% tested.
(1) (2)
Table 7.
Symbol
Read mode DC characteristics
Parameter
Test Condition
Min
Max
Unit
ILI
Input Leakage Current
Output Leakage Current
0V ≤VIN ≤VCC
±10
±10
µA
µA
ILO
0V ≤VOUT ≤VCC
E = VIL, GVPP = VIL,
OUT = 0mA,
ICC
Supply Current
I
15
mA
f = 5MHz, VCC ≤3.6V
ICC1
ICC2
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
E = VIH
1
mA
µA
E > VCC – 0.2V,
30
VCC ≤3.6V
IPP
VIL
Program Current
VPP = VCC
10
µA
V
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage TTL
–0.6
0.2 VCC
(3)
VIH
0.7 VCC VCC + 0.5
V
VOL
VOH
IOL = 2.1mA
IOH = –1mA
0.4
V
2.4
V
1.
TA = –40 to 85 °C; VCC = 2.7V to 3.6V; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Maximum DC voltage on Output is VCC +0.5V.
.
(1) (2)
Table 8.
Symbol
Programming mode DC characteristics
Parameter
Test Condition
Min
Max
Unit
ILI
ICC
IPP
Input Leakage Current
Supply Current
V
IL ≤VIN ≤VIH
±10
50
µA
mA
mA
V
Program Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage TTL
A9 Voltage
E = VIL
50
VIL
–0.3
2
0.8
VIH
VOL
VOH
VID
VCC + 0.5
0.4
V
IOL = 2.1mA
IOH = –1mA
V
3.6
V
11.5
12.5
V
1.
TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
.
14/24
M27W801
DC and AC parameters
Figure 8.
Read mode AC waveforms
VALID
tAVQV
VALID
tEHQZ
A0-A19
tAXQX
E
tGLQV
G
tGHQZ
tELQV
Hi-Z
Q0-Q7
AI01583B
(1) (2)
Table 9.
Read mode AC characteristics
M27W801
-120 (-150/-200)
-100 (3)
Test
Parameter
Symbol Alt
Unit
VCC = 3.0V VCC = 2.7V VCC = 2.7V to
Condition
to 3.6V to 3.6V 3.6V
Min Max Min Max
Min
Max
Address Valid to
Output Valid
E = VIL,
G = VIL
tAVQV tACC
80
80
50
50
50
100
100
60
120
ns
ns
ns
ns
ns
ns
Chip Enable Low to
Output Valid
tELQV
tGLQV
tCE
tOE
tDF
tDF
tOH
G = VIL
E = VIL
G = VIL
E = VIL
120
70
Output Enable Low
to Output Valid
Chip Enable High to
Output Hi-Z
(4)
tEHQZ
0
0
0
0
0
0
60
0
0
0
70
tGHQZ
Output Enable High
to Output Hi-Z
60
70
(4)
Address Transition
to Output Transition
E = VIL,
G = VIL
tAXQX
1.
TA = –40 to 85 °C; VCC = 2.7V to 3.6V; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Speed obtained with High Speed AC measurement conditions.
4. Sampled only, not 100% tested.
.
15/24
DC and AC parameters
Figure 9.
M27W801
Margin mode AC waveforms
V
CC
A8
A9
tA9HVPH
tVPXA9X
GV
PP
tVPHEL
tEXVPX
E
tA10HEH
tEXA10X
A10 Set
A10 Reset
tA10LEH
AI00736B
1. A8 High level = 5V; A9 High level = 12V.
(1) (2)
Table 10. Margin mode AC characteristics
Test
Condition
Symbol
Alt
Parameter
Min
Max
Unit
tA9HVPH
tVPHEL
tAS9 VA9 High to VPP High
2
2
1
µs
µs
µs
tVPS VPP High to Chip Enable Low
tAS10 VA10 High to Chip Enable High (Set)
tA10HEH
VA10 Low to Chip Enable High
(Reset)
tA10LEH
tEXA10X
tAS10
1
1
µs
µs
Chip Enable Transition to VA10
Transition
tAH10
Chip Enable Transition to VPP
Transition
tEXVPX
tVPH
2
2
µs
µs
tVPXA9X
tAH9 VPP Transition to VA9 Transition
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
.
16/24
M27W801
DC and AC parameters
Figure 10. Programming and Verify modes AC waveforms
VALID
A0-A19
Q0-Q7
tAVEL
tQVEL
tEHAX
DATA IN
DATA OUT
tEHQX
tEHQZ
V
CC
tVCHEL
tVPHEL
tEHVPX
tELQV
GV
PP
tVPLEL
E
tELEH
PROGRAM
VERIFY
AI01270
(1) (2)
Table 11. Programming mode AC characteristics
Test
Condition
Symbol
Alt
Parameter
Min
Max
Unit
tAVEL
tQVEL
tAS
tDS
Address Valid to Chip Enable Low
Input Valid to Chip Enable Low
2
2
µs
µs
µs
µs
ns
µs
µs
µs
µs
µs
ns
ns
tVCHEL
tVPHEL
tVPLVPH
tELEH
tVCS VCC High to Chip Enable Low
tOES VPP High to Chip Enable Low
tPRT VPP Rise Time
2
2
50
45
2
tPW
tDH
Chip Enable Program Pulse Width (Initial)
Chip Enable High to Input Transition
55
tEHQX
tEHVPX
tVPLEL
tELQV
tOEH Chip Enable High to VPP Transition
2
tVR
tDV
VPP Low to Chip Enable Low
2
Chip Enable Low to Output Valid
1
(3)
tEHQZ
tDFP Chip Enable High to Output Hi-Z
tAH Chip Enable High to Address Transition
0
0
130
tEHAX
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Sampled only, not 100% tested.
.
17/24
Package mechanical
M27W801
5
Package mechanical
Figure 11. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package outline
A2
A3
A
L
A1
e1
α
B1
B
C
eA
eB
D2
D
S
N
1
K
E1
E
K1
FDIPW-b
1. Drawing is not to scale.
Table 12. FDIP32WC - 32 pin Ceramic Frit-seal DIP, with window (0.260" x 0.420"),
package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
A3
B
5.72
1.40
4.57
4.50
0.56
–
0.225
0.055
0.180
0.177
0.022
–
0.51
3.91
3.89
0.41
–
0.020
0.154
0.153
0.016
–
B1
C
1.45
0.057
0.23
41.73
–
0.30
42.04
–
0.009
1.643
–
0.012
1.655
–
D
D2
e
38.10
2.54
1.500
0.100
0.590
–
–
–
–
eA
eB
E
14.99
–
–
–
–
16.18
–
18.03
–
0.637
–
0.710
–
15.24
0.600
E1
K
13.06
–
13.36
–
0.514
–
0.526
–
6.60
0.260
0.420
K1
L
10.67
–
–
–
–
3.18
1.52
4°
4.10
2.49
11°
0.125
0.060
4°
0.161
0.098
11°
S
α
N
32
32
18/24
M27W801
Package mechanical
Figure 12. PDIP32 - 32 pin Plastic DIP, 600 mils width, package outline
A2
A1
A
L
α
c
b1
b
e
eA
D2
D
S
N
1
E1
E
PDIP-C
1. Drawing is not to scale.
Table 13. PDIP32 – 32 pin Plastic DIP, 600 mils width, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
4.83
0.190
0.38
0.015
3.81
0.150
0.41
1.14
0.23
41.78
–
0.53
1.65
0.38
42.29
–
0.016
0.045
0.009
1.645
–
0.021
0.065
0.015
1.665
–
b1
c
D
D2
eA
e
38.10
15.24
2.54
1.500
0.600
0.100
–
–
–
–
–
–
–
–
E
15.24
13.46
1.65
3.05
0°
15.88
13.97
2.21
3.56
15°
0.600
0.530
0.065
0.120
0°
0.625
0.550
0.087
0.140
15°
E1
S
L
α
N
32
32
19/24
Package mechanical
M27W801
Figure 13. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package outline
D
A1
A2
D1
1
N
B1
e
E2
E2
E3
E1 E
F
B
0.51 (.020)
1.14 (.045)
D3
A
R
CP
D2
D2
PLCC-A
1. Drawing is not to scale.
Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
B
3.17
1.53
0.38
0.33
0.66
3.56
2.41
–
0.125
0.060
0.015
0.013
0.026
0.140
0.095
–
0.53
0.81
0.10
12.57
11.51
5.66
–
0.021
0.032
0.004
0.495
0.453
0.223
–
B1
CP
D
12.32
11.35
4.78
–
0.485
0.447
0.188
–
D1
D2
D3
E
7.62
0.300
14.86
13.89
6.05
–
15.11
14.05
6.93
–
0.585
0.547
0.238
–
0.595
0.553
0.273
–
E1
E2
E3
e
10.16
1.27
0.400
0.050
–
–
–
–
F
0.00
–
0.13
–
0.000
–
0.005
–
R
0.89
0.035
N
32
32
20/24
M27W801
Package mechanical
Figure 14. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package outline
A2
1
N
e
E
B
N/2
D1
D
A
CP
DIE
C
TSOP-a
A1
α
L
1. Drawing is not to scale.
Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package
mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
B
1.200
0.150
1.050
0.250
0.210
0.100
20.200
18.500
–
0.0472
0.0059
0.0413
0.0098
0.0083
0.0039
0.7953
0.7283
–
0.050
0.950
0.170
0.100
0.0020
0.0374
0.0067
0.0039
C
CP
D
19.800
18.300
–
0.7795
0.7205
–
D1
e
0.500
0.0197
E
7.900
0.500
32
8.100
0.700
0.3110
0.0197
32
0.3189
0.0276
L
N
α
0°
5°
0°
5°
21/24
Part numbering
M27W801
6
Part numbering
Table 16. Ordering information scheme
Example:
M27W801
-100 K
6
TR
Device Type
M27
Supply Voltage
W = 2.7V to 3.6V
Device Function
801 = 8 Mbit (1Mb x8)
Speed
-100 (1),(2) = 100 ns
-120 = 120 ns
Not For New Design(3)
-150 = 150 ns
-200 = 200 ns
Package
F = FDIP32W(4)
B = PDIP32
K = PLCC32
N = TSOP32: 8 x 20 mm(4)
Temperature Range
6 = –40 to 85 °C
Options
TR = Tape & Reel Packing
1. High Speed, see AC Characteristics section for further information.
2. This speed also guarantees 80ns access time at VCC = 3.0V to 3.6V.
3. These speeds are replaced by the 120ns.
4. Packages option available on request. Please contact STMicroelectronics local Sales Office.
For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/24
M27W801
Revision history
7
Revision history
Table 17. Document revision history
Date
Version
Revision Details
July 1999
1.0
First Issue
FDIP32W Package Dimension, L Max added (Table 12.)
TSOP32 Package Dimension changed (Table 15)
0 to 70°C Temperature Range removed
Programming Time changed
15-Mar-2000
1.1
Read Mode AC Characteristics: tAVQV, tELQV, tGLQV, tEHQZ, tGHQZ changed
(Table 9)
21-Apr-2000
20-Feb-2002
1.2
1.3
PDIP32 Mechanical data and drawing changed (Table 13)
PLCC32 Mechanical data: A2 clarified (Table 14)
Read Mode DC Characteristics: VOH clarified (Table 7)
PLCC32 Mechanical data and drawing clarified (Table 14, Figure 13)
06-May-2002
21-Mar-2003
1.4
1.5
ICC Standby value clarified
Ordering Information Scheme clarified (Table 16)
TSOP32 Package Mechanical Data clarified (Table 15)
Document converted to new template (sections added, information
moved).
22-May-2006
2
Packages are ECOPACK® compliant. Package specifications updated
(see Section 5: Package mechanical).
23/24
M27W801
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