SM30T42AY [STMICROELECTRONICS]
汽车级3000 W、36 V TVS，SMC封装;
| 型号： | SM30T42AY |
| 厂家： | 
ST |
| 描述： | 汽车级3000 W、36 V TVS，SMC封装 局域网 光电二极管 电视 |
| 文件： | 总12页 (文件大小：277K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SM30TY
Automotive 3000 W Transil™
Datasheet − production data
(a)
•
ISO 7637-2
:
– Pulse 1: V = -100 V
S
– Pulse 2a: V = +50 V
S
– Pulse 3a: V = -150 V
S
– Pulse 3b: V = +100 V
A
S
Description
The SM30TY Transil series has been designed to
protect automotive sensitive circuits against
surges defined in ISO 7637-2 and against
electrostatic discharges according to ISO 10605.
K
Unidirectional
Bidirectional
SMC
(JEDEC DO-214AB)
The Planar technology makes it compatible with
high-end circuits where low leakage current and
high junction temperature are required to provide
reliability and stability over time. The SM30TY
devices are packaged in SMC (SMC footprint in
accordance with IPC 7531 standard).
Features
•
Peak pulse power:
– 3000 W (10/1000 µs)
– Up to 28 kW (8/20 µs)
•
•
•
•
Stand off voltage range: from 13 V to 33 V
Unidirectional and bidirectional types
Operating T
: 150 °C
j max
High power capability at T
– 2200 W (10/1000 µs)
:
jmax
•
•
•
JEDEC registered package outline
Resin meets UL 94, V0
AEC-Q101 qualified
Complies with the following standards
•
•
ISO 10605 - C = 150 pF, R = 330 Ω :
– 30 kV (air discharge)
TM: Transil is a trademark of STMicroelectronics
– 30 kV (contact discharge)
ISO 10605 - C = 330 pF, R = 330 Ω
– 30 kV (air discharge)
a. Not applicable to parts with stand-off voltage lower
than the average battery voltage (13.5 V)
– 30 kV (contact discharge)
June 2014
DocID022065 Rev 3
1/12
This is information on a product in full production.
www.st.com
Characteristics
SM30TY
1
Characteristics
Table 1. Absolute maximum ratings (T
Parameter
= 25 °C)
amb
Symbol
Value
Unit
ISO10605 (C = 330 pF, R = 330 Ω )
contact discharge
30
30
air discharge
V
P
Peak pulse voltage
kV
PP
IEC 61000-4-2 /ISO10605 (C = 150 pF, R = 330 Ω)
contact discharge
air discharge
(1)
30
30
Peak pulse power dissipation
T
= T
3000
-65 to + 150
-55 to + 150
260
W
°C
°C
°C
PP
j initial
amb
T
Storage temperature range
stg
T
Operating junction temperature range
Maximum lead temperature for soldering during 10 s.
j
T
L
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 1. Electrical characteristics - definitions
I
I
Symbol Parameter
IPP
IF
Unidirectional
VRM
VBR
VCL
IRM
IPP
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ VRM
Peak pulse current
IR
IRM
VF
VCLVBR VRM
V
VCLVBR VRM
V
IRM
IR
IRM
IR
VRMVBR VCL
αT
Voltage temperature coefficient
Forward voltage drop
Dynamic resistance
VF
Bidirectional
RD
IPP
IPP
Figure 2. Pulse definition for electrical characteristics
%I
PP
100
Pulse waveform
tr = rise time (µs)
50
tp = pulse duration time (µs)
0
t
t
t
r
p
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DocID022065 Rev 3
SM30TY
Characteristics
Table 2. Electrical characteristics, parameter values (T
= 25 °C)
at I R
D
amb
I
max
V
at I
R
V
(1)
(2)
RM
CL
PP
D
CL
PP
V
at I
⍺ T
BR
R
at V
10/1000 µs 10/1000 µs 8/20 µs 8/20 µs
RM
Order code
min typ max
V
max
max
max
(3)
(4)
(3)
(4)
µA
V
mA
V
A
Ω
V
A
Ω
10-4/ °C
SM30T15AY/CAY 0.2 13 14.4 15.2 16
SM30T18AY/CAY 0.2 15 16.7 17.6 18.5
SM30T19AY/CAY 0.2 16 17.8 18.7 19.6
1
1
1
1
1
1
1
1
1
1
1
21.5 140
24.4 123.0
26.0 115.4
29.2 102.7
32.4 92.6
35.5 84.5
38.9 77.1
42.1 71.3
45.4 66.1
48.4 62.0
53.3 56.3
0.045
0.055
0.063
0.079
0.097
0.116
0.140
0.164
0.192
0.215
0.261
25 930 0.011
30.0 910 0.014
31.5 870 0.015
35.0 790 0.018
37.5 730 0.019
40.5 680 0.022
43.9 630 0.025
47.0 600 0.028
50.0 560 0.031
53.0 530 0.034
58.0 490 0.040
8.4
8.8
8.8
9.2
9.4
9.6
9.6
9.7
9.8
9.9
10
SM30T21AY/CAY 0.2 18
20 21.1 22.2
SM30T23AY/CAY 0.2 20 22.2 23.4 24.6
SM30T26AY/CAY 0.2 22 24.4 25.7 27.0
SM30T28AY/CAY 0.2 24 26.7 28.1 29.5
SM30T30AY/CAY 0.2 26 28.9 30.4 31.9
SM30T33AY/CAY 0.2 28 31.1 32.7 34.3
SM30T35AY/CAY 0.2 30 33.3 35.1 36.9
SM30T39AY/CAY 0.2 33 36.7 38.6 40.5
1. Pulse test: tp < 50 ms
2. To calculate maximum clamping voltage at other surge level, use the following formula: VCLmax = VCL - RD x (IPP - IPPappli
)
where IPPappli is the surge current in the application
3. To calculate VBR or VCL versus junction temperature, use the following formulas:
VBR at TJ = VBR at 25 °C x (1 + T x (TJ - 25))
VCL at TJ = VCL at 25 °C x (1 + T x (TJ - 25))
4. Surge capability given for both directions for unidirectional and bidirectional types.
DocID022065 Rev 3
3/12
12
Characteristics
SM30TY
Figure 3. Peak pulse power dissipation versus Figure 4. Peak pulse power versus exponential
initial junction temperature (typical value)
pulse duration (T initial = 25 °C)
j
PPP(kW)
1000.0
100.0
10.0
1.0
PPP(W)
3500
Tjinitial = 25 °C
10/1000 µs
3000
2500
2000
1500
1000
500
Tj(°C)
150 175
tP(ms)
1.E-01
0
0.1
1.E-03
0
25
50
75
100
125
1.E-02
1.E+00
1.E+01
1.E+02
Figure 5. Clamping voltage versus peak pulse Figure 6. Junction capacitance versus reverse
current
applied voltage for unidirectional types
(typical values)
(exponential waveform, maximum values)
IPP(A)
C(nF)
10.0
1000.0
Tjinitial = 25 °C
F = 1 MHz
VOSC = 30 mVRMS
8/20 µs
Tj = 25 °C
100.0
10.0
1.0
10/1000 µs
SM30T18AY
1.0
SM30T39AY
VCL(V)
100
VR(V)
100
0.1
0.1
1
10
10
Figure 7. Junction capacitance versus reverse
applied voltage for bidirectional types
(typical values)
Figure 8. Leakage current versus junction
temperature (typical values)
C(nF)
IR(nA)
10.0
1.E+03
VR = VRM
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
1.E+02
1.E+01
1.E+00
SM30T18CAY
1.0
SM30T39CAY
Tj(°C)
150
VR(V)
0.1
1
10
100
25
50
75
100
125
4/12
DocID022065 Rev 3
SM30TY
Characteristics
Figure 9. Peak forward voltage drop versus
Figure 10. Relative variation of thermal
peak forward current
(typical values)
impedance, junction to ambient, versus pulse
duration
IFM(A)
Zth(j-a)/Rth(j-a)
1.00
100.0
10.0
1.0
Recommended pad layout
Tj = 150 °C
Tj = 25 °C
0.10
Single pulse
epoxy printed board, FR4 copper thickness = 35 µm
tp(s)
VFM(V)
1.6 1.8
0.01
1.E-03
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Figure 11. Thermal resistance junction to ambient versus copper surface under each
lead
Rth(j-a)(°C/W)
100
epoxy printed board, FR4 copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
SCu(cm2)
4.5 5.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
DocID022065 Rev 3
5/12
12
Characteristics
SM30TY
Figure 12. ISO7637-2 pulse 1 response (VS = -100 V)
Figure 13. ISO7637-2 pulse 2 response (VS = 50 V)
6/12
DocID022065 Rev 3
SM30TY
Characteristics
Figure 14. ISO7637-2 pulse 3a response (VS = -150 V)
Figure 15. ISO7637-2 pulse 3b response (VS = 100 V)
Note:
ISO7637-2 pulses responses are not applicable for product with a stand off voltage lower
than the average battery voltage (13.5 V).
DocID022065 Rev 3
7/12
12
Application and design guidelines
SM30TY
2
Application and design guidelines
More information is available in the Application note AN2689 “Protection of automotive
electronics from electrical hazards, guidelines for design and component selection”.
8/12
DocID022065 Rev 3
SM30TY
Package information
3
Package information
•
•
•
•
•
Case: JEDEC DO-214AB molded plastic over planar junction
Terminals: solder plated, solderable as per MIL-STD-750, Method 2026
Polarity: for unidirectional types the band indicates cathode
Flammability: epoxy is rated UL 94, V0
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 16. IPAK dimension definitions
E1
D
E
A1
C
A2
E2
L
b
Table 3. SMC dimension values
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
A2
b
1.90
0.05
2.90
0.15
5.55
7.75
6.60
4.40
0.75
2.45
0.20
3.20
0.40
6.25
8.15
7.15
4.70
1.50
0.075
0.002
0.114
0.006
0.218
0.305
0.260
0.173
0.030
0.096
0.008
0.126
0.016
0.246
0.321
0.281
0.185
0.059
c
D
E
E1
E2
L
DocID022065 Rev 3
9/12
12
Package information
SM30TY
(1)
Figure 17. SMC footprint dimensions in
mm (inches)
Figure 18. Marking layout
1.54
5.11
1.54
(0.061)
devices only)
unidirectional
Cathode bar (
(0.061)
(0.201)
ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
3.14
(0.124)
x x x
z y w w
WW: week
8.19
(0.322)
1. Marking layout can vary according to assembly location.
Table 4. Marking
Order code
SM30T15AY
Marking
Order code
SM30T15CAY
Marking
3AAGY
3AAHY
3AAIY
3BAGY
3BAHY
3BAIY
SM30T18AY
SM30T19AY
SM30T21AY
SM30T23AY
SM30T26AY
SM30T28AY
SM30T30AY
SM30T33AY
SM30T35AY
SM30T39AY
SM30T18CAY
SM30T19CAY
SM30T21CAY
SM30T23CAY
SM30T26CAY
SM30T28CAY
SM30T30CAY
SM30T33CAY
SM30T35CAY
SM30T39CAY
3AAJY
3AAKY
3AALY
3AAEY
3AAMY
3AANY
3AAOY
3AAPY
3BAJY
3BAKY
3BALY
3BAEY
3BAMY
3BANY
3BAOY
3BAPY
10/12
DocID022065 Rev 3
SM30TY
Ordering information
4
Ordering information
Figure 19. Ordering information scheme
SM 30T xx CA
Y
Surface mount
Surge rating
30 = 3000 W Transil in SMC
Breakdown voltage
Type
A = Unidirectinal
CA = Bidirectional
Automotive grade
Table 5. Ordering information
Order code
Marking
Package Weight Base qty Delivery mode
SMC 0.25 g 2500 Tape and reel
(1)
SM30TxxAY/CAY
See Table 4 on page 10
1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See
Table 2 for list of available devices and their order codes
5
Revision history
Table 6. Document revision history
Date
Revision
Changes
28-Jul-2011
1
Initial release.
Updated footnote on page 1. Removed Table 2. Thermal
parameter.
27-Mar-2012
23-Jun-2014
2
3
Updated : Features, Table 2, Table 4 and reformatted to
current standard.
DocID022065 Rev 3
11/12
12
SM30TY
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