SMTPB232 概述
TRISILTM TRISILTM
SMTPB232 数据手册
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PDF下载SMTPB SERIES
TM
TRISIL
MAIN APPLICATIONS
Any sensitive equipment requiring protection
against lightning strikes:
ANALOGAND DIGITAL LINE CARDS
MAIN DISTRIBUTION FRAMES
TERMINALSANDTRANSMISSIONEQUIPMENT
GMS-TUBE REPLACEMENT
DESCRIPTION
SMC
The SMTPBxxseries hasbeen designedto protect
telecommunication equipment against lightning
and transient induced by AC power lines.
SCHEMATIC DIAGRAM
FEATURES
BIDIRECTIONAL CROWBAR PROTECTION.
BREAKDOWNVOLTAGE RANGE:
From 62 V To 270 V.
HOLDING CURRENT: IH = 150 mA min
REPETITIVEPEAK PULSE CURRENT :
IPP = 100A, 10/1000 µs.
BENEFITS
NO AGEINGAND NO NOISE
IF DESTROYED, THE SMTPB FALLS INTO
SHORT CIRCUIT, STILL ENSURING
PROTECTION
Peak Surge
Voltage
(V)
Voltage
Current
Admissible Necessary
COMPLIES WITH THE
FOLLOWING STANDARDS:
Waveform
Waveform
Ipp
(A)
Resistor
( s)
µ
( s)
µ
( )
Ω
CCITT K20
VDE0433
4000
4000
4000
10/700
10/700
1.2/50
5/310
5/310
1/20
100
100
100
-
-
-
VDE0878
IEC-1000-4-5
level 4
level 4
10/700
1.2/50
5/310
8/20
100
100
-
-
FCC Part 68, lightning surge
type A
1500
800
10/160
10/560
10/160
10/560
200
100
-
-
FCC Part 68, lightning surge
type B
100
5/320
5/320
25
-
BELLCORETR-NWT-001089
First level
2500
1000
2/10
10/1000
2/10
10/1000
500
100
-
-
BELLCORETR-NWT-001089
Second level
500
2/10
2/10
500
-
CNET l31-24
4000
0.5/700
0.8/310
100
-
1/5
August 1999 - Ed: 2C
SMTPBxxx
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Symbol
Parameter
Value
Unit
W
P
Power dissipation
Peakpulse current
T
lead = 50 °C
5
IPP
10/1000 µs
8/20 µs
100
250
500
A
2/10 µs
ITSM
Non repetitivesurge peak on-state
current
tp = 20 ms
VRM
50
A
dV/dt
Critical rate of rise of off-state voltage
5
KV/µs
Tstg
Tj
Storagetemperature range
Maximum junction temperature
- 55 to + 150
+ 150
°C
°C
TL
Maximum lead temperature for soldering during 10 s.
+ 260
°C
THERMAL RESISTANCES
Symbol
Parameter
Value
20
Unit
°C/W
°C/W
Rth (j-l)
Junctionto leads
Rth (j-a)
Junctionto ambient.
On printed circuit with standard footprint dimensions.
75
ELECTRICAL CHARACTERISTICS
(Tamb =25°C)
Symbol
VRM
IRM
VR
Parameter
Stand-offvoltage
Leakage current at stand-offvoltage
ContinuousReverse voltage
Breakdownvoltage
Breakovervoltage
VBR
VBO
IH
Holding current
IBO
Breakovercurrent
IPP
Peakpulse current
C
Capacitance
Type
Marking
IRM @ VRM
max.
IR @ VR
VBO @ IBO
IH
C
max.
note1
max.
max.
min.
note3
typ.
note4
note2
Laser
µA
V
µA
V
V
mA
mA
pF
SMTPB62
SMTPB68
SMTPB120
SMTPB200
SMTPB270
W07
W11
W21
W31
W43
2
2
2
2
2
56
61
108
180
243
50
50
50
50
50
62
68
120
200
270
82
90
160
267
360
800
800
800
800
800
150
150
150
150
150
160
160
140
130
120
All parameters tested at 25°C, except where indicated.
Note 1: measured at V guarantees V ≥ V
R
I
Note 3: See test circuit 2.
Note 4: = 1V, F = 1MHz. Refer to fig 3 for C versus V .
R
R
R
BRmin
Note 2: Measured at 50 Hz (1 cycle) - Seetest circuit 1.
V
R
2/5
SMTPBxxx
TEST CIRCUIT 1 FOR IBO and VBO parameters:
tp
= 20ms
Auto
Transformer
220V/2A
R1
static
relay.
140
R2
240
K
V
V
BO
measure
out
D.U.T
I
BO
measure
Transformer
220V/800V
5A
TEST PROCEDURE :
Pulse Test duration (tp = 20ms):
- For Bidirectional devices= Switch K is closed
- For Unidirectionaldevices = Switch K is open.
V
OUT Selection
- Device with VBO < 200 Volt
- VOUT = 250 VRMS, R1 = 140 Ω.
- Device with VBO ≥ 200 Volt
- VOUT = 480 VRMS, R2 = 240 Ω.
TEST CIRCUIT 2 for IH parameter.
R
- V
P
D.U.T.
V
= - 48 V
BAT
Surge generator
This is a GO-NOGO Test which allows to confirm the holdingcurrent (IH) level in a functional
test circuit.
TEST PROCEDURE :
1) Adjustthe current level at the IH value by short circuiting the AK of the D.U.T.
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000µs.
3) The D.U.T will come back off-state within 50 ms max.
3/5
SMTPBxxx
Fig. 1:
Non repetitive surge peak on-state current
Fig. 2:
junction temperature.
Relativevariation of holding current versus
versus overload duration (Tj initial=25°C).
Fig. 3: Relative variation of junction capacitance
versus reverse applied voltage(typical values).
Note: For VRM upper than 56V, the curve is
extrapolated(dotted line).
Fig. 4: On-state voltage versus on-state current
(typical values).
IT(A)
50
Tj=25°C
10
VT(V)
1
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
Fig. 5: Transient thermal impedance junction to
ambient versus pulse duration (for FR4 PC Board
withrecommended pad layout).
4/5
SMTPBxxx
ORDER CODE
SM TPB 100
SURFACE MOUNT
VOLTAGE
TRISIL PROTECTION 100 A
Marking:
Logo, date code, type code.
PACKAGE MECHANICAL DATA.
SMC
DIMENSIONS
Millimeters Inches
Min.
REF.
E1
Min.
1.90
0.05
2.90
0.15
7.75
6.60
4.40
5.55
0.75
Max.
2.45
0.20
3.2
Max.
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
A1
A2
b
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
D
c
0.41
8.15
7.15
4.70
6.25
1.60
E
E
E1
E2
A1
A2
C
D
L
E2
b
L
FOOTPRINT DIMENSIONS
SMC
(in millimeters)
Packaging: Standardpackagingis in tapeand reel
Weight : 0.25g.
3.3
2.0
4.2
2.0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor forany infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
5/5
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