M41T315W [STMICROELECTRONICS]

Serial access phantom RTC supervisor; 串行访问幻影RTC主管
M41T315W
型号: M41T315W
厂家: ST    ST
描述:

Serial access phantom RTC supervisor
串行访问幻影RTC主管

文件: 总30页 (文件大小:242K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
M41T315Y  
M41T315V, M41T315W  
Serial access phantom RTC supervisor  
Not For New Design  
Features  
3.0V, 3.3V, or 5V operating voltage  
Real-time clock keeps track of  
tenths/hundredths of seconds, seconds,  
minutes, hours, days, date of the month,  
months, and years  
16  
Automatic leap year correction valid up to 2100  
Automatic switch-over and deselect circuitry  
Choice of power-fail deselect voltages:  
1
SO16 (MQ)  
(V  
= power-fail deselect voltage)  
PFD  
(a)  
– M41T315Y : V = 4.5 to 5.5V  
CC  
4.25V V  
4.50V  
PFD  
– M41T315V: V = 3.0 to 3.6V  
CC  
2.80V V  
2.97V  
PFD  
– M41T315W: V = 2.7 to 3.3V  
SNAPHAT (SH)  
battery & crystal  
CC  
2.60V V  
2.70V  
PFD  
No address space required to communicate  
with RTC  
Provides nonvolatile supervisor functions for  
battery backup of SRAM  
Full 10% V operating range  
CC  
Industrial operating temperature range (–40 to  
+85°C)  
28  
Ultra-low battery supply current of 500nA (max)  
1
Optional packaging includes A 28-lead SOIC  
®
and SNAPHAT top (to be ordered separately)  
SOH28 (MH)  
SNAPHAT package provides direct connection  
for a snaphat top, which contains the battery  
and crystal  
RoHS compliant  
– Lead-free second level interconnect  
a. Contact local ST sales office for availability.  
November 2007  
Rev 3  
1/30  
This is information on a product still in production but not recommended for new designs.  
www.st.com  
1
Contents  
M41T315Y, M41T315V, M41T315W  
Contents  
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.1  
2.2  
Non-volatile supervisor operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
3
Clock operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
3.1  
3.2  
3.3  
3.4  
Clock register information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
AM-PM/12/24 mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Oscillator and reset bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Zero bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4
5
6
7
8
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
2/30  
M41T315Y, M41T315V, M41T315W  
List of tables  
List of tables  
Table 1.  
Table 2.  
Table 3.  
Table 4.  
Table 5.  
Table 6.  
Table 7.  
Table 8.  
Table 9.  
Table 10.  
Table 11.  
Table 12.  
Table 13.  
Table 14.  
Table 15.  
Table 16.  
Table 17.  
Table 18.  
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
AC electrical characteristics (M41T315Y). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
AC electrical characteristics (M41T315V/W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
RTC register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Ablolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
DC and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Crystal electrical characteristics (externally supplied) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
SO16 - 16-lead plastic small outline (150 mils body width), package mechanical data . . . 23  
SOH28 - 28-lead plastic small outline, package mechanical data . . . . . . . . . . . . . . . . . . . 24  
SH - 4-pin SNAPHAT housing for 48mAh battery and crystal, package mechanical data . 25  
SH - 4-pin SNAPHAT housing for 120mAh battery and crystal, package mechanical data 26  
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
SNAPHAT battery table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
3/30  
List of figures  
M41T315Y, M41T315V, M41T315W  
List of figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Figure 9.  
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
16-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
28-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
M41T315Y/V/W to RAM/clock interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Read mode waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Write mode waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Comparison register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Reset pulse waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Figure 10. AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Figure 11. Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Figure 12. SO16 - 16-lead plastic small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Figure 13. SOH28 - 28-lead plastic small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Figure 14. SH - 4-pin SNAPHAT housing for 48mAh battery and crystal, package mechanical data . 25  
Figure 15. SH - 4-pin SNAPHAT housing for 120mAh battery and crystal, package outline. . . . . . . . 26  
4/30  
M41T315Y, M41T315V, M41T315W  
Description  
1
Description  
®
The M41T315Y/V/W RTC Supervisor is a combination of a CMOS TIMEKEEPER and a  
nonvolatile memory supervisor. Power is constantly monitored by the memory supervisor. In  
the event of power instability or absence, an external battery maintains the timekeeping  
operation and provides power for a CMOS static RAM by switching on and invoking write  
protection to prevent data corruption in the memory and RTC.  
The clock keeps track of tenths/hundredths of seconds, seconds, minutes, hours, day, date,  
month, and year information. The last day of the month is automatically adjusted for months  
with less than 31 days, including leap year correction.  
The clock operates in one of two formats:  
a 12-hour mode with an AM/PM indicator;  
or  
a 24-hour mode  
The nonvolatile supervisor supplies all the necessary support circuitry to convert a CMOS  
RAM to a nonvolatile memory. The M41T315Y/V/W can be interfaced with RAM without  
leaving gaps in memory.  
The M41T315Y/V/W is supplied in a 28-lead SOIC SNAPHAT® package (which integrates  
both crystal and battery in a single SNAPHAT top) or a-16 pin SOIC. The 28-pin, 330mil  
SOIC provides sockets with gold plated contacts at both ends for direct connection to a  
separate SNAPHAT housing containing the battery and crystal. The unique design allows  
the SNAPHAT battery/crystal package to be mounted on top of the SOIC package after the  
completion of the surface mount process.  
Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal  
damage due to the high temperatures required for device surface-mounting. The SNAPHAT  
housing is also keyed to prevent reverse insertion.  
The 28-pin SOIC and battery/crystal packages are shipped separately in plastic anti-static  
tubes or in Tape & Reel form. For the 28-lead SOIC, the battery/crystal package (e.g.,  
SNAPHAT) part number is “M4TXX-BR12SH” (see Table 17 on page 28).  
Caution:  
Do not place the SNAPHAT battery/crystal top in conductive foam, as this will drain the  
lithium button-cell battery.  
5/30  
Description  
M41T315Y, M41T315V, M41T315W  
Figure 1.  
Logic diagram  
V
V
CCO  
CCI  
D
Q
XI(1)  
(1)  
CEO  
XO  
M41T315Y  
M41T315V  
M41T315W  
WE  
CEI  
OE  
RST  
(1)  
BAT  
V
V
SS  
AI03902  
1. For 16-pin SOIC only  
Table 1.  
Signal names  
XI-XO  
D
32.768 KHz crystal connection  
Data input  
Q
Data output  
RST  
CEO  
CEI  
VBAT  
OE  
Reset input  
Chip enable output  
Chip enable input  
Battery input  
Output enable input  
WRITE enable input  
Switched supply voltage output  
Supply voltage input  
Ground  
WE  
VCCO  
VCCI  
VSS  
NC  
Not connected internally  
Don’t Use  
DU  
6/30  
M41T315Y, M41T315V, M41T315W  
Figure 2. 16-pin SOIC connections  
Description  
XI  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
V
CCI  
XO  
CCO  
WE  
(1)  
DU  
M41T315Y  
M41T315V  
M41T315W  
V
RST  
OE  
BAT  
V
SS  
D
CEI  
CEO  
NC  
Q
V
SS  
AI03909  
Figure 3.  
28-pin SOIC connections  
WE  
NC  
NC  
NC  
NC  
NC  
NC  
1
28  
V
CCI  
NC  
2
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
3
NC  
4
V
CCO  
5
DU  
NC  
RST  
NC  
OE  
NC  
NC  
CEI  
6
M41T315Y  
M41T315V  
M41T315W  
7
V
8
SS  
NC  
NC  
D
9
10  
11  
12  
13  
14  
Q
NC  
CEO  
NC  
V
SS  
AI03910  
7/30  
Description  
Figure 4.  
M41T315Y, M41T315V, M41T315W  
Block diagram  
XO  
XI  
32,768 Hz  
CRYSTAL  
CLOCK/CALENDAR LOGIC  
CEO  
UPDATE  
READ  
CEI  
OE  
WRITE  
TIMEKEEPER REGISTER  
CONTROL  
LOGIC  
WE  
RST  
POWER-FAIL  
ACCESS  
ENABLE  
SEQUENCE  
DETECTOR  
COMPARISON REGISTER  
D
Q
I/O  
BUFFERS  
DATA  
INTERNAL V  
V
CC  
POWER-FAIL  
DETECT  
LOGIC  
V
CCI  
CCO  
V
BAT  
AI03636B  
8/30  
M41T315Y, M41T315V, M41T315W  
Figure 5. M41T315Y/V/W to RAM/clock interface  
Description  
A0-An  
DATA I/O  
A0-An  
D0-D7  
CMOS  
SRAM  
WE  
OE  
WE  
OE  
CE  
V
CC  
CEO  
OE  
V
CCO  
D
WE  
V
CC  
M41T315Y/V/W  
CE  
CEI  
Q
RST  
RST  
V
CCI  
V
BAT  
X
X
1
0
+
BAT  
V
SS  
32.768 Hz  
CRYSTAL  
V
SS  
AI04258  
9/30  
Operation  
M41T315Y, M41T315V, M41T315W  
2
Operation  
Figure 6 on page 11 illustrates the main elements of the device. The following paragraphs  
describe the signals and functions.  
Communication with the clock is established by pattern recognition of a serial bit stream of  
64 bits which must be matched by executing 64 consecutive WRITE cycles containing the  
proper data on data in (D). All accesses which occur prior to recognition of the 64-bit pattern  
are directed to memory via the chip enable output pin (CEO).  
After recognition is established, the next 64 READ or WRITE Cycles either extract or update  
data in the clock and CEO remains high during this time, disabling the connected memory  
(see Table 2 on page 11).  
Data transfer to and from the timekeeping function is accomplished with a serial bit stream  
under control of chip enable input (CEI), output enable (OE), and WRITE enable (WE).  
Initially, a READ cycle using the CEI and OE control of the clock starts the pattern  
recognition sequence by moving the pointer to the first bit of the 64-bit comparison register.  
Next, 64 consecutive WRITE cycles are executed using the CEI and WE control of the clock.  
These 64 WRITE cycles are used only to gain access to the clock.  
When the first WRITE cycle is executed, it is compared to the first bit of the 64-bit  
comparison register. If a match is found, the pointer increments to the next location of the  
comparison register and awaits the next WRITE cycle.  
If a match is not found, the pointer does not advance and all subsequent WRITE cycles are  
ignored. If a READ cycle occurs at any time during pattern recognition, the present  
sequence is aborted and the comparison register pointer is reset. Pattern recognition  
continues for a total of 64 WRITE cycles as described above until all the bits in the  
comparison register have been matched (see Figure 8 on page 14).  
With a correct match for 64 bits, access to the registers is enabled and data transfer to or  
from the timekeeping registers may proceed. The next 64 cycles will cause the device to  
either receive data on D, or transmit data on Q, depending on the level of OE pin or the WE  
pin. Cycles to other locations outside the memory block can be interleaved with CEI cycles  
without interrupting the pattern recognition sequence or data transfer sequence to the  
device.  
For a SO16 pin package, a standard 32.768 kHz quartz crystal can be directly connected to  
the M41T315Y/V/W via pins 1 and 2 (XI, XO). The crystal selected for use should have a  
specified load capacitance (C ) of 12.5 pF (see Table 10 on page 21).  
L
10/30  
M41T315Y, M41T315V, M41T315W  
Operation  
Table 2.  
Mode  
Operating modes  
VCC  
CEI  
OE  
WE  
D
Q
Power  
Deselect  
WRITE  
READ  
VIH  
VIL  
VIL  
VIL  
X
X
X
X
VIL  
VIH  
VIH  
X
Hi-Z  
DIN  
Hi-Z  
Hi-Z  
DOUT  
Hi-Z  
Hi-Z  
Hi-Z  
Standby  
Active  
4.5 to 5.5V  
or  
3.0 to 3.6V  
or  
VIL  
VIH  
X
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
Active  
2.7 to 3.3V  
READ  
Active  
Deselect  
Deselect  
VSO to VPFD (min)(1)  
CMOS standby  
Battery back-up mode  
(1)  
VSO  
X
X
X
1. See Table 11 on page 21 for details.  
2.1  
Non-volatile supervisor operation  
A switch is provided to direct power from the battery input or V  
to V  
with a maximum  
CCI  
CCO  
voltage drop of 0.3 Volts. The V  
output pin is used to supply uninterrupted power to  
CCO  
CMOS SRAM. The M41T315Y/V/W safeguards the clock and RAM data by power-fail  
detection and write protection.  
Power-fail detection occurs when V  
falls below V  
which is set by an internal bandgap  
CCI  
PFD  
reference. The M41T315Y/V/W constantly monitors the V  
supply pin. When V  
is less  
CCI  
CCI  
than V  
, power-fail circuitry forces the chip enable output (CEO) to V  
or V -0.2 volts  
PFD  
CCI BAT  
for external RAM write protection. During nominal supply conditions, CEO will track CEI with  
a propagation delay. Internally, the M41T315Y/V/W aborts any data transfer in progress  
without changing any of the device registers and prevents future access until V  
exceeds  
CCI  
V
. Figure 5 on page 9 illustrates a typical RAM/clock interface.  
PFD  
Figure 6.  
Read mode waveforms  
WE  
tRC  
tCW  
tOW  
tRR  
tCO  
CEI  
OE  
tOD  
tODO  
tOE  
tOEE  
tCOE  
DATA OUTPUT VALID  
Q
AI04259  
11/30  
Operation  
Figure 7.  
M41T315Y, M41T315V, M41T315W  
Write mode waveforms  
OE  
tWC  
tWP  
tWR  
WE  
CEI  
tWR  
tCW  
t
DH  
tDH  
tDS  
D
DATA INPUT STABLE  
AI04261  
Table 3.  
AC electrical characteristics (M41T315Y)  
Symbol  
tRC  
tCO  
Parameter(1)  
Min  
Typ  
Max  
Units  
tAVAV  
tELQV  
tGLQV  
tELQX  
tGLQX  
tEHQZ  
tGHQZ  
READ cycle time  
CEI access time  
OE access time  
65  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
55  
55  
tOE  
tCOE  
tOEE  
tOD  
CEI to output low Z  
OE to output low Z  
CEI to output high Z  
5
5
25  
25  
tODO OE to output high Z  
tRR  
tCW  
tOW  
tWC  
tWP  
READ recovery  
CEI pulse width  
OE pulse width  
WRITE cycle  
10  
55  
55  
65  
55  
tELEH  
tGLGH  
tAVAV  
tWLWH  
WRITE pulse width  
tEHAX  
tWHAX  
tDVEH  
tDVWH  
tEHDX  
tWHDX  
(2)  
tWR  
WRITE recovery  
Data setup  
10  
30  
ns  
ns  
(3)  
tDS  
(3)  
tDH  
Data hold time  
0
ns  
ns  
tRST  
RST pulse width  
65  
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V (except where noted).  
2. tWR is a function of the latter occurring edge of WE or CEI.  
3. tDH and tDS are functions of the first occurring edge of WE or CEI in RAM mode.  
12/30  
M41T315Y, M41T315V, M41T315W  
Operation  
Units  
Table 4.  
Symbol  
tRC  
tCO  
AC electrical characteristics (M41T315V/W)  
Parameter(1)  
Min  
Typ  
Max  
tAVAV  
tELQV  
tGLQV  
tELQX  
tGLQX  
tEHQZ  
tGHQZ  
READ cycle time  
CEI access time  
OE access time  
85  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
85  
85  
tOE  
tCOE  
tOEE  
tOD  
CEI to output low Z  
OE to output low Z  
CEI to output high Z  
5
5
30  
30  
tODO OE to output high Z  
tRR  
tCW  
tOW  
tWC  
tWP  
READ recovery  
CEI pulse width  
OE pulse width  
WRITE cycle  
20  
65  
60  
85  
60  
tELEH  
tGLGH  
tAVAV  
tWLWH  
WRITE pulse width  
tEHAX  
tWHAX  
tDVEH  
tDVWH  
tEHDX  
tWHDX  
(2)  
tWR  
WRITE recovery  
Data setup  
25  
35  
ns  
ns  
(3)  
tDS  
(3)  
tDH  
Data hold time  
5
ns  
ns  
tRST  
RST pulse width  
85  
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V (except where noted).  
2. tWR is a function of the latter occurring edge of WE or CEI.  
3. tDH and tDS are functions of the first occurring edge of WE or CEI in RAM mode.  
13/30  
Operation  
Figure 8.  
M41T315Y, M41T315V, M41T315W  
Comparison register definition  
Hex  
Value  
6
1
5
0
4
0
3
0
2
1
0
1
7
1
C5  
BYTE 0  
BYTE 1  
0
1
1
0
1
0
1
0
1
1
0
0
1
0
1
0
1
0
0
1
3A  
0
0
1
1
0
1
BYTE 2  
BYTE 3  
BYTE 4  
BYTE 5  
BYTE 6  
A3  
5C  
C5  
3A  
A3  
0
1
1
0
1
1
1
0
1
0
1
0
1
0
0
1
0
1
1
0
0
0
1
0
5C  
0
0
BYTE 7  
0
1
1
0
1
1
AI04262  
Note:  
Pattern recognition in “hex” is C5, 3A, A3, 5C, C5, 3A, A3, and 5C. The odds of this pattern  
being accidentally duplicated and sending aberrant entries to the RTC is less than 1 in 10 .  
19  
This pattern is sent to the clock LSB to MSB.  
2.2  
Data retention  
Most low power SRAMs on the market today can be used with the M41T315Y/V/W. There  
are, however some criteria which should be used in making the final choice of an SRAM to  
use. The SRAM must be designed in a way where the chip enable input disables all other  
inputs to the SRAM. This allows inputs to the M41T315Y/V/W and SRAMs to be Don’t Care  
once V  
falls below V  
(min). The SRAM should also guarantee data retention down to  
CCI  
PFD  
V
= 2.0 volts. The chip enable access time must be sufficient to meet the system needs  
CC  
with the chip enable output propagation delays included. If the SRAM includes a second  
chip enable pin (E2), this pin should be tied to V  
.
OUT  
If data retention lifetime is a critical parameter for the system, it is important to review the  
data retention current specifications for the particular SRAMs being evaluated. Most SRAMs  
specify a data retention current at 3.0 volts. Manufacturers generally specify a typical  
condition for room temperature along with a worst case condition (generally at elevated  
temperatures). The system level requirements will determine the choice of which value to  
14/30  
M41T315Y, M41T315V, M41T315W  
Operation  
use. The data retention current value of the SRAMs can then be added to the IBAT value of  
the M41T315Y/V/W to determine the total current requirements for data retention. The  
®
available battery capacity for the SNAPHAT of your choice can then be divided by this  
current to determine the amount of data retention available (see Table 17 on page 28).  
For a further more detailed review of lifetime calculations, please see Application Note  
AN1012.  
15/30  
Clock operation  
M41T315Y, M41T315V, M41T315W  
3
Clock operation  
3.1  
Clock register information  
Clock information is contained in eight registers of 8 bits, each of which is sequentially  
accessed 1 bit at a time after the 64-bit pattern recognition sequence has been completed.  
When updating the clock registers, each must be handled in groups of 8 bits. Writing and  
reading individual bits within a register could produce erroneous results. These  
READ/WRITE registers are defined in Table 5 on page 17.  
Data contained in the clock registers is in binary coded decimal format (BCD). Reading and  
writing the registers is always accomplished by stepping though all eight registers, starting  
with Bit 0 of Register 0 and ending with Bit 7 of Register 7.  
3.2  
3.3  
AM-PM/12/24 mode  
Bit 7 of the hours register is defined as the 12-hour or 24-hour mode select bit. When high,  
the 12-hour mode is selected. In the 12-hour mode, Bit 5 is the AM/PM bit with logic high  
being PM. In the 24-hour mode, Bit 5 is the second 10-hour bit (20-23 hours).  
Oscillator and reset bits  
Bits 4 and 5 of the day register are used to control the reset and oscillator functions. Bit 4  
controls the reset pin input. When the Reset Bit is set to logic '1,' the reset input pin is  
ignored. When the Reset Bit is set to logic '0,' a low input on the reset pin will cause the  
device to abort data transfer without changing data in the timekeeping registers. Reset  
operates independently of all other inputs. Bit 5 controls the oscillator. When set to logic '0,'  
the oscillator turns on and the real-time clock/calendar begins to increment.  
3.4  
Zero bits  
Registers 1, 2, 3, 4, 5, and 6 contain one (1) or more bits that will always read logic '0.' When  
writing to these locations, either a logic '1' or '0' is acceptable.  
16/30  
M41T315Y, M41T315V, M41T315W  
Clock operation  
Table 5.  
Register  
RTC register map  
Function/range  
BCD format  
D7  
D6  
0.1 seconds  
10 seconds  
D5  
D4  
D3  
D2  
D1  
D0  
0
1
2
0.01 seconds  
seconds  
seconds  
00-99  
00-59  
00-59  
0
0
seconds  
minutes  
10 minutes  
minutes  
10/  
A/P  
01-12/  
00-23  
3
12/24  
0
hrs  
hours (24 hour format)  
hours  
4
5
6
7
0
0
0
0
0
0
OSC  
0
RST  
0
day of the week  
date: day of the month  
month  
day  
date  
01-07  
01-31  
01-12  
00-99  
10 date  
10M  
month  
year  
10 years  
year  
Keys:  
A/P = AM/PM bit  
12/24 = 12 or 24-hour mode bit  
OSC = Oscillator bit  
RST = Reset bit  
0 = Must be set to ‘0’  
Figure 9.  
Reset pulse waveform  
tRST  
RST  
AI04260  
17/30  
Maximum rating  
M41T315Y, M41T315V, M41T315W  
4
Maximum rating  
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may  
cause permanent damage to the device. These are stress ratings only and operation of the  
device at these or any other conditions above those indicated in the Operating sections of  
this specification is not implied. Exposure to Absolute Maximum Rating conditions for  
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE  
Program and other relevant quality documents.  
Table 6.  
Symbol  
Ablolute maximum ratings  
Parameter  
Value  
Unit  
TA  
Operating temperature  
–40 to +85  
–40 to +85  
–55 to +125  
260  
°C  
°C  
°C  
°C  
V
®
SNAPHAT  
SOIC  
TSTG  
Storage temperature (VCC, oscillator off)  
Lead solder temperature for 10 seconds  
Supply voltage (on any pin relative to Ground)  
(1)  
TSLD  
M41T315Y  
–0.3 to +7.0  
–0.3 to +4.6  
–0.3 to VCC to +0.3  
20  
VCCI  
M41T315V/W  
V
VIO  
IO  
Input or output voltages  
Output current  
V
mA  
W
PD  
Power dissipation  
1
1. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed  
245°C for greater than 30 seconds).  
Caution:  
Caution:  
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up  
mode.  
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.  
18/30  
M41T315Y, M41T315V, M41T315W  
DC and AC parameters  
5
DC and AC parameters  
This section summarizes the operating and measurement conditions, as well as the DC and  
AC characteristics of the device. The parameters in the following DC and AC Characteristic  
tables are derived from tests performed under the Measurement Conditions listed in the  
relevant tables. Designers should check that the operating conditions in their projects match  
the measurement conditions when using the quoted parameters.  
Table 7.  
DC and AC measurement conditions  
Parameter M41T315Y  
M41T315V/W  
VCC supply voltage  
4.5 to 5.5V  
–40 to +85°C  
100pF  
2.7 to 3.6V  
–40 to +85°C  
50pF  
Ambient operating temperature  
Load capacitance (CL)  
Input rise and fall times  
Input pulse voltages  
5ns  
5ns  
0 to 3V  
0 to 3V  
Input and output timing ref. voltages  
1.5V  
1.5V  
Figure 10. AC testing load circuit  
400  
DEVICE  
UNDER  
TEST  
2.0V  
AI04255  
Max  
C
L
C
includes JIG capacitance  
L
Note:  
50pF for M41T315V.  
Table 8.  
Symbol  
CIN  
Capacitance  
Parameter(1)(2)  
Min  
Unit  
Input capacitance  
10  
10  
pF  
pF  
(3)  
CIO  
Input/output capacitance  
1. Effective capacitance measured with power supply at 5V; sampled only; not 100% tested.  
2. At 25°C, f = 1MHz.  
3. Outputs were deselected.  
19/30  
DC and AC parameters  
M41T315Y, M41T315V, M41T315W  
M41T315V/W  
Table 9.  
Sym  
DC characteristics  
M41T315Y  
–65  
Parameter  
Test condition(1)  
–85  
Typ  
Unit  
Min  
Typ  
Max  
Min  
Max  
Input leakage  
current  
(2)  
IIL  
0V VIN VCC  
1
1
µA  
Output leakage  
current  
IOL  
0V VOUT VCC  
1
10  
1
6
µA  
mA  
mA  
(3)  
ICC1  
Supply current  
VCC power supply  
current  
(4)  
ICCO1  
VCC0 = VCC1 – 0.3  
150  
100  
Supply current  
(TTL standby)  
(3)  
ICC2  
CEI = VIH  
3
2
mA  
VCC power supply  
current  
(3)  
ICC3  
CEI = VCC1 – 0.2  
1
1
mA  
V
(5)  
VIL  
Input low voltage  
Input high voltage  
Output low voltage  
–0.3  
2.2  
0.8  
–0.3  
2.0  
0.6  
VCC  
0.3  
+
(5)  
VIH  
VCC1 + 0.3  
0.4  
V
(6)  
VOL  
IOL = 4.0 mA  
0.4  
V
Output high  
voltage  
(6)  
VOH  
IOH = –1.0 mA  
2.4  
2.4  
V
2.80 (V)  
2.60 (W)  
2.97 (V)  
2.70 (W)  
Power fail  
deselect  
VPFD  
4.25  
4.50  
3.7  
V
Battery back-up  
switchover  
VSO  
VBAT  
2.5  
V
V
VBAT Battery voltage  
2.5  
2.5  
3.7  
VCC1 – 0.2  
or  
VCC1 – 0.2  
or  
CEO output  
VCEO  
V
voltage  
VBAT – 0.2  
VBAT – 0.2  
VBAT = 3.0V  
TA = 25°C  
VCC = 0V  
(3)  
IBAT  
Battery current  
0.5  
0.5  
µA  
µA  
Battery backup  
current  
(7)  
ICCO2  
VCC0 = VBAT – 0.2V  
100  
100  
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V or 2.7 to 3.6V (except where noted).  
2. Applies to all input pins except RST, which is pulled internally to VCCI  
.
3. Measured without RAM connected.  
4. ICCO1 is the maximum average load current the device can supply to external memory.  
5. Voltages are referenced to Ground.  
6. Measured with load shown in Figure 10 on page 19.  
7. ICCO2 is the maximum average load current that the device can supply to memory in the battery backup mode.  
20/30  
M41T315Y, M41T315V, M41T315W  
DC and AC parameters  
Table 10. Crystal electrical characteristics (externally supplied)  
Symbol  
Parameter(1)(2)  
Min  
Typ  
Max  
Unit  
fO  
RS  
CL  
Resonant frequency  
Series resistance  
Load capacitance  
32.768  
kHz  
kΩ  
pF  
60  
12.5  
1. These values are externally supplied. STMicroelectronics recommends the KDS DT-38:  
1TA/1TC252E127, Tuning Fork Type (thruhole) or the DMX-26S: 1TJS125FH2A212, (SMD) quartz crystal  
for industrial temperature operations. KDS can be contacted at kouhou@ kdsj.co.jp or  
http://www.kdsj.co.jp for further information on this crystal type.  
2. Load capacitors are integrated within the M41T315Y/V/W. Circuit board layout considerations for the  
32.768kHz crystal of minimum trace lengths and isolation from RF generating signals should be taken into  
account.  
Figure 11. Power down/up mode AC waveforms  
V
CC  
V
(max)  
PFD  
V
(min)  
PFD  
V
SO  
tR  
tFB  
tF  
tREC  
tPF  
DON’T CARE  
CEI  
V
0.2V  
V
0.2V  
tPD  
tPD  
BAT  
BAT  
CEO  
AI04257  
Table 11. Power down/up trip points DC characteristics  
Symbol  
Parameter(1)(2)  
Min  
Max  
Unit  
tREC  
tF  
tFB  
tR  
VPFD (max) to CEI low  
1.5  
300  
10  
0
2.5  
ms  
µs  
µs  
µs  
µs  
ns  
ns  
VPFD (max) to VPFD (min) VCC fall time  
VPFD (min) to VSO VCC fall time  
VPFD (min) to VPFD (max) VCC rise time  
CEI high to power-fail  
tPF  
0
M41T315Y  
M41T315V/W  
10  
15  
(3)(4)  
tPD  
CEI propagation delay  
1. Valid for ambient operating temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V or 2.7 to 3.6V (except  
where noted).  
2. Measured at 25°C.  
3. Measured with load shown in Figure 10 on page 19.  
4. Input pulse rise and fall times equal 10ns  
21/30  
Package mechanical data  
M41T315Y, M41T315V, M41T315W  
6
Package mechanical data  
®
In order to meet environmental requirements, ST offers these devices in ECOPACK  
packages. These packages have a lead-free second level interconnect. The category of  
second Level Interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
22/30  
M41T315Y, M41T315V, M41T315W  
Package mechanical data  
Figure 12. SO16 - 16-lead plastic small outline, package outline  
A2  
A
C
B
CP  
e
D
N
1
E
H
A1  
L
SO-b  
Note:  
Drawing is not to scale  
Table 12. SO16 - 16-lead plastic small outline (150 mils body width), package  
mechanical data  
mm  
Min  
inches  
Min  
Sym  
Typ  
Max  
Typ  
Max  
A
A1  
A2  
B
1.75  
0.25  
1.60  
0.46  
0.25  
10.00  
4.00  
-
0.069  
0.010  
0.063  
0.018  
0.010  
0.394  
0.158  
-
0.10  
0.004  
0.35  
0.19  
9.80  
3.30  
-
0.014  
0.007  
0.386  
0.150  
-
C
D
E
e
1.27  
0.050  
H
5.80  
0.40  
0°  
6.20  
1.27  
8°  
0.228  
0.016  
0°  
0.244  
0.050  
8°  
L
a
N
16  
16  
CP  
0.10  
0.004  
23/30  
Package mechanical data  
M41T315Y, M41T315V, M41T315W  
Figure 13. SOH28 - 28-lead plastic small outline, package outline  
A2  
A
C
eB  
B
e
CP  
D
N
E
H
A1  
L
1
SOH-A  
Note:  
Drawing is not to scale.  
Table 13. SOH28 - 28-lead plastic small outline, package mechanical data  
mm  
Min  
inches  
Min  
Sym  
Typ  
Max  
Typ  
Max  
A
A1  
A2  
B
3.05  
0.36  
2.69  
0.51  
0.32  
18.49  
8.89  
-
0.120  
0.014  
0.106  
0.020  
0.12  
0.05  
2.34  
0.36  
0.15  
17.71  
8.23  
-
0.002  
0.092  
0.014  
0.006  
0.697  
0.324  
-
C
D
0.728  
0.350  
-
E
e
1.27  
0.050  
eB  
H
3.20  
11.51  
0.41  
0°  
3.61  
12.70  
1.27  
8°  
0.126  
0.453  
0.016  
0°  
0.142  
0.500  
0.050  
8°  
L
a
N
28  
28  
CP  
0.10  
0.004  
24/30  
M41T315Y, M41T315V, M41T315W  
Package mechanical data  
Figure 14. SH - 4-pin SNAPHAT housing for 48mAh battery and crystal, package  
mechanical data  
A2  
A1  
A
A3  
L
eA  
D
B
eB  
E
SHTK-A  
Table 14. SH - 4-pin SNAPHAT housing for 48mAh battery and crystal, package  
mechanical data  
mm  
Min  
inches  
Min  
Sym  
Typ  
Max  
Typ  
Max  
A
A1  
A2  
A3  
B
9.78  
7.24  
0
0.385  
0.285  
0.275  
0.015  
0.022  
0.860  
0.590  
0.628  
0.142  
0.090  
6.73  
6.48  
0.265  
0.255  
0
6.99  
0.38  
0.46  
21.21  
14.22  
15.55  
3.20  
0.56  
21.84  
14.99  
15.95  
3.61  
0.018  
0.835  
0.560  
0.612  
0.126  
0.080  
D
E
eA  
eB  
L
2.03  
2.29  
25/30  
Package mechanical data  
M41T315Y, M41T315V, M41T315W  
Figure 15. SH - 4-pin SNAPHAT housing for 120mAh battery and crystal, package  
outline  
A2  
A1  
A
A3  
L
eA  
D
B
eB  
E
SHTK-A  
Table 15. SH - 4-pin SNAPHAT housing for 120mAh battery and crystal, package  
mechanical data  
mm  
Min  
inches  
Min  
Sym  
Typ  
Max  
Typ  
Max  
A
A1  
A2  
A3  
B
10.54  
8.51  
0
0.415  
0.335  
0.315  
0.015  
0.022  
0.860  
0.710  
0.628  
0.142  
0.090  
8.00  
7.24  
0.315  
0.285  
0
8.00  
0.38  
0.46  
21.21  
17.27  
15.55  
3.20  
0.56  
0.018  
0.835  
0.680  
0.612  
0.126  
0.080  
D
21.84  
18.03  
15.95  
3.61  
E
eA  
eB  
L
2.03  
2.29  
26/30  
M41T315Y, M41T315V, M41T315W  
Part numbering  
7
Part numbering  
Table 16. Ordering information scheme  
Example:  
M41T  
315Y  
–65  
MH  
6
E
Device type  
M41T  
Supply voltage and write protect voltage  
315Y(1) = VCC = 4.5 to 5.5V; VPFD = 4.25 to 4.50V  
315V = VCC = 3.0 to 3.6V; VPFD = 2.80 to 2.97V  
315W = VCC = 2.7 to 3.3V; VPFD = 2.60 to 2.70V  
Speed  
–65 = 65ns (315Y)  
–85 = 85ns (315V/W)  
Package  
MH(2) = SOH28  
MQ = SO16  
Temperature range  
6 = –40 to 85°C  
Shipping method  
For SOH28:  
blank = Tubes (not for new design - use E)  
E = Lead-free package (ECOPACK®), tubes  
F = Lead-free package (ECOPACK®), tape & reel  
TR = Tape & reel (not for new design - use F)  
For SOH16:  
blank = Tubes (not for new design - use E)  
E = Lead-free package (ECOPACK®), tubes  
F = Lead-free package (ECOPACK®), tape & reel  
TR = Tape & reel (not for new design - use F)  
1. Contact local sales office  
2. The SOIC package (SOH28) requires the SNAPHAT® battery package which is ordered separately under the part number  
“M4Txx-BR12SHX” in plastic tube or “M4TXX-BR12SHXTR” in tape & reel form (see Table 17 on page 28).  
27/30  
Part numbering  
M41T315Y, M41T315V, M41T315W  
Caution:  
Do not place the SNAPHAT battery package “M4TXX-BR12SH” in conductive foam as it will  
drain the lithium button-cell battery.  
For other options, or for more information on any aspect of this device, please contact the  
ST sales office nearest you.  
Table 17. SNAPHAT battery table  
Part number  
Description  
Package  
M48T28-BR12SH  
M48T32-BR12SH  
Lithium battery (48mAh) SNAPHAT  
Lithium battery (120mAh) SNAPHAT  
SH  
SH  
28/30  
M41T315Y, M41T315V, M41T315W  
Revision history  
8
Revision history  
Table 18. Document revision history  
Date  
Revision  
Changes  
Jun-2001  
1.0  
1.1  
1.2  
1.3  
1.4  
First issue  
17-Jul-2001  
18-Sep-2001  
27-Sep-2001  
01-May-2002  
Basic formatting changes  
Changed pin 8 in 28-pin to VSS  
Added ambient temp to DC characteristics table (Table 9)  
Modify reflow time and temperature footnote (Table 6)  
Modify crystal electrical characteristics table footnotes (Table 10);  
add marketing status (Table 16)  
04-Nov-2002  
1.5  
26-Mar-2003  
08-Jun-2004  
1.6  
2.0  
Update test condition (Table 9)  
Reformatted; add lead-free information  
Reformatted document; product status Not for New Design; added  
lead-free second level interconnect information to cover page and  
Section 6: Package mechanical data; updated Table 6.  
26-Nov-2007  
3
29/30  
M41T315Y, M41T315V, M41T315W  
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