SMA6F5.0A-TR [STMICROELECTRONICS]
High junction temperature Transilâ¢; 高结温Transilâ ?? ¢
| 型号： | SMA6F5.0A-TR |
| 厂家： | 
ST |
| 描述： | High junction temperature Transil⢠|
| 文件： | 总9页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMA6F
High junction temperature Transil™
Features
®
■ ECOPACK 2 compliant product
■ Peak pulse power:
– 600 W (10/1000 µs)
– 4 kW (8/20 µs)
■ Stand off voltage: 5, 12 or 13 V
■ Unidirectional type
A
■ Low clamping voltage versus standard series
■ Low leakage current, 0.2 µA at 25 °C
K
Unidirectional
■ Operating T max: 175 °C
j
■ JEDEC registered package outline
SMAflat
Complies with the following standards
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883G-Method 3015-7: class3B
– 25 kV (human body model)
Description
The SMA6F Transil series has been designed to
protect sensitive equipment against electro-static
discharges according to IEC 61000-4-2, MIL STD
883 Method 3015, and electrical over stress such
as IEC 61000-4-4 and 5. They are generally for
surges below 600 W 10/1000 µs.
This planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time. Their low clamping voltages provides a
better safety margin to protect sensitive circuits
with extended life time expectancy.
Packaged in SMAflat non exposed pad, this
minimizes PCB space consumption (footprint in
accordance with IPC 7531 standard).
TM: Transil is a trademark of STMicroelectronics
September 2011
Doc ID 14996 Rev 2
1/9
www.st.com
9
Characteristics
SMA6F
1
Characteristics
Table 1.
Symbol
Absolute ratings (T
= 25 °C)
amb
Parameter
Value
Unit
PPP
P
Peak pulse power dissipation (1)
Tj initial = Tamb
Tlead = 55 °C
600
6
W
W
Power dissipation on infinite heatsink
Non repetitive surge peak forward current for
unidirectional types
tp = 10 ms
Tj initial = Tamb
IFSM
60
A
Tstg
Tj
Storage temperature range
-65 to +175
-55 to +175
260
°C
°C
°C
Operating junction temperature range
Maximum lead temperature for soldering during 10 s
TL
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Symbol
Thermal resistance
Parameter
Value
Unit
Rth (j-l)
Junction to leads
20
°C/W
Table 3.
Symbol
Electrical characteristics - definitions (T
= 25 °C)
amb
Parameter
I
VRM
VBR
VCL
IRM
IPP
Stand-off voltage
IF
Breakdown voltage
Clamping voltage
VF
VCLVBR VRM
V
Leakage current @ VRM
Peak pulse current
IRM
IR
αT
Voltage temperature coefficient
Forward voltage drop
IPP
VF
RD
Dynamic resistance
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Doc ID 14996 Rev 2
SMA6F
Table 4.
Characteristics
Electrical characteristics - values (T
= 25 °C)
amb
(2)
(2)
VCL @IPP
RD
VCL @IPP RD
IRM max@VRM
25 °C 85 °C
VBR @IR
αT(3)
(1)
10/1000 µs 10/1000 µs 8/20 µs 8/20 µs
Type
min typ max
V
max
V
max
V
max
µA (Max)
V
mA
A
Ω
A
Ω
10-4/°C
SMA6F5.0A
SMA6F12AVCL
SMA6F13A
10
0.2
0.2
50
1
5.0 6.40 6.74 7.07 10 9.2
68
0.029
0.135
0.154
13.4 298 0.021
22.9 157 0.055
23.9 147 0.054
5.7
7.8
8.3
12 13.2 13.7 14.3
13 14.4 15.2 15.9
1
1
18.5 31
20.4 29
1
1. Pulse test: tp <50ms.
2. To calculate maximum clamping voltage at other surge currents, use the following formula
VCLmax = RD x IPP + VBRmax
3. To calculate VBR versus junction temperature, use the following formula:
V
BR @ Tj = VBR @ 25 °C x (1 + αT x (Tj - 25))
Figure 1.
Definition of I pulse
pp
Repetitive peak pulse current
tr = rise time (µs)
%IPP
tp = pulse duration time (µs)
100
50
0
t
tr
tp
Figure 2.
Relative peak power dissipation
versus initial junction temperature
Figure 3.
Peak pulse power versus
exponential pulse duration
(T initial = 25 °C)
j
PPP[Tj initial] / PPP[Tj initial=25°C]
P
(kW)
PP
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100.0
10.0
1.0
Tj initial = 25 °C
Tj initial (°C)
t (ms)
p
0.1
0
25
50
75
100
125
150
175
200
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
Doc ID 14996 Rev 2
3/9
Characteristics
Figure 4.
SMA6F
Clamping voltage versus peak pulse current
(exponential waveform, maximum values)
I
(A)
PP
1000.0
100.0
10.0
1.0
Tj initial=25 °C
SMA6F5.0A
SMA6F12AVCL
SMA6F13A
tp = 8/20 µs
tp = 10/1000 µs
V
(V)
CL
0.1
5
10
15
20
25
Figure 5.
Junction capacitance versus reverse applied voltage (typical values)
C(pF)
10000
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
SMA6F5.0A
1000
SMA6F12AVCL
SMA6F13A
V (V)
R
100
1
10
100
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Doc ID 14996 Rev 2
SMA6F
Characteristics
Figure 6.
Peak forward voltage drop versus Figure 7.
peak forward current (typical
values)
Relative variation of thermal
impedance junction to ambient
versus pulse duration
I
(A)
FM
Z
/R
th(j-a) th(j-a)
1.0E+02
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.00
0.10
0.01
0.00
On recommended pad layout.
Printed circuit board, FR4
copper thickness = 35 µm
copper surface = 1 cm²
Tj =25 °C
Tj =125 °C
V (V)
FM
t (S)
p
0.0
0.5
1.0
1.5
2.0
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 9.
Leakage current versus junction
temperature (typical values)
R
(°C/W)
th(j-a)
I (nA)
R
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
200
180
160
140
120
100
80
Printed circuit board, FR4
copper thickness = 35 µm
VBR=11.7V
VBR>11.7V
60
40
VR=VRM
20
2
T (°C)
j
S
CU
(cm )
0
25
50
75
100
125
150
175
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Doc ID 14996 Rev 2
5/9
Ordering information scheme
SMA6F
2
Ordering information scheme
Figure 10. Ordering information scheme
SM A 6F xx
A
-
TR
Surface mount
Package
A = SMAflat package
Surge rating
6F = 600 W
Stand off voltage
example: 5.0 = 5.0 V
Type
A = Unidirectional
Delivery mode
TR = Tape and reel
6/9
Doc ID 14996 Rev 2
SMA6F
Package information
3
Package information
●
●
●
●
●
Case: JEDEC DO-221AC molded plastic over Planar junction
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Band indicates cathode
Flammability: Epoxy rated UL94V-0
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 5.
SMAflat (non exposed pad) dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
c
D
A
b
0.90
1.25
0.15
2.25
4.80
1.10 0.035
1.65 0.049
0.40 0.006
2.95 0.088
5.60 0.189
4.60 0.156
1.50 0.030
0.043
0.065
0.016
0.116
0.220
0.181
0.059
L 2x
L1 2x
L2 2x
c
E
E1
D
E
L
E1 3.95
b
L
0.75
L1
L2
0.50
0.50
0.019
0.019
Figure 11. SMAflat footprint dimensions Figure 12. Marking information
5.52
(0.217)
devices only)
unidirectional
Cathode bar (
1.52
(0.060)
ECOPACK status
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
x x x
z y w w
1.20
(0.047)
3.12
(0.123)
1.20
(0.047)
millimeters
(inches)
Doc ID 14996 Rev 2
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Ordering information
SMA6F
4
Ordering information
Table 6.
Order code
SMA6F5.0A-TR
Ordering information
Marking
Package
Weight Base qty Delivery mode
SUA
SUJ
SUG
SMA6F12AVCL
SMA6F13A-TR
SMAflat
0.035 g
10000
Tape and reel
For the latest information on available order codes see the product pages on www.st.com.
5
Revision history
Rev
2
Table 7.
Date
Document revision history
Revision
Changes
04-Sep-2008
01-Sep-2011
1
2
First issue.
Updated order code in Table 6.
8/9
Doc ID 14996 Rev 2
SMA6F
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Doc ID 14996 Rev 2
9/9
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