SPC58NH92E5 [STMICROELECTRONICS]

A scalable approach for high-end body, networking and security platforms for Automotive;


型号：	SPC58NH92E5
厂家：	ST
描述：	A scalable approach for high-end body, networking and security platforms for Automotive
文件：	总7页 (文件大小：300K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SPC58EHx, SPC58NHx

A scalable approach for high-end body, networking and security

platforms for Automotive

Data brief

 Comprehensive new generation ASIL-D safety

concept:

– ASIL-D of ISO 26262

– One CPU channel in lockstep

eTQFP144 (20x20x1 mm)

FPBGA302 (17x17x1.8 mm)

eLQFP176 (24x24x1 mm)

FPBGA386 (19x19x1.8 mm)

– Logic BIST

– FCCU for collection and reaction to failure

notifications

– Memory BIST

– Cyclic redundancy check (CRC) unit

Features

– Memory Error Management Unit (MEMU)

for collection and reporting of error events

in memories

 AEC-Q100 qualified

 High performance e200z4 triple core:

– 32-bit Power Architecture technology CPU

– Core frequency as high as 200 MHz

– Variable Length Encoding (VLE)

 Crossbar switch architecture for concurrent

access to peripherals, Flash, or RAM from

multiple bus masters with end-to-end ECC

 Body cross triggering unit (BCTU):

– Floating Point, End-to-End Error Correction

– Triggers ADC conversions from any eMIOS

channel

 10496 KB (10240 KB code Flash + 256 KB

data Flash) on-chip Flash memory:

– Triggers ADC conversions from up to 2

dedicated PIT_RTIs

– Supports read during program and erase

operations, and multiple blocks allowing

EEPROM emulation

 Enhanced modular IO subsystem (eMIOS):

– up to 96 timed IO channels with 16-bit

counter resolution

– Supports read while read between the two

code Flash partitions

 Enhanced analog-to-digital converter system

– Hardware support for Flash context

switching (for FOTA with multi software

versions)

with:

– 4 independent fast 12-bit SAR analog

converters

 1088 KB on-chip general-purpose SRAM (in

– One supervisor 12-bit SAR analog

converter

addition to 192 KB core local data RAM):

– 64 KB in CPU_0, 64 KB in CPU_1 and

64 KB in CPU_2

– One standby 10-bit SAR analog converter

– 100 ADC channels

 224 KB HSM dedicated Flash memory (192 KB

 Communication interfaces:

code + 32 KB data)

– 24 LINFlexD modules

 Multi-channel direct memory access controller

– 10 deserial serial peripheral interface

(DSPI) modules

(eDMA):

– One eDMA with 64 channels

– One eDMA with 16 channels

– 1 deserial serial peripheral interface

(DSPI_LP) module available in low power

mode

 One interrupt controller (INTC)

July 2020

DB3758 Rev 2

1/7

For further information contact your local STMicroelectronics sales office.

www.st.com

SPC58EHx, SPC58NHx

– 16 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support

– Dual-channel FlexRay controller

– One SD/SDIO/eMMC module

– One OctalSPI module with double Chip Select

– Two independent Ethernet controllers, one 10/100Mbps and the other one 10/100Mbps or 1Gbps,

compliant IEEE 802.3-2008 and OPEN RGMII EPL v2.3

– Four I C modules

– Two PSI5 modules

 Low power capabilities:

– Versatile low power modes

– Ultra low power standby with RTC

– Smart Wake-up Unit for contact monitoring

– Fast wakeup schemes

 Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for

computational shell

 Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010

standard

 Boot assist Flash (BAF) supports factory programming using a serial bootload through the

asynchronous CAN or LIN/UART

 Low power supply options:

– Single internal linear regulator with external ballast

– External low voltage supply (1.2 V)

 Temperature range:

– -40 °C to 105 °C

– -40 °C to 125 °C

Table 1. Device summary

Part number

Package

6 MB

8 MB

10 MB

Dual core Triple core

Dual core

Triple core

Dual core

Triple core

eTQFP144 SPC58EH84E5 SPC58NH84E5 SPC58EH90E5 SPC58NH90E5 SPC58EH92E5 SPC58NH92E5

eLQFP176 SPC58EH84E7 SPC58NH84E7 SPC58EH90E7 SPC58NH90E7 SPC58EH92E7 SPC58NH92E7

FPBGA302 SPC58EH84C3 SPC58NH84C3 SPC58EH90C3 SPC58NH90C3 SPC58EH92C3 SPC58NH92C3

FPBGA386 SPC58EH84C5 SPC58NH84C5 SPC58EH90C5 SPC58NH90C5 SPC58EH92C5 SPC58NH92C5

2/7

DB3758 Rev 2

SPC58EHx, SPC58NHx

Description

The SPC58 H Line is a general-purpose MCU targeting high-end Body, Networking and

Security applications. SPC58 H Line extends the Chorus Series of successful 40nm

Automotive MCUs. and offers a seamless extension with compatible devices from 2 M up to

10 Mbytes Flash. Combining the 3x PowerPC cores (200Mhz) with a rich set of

communication interfaces like 2x Ethernet, 16x ISO CAN FD and 24x LIN, it introduces new

features to support Connected Gateway applications with Gigabit ethernet MAC for fast

download, an hyperbus interface to extend the internal RAM and the eMMC interface to

allow big data file storage.

To manage OTA update while the application keeps running, the 10 Mbyte flash can be

programmed in background and its context swapped on reset.

The Smart Standby domain including RAM, RTC, ADC and a new low power SPI module

increases the contact monitoring capability keeping the consumption extremely low

(< 160 μA) and guaranteeing a fast start-up on wake-up event (< 500 μs).

The SPC58 H Line offers the highest performance and integrated devices available in high-

efficiency pin count packages like eTQFP144 fully scalable up to FPBGA386. Designed

according to ISO 26262, the SPC58 H Line supports ASIL-B/D offering 1 lockstep core as

well as a EVITA full Security supporting asymmetric keys. With its 100 Mbit IPC the Chorus

H Line is designed for system scalability coupling 2 Chorus H devices to build a system with

6 cores, 20 Mbytes flash and 2x Gigabit ethernet.

DB3758 Rev 2

3/7

Software Library and Tools

SPC58EHx, SPC58NHx

Software Library and Tools

The product family is provided as a set of software libraries to enable application

development. The libraries are available on www.st.com and they include:



Flash drivers for run-time and off-line device programming

MCAL drivers

Core Self Test

Security Firmware for HSM

Additional software components and tools are available by selected 3rd parties:

Figure 1. Software components and tools

4/7

DB3758 Rev 2

SPC58EHx, SPC58NHx

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

DB3758 Rev 2

5/7

Revision history

SPC58EHx, SPC58NHx

Revision history

Table 2. Document revision history

Revision Changes

Date

17-Oct-2018

Initial release.

Updated:

15-Jul-2020

– Features on page 1

– Figure 1: Software components and tools

6/7

DB3758 Rev 2

SPC58EHx, SPC58NHx

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and

improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on

ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order

acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or

the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other

product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

DB3758 Rev 2

7/7

SPC58NH92E5 [STMICROELECTRONICS]

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