ST7232AJ2BC [STMICROELECTRONICS]

8-BIT MICROCONTROLLER WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE; 具有8K闪存/ ROM , ADC , 4个定时器, SPI , SCI接口8位微控制器
ST7232AJ2BC
型号: ST7232AJ2BC
厂家: ST    ST
描述:

8-BIT MICROCONTROLLER WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
具有8K闪存/ ROM , ADC , 4个定时器, SPI , SCI接口8位微控制器

闪存 微控制器
文件: 总157页 (文件大小:1415K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ST7232A  
8-BIT MICROCONTROLLER WITH 8K FLASH/ROM,  
ADC, 4 TIMERS, SPI, SCI INTERFACE  
Memories  
– 8K dual voltage High Density Flash (HDFlash)  
or ROM with read-out protection capability. In-  
Application Programming and In-Circuit Pro-  
gramming for HDFlash devices  
– 384 bytes RAM  
TQFP32  
7 x 7  
SDIP32  
400mil  
– HDFlash endurance: 100 cycles, data reten-  
tion: 40 years at 85°C  
Clock, Reset And Supply Management  
– Clock sources: crystal/ceramic resonator os-  
cillators and bypass for external clock  
– PLL for 2x frequency multiplication  
– Four Power Saving Modes: Halt, Active-Halt,  
TQFP44  
SDIP42  
Wait and Slow  
Interrupt Management  
– Nested interrupt controller  
– 14 interrupt vectors plus TRAP and RESET  
– 6 external interrupt lines (on 4 vectors)  
Up to 32 I/O Ports  
1 Analog peripheral (low current coupling)  
– 10-bit ADC with up to 12 robust input ports  
Instruction Set  
– 8-bit Data Manipulation  
– 63 Basic Instructions  
– 17 main Addressing Modes  
– 8 x 8 Unsigned Multiply Instruction  
Development Tools  
– 32/24 multifunctional bidirectional I/O lines  
– 22/17 alternate function lines  
– 12/10 high sink outputs  
4Timers  
– Main Clock Controller with: Real time base,  
Beep and Clock-out capabilities  
– Full hardware/software development package  
– In-Circuit Testing capability  
– Configurable watchdog timer  
– Two 16-bit Timers with: 2 input captures, 2  
output compares, PWM and pulse generator  
modes  
2 Communications Interfaces  
– SPI synchronous serial interface  
– SCI asynchronous serial interface  
Device Summary  
Features  
ST72F32AK1 ST72F32AK2 ST72F32AJ1 ST72F32AJ2 ST7232AK1 ST7232AK2 ST7232AJ1 ST7232AJ2  
Program memory  
- bytes  
FLASH 4K  
FLASH 8K  
FLASH 4K  
FLASH 8K  
ROM 4K  
ROM 8K  
ROM 4K  
ROM 8K  
RAM (stack) -  
bytes  
384 (256)  
384 (256)  
Operating Voltage  
Temp. Range  
3.8V to 5.5V  
3.8V to 5.5V  
up to -40°C to +125°C  
up to -40°C to +125°C  
SDIP32 400mils /  
TQFP32 7x7  
SDIP42 600mils /  
TQFP44 10x10  
SDIP32 400mils /  
TQFP32 7x7  
SDIP42 600mils /  
TQFP44 10x10  
Package  
Rev. 2  
December 2005  
1/157  
1
Table of Contents  
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.3 STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.3.1 Read-out Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
4.5 ICP (IN-CIRCUIT PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
4.6 IAP (IN-APPLICATION PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
4.7 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
4.7.1 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
5.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
6.2 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
6.3 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
6.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
6.3.2 Asynchronous External RESET pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
6.3.3 External Power-On RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
6.3.4 Internal Watchdog RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
6.4 SYSTEM INTEGRITY MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
6.4.1 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.2 MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
7.3 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
7.4 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
7.5 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
7.6 EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
7.6.1 I/O Port Interrupt Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
7.7 EXTERNAL INTERRUPT CONTROL REGISTER (EICR) . . . . . . . . . . . . . . . . . . . . . . . 35  
8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
8.2 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
8.3 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
8.4 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
8.4.1 ACTIVE-HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
8.4.2 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
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Table of Contents  
9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.2.1 Input Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.2.2 Output Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.2.3 Alternate Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
9.4 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
9.5 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
9.5.1 I/O Port Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
10 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
10.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
10.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
10.1.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
10.1.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
10.1.4 How to Program the Watchdog Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
10.1.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
10.1.6 Hardware Watchdog Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
10.1.7 Using Halt Mode with the WDG (WDGHALT option) . . . . . . . . . . . . . . . . . . . . . . . 51  
10.1.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
10.1.9 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC) . 53  
10.2.1 Programmable CPU Clock Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
10.2.2 Clock-out Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
10.2.3 Real Time Clock Timer (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
10.2.4 Beeper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
10.2.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
10.2.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
10.2.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
10.3 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
10.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
10.3.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
10.3.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
10.3.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
10.3.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
10.3.6 Summary of Timer modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
10.3.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
10.4 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
10.4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
10.4.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
10.4.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
10.4.4 Clock Phase and Clock Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80  
10.4.5 Error Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81  
10.4.6 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83  
10.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83  
10.4.8 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84  
10.5 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87  
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Table of Contents  
10.5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87  
10.5.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87  
10.5.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87  
10.5.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89  
10.5.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96  
10.5.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96  
10.5.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97  
10.6 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103  
10.6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103  
10.6.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103  
10.6.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104  
10.6.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104  
10.6.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104  
10.6.6 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105  
11 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107  
11.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107  
11.1.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
11.1.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
11.1.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
11.1.4 Indexed (No Offset, Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
11.1.5 Indirect (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
11.1.6 Indirect Indexed (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109  
11.1.7 Relative mode (Direct, Indirect) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109  
11.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110  
12 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.1.1 Minimum and Maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113  
12.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114  
12.2.1 Voltage Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114  
12.2.2 Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114  
12.2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115  
12.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115  
12.3.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115  
12.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116  
12.4.1 CURRENT CONSUMPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116  
12.4.2 Supply and Clock Managers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118  
12.4.3 On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119  
12.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120  
12.5.1 General Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120  
12.5.2 External Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120  
12.5.3 Crystal and Ceramic Resonator Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121  
12.5.4 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123  
12.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124  
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Table of Contents  
12.6.1 RAM and Hardware Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124  
12.6.2 FLASH Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124  
12.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125  
12.7.1 Functional EMS (Electro Magnetic Susceptibility) . . . . . . . . . . . . . . . . . . . . . . . . 125  
12.7.2 Electro Magnetic Interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126  
12.7.3 Absolute Maximum Ratings (Electrical Sensitivity) . . . . . . . . . . . . . . . . . . . . . . . . 127  
12.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128  
12.8.1 General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128  
12.8.2 Output Driving Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129  
12.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131  
12.9.1 Asynchronous RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131  
12.9.2 ICCSEL/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133  
12.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134  
12.10.116-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134  
12.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 135  
12.11.1SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135  
12.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137  
12.12.1Analog Power Supply and Reference Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139  
12.12.2General PCB Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139  
12.12.3ADC Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140  
13 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141  
13.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141  
13.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143  
13.3 SOLDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144  
14 ST7232A DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . 145  
14.1 FLASH OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145  
14.2 ROM DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE 147  
14.3 VERSION-SPECIFIC SALES CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149  
14.4 FLASH DEVICE ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149  
14.5 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150  
14.5.1 Socket and Emulator Adapter Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151  
14.6 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152  
15 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1 ALL FLASH AND ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1.1 Safe Connection of OSC1/OSC2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1.2 Unexpected Reset Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1.3 Clearing active interrupts outside interrupt routine . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1.4 16-bit Timer PWM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1.5 SCI Wrong Break duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154  
15.1.6 39-Pulse ICC Entry Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155  
15.2 ROM DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155  
15.2.1 I/O Port A and F Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155  
15.2.2 External clock source with PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155  
16 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156  
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Table of Contents  
To obtain the most recent version of this datasheet,  
please check at www.st.com>products>technical literature>datasheet.  
Please also pay special attention to the Section “KNOWN LIMITATIONS” on page 154.  
157  
6/157  
1
ST7232A  
Under software control, all devices can be placed  
in WAIT, SLOW, ACTIVE-HALT or HALT mode,  
reducing power consumption when the application  
is in idle or stand-by state.  
1 INTRODUCTION  
The ST72F32A and ST7232A devices are mem-  
bers of the ST7 microcontroller family designed for  
the 5V operating range.  
The enhanced instruction set and addressing  
modes of the ST7 offer both power and flexibility to  
software developers, enabling the design of highly  
efficient and compact application code. In addition  
to standard 8-bit data management, all ST7 micro-  
controllers feature true bit manipulation, 8x8 un-  
signed multiplication and indirect addressing  
modes.  
The 32 and 44-pin devices are designed for mid-  
range applications  
All devices are based on a common industry-  
standard 8-bit core, featuring an enhanced instruc-  
tion set and are available with FLASH or ROM pro-  
gram memory.  
Figure 1. Device Block Diagram  
8-BIT CORE  
ALU  
PROGRAM  
MEMORY  
(8K Bytes)  
RESET  
CONTROL  
V
PP  
RAM  
(384 Bytes)  
V
V
SS  
DD  
WATCHDOG  
PORT A  
OSC1  
OSC2  
OSC  
MCC/RTC/BEEP  
PORT F  
TIMER A  
BEEP  
PORT B  
PORT E  
PORT C  
TIMER B  
SPI  
SCI  
PORT D  
10-BIT ADC  
V
AREF  
V
SSA  
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3
ST7232A  
2 PIN DESCRIPTION  
Figure 2. 32-Pin SDIP Package Pinout  
PB3  
PB0  
(HS) PB4  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
ei3  
ei1  
ei2  
AIN0 / PD0  
AIN1 / PD1  
2
PE1 / RDI  
PE0 / TDO  
3
V
4
AREF  
V
_2  
V
5
DD  
SSA  
OSC1  
OSC2  
MCO / AIN8 / PF0  
BEEP / (HS) PF1  
6
7
OCMP1_A / AIN10 / PF4  
V
_2  
8
SS  
ICAP1_A / (HS) PF6  
EXTCLK_A / (HS) PF7  
AIN12 / OCMP2_B / PC0  
RESET  
/ ICCSEL  
9
V
10  
11  
12  
13  
14  
15  
16  
PP  
PA7 (HS)  
AIN13 / OCMP1_B / PC1  
ICAP2_B / (HS) PC2  
ICAP1_B / (HS) PC3  
ICCDATA/ MISO / PC4  
AIN14 / MOSI / PC5  
PA6 (HS)  
PA4 (HS)  
PA3 (HS)  
ei0  
PC7 / SS / AIN15  
PC6 / SCK / ICCCLK  
(HS) 20mA high sink capability  
eix associated external interrupt vector  
Figure 3. 32-Pin TQFP 7x7 Package Pinout  
32 31 30 29 28 27 26 25  
V
24  
23  
22  
21  
20  
19  
18  
17  
OSC1  
OSC2  
_2  
1
2
3
4
5
6
7
8
AREF  
ei3 ei2  
V
SSA  
MCO / AIN8 / PF0  
BEEP / (HS) PF1  
V
SS  
ei1  
RESET  
/ ICCSEL  
OCMP1_A / AIN10 / PF4  
ICAP1_A / (HS) PF6  
V
PP  
PA7 (HS)  
PA6 (HS)  
PA4 (HS)  
EXTCLK_A / (HS) PF7  
AIN12 / OCMP2_B / PC0  
ei0  
9 10 11 12 13 14 15 16  
(HS) 20mA high sink capability  
eix associated external interrupt vector  
8/157  
ST7232A  
PIN DESCRIPTION (Cont’d)  
Figure 4. 42-Pin SDIP and 44-Pin TQFP Package Pinouts  
44 43 42 41 40 39 38 37 36 35 34  
RDI / PE1  
V
V
1
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
SS_1  
DD_1  
PB0  
PB1  
2
PA3 (HS)  
3
ei0  
ei2  
ei3  
PB2  
PC7 / SS / AIN15  
4
PB3  
PC6 / SCK / ICCCLK  
PC5 / MOSI / AIN14  
PC4 / MISO / ICCDATA  
PC3 (HS) / ICAP1_B  
PC2 (HS) / ICAP2_B  
PC1 / OCMP1_B / AIN13  
PC0 / OCMP2_B / AIN12  
5
(HS) PB4  
AIN0 / PD0  
AIN1 / PD1  
AIN2 / PD2  
AIN3 / PD3  
AIN4 / PD4  
6
7
8
9
ei1  
10  
11  
12 13 14 15 16 17 18 19 20 21 22  
(HS) PB4  
AIN0 / PD0  
PB3  
1
ei3  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
PB2  
PB1  
PB0  
2
ei2  
AIN1 / PD1  
AIN2 / PD2  
AIN3 / PD3  
AIN4 / PD4  
AIN5 / PD5  
3
4
PE1 / RDI  
PE0 / TDO  
5
6
V
_2  
7
DD  
V
OSC1  
OSC2  
8
AREF  
V
9
SSA  
MCO / AIN8 / PF0  
BEEP / (HS) PF1  
V
_2  
SS  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
RESET  
V / ICCSEL  
PP  
ei1  
(HS) PF2  
AIN10 / OCMP1_A / PF4  
ICAP1_A / (HS) PF6  
EXTCLK_A / (HS) PF7  
AIN12 / OCMP2_B / PC0  
AIN13 / OCMP1_B / PC1  
ICAP2_B/ (HS) PC2  
ICAP1_B / (HS) PC3  
ICCDATA / MISO / PC4  
AIN14 / MOSI / PC5  
PA7 (HS)  
PA6 (HS)  
PA5 (HS)  
PA4 (HS)  
V
SS_1  
V
DD_1  
PA3 (HS)  
ei0  
PC7 / SS / AIN15  
PC6 / SCK / ICCCLK  
(HS) 20mA high sink capability  
eix associated external interrupt vector  
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1
ST7232A  
PIN DESCRIPTION (Cont’d)  
For external pin connection guidelines, refer to See “ELECTRICAL CHARACTERISTICS” on page 113.  
Legend / Abbreviations for Table 1:  
Type:  
I = input, O = output, S = supply  
A = Dedicated analog input  
Input level:  
In/Output level: C = CMOS 0.3V /0.7V  
DD  
DD  
DD  
C = CMOS 0.3V /0.7V with input trigger  
T
DD  
Output level:  
HS = 20mA high sink (on N-buffer only)  
Port and control configuration:  
1)  
– Input:  
float = floating, wpu = weak pull-up, int = interrupt , ana = analog ports  
2)  
– Output:  
OD = open drain , PP = push-pull  
Refer to “I/O PORTS” on page 42 for more details on the software configuration of the I/O ports.  
The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is  
in reset state.  
Table 1. Device Pin Description  
Pin n°  
Level  
Port  
Main  
function  
(after  
Input  
Output  
Pin Name  
Alternate Function  
reset)  
6
7
1
2
3
4
5
6
7
8
9
30  
31  
32  
1
2
3
PB4 (HS)  
I/O C  
I/O C  
I/O C  
I/O C  
I/O C  
I/O C  
I/O C  
S
HS  
X
X
X
X
X
X
X
ei3  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Port B4  
T
T
T
T
T
T
T
PD0/AIN0  
PD1/AIN1  
PD2/AIN2  
PD3/AIN3  
PD4/AIN4  
PD5/AIN5  
X
X
X
X
X
X
Port D0 ADC Analog Input 0  
Port D1 ADC Analog Input 1  
Port D2 ADC Analog Input 2  
Port D3 ADC Analog Input 3  
Port D4 ADC Analog Input 4  
Port D5 ADC Analog Input 5  
Analog Reference Voltage for ADC  
Analog Ground Voltage  
8
X
9
X
10  
11  
12  
13  
14  
X
X
X
1
2
4
5
V
V
AREF  
SSA  
S
Main clock  
out (f  
ADC Analog  
Input 8  
15 10  
3
4
6
7
PF0/MCO/AIN8  
I/O C  
X
ei1  
ei1  
X
X
X
Port F0  
T
)
CPU  
16 11  
17 12  
PF1 (HS)/BEEP  
PF2 (HS)  
I/O C  
I/O C  
HS  
HS  
X
X
X
X
X
X
Port F1 Beep signal output  
Port F2  
T
T
ei1  
Timer A Out-  
Port F4 put Com-  
pare 1  
PF4/OCMP1_A/  
AIN10  
ADC Analog  
Input 10  
18 13  
5
8
I/O C  
X
X
X
X
X
T
19 14  
20 15  
6
7
9
PF6 (HS)/ICAP1_A I/O C  
HS  
HS  
X
X
X
X
X
X
X
X
Port F6 Timer A Input Capture 1  
T
T
PF7 (HS)/  
I/O C  
Timer A External Clock  
10  
Port F7  
Source  
EXTCLK_A  
21  
22  
V
V
S
S
Digital Main Supply Voltage  
Digital Ground Voltage  
DD_0  
SS_0  
Timer B Out-  
ADC Analog  
PC0/OCMP2_B/  
AIN12  
23 16  
8
11  
I/O C  
X
X
X
X
X
Port C0 put Com-  
Input 12  
T
pare 2  
10/157  
1
ST7232A  
Pin n°  
Level  
Port  
Main  
function  
(after  
Input  
Output  
Pin Name  
Alternate Function  
reset)  
Timer B Out-  
Port C1 put Com-  
pare 1  
PC1/OCMP1_B/  
AIN13  
ADC Analog  
Input 13  
24 17  
9
12  
I/O C  
X
X
X
X
X
T
25 18 10 13 PC2 (HS)/ICAP2_B I/O C  
26 19 11 14 PC3 (HS)/ICAP1_B I/O C  
HS  
HS  
X
X
X
X
X
X
X
X
Port C2 Timer B Input Capture 2  
Port C3 Timer B Input Capture 1  
T
T
SPI Master  
ICC Data In-  
Port C4 In / Slave  
put  
PC4/MISO/ICCDA-  
TA  
27 20 12 15  
I/O C  
X
X
X
X
T
Out Data  
SPI Master  
ADC Analog  
28 21 13 16 PC5/MOSI/AIN14  
29 22 14 17 PC6/SCK/ICCCLK  
I/O C  
I/O C  
I/O C  
X
X
X
X
X
X
X
X
X
X
X
Port C5 Out / Slave  
Input 14  
T
T
In Data  
SPI Serial  
Clock  
ICC Clock  
Output  
Port C6  
SPI Slave  
Port C7 Select (ac-  
tive low)  
ADC Analog  
Input 15  
30 23 15 18 PC7/SS/AIN15  
31 24 16 19 PA3 (HS)  
X
X
X
X
X
X
T
T
I/O C  
S
HS  
ei0  
Port A3  
32 25  
33 26  
V
V
Digital Main Supply Voltage  
Digital Ground Voltage  
Port A4  
DD_1  
SS_1  
S
34 27 17 20 PA4 (HS)  
35 28 PA5 (HS)  
I/O C  
I/O C  
I/O C  
I/O C  
HS  
HS  
HS  
HS  
X
X
X
X
X
X
X
X
T
T
X
X
T
T
T
T
Port A5  
1)  
36 29 18 21 PA6 (HS)  
37 30 19 22 PA7 (HS)  
Port A6  
1)  
Port A7  
Must be tied low. In the flash pro-  
gramming mode, this pin acts as the  
programming voltage input V . See  
PP  
38 31 20 23 V /ICCSEL  
I
PP  
Section 12.9.2 for more details. High  
voltage must not be applied to ROM  
devices.  
39 32 21 24 RESET  
I/O C  
Top priority non maskable interrupt.  
Digital Ground Voltage  
T
40 33 22 25 V  
S
SS_2  
41 34 23 26 OSC2  
O
Resonator oscillator inverter output  
External clock input or Resonator os-  
cillator inverter input  
42 35 24 27 OSC1  
I
43 36 25 28 V  
S
Digital Main Supply Voltage  
DD_2  
44 37 26 29 PE0/TDO  
I/O C  
I/O C  
X
X
X
X
X
X
X
X
Port E0 SCI Transmit Data Out  
Port E1 SCI Receive Data In  
T
1
38 27 30 PE1/RDI  
T
Caution: Negative cur-  
2
39 28 31 PB0  
I/O C  
X
ei2  
X
X
Port B0 rent injection not al-  
T
5)  
lowed on this pin  
3
4
5
40  
41  
PB1  
PB2  
I/O C  
I/O C  
I/O C  
X
X
X
ei2  
ei2  
X
X
X
X
X
X
Port B1  
Port B2  
Port B3  
T
T
T
42 29 32 PB3  
ei2  
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ST7232A  
Notes:  
1. In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up  
column (wpu) is merged with the interrupt column (int), then the I/O configuration is pull-up interrupt input,  
else the configuration is floating interrupt input.  
2. In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to V  
DD  
are not implemented). See See “I/O PORTS” on page 42. and Section 12.8 I/O PORT PIN CHARACTER-  
ISTICS for more details.  
3. OSC1 and OSC2 pins connect a crystal/ceramic resonator, or an external source to the on-chip oscil-  
lator; see Section 1 INTRODUCTION and Section 12.5 CLOCK AND TIMING CHARACTERISTICS for  
more details.  
4. On the chip, each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up con-  
figuration after reset. The configuration of these pads must be kept at reset state to avoid added current  
consumption.  
5. For details refer to Section 12.8.1 on page 128  
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ST7232A  
3 REGISTER & MEMORY MAP  
As shown in Figure 5, the MCU is capable of ad-  
dressing 64K bytes of memories and I/O registers.  
The highest address bytes contain the user reset  
and interrupt vectors.  
The available memory locations consist of 128  
bytes of register locations, up to 384 bytes of RAM  
and up to 8 Kbytes of user program memory. The  
RAM space includes up to 256 bytes for the stack  
from 0100h to 01FFh.  
IMPORTANT: Memory locations marked as “Re-  
served” must never be accessed. Accessing a re-  
served area can have unpredictable effects on the  
device.  
Figure 5. Memory Map  
0080h  
Short Addressing  
RAM (zero page)  
0000h  
HW Registers  
(see Table 2)  
00FFh  
0100h  
007Fh  
0080h  
256 Bytes Stack  
Reserved  
RAM  
(384 Bytes)  
01FFh  
0200h  
047Fh  
0480h  
027Fh  
or 047Fh  
Reserved  
E000h  
E000h  
Program Memory  
(4K or 8K)  
8 KBytes  
FFDFh  
FFE0h  
F000h  
4 Kbytes  
Interrupt & Reset Vectors  
(see Table 8)  
FFFFh  
FFFFh  
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ST7232A  
Table 2. Hardware Register Map  
Register  
Label  
Reset  
Status  
Address  
Block  
Register Name  
Remarks  
1)  
0000h  
0001h  
0002h  
PADR  
PADDR  
PAOR  
Port A Data Register  
Port A Data Direction Register  
Port A Option Register  
00h  
R/W  
R/W  
R/W  
2)  
Port A  
Port B  
00h  
00h  
1)  
0003h  
0004h  
0005h  
PBDR  
PBDDR  
PBOR  
Port B Data Register  
Port B Data Direction Register  
Port B Option Register  
00h  
R/W  
R/W  
R/W  
2)  
00h  
00h  
1)  
0006h  
0007h  
0008h  
PCDR  
PCDDR  
PCOR  
Port C Data Register  
Port C Data Direction Register  
Port C Option Register  
00h  
R/W  
R/W  
R/W  
Port C  
00h  
00h  
1)  
0009h  
000Ah  
000Bh  
PDADR  
PDDDR  
PDOR  
Port D Data Register  
Port D Data Direction Register  
Port D Option Register  
00h  
R/W  
R/W  
R/W  
2)  
Port D  
Port E  
Port F  
00h  
00h  
1)  
000Ch  
000Dh  
000Eh  
PEDR  
PEDDR  
PEOR  
Port E Data Register  
Port E Data Direction Register  
Port E Option Register  
00h  
R/W  
R/W  
R/W  
2)  
2)  
2)  
2)  
00h  
00h  
1)  
000Fh  
0010h  
0011h  
PFDR  
PFDDR  
PFOR  
Port F Data Register  
Port F Data Direction Register  
Port F Option Register  
00h  
R/W  
R/W  
R/W  
00h  
00h  
0012h  
to  
Reserved Area (15 Bytes)  
0020h  
0021h  
0022h  
0023h  
SPIDR  
SPICR  
SPICSR  
SPI Data I/O Register  
SPI Control Register  
SPI Control/Status Register  
xxh  
0xh  
00h  
R/W  
R/W  
R/W  
SPI  
ITC  
0024h  
0025h  
0026h  
0027h  
ISPR0  
ISPR1  
ISPR2  
ISPR3  
Interrupt Software Priority Register 0  
Interrupt Software Priority Register 1  
Interrupt Software Priority Register 2  
Interrupt Software Priority Register 3  
FFh  
FFh  
FFh  
FFh  
R/W  
R/W  
R/W  
R/W  
0028h  
0029h  
002Ah  
002Bh  
EICR  
External Interrupt Control Register  
Flash Control/Status Register  
Watchdog Control Register  
Reserved Area (1 Byte)  
00h  
00h  
7Fh  
R/W  
R/W  
R/W  
FLASH  
FCSR  
WATCHDOG  
WDGCR  
002Ch  
002Dh  
MCCSR  
MCCBCR  
Main Clock Control / Status Register  
Main Clock Controller: Beep Control Register  
00h  
00h  
R/W  
R/W  
MCC  
002Eh  
to  
Reserved Area (3 Bytes)  
0030h  
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1
ST7232A  
Register  
Label  
Reset  
Status  
Address  
Block  
Register Name  
Remarks  
0031h  
0032h  
0033h  
0034h  
0035h  
0036h  
0037h  
0038h  
0039h  
003Ah  
003Bh  
003Ch  
003Dh  
003Eh  
003Fh  
TACR2  
TACR1  
TACSR  
TAIC1HR  
TAIC1LR  
TAOC1HR  
TAOC1LR  
TACHR  
Timer A Control Register 2  
Timer A Control Register 1  
Timer A Control/Status Register  
Timer A Input Capture 1 High Register  
Timer A Input Capture 1 Low Register  
Timer A Output Compare 1 High Register  
Timer A Output Compare 1 Low Register  
Timer A Counter High Register  
00h  
00h  
R/W  
R/W  
xxxx x0xxb R/W  
xxh  
xxh  
80h  
00h  
FFh  
FCh  
FFh  
FCh  
xxh  
xxh  
80h  
00h  
Read Only  
Read Only  
R/W  
R/W  
TIMER A  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
R/W  
TACLR  
Timer A Counter Low Register  
TAACHR  
TAACLR  
TAIC2HR  
TAIC2LR  
TAOC2HR  
TAOC2LR  
Timer A Alternate Counter High Register  
Timer A Alternate Counter Low Register  
Timer A Input Capture 2 High Register  
Timer A Input Capture 2 Low Register  
Timer A Output Compare 2 High Register  
Timer A Output Compare 2 Low Register  
R/W  
0040h  
Reserved Area (1 Byte)  
0041h  
0042h  
0043h  
0044h  
0045h  
0046h  
0047h  
0048h  
0049h  
004Ah  
004Bh  
004Ch  
004Dh  
004Eh  
004Fh  
TBCR2  
TBCR1  
TBCSR  
TBIC1HR  
TBIC1LR  
TBOC1HR  
TBOC1LR  
TBCHR  
Timer B Control Register 2  
Timer B Control Register 1  
Timer B Control/Status Register  
Timer B Input Capture 1 High Register  
Timer B Input Capture 1 Low Register  
Timer B Output Compare 1 High Register  
Timer B Output Compare 1 Low Register  
Timer B Counter High Register  
00h  
00h  
R/W  
R/W  
xxxx x0xxb R/W  
xxh  
xxh  
80h  
00h  
FFh  
FCh  
FFh  
FCh  
xxh  
xxh  
80h  
00h  
Read Only  
Read Only  
R/W  
R/W  
TIMER B  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
Read Only  
R/W  
TBCLR  
Timer B Counter Low Register  
TBACHR  
TBACLR  
TBIC2HR  
TBIC2LR  
TBOC2HR  
TBOC2LR  
Timer B Alternate Counter High Register  
Timer B Alternate Counter Low Register  
Timer B Input Capture 2 High Register  
Timer B Input Capture 2 Low Register  
Timer B Output Compare 2 High Register  
Timer B Output Compare 2 Low Register  
R/W  
0050h  
0051h  
0052h  
0053h  
0054h  
0055h  
0056h  
0057h  
SCISR  
SCIDR  
SCIBRR  
SCICR1  
SCICR2  
SCIERPR  
SCI Status Register  
SCI Data Register  
SCI Baud Rate Register  
SCI Control Register 1  
SCI Control Register 2  
SCI Extended Receive Prescaler Register  
Reserved area  
SCI Extended Transmit Prescaler Register  
C0h  
xxh  
00h  
Read Only  
R/W  
R/W  
x000 0000h R/W  
SCI  
00h  
00h  
---  
R/W  
R/W  
SCIETPR  
00h  
R/W  
0058h  
to  
Reserved Area (24 Bytes)  
006Fh  
0070h  
0071h  
0072h  
ADCCSR  
ADCDRH  
ADCDRL  
Control/Status Register  
Data High Register  
Data Low Register  
00h  
00h  
00h  
R/W  
Read Only  
Read Only  
ADC  
0073h  
007Fh  
Reserved Area (13 Bytes)  
Legend: x=undefined, R/W=read/write  
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ST7232A  
Notes:  
1. The contents of the I/O port DR registers are readable only in output configuration. In input configura-  
tion, the values of the I/O pins are returned instead of the DR register contents.  
2. The bits associated with unavailable pins must always keep their reset value.  
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ST7232A  
4 FLASH PROGRAM MEMORY  
4.1 Introduction  
Depending on the overall Flash memory size in the  
microcontroller device, there are up to three user  
sectors (see Table 3). Each of these sectors can  
be erased independently to avoid unnecessary  
erasing of the whole Flash memory when only a  
partial erasing is required.  
The ST7 dual voltage High Density Flash  
(HDFlash) is a non-volatile memory that can be  
electrically erased as a single block or by individu-  
al sectors and programmed on a Byte-by-Byte ba-  
sis using an external V supply.  
PP  
The first two sectors have a fixed size of 4 Kbytes  
(see Figure 6). They are mapped in the upper part  
of the ST7 addressing space so the reset and in-  
terrupt vectors are located in Sector 0 (F000h-  
FFFFh).  
The HDFlash devices can be programmed and  
erased off-board (plugged in a programming tool)  
or on-board using ICP (In-Circuit Programming) or  
IAP (In-Application Programming).  
The array matrix organisation allows each sector  
to be erased and reprogrammed without affecting  
other sectors.  
Table 3. Sectors available in Flash devices  
Flash Size (bytes)  
Available Sectors  
4K  
8K  
Sector 0  
Sectors 0,1  
Sectors 0,1, 2  
4.2 Main Features  
Three Flash programming modes:  
> 8K  
– Insertion in a programming tool. In this mode,  
all sectors including option bytes can be pro-  
grammed or erased.  
4.3.1 Read-out Protection  
– ICP (In-Circuit Programming). In this mode, all  
sectors including option bytes can be pro-  
grammed or erased without removing the de-  
vice from the application board.  
– IAP (In-Application Programming) In this  
mode, all sectors except Sector 0, can be pro-  
grammed or erased without removing the de-  
vice from the application board and while the  
application is running.  
Read-out protection, when selected, provides a  
protection against Program Memory content ex-  
traction and against write access to Flash memo-  
ry. Even if no protection can be considered as to-  
tally unbreakable, the feature provides a very high  
level of protection for a general purpose microcon-  
troller.  
In flash devices, this protection is removed by re-  
programming the option. In this case, the entire  
program memory is first automatically erased.  
ICT (In-Circuit Testing) for downloading and  
executing user application test patterns in RAM  
Read-out protection  
Read-out protection selection depends on the de-  
vice type:  
Register Access Security System (RASS) to  
prevent accidental programming or erasing  
– In Flash devices it is enabled and removed  
through the FMP_R bit in the option byte.  
4.3 Structure  
– In ROM devices it is enabled by mask option  
specified in the Option List.  
The Flash memory is organised in sectors and can  
be used for both code and data storage.  
Figure 6. Memory Map and Sector Address  
4K  
8K  
10K  
16K  
24K  
32K  
48K  
60K  
FLASH  
MEMORY SIZE  
1000h  
3FFFh  
7FFFh  
9FFFh  
BFFFh  
D7FFh  
DFFFh  
EFFFh  
FFFFh  
SECTOR 2  
52 Kbytes  
2 Kbytes 8 Kbytes 16 Kbytes 24 Kbytes 40 Kbytes  
4 Kbytes  
4 Kbytes  
SECTOR 1  
SECTOR 0  
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ST7232A  
FLASH PROGRAM MEMORY (Cont’d)  
4.4 ICC Interface  
– ICCCLK: ICC output serial clock pin  
– ICCDATA: ICC input/output serial data pin  
ICC needs a minimum of 4 and up to 6 pins to be  
connected to the programming tool (see Figure 7).  
These pins are:  
– ICCSEL/V : programming voltage  
PP  
– OSC1(or OSCIN): main clock input for exter-  
nal source (optional)  
– RESET: device reset  
– V : application board power supply (option-  
DD  
– V : device power supply ground  
al, see Figure 7, Note 3)  
SS  
Figure 7. Typical ICC Interface  
PROGRAMMING TOOL  
ICC CONNECTOR  
ICC Cable  
APPLICATION BOARD  
ICC CONNECTOR  
(See Note 3)  
(See caution)  
HE10 CONNECTOR TYPE  
9
7
5
6
3
1
2
10  
8
4
APPLICATION  
RESET SOURCE  
See Note 2  
10kΩ  
APPLICATION  
POWER SUPPLY  
C
C
L2  
L1  
See Note 1  
APPLICATION  
I/O  
ST7  
Notes:  
1. If the ICCCLK or ICCDATA pins are only used  
classical RC network with R>1K or a reset man-  
agement IC with open drain output and pull-up re-  
sistor>1K, no additional components are needed.  
In all cases the user must ensure that no external  
reset is generated by the application during the  
ICC session.  
as outputs in the application, no signal isolation is  
necessary. As soon as the Programming Tool is  
plugged to the board, even if an ICC session is not  
in progress, the ICCCLK and ICCDATA pins are  
not available for the application. If they are used as  
inputs by the application, isolation such as a serial  
resistor has to implemented in case another de-  
vice forces the signal. Refer to the Programming  
Tool documentation for recommended resistor val-  
ues.  
3. The use of Pin 7 of the ICC connector depends  
on the Programming Tool architecture. This pin  
must be connected when using most ST Program-  
ming Tools (it is used to monitor the application  
power supply). Please refer to the Programming  
Tool manual.  
2. During the ICC session, the programming tool  
must control the RESET pin. This can lead to con-  
flicts between the programming tool and the appli-  
cation reset circuit if it drives more than 5mA at  
high level (push pull output or pull-up resistor<1K).  
A schottky diode can be used to isolate the appli-  
cation RESET circuit in this case. When using a  
Caution: External clock ICC entry mode is man-  
datory. Pin 9 must be connected to the OSC1 or  
OSCIN pin of the ST7 and OSC2 must be ground-  
ed.  
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ST7232A  
FLASH PROGRAM MEMORY (Cont’d)  
4.5 ICP (In-Circuit Programming)  
possible to download code from the SPI, SCI, USB  
or CAN interface and program it in the Flash. IAP  
mode can be used to program any of the Flash  
sectors except Sector 0, which is write/erase pro-  
tected to allow recovery in case errors occur dur-  
ing the programming operation.  
To perform ICP the microcontroller must be  
switched to ICC (In-Circuit Communication) mode  
by an external controller or programming tool.  
Depending on the ICP code downloaded in RAM,  
Flash memory programming can be fully custom-  
ized (number of bytes to program, program loca-  
tions, or selection serial communication interface  
for downloading).  
4.7 Related Documentation  
For details on Flash programming and ICC proto-  
col, refer to the ST7 Flash Programming Refer-  
ence Manual and to the ST7 ICC Protocol Refer-  
ence Manual.  
When using an STMicroelectronics or third-party  
programming tool that supports ICP and the spe-  
cific microcontroller device, the user needs only to  
implement the ICP hardware interface on the ap-  
plication board (see Figure 7). For more details on  
the pin locations, refer to the device pinout de-  
scription.  
4.7.1 Register Description  
FLASH CONTROL/STATUS REGISTER (FCSR)  
Read/Write  
Reset Value: 0000 0000 (00h)  
4.6 IAP (In-Application Programming)  
7
0
0
0
This mode uses a BootLoader program previously  
stored in Sector 0 by the user (in ICP mode or by  
plugging the device in a programming tool).  
0
0
0
0
0
0
This mode is fully controlled by user software. This  
allows it to be adapted to the user application, (us-  
er-defined strategy for entering programming  
mode, choice of communications protocol used to  
fetch the data to be stored, etc.). For example, it is  
This register is reserved for use by Programming  
Tool software. It controls the Flash programming  
and erasing operations.  
Table 4. Flash Control/Status Register Address and Reset Value  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
FCSR  
Reset Value  
0029h  
0
0
0
0
0
0
0
0
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ST7232A  
5 CENTRAL PROCESSING UNIT  
5.1 INTRODUCTION  
5.3 CPU REGISTERS  
This CPU has a full 8-bit architecture and contains  
six internal registers allowing efficient 8-bit data  
manipulation.  
The 6 CPU registers shown in Figure 8 are not  
present in the memory mapping and are accessed  
by specific instructions.  
Accumulator (A)  
5.2 MAIN FEATURES  
The Accumulator is an 8-bit general purpose reg-  
ister used to hold operands and the results of the  
arithmetic and logic calculations and to manipulate  
data.  
Enable executing 63 basic instructions  
Fast 8-bit by 8-bit multiply  
17 main addressing modes (with indirect  
Index Registers (X and Y)  
addressing mode)  
These 8-bit registers are used to create effective  
addresses or as temporary storage areas for data  
manipulation. (The Cross-Assembler generates a  
precede instruction (PRE) to indicate that the fol-  
lowing instruction refers to the Y register.)  
Two 8-bit index registers  
16-bit stack pointer  
Low power HALT and WAIT modes  
Priority maskable hardware interrupts  
Non-maskable software/hardware interrupts  
The Y register is not affected by the interrupt auto-  
matic procedures.  
Program Counter (PC)  
The program counter is a 16-bit register containing  
the address of the next instruction to be executed  
by the CPU. It is made of two 8-bit registers PCL  
(Program Counter Low which is the LSB) and PCH  
(Program Counter High which is the MSB).  
Figure 8. CPU Registers  
7
0
ACCUMULATOR  
RESET VALUE = XXh  
7
0
0
X INDEX REGISTER  
Y INDEX REGISTER  
RESET VALUE = XXh  
7
RESET VALUE = XXh  
PCL  
PCH  
7
8
15  
0
PROGRAM COUNTER  
RESET VALUE = RESET VECTOR @ FFFEh-FFFFh  
7
1
0
1
1
I1 H I0 N Z C  
CONDITION CODE REGISTER  
RESET VALUE =  
8
1
1
X 1 X X X  
0
15  
7
STACK POINTER  
RESET VALUE = STACK HIGHER ADDRESS  
X = Undefined Value  
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ST7232A  
CENTRAL PROCESSING UNIT (Cont’d)  
Condition Code Register (CC)  
Read/Write  
Bit 1 = Z Zero.  
This bit is set and cleared by hardware. This bit in-  
dicates that the result of the last arithmetic, logical  
or data manipulation is zero.  
0: The result of the last operation is different from  
zero.  
1: The result of the last operation is zero.  
Reset Value: 111x1xxx  
7
0
1
1
I1  
H
I0  
N
Z
C
This bit is accessed by the JREQ and JRNE test  
instructions.  
The 8-bit Condition Code register contains the in-  
terrupt masks and four flags representative of the  
result of the instruction just executed. This register  
can also be handled by the PUSH and POP in-  
structions.  
Bit 0 = C Carry/borrow.  
This bit is set and cleared by hardware and soft-  
ware. It indicates an overflow or an underflow has  
occurred during the last arithmetic operation.  
0: No overflow or underflow has occurred.  
1: An overflow or underflow has occurred.  
These bits can be individually tested and/or con-  
trolled by specific instructions.  
Arithmetic Management Bits  
This bit is driven by the SCF and RCF instructions  
and tested by the JRC and JRNC instructions. It is  
also affected by the “bit test and branch”, shift and  
rotate instructions.  
Bit 4 = H Half carry.  
This bit is set by hardware when a carry occurs be-  
tween bits 3 and 4 of the ALU during an ADD or  
ADC instructions. It is reset by hardware during  
the same instructions.  
Interrupt Management Bits  
Bit 5,3 = I1, I0 Interrupt  
0: No half carry has occurred.  
1: A half carry has occurred.  
The combination of the I1 and I0 bits gives the cur-  
rent interrupt software priority.  
This bit is tested using the JRH or JRNH instruc-  
tion. The H bit is useful in BCD arithmetic subrou-  
tines.  
Interrupt Software Priority  
Level 0 (main)  
I1  
1
0
0
1
I0  
0
1
0
1
Level 1  
Bit 2 = N Negative.  
Level 2  
This bit is set and cleared by hardware. It is repre-  
sentative of the result sign of the last arithmetic,  
logical or data manipulation. It’s a copy of the re-  
Level 3 (= interrupt disable)  
These two bits are set/cleared by hardware when  
entering in interrupt. The loaded value is given by  
the corresponding bits in the interrupt software pri-  
ority registers (IxSPR). They can be also set/  
cleared by software with the RIM, SIM, IRET,  
HALT, WFI and PUSH/POP instructions.  
th  
sult 7 bit.  
0: The result of the last operation is positive or null.  
1: The result of the last operation is negative  
(i.e. the most significant bit is a logic 1).  
This bit is accessed by the JRMI and JRPL instruc-  
tions.  
See the interrupt management chapter for more  
details.  
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ST7232A  
CENTRAL PROCESSING UNIT (Cont’d)  
Stack Pointer (SP)  
Read/Write  
The least significant byte of the Stack Pointer  
(called S) can be directly accessed by a LD in-  
struction.  
Reset Value: 01 FFh  
Note: When the lower limit is exceeded, the Stack  
Pointer wraps around to the stack upper limit, with-  
out indicating the stack overflow. The previously  
stored information is then overwritten and there-  
fore lost. The stack also wraps in case of an under-  
flow.  
15  
8
1
0
7
0
0
0
0
0
0
0
The stack is used to save the return address dur-  
ing a subroutine call and the CPU context during  
an interrupt. The user may also directly manipulate  
the stack by means of the PUSH and POP instruc-  
tions. In the case of an interrupt, the PCL is stored  
at the first location pointed to by the SP. Then the  
other registers are stored in the next locations as  
shown in Figure 9.  
SP7  
SP6  
SP5  
SP4  
SP3  
SP2  
SP1  
SP0  
The Stack Pointer is a 16-bit register which is al-  
ways pointing to the next free location in the stack.  
It is then decremented after data has been pushed  
onto the stack and incremented before data is  
popped from the stack (see Figure 9).  
– When an interrupt is received, the SP is decre-  
mented and the context is pushed on the stack.  
Since the stack is 256 bytes deep, the 8 most sig-  
nificant bits are forced by hardware. Following an  
MCU Reset, or after a Reset Stack Pointer instruc-  
tion (RSP), the Stack Pointer contains its reset val-  
ue (the SP7 to SP0 bits are set) which is the stack  
higher address.  
– On return from interrupt, the SP is incremented  
and the context is popped from the stack.  
A subroutine call occupies two locations and an in-  
terrupt five locations in the stack area.  
Figure 9. Stack Manipulation Example  
CALL  
Subroutine  
RET  
or RSP  
PUSH Y  
POP Y  
IRET  
Interrupt  
Event  
@ 0100h  
SP  
SP  
SP  
Y
CC  
A
CC  
A
CC  
A
X
X
X
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
PCH  
PCL  
SP  
SP  
PCH  
PCL  
PCH  
PCL  
SP  
@ 01FFh  
Stack Higher Address = 01FFh  
0100h  
Stack Lower Address =  
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ST7232A  
6 SUPPLY, RESET AND CLOCK MANAGEMENT  
The device includes a range of utility features for  
securing the application in critical situations (for  
example in case of a power brown-out), and re-  
ducing the number of external components. An  
overview is shown in Figure 11.  
the frequency by two to obtain an f  
of 4 to 8  
OSC2  
MHz. The PLL is enabled by option byte. If the PLL  
is disabled, then f /2.  
f
OSC2 = OSC  
Caution: The PLL is not recommended for appli-  
cations where timing accuracy is required.  
For more details, refer to dedicated parametric  
section.  
Figure 10. PLL Block Diagram  
Main features  
Optional PLL for multiplying the frequency by 2  
Reset Sequence Manager (RSM)  
Multi-Oscillator Clock Management (MO)  
– 5 Crystal/Ceramic resonator oscillators  
PLL x 2  
/ 2  
0
1
f
OSC  
f
OSC2  
PLL OPTION BIT  
6.1 PHASE LOCKED LOOP  
If the clock frequency input to the PLL is in the  
range 2 to 4 MHz, the PLL can be used to multiply  
Figure 11. Clock, Reset and Supply Block Diagram  
MAIN CLOCK  
CONTROLLER  
WITH REALTIME  
MULTI-  
f
OSC2  
f
f
CPU  
OSC2  
OSC  
PLL  
(option)  
OSCILLATOR  
(MO)  
OSC1  
CLOCK (MCC/RTC)  
SYSTEM INTEGRITY MANAGEMENT  
RESET SEQUENCE  
MANAGER  
WATCHDOG  
TIMER (WDG)  
RESET  
SICSR  
WDG  
RF  
(RSM)  
0
0
0
0
V
V
SS  
DD  
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ST7232A  
6.2 MULTI-OSCILLATOR (MO)  
The main clock of the ST7 can be generated by  
two different source types coming from the multi-  
oscillator block:  
an external source  
4 crystal or ceramic resonator oscillators  
the frequency ranges). In this mode of the multi-  
oscillator, the resonator and the load capacitors  
have to be placed as close as possible to the oscil-  
lator pins in order to minimize output distortion and  
start-up stabilization time. The loading capaci-  
tance values must be adjusted according to the  
selected oscillator.  
Each oscillator is optimized for a given frequency  
range in terms of consumption and is selectable  
through the option byte. The associated hardware  
configurations are shown in Table 5. Refer to the  
electrical characteristics section for more details.  
These oscillators are not stopped during the  
RESET phase to avoid losing time in the oscillator  
start-up phase.  
Table 5. ST7 Clock Sources  
Hardware Configuration  
Caution: The OSC1 and/or OSC2 pins must not  
be left unconnected. For the purposes of Failure  
Mode and Effect Analysis, it should be noted that if  
the OSC1 and/or OSC2 pins are left unconnected,  
the ST7 main oscillator may start and, in this con-  
ST7  
figuration, could generate an f  
clock frequency  
OSC  
OSC1  
OSC2  
in excess of the allowed maximum (>16MHz.),  
putting the ST7 in an unsafe/undefined state. The  
product behaviour must therefore be considered  
undefined when the OSC pins are left unconnect-  
ed.  
EXTERNAL  
SOURCE  
External Clock Source  
In this external clock mode, a clock signal (square,  
sinus or triangle) with ~50% duty cycle has to drive  
the OSC1 pin while the OSC2 pin is tied to ground.  
ST7  
OSC1  
OSC2  
Crystal/Ceramic Oscillators  
This family of oscillators has the advantage of pro-  
ducing a very accurate rate on the main clock of  
the ST7. The selection within a list of 4 oscillators  
with different frequency ranges has to be done by  
option byte in order to reduce consumption (refer  
to Section 14.1 on page 145 for more details on  
C
C
L2  
L1  
LOAD  
CAPACITORS  
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ST7232A  
6.3 RESET SEQUENCE MANAGER (RSM)  
6.3.1 Introduction  
The RESET vector fetch phase duration is 2 clock  
cycles.  
The reset sequence manager includes two RE-  
SET sources as shown in Figure 13:  
External RESET source pulse  
Internal WATCHDOG RESET  
Figure 12. RESET Sequence Phases  
RESET  
These sources act on the RESET pin and it is al-  
ways kept low during the delay phase.  
INTERNAL RESET  
256 or 4096 CLOCK CYCLES  
FETCH  
VECTOR  
Active Phase  
The RESET service routine vector is fixed at ad-  
dresses FFFEh-FFFFh in the ST7 memory map.  
The basic RESET sequence consists of 3 phases  
as shown in Figure 12:  
Active Phase depending on the RESET source  
256 or 4096 CPU clock cycle delay (selected by  
option byte)  
RESET vector fetch  
6.3.2 Asynchronous External RESET pin  
The RESET pin is both an input and an open-drain  
output with integrated R  
weak pull-up resistor.  
ON  
This pull-up has no fixed value but varies in ac-  
cordance with the input voltage. It can be pulled  
low by external circuitry to reset the device. See  
Electrical Characteristic section for more details.  
The 256 or 4096 CPU clock cycle delay allows the  
oscillator to stabilise and ensures that recovery  
has taken place from the Reset state. The shorter  
or longer clock cycle delay should be selected by  
option byte to correspond to the stabilization time  
of the external oscillator used in the application.  
A RESET signal originating from an external  
source must have a duration of at least t  
in  
h(RSTL)in  
order to be recognized (see Figure 14). This de-  
tection is asynchronous and therefore the MCU  
can enter reset state even in HALT mode.  
Figure 13. Reset Block Diagram  
V
DD  
R
ON  
INTERNAL  
RESET  
Filter  
RESET  
PULSE  
WATCHDOG RESET  
GENERATOR  
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ST7232A  
RESET SEQUENCE MANAGER (Cont’d)  
The RESET pin is an asynchronous signal which  
plays a major role in EMS performance. In a noisy  
environment, it is recommended to follow the  
guidelines mentioned in the electrical characteris-  
tics section.  
A proper reset signal for a slow rising V supply  
can generally be provided by an external RC net-  
work connected to the RESET pin.  
DD  
6.3.4 Internal Watchdog RESET  
The RESET sequence generated by a internal  
Watchdog counter overflow is shown in Figure 14.  
6.3.3 External Power-On RESET  
To start up the microcontroller correctly, the user  
must ensure by means of an external reset circuit  
Starting from the Watchdog counter underflow, the  
device RESET pin acts as an output that is pulled  
that the reset signal is held low until V  
the minimum level specified for the selected f  
frequency.  
is over  
DD  
low during at least t  
.
w(RSTL)out  
OSC  
Figure 14. RESET Sequences  
EXTERNAL  
RESET  
WATCHDOG  
RESET  
RUN  
RUN  
RUN  
ACTIVE  
ACTIVE  
PHASE  
PHASE  
t
w(RSTL)out  
t
h(RSTL)in  
EXTERNAL  
RESET  
SOURCE  
RESET PIN  
WATCHDOG  
RESET  
WATCHDOG UNDERFLOW  
INTERNAL RESET (256 or 4096 TCPU  
VECTOR FETCH  
)
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ST7232A  
6.4 SYSTEM INTEGRITY MANAGEMENT  
6.4.1 Register Description  
SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)  
Read/Write  
Reset Value: 0000 000x (00h)  
Bit 0 = WDGRF Watchdog reset flag  
This bit indicates that the last Reset was generat-  
ed by the Watchdog peripheral. It is set by hard-  
ware (watchdog reset) and cleared by software  
(writing zero).  
7
0
WDG  
RF  
0
0
0
0
0
0
0
Bits 7:1 = Reserved, must be kept cleared.  
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ST7232A  
7 INTERRUPTS  
7.1 INTRODUCTION  
When an interrupt request has to be serviced:  
– Normal processing is suspended at the end of  
the current instruction execution.  
– The PC, X, A and CC registers are saved onto  
the stack.  
– I1 and I0 bits of CC register are set according to  
the corresponding values in the ISPRx registers  
of the serviced interrupt vector.  
– The PC is then loaded with the interrupt vector of  
the interrupt to service and the first instruction of  
the interrupt service routine is fetched (refer to  
“Interrupt Mapping” table for vector addresses).  
The ST7 enhanced interrupt management pro-  
vides the following features:  
Hardware interrupts  
Software interrupt (TRAP)  
Nested or concurrent interrupt management  
with flexible interrupt priority and level  
management:  
– Up to 4 software programmable nesting levels  
– Up to 16 interrupt vectors fixed by hardware  
– 2 non maskable events: RESET, TRAP  
This interrupt management is based on:  
The interrupt service routine should end with the  
IRET instruction which causes the contents of the  
saved registers to be recovered from the stack.  
– Bit 5 and bit 3 of the CPU CC register (I1:0),  
– Interrupt software priority registers (ISPRx),  
– Fixed interrupt vector addresses located at the  
high addresses of the memory map (FFE0h to  
FFFFh) sorted by hardware priority order.  
Note: As a consequence of the IRET instruction,  
the I1 and I0 bits will be restored from the stack  
and the program in the previous level will resume.  
This enhanced interrupt controller guarantees full  
upward compatibility with the standard (not nest-  
ed) ST7 interrupt controller.  
Table 6. Interrupt Software Priority Levels  
Interrupt software priority Level  
I1  
1
I0  
0
Level 0 (main)  
Level 1  
Low  
7.2 MASKING AND PROCESSING FLOW  
0
1
Level 2  
0
0
The interrupt masking is managed by the I1 and I0  
bits of the CC register and the ISPRx registers  
which give the interrupt software priority level of  
each interrupt vector (see Table 6). The process-  
ing flow is shown in Figure 15  
Level 3 (= interrupt disable)  
High  
1
1
Figure 15. Interrupt Processing Flowchart  
PENDING  
INTERRUPT  
Y
Y
RESET  
TRAP  
N
Interrupt has the same or a  
lower software priority  
than current one  
N
I1:0  
FETCH NEXT  
INSTRUCTION  
THE INTERRUPT  
STAYS PENDING  
Y
“IRET”  
N
RESTORE PC, X, A, CC  
FROM STACK  
EXECUTE  
INSTRUCTION  
STACK PC, X, A, CC  
LOAD I1:0 FROM INTERRUPT SW REG.  
LOAD PC FROM INTERRUPT VECTOR  
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ST7232A  
INTERRUPTS (Cont’d)  
Servicing Pending Interrupts  
vector is loaded in the PC register and the I1 and  
I0 bits of the CC are set to disable interrupts (level  
3). These sources allow the processor to exit  
HALT mode.  
As several interrupts can be pending at the same  
time, the interrupt to be taken into account is deter-  
mined by the following two-step process:  
TRAP (Non Maskable Software Interrupt)  
– the highest software priority interrupt is serviced,  
This software interrupt is serviced when the TRAP  
instruction is executed. It will be serviced accord-  
ing to the flowchart in Figure 15.  
– if several interrupts have the same software pri-  
ority then the interrupt with the highest hardware  
priority is serviced first.  
RESET  
Figure 16 describes this decision process.  
The RESET source has the highest priority in the  
ST7. This means that the first current routine has  
the highest software priority (level 3) and the high-  
est hardware priority.  
Figure 16. Priority Decision Process  
PENDING  
INTERRUPTS  
See the RESET chapter for more details.  
Maskable Sources  
Maskable interrupt vector sources can be serviced  
if the corresponding interrupt is enabled and if its  
own interrupt software priority (in ISPRx registers)  
is higher than the one currently being serviced (I1  
and I0 in CC register). If any of these two condi-  
tions is false, the interrupt is latched and thus re-  
mains pending.  
Different  
Same  
SOFTWARE  
PRIORITY  
HIGHEST SOFTWARE  
PRIORITY SERVICED  
External Interrupts  
HIGHEST HARDWARE  
PRIORITY SERVICED  
External interrupts allow the processor to exit from  
HALT low power mode. External interrupt sensitiv-  
ity is software selectable through the External In-  
terrupt Control register (EICR).  
External interrupt triggered on edge will be latched  
and the interrupt request automatically cleared  
upon entering the interrupt service routine.  
If several input pins of a group connected to the  
same interrupt line are selected simultaneously,  
these will be logically ORed.  
When an interrupt request is not serviced immedi-  
ately, it is latched and then processed when its  
software priority combined with the hardware pri-  
ority becomes the highest one.  
Note 1: The hardware priority is exclusive while  
the software one is not. This allows the previous  
process to succeed with only one interrupt.  
Note 2: RESET and TRAP can be considered as  
having the highest software priority in the decision  
process.  
Peripheral Interrupts  
Usually the peripheral interrupts cause the MCU to  
exit from HALT mode except those mentioned in  
the “Interrupt Mapping” table. A peripheral inter-  
rupt occurs when a specific flag is set in the pe-  
ripheral status registers and if the corresponding  
enable bit is set in the peripheral control register.  
The general sequence for clearing an interrupt is  
based on an access to the status register followed  
by a read or write to an associated register.  
Note: The clearing sequence resets the internal  
latch. A pending interrupt (i.e. waiting for being  
serviced) will therefore be lost if the clear se-  
quence is executed.  
Different Interrupt Vector Sources  
Two interrupt source types are managed by the  
ST7 interrupt controller: the non-maskable type  
(RESET,TRAP) and the maskable type (external  
or from internal peripherals).  
Non-Maskable Sources  
These sources are processed regardless of the  
state of the I1 and I0 bits of the CC register (see  
Figure 15). After stacking the PC, X, A and CC  
registers (except for RESET), the corresponding  
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ST7232A  
INTERRUPTS (Cont’d)  
7.3 INTERRUPTS AND LOW POWER MODES  
7.4 CONCURRENT & NESTED MANAGEMENT  
All interrupts allow the processor to exit the WAIT  
low power mode. On the contrary, only external  
and other specified interrupts allow the processor  
to exit from the HALT modes (see column “Exit  
from HALT” in “Interrupt Mapping” table). When  
several pending interrupts are present while exit-  
ing HALT mode, the first one serviced can only be  
an interrupt with exit from HALT mode capability  
and it is selected through the same decision proc-  
ess shown in Figure 16.  
The following Figure 17 and Figure 18 show two  
different interrupt management modes. The first is  
called concurrent mode and does not allow an in-  
terrupt to be interrupted, unlike the nested mode in  
Figure 18. The interrupt hardware priority is given  
in this order from the lowest to the highest: MAIN,  
IT4, IT3, IT2, IT1, IT0. The software priority is giv-  
en for each interrupt.  
Warning: A stack overflow may occur without no-  
tifying the software of the failure.  
Note: If an interrupt, that is not able to Exit from  
HALT mode, is pending with the highest priority  
when exiting HALT mode, this interrupt is serviced  
after the first one serviced.  
Figure 17. Concurrent Interrupt Management  
SOFTWARE  
PRIORITY  
I1  
I0  
LEVEL  
TRAP  
3
1 1  
1 1  
1 1  
1 1  
1 1  
1 1  
IT0  
3
IT1  
IT1  
3
IT2  
3
IT3  
3
RIM  
IT4  
3
MAIN  
MAIN  
3/0  
11 / 10  
10  
Figure 18. Nested Interrupt Management  
SOFTWARE  
PRIORITY  
LEVEL  
I1  
I0  
TRAP  
3
1 1  
1 1  
0 0  
0 1  
1 1  
1 1  
IT0  
3
IT1  
IT1  
IT2  
2
IT2  
1
IT3  
3
RIM  
IT4  
IT4  
3
MAIN  
MAIN  
3/0  
11 / 10  
10  
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ST7232A  
INTERRUPTS (Cont’d)  
7.5 INTERRUPT REGISTER DESCRIPTION  
CPU CC REGISTER INTERRUPT BITS  
Read/Write  
INTERRUPT SOFTWARE PRIORITY REGIS-  
TERS (ISPRX)  
Reset Value: 111x 1010 (xAh)  
Read/Write (bit 7:4 of ISPR3 are read only)  
7
0
Reset Value: 1111 1111 (FFh)  
7
0
1
1
I1  
H
I0  
N
Z
C
ISPR0  
ISPR1  
I1_3 I0_3 I1_2 I0_2 I1_1 I0_1 I1_0 I0_0  
I1_7 I0_7 I1_6 I0_6 I1_5 I0_5 I1_4 I0_4  
Bit 5, 3 = I1, I0 Software Interrupt Priority  
These two bits indicate the current interrupt soft-  
ware priority.  
ISPR2 I1_11 I0_11 I1_10 I0_10 I1_9 I0_9 I1_8 I0_8  
Interrupt Software Priority Level  
I1  
1
I0  
0
Level 0 (main)  
Level 1  
Low  
ISPR3  
1
1
1
1
I1_13 I0_13 I1_12 I0_12  
0
1
Level 2  
0
0
These four registers contain the interrupt software  
priority of each interrupt vector.  
Level 3 (= interrupt disable*)  
High  
1
1
These two bits are set/cleared by hardware when  
entering in interrupt. The loaded value is given by  
the corresponding bits in the interrupt software pri-  
ority registers (ISPRx).  
– Each interrupt vector (except RESET and TRAP)  
has corresponding bits in these registers where  
its own software priority is stored. This corre-  
spondance is shown in the following table.  
They can be also set/cleared by software with the  
RIM, SIM, HALT, WFI, IRET and PUSH/POP in-  
structions (see “Interrupt Dedicated Instruction  
Set” table).  
Vector address  
ISPRx bits  
FFFBh-FFFAh  
FFF9h-FFF8h  
...  
I1_0 and I0_0 bits*  
I1_1 and I0_1 bits  
...  
*Note: TRAP and RESET events can interrupt a  
level 3 program.  
FFE1h-FFE0h  
I1_13 and I0_13 bits  
– Each I1_x and I0_x bit value in the ISPRx regis-  
ters has the same meaning as the I1 and I0 bits  
in the CC register.  
– Level 0 can not be written (I1_x=1, I0_x=0). In  
this case, the previously stored value is kept. (ex-  
ample: previous=CFh, write=64h, result=44h)  
The RESET, and TRAP vectors have no software  
priorities. When one is serviced, the I1 and I0 bits  
of the CC register are both set.  
Caution: If the I1_x and I0_x bits are modified  
while the interrupt x is executed the following be-  
haviour has to be considered: If the interrupt x is  
still pending (new interrupt or flag not cleared) and  
the new software priority is higher than the previ-  
ous one, the interrupt x is re-entered. Otherwise,  
the software priority stays unchanged up to the  
next interrupt request (after the IRET of the inter-  
rupt x).  
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ST7232A  
INTERRUPTS (Cont’d)  
Table 7. Dedicated Interrupt Instruction Set  
Instruction  
New Description  
Entering Halt mode  
Function/Example  
I1  
H
I0  
N
Z
C
HALT  
IRET  
JRM  
1
0
Interrupt routine return  
Jump if I1:0=11 (level 3)  
Jump if I1:0<>11  
Pop CC, A, X, PC  
I1:0=11 ?  
I1  
H
I0  
N
Z
C
JRNM  
POP CC  
RIM  
I1:0<>11 ?  
Pop CC from the Stack  
Enable interrupt (level 0 set)  
Disable interrupt (level 3 set)  
Software trap  
Mem => CC  
I1  
1
H
I0  
0
1
1
0
N
Z
C
Load 10 in I1:0 of CC  
Load 11 in I1:0 of CC  
Software NMI  
SIM  
1
TRAP  
WFI  
1
Wait for interrupt  
1
Note: During the execution of an interrupt routine, the HALT, POPCC, RIM, SIM and WFI instructions change the current  
software priority up to the next IRET instruction or one of the previously mentioned instructions.  
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ST7232A  
INTERRUPTS (Cont’d)  
Table 8. Interrupt Mapping  
Exit  
from  
ACTIVE  
HALT  
Exit  
from  
HALT  
Source  
Block  
Register Priority  
Address  
Vector  
N°  
Description  
Label  
Order  
RESET  
TRAP  
Reset  
Software interrupt  
Not used  
yes  
no  
yes  
no  
FFFEh-FFFFh  
FFFCh-FFFDh  
FFFAh-FFFBh  
N/A  
0
1
Main clock controller time base inter-  
rupt  
MCC/RTC  
MCCSR  
N/A  
yes  
yes  
FFF8h-FFF9h  
Higher  
Priority  
2
3
ei0  
ei1  
ei2  
ei3  
External interrupt port A3..0  
External interrupt port F2..0  
External interrupt port B3..0  
External interrupt port B7..4  
Not used  
yes  
yes  
yes  
yes  
no  
no  
no  
no  
FFF6h-FFF7h  
FFF4h-FFF5h  
FFF2h-FFF3h  
FFF0h-FFF1h  
FFEEh-FFEFh  
FFECh-FFEDh  
FFEAh-FFEBh  
FFE8h-FFE9h  
FFE6h-FFE7h  
FFE4h-FFE5h  
4
5
6
1)  
7
SPI  
SPI peripheral interrupts  
TIMER A peripheral interrupts  
TIMER B peripheral interrupts  
SCI Peripheral interrupts  
Not used  
SPICSR  
TASR  
yes  
no  
no  
no  
no  
8
TIMER A  
TIMER B  
SCI  
no  
no  
no  
9
TBSR  
10  
11  
SCISR  
Lower  
Priority  
Note 1: Unexpected exit from HALT may occur when SPI is in slave mode.  
7.6 EXTERNAL INTERRUPTS  
7.6.1 I/O Port Interrupt Sensitivity  
Falling edge and low level  
Rising edge and high level (only for ei0 and ei2)  
The external interrupt sensitivity is controlled by  
the IPA, IPB and ISxx bits of the EICR register  
(Figure 19). This control allows to have up to 4 fully  
independent external interrupt source sensitivities.  
To guarantee correct functionality, the sensitivity  
bits in the EICR register can be modified only  
when the I1 and I0 bits of the CC register are both  
set to 1 (level 3). This means that interrupts must  
be disabled before changing sensitivity.  
Each external interrupt source can be generated  
on four (or five) different events on the pin:  
Falling edge  
Rising edge  
Falling and rising edge  
The pending interrupts are cleared by writing a dif-  
ferent value in the ISx[1:0], IPA or IPB bits of the  
EICR.  
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ST7232A  
Figure 19. External Interrupt Control bits  
EICR  
IS20 IS21  
PORT A3 INTERRUPT  
PAOR.3  
PADDR.3  
ei0 INTERRUPT SOURCE  
SENSITIVITY  
CONTROL  
PA3  
IPA BIT  
EICR  
PORT F [2:0] INTERRUPTS  
IS20  
IS21  
PFOR.2  
PFDDR.2  
SENSITIVITY  
CONTROL  
PF2  
PF1  
PF0  
ei1 INTERRUPT SOURCE  
PF2  
EICR  
PORT B [3:0] INTERRUPTS  
IS10  
IS11  
PBOR.3  
PBDDR.3  
SENSITIVITY  
CONTROL  
PB3  
PB2  
PB1  
PB0  
PB3  
ei2 INTERRUPT SOURCE  
IPB BIT  
EICR  
PORT B [7:4] INTERRUPTS  
IS10  
IS11  
PBOR.7  
PBDDR.7  
SENSITIVITY  
CONTROL  
PB7  
PB6  
PB5  
PB4  
ei3 INTERRUPT SOURCE  
PB7  
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ST7232A  
INTERRUPTS (Cont’d)  
7.7 EXTERNAL INTERRUPT CONTROL REGISTER (EICR)  
Read/Write  
Bit 4:3 = IS2[1:0] ei0 and ei1 sensitivity  
The interrupt sensitivity, defined using the IS2[1:0]  
bits, is applied to the following external interrupts:  
Reset Value: 0000 0000 (00h)  
7
0
0
IS11 IS10 IPB IS21 IS20 IPA  
0
- ei0 (port A3..0)  
Bit 7:6 = IS1[1:0] ei2 and ei3 sensitivity  
The interrupt sensitivity, defined using the IS1[1:0]  
bits, is applied to the following external interrupts:  
- ei2 (port B3..0)  
External Interrupt Sensitivity  
IS21 IS20  
IPA bit =0  
IPA bit =1  
Falling edge &  
low level  
Rising edge  
& high level  
0
0
External Interrupt Sensitivity  
IS11 IS10  
0
1
1
1
0
1
Rising edge only  
Falling edge only  
Falling edge only  
Rising edge only  
IPB bit =0  
IPB bit =1  
Falling edge &  
low level  
Rising edge  
& high level  
0
0
Rising and falling edge  
0
1
1
1
0
1
Rising edge only  
Falling edge only  
Falling edge only  
Rising edge only  
- ei1 (port F2..0)  
Rising and falling edge  
IS21 IS20  
External Interrupt Sensitivity  
- ei3 (port B4)  
0
0
1
1
0
1
0
1
Falling edge & low level  
Rising edge only  
IS11 IS10  
External Interrupt Sensitivity  
0
0
1
1
0
1
0
1
Falling edge & low level  
Rising edge only  
Falling edge only  
Rising and falling edge  
Falling edge only  
These 2 bits can be written only when I1 and I0 of  
the CC register are both set to 1 (level 3).  
Rising and falling edge  
These 2 bits can be written only when I1 and I0 of  
the CC register are both set to 1 (level 3).  
Bit 2 = IPA Interrupt polarity for port A  
This bit is used to invert the sensitivity of the port A  
[3:0] external interrupts. It can be set and cleared  
by software only when I1 and I0 of the CC register  
are both set to 1 (level 3).  
Bit 5 = IPB Interrupt polarity for port B  
This bit is used to invert the sensitivity of the port B  
[3:0] external interrupts. It can be set and cleared  
by software only when I1 and I0 of the CC register  
are both set to 1 (level 3).  
0: No sensitivity inversion  
1: Sensitivity inversion  
0: No sensitivity inversion  
1: Sensitivity inversion  
Bits 1:0 = Reserved, must always be kept cleared.  
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ST7232A  
INTERRUPTS (Cont’d)  
Table 9. Nested Interrupts Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
ei1  
SPI  
ei0  
MCC + SI  
0024h  
0025h  
0026h  
I1_3  
1
I0_3  
1
I1_2  
1
I0_2  
1
I1_1  
1
I0_1  
1
ISPR0  
Reset Value  
1
1
ei3  
ei2  
I1_7  
1
I0_7  
1
I1_6  
1
I0_6  
1
I1_5  
1
I0_5  
1
I1_4  
1
I0_4  
1
ISPR1  
Reset Value  
AVD  
SCI  
TIMER B  
TIMER A  
I1_11  
1
I0_11  
1
I1_10  
1
I0_10  
1
I1_9  
I0_9  
1
I1_8  
1
I0_8  
1
ISPR2  
Reset Value  
1
0027h  
0028h  
I1_13  
1
I0_13  
1
I1_12  
1
I0_12  
1
ISPR3  
Reset Value  
1
1
1
1
EICR  
Reset Value  
IS11  
0
IS10  
0
IPB  
0
IS21  
0
IS20  
0
IPA  
0
0
0
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ST7232A  
8 POWER SAVING MODES  
8.1 INTRODUCTION  
8.2 SLOW MODE  
To give a large measure of flexibility to the applica-  
tion in terms of power consumption, four main  
power saving modes are implemented in the ST7  
(see Figure 20): SLOW, WAIT (SLOW WAIT), AC-  
TIVE HALT and HALT.  
This mode has two targets:  
– To reduce power consumption by decreasing the  
internal clock in the device,  
– To adapt the internal clock frequency (f  
the available supply voltage.  
) to  
CPU  
After a RESET the normal operating mode is se-  
lected by default (RUN mode). This mode drives  
the device (CPU and embedded peripherals) by  
means of a master clock which is based on the  
main oscillator frequency divided or multiplied by 2  
SLOW mode is controlled by three bits in the  
MCCSR register: the SMS bit which enables or  
disables Slow mode and two CPx bits which select  
the internal slow frequency (f  
).  
CPU  
(f  
).  
In this mode, the master clock frequency (f  
)
OSC2  
OSC2  
can be divided by 2, 4, 8 or 16. The CPU and pe-  
ripherals are clocked at this lower frequency  
CPU  
From RUN mode, the different power saving  
modes may be selected by setting the relevant  
register bits or by calling the specific ST7 software  
instruction whose action depends on the oscillator  
status.  
(f  
).  
Note: SLOW-WAIT mode is activated when enter-  
ing the WAIT mode while the device is already in  
SLOW mode.  
Figure 20. Power Saving Mode Transitions  
Figure 21. SLOW Mode Clock Transitions  
High  
RUN  
f
/2  
f
/4  
f
OSC2  
OSC2  
OSC2  
f
CPU  
f
OSC2  
SLOW  
WAIT  
00  
01  
CP1:0  
SMS  
SLOW WAIT  
ACTIVE HALT  
HALT  
NORMAL RUN MODE  
REQUEST  
NEW SLOW  
FREQUENCY  
REQUEST  
Low  
POWER CONSUMPTION  
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POWER SAVING MODES (Cont’d)  
8.3 WAIT MODE  
Figure 22. WAIT Mode Flow-chart  
WAIT mode places the MCU in a low power con-  
sumption mode by stopping the CPU.  
This power saving mode is selected by calling the  
‘WFI’ instruction.  
OSCILLATOR  
PERIPHERALS  
CPU  
I[1:0] BITS  
ON  
ON  
OFF  
10  
WFI INSTRUCTION  
All peripherals remain active. During WAIT mode,  
the I[1:0] bits of the CC register are forced to ‘10’,  
to enable all interrupts. All other registers and  
memory remain unchanged. The MCU remains in  
WAIT mode until an interrupt or RESET occurs,  
whereupon the Program Counter branches to the  
starting address of the interrupt or Reset service  
routine.  
N
RESET  
Y
N
INTERRUPT  
The MCU will remain in WAIT mode until a Reset  
or an Interrupt occurs, causing it to wake up.  
Y
OSCILLATOR  
PERIPHERALS  
CPU  
I[1:0] BITS  
ON  
OFF  
ON  
10  
Refer to Figure 22.  
256 OR 4096 CPU CLOCK  
CYCLE DELAY  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
ON  
ON  
I[1:0] BITS  
XX 1)  
FETCH RESET VECTOR  
OR SERVICE INTERRUPT  
Note:  
1. Before servicing an interrupt, the CC register is  
pushed on the stack. The I[1:0] bits of the CC reg-  
ister are set to the current software priority level of  
the interrupt routine and recovered when the CC  
register is popped.  
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ST7232A  
POWER SAVING MODES (Cont’d)  
8.4 ACTIVE-HALT AND HALT MODES  
pending on option byte). Otherwise, the ST7 en-  
ters HALT mode for the remaining t  
period.  
DELAY  
ACTIVE-HALT and HALT modes are the two low-  
est power consumption modes of the MCU. They  
are both entered by executing the ‘HALT’ instruc-  
tion. The decision to enter either in ACTIVE-HALT  
or HALT mode is given by the MCC/RTC interrupt  
enable flag (OIE bit in MCCSR register).  
Figure 23. ACTIVE-HALT Timing Overview  
ACTIVE  
HALT  
256 OR 4096 CPU  
CYCLE DELAY  
RUN  
RUN  
1)  
RESET  
OR  
INTERRUPT  
MCCSR Power Saving Mode entered when HALT  
HALT  
INSTRUCTION  
[MCCSR.OIE=1]  
OIE bit  
instruction is executed  
HALT mode  
ACTIVE-HALT mode  
FETCH  
VECTOR  
0
1
Figure 24. ACTIVE-HALT Mode Flow-chart  
8.4.1 ACTIVE-HALT MODE  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
OFF  
OFF  
10  
2)  
HALT INSTRUCTION  
(MCCSR.OIE=1)  
ACTIVE-HALT mode is the lowest power con-  
sumption mode of the MCU with a real time clock  
available. It is entered by executing the ‘HALT’ in-  
struction when the OIE bit of the Main Clock Con-  
troller Status register (MCCSR) is set (see Section  
10.2 on page 53 for more details on the MCCSR  
register).  
I[1:0] BITS  
N
RESET  
Y
N
3)  
INTERRUPT  
Y
The MCU can exit ACTIVE-HALT mode on recep-  
tion of either an MCC/RTC interrupt, a specific in-  
terrupt (see Table 8, “Interrupt Mapping,” on  
page 33) or a RESET. When exiting ACTIVE-  
HALT mode by means of an interrupt, no 256 or  
4096 CPU cycle delay occurs. The CPU resumes  
operation by servicing the interrupt or by fetching  
the reset vector which woke it up (see Figure 24).  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
OFF  
ON  
4)  
I[1:0] BITS  
XX  
256 OR 4096 CPU CLOCK  
CYCLE DELAY  
When entering ACTIVE-HALT mode, the I[1:0] bits  
in the CC register are forced to ‘10b’ to enable in-  
terrupts. Therefore, if an interrupt is pending, the  
MCU wakes up immediately.  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
ON  
ON  
4)  
I[1:0] BITS  
XX  
In ACTIVE-HALT mode, only the main oscillator  
and its associated counter (MCC/RTC) are run-  
ning to keep a wake-up time base. All other periph-  
erals are not clocked except those which get their  
clock supply from another clock generator (such  
as external or auxiliary oscillator).  
FETCH RESET VECTOR  
OR SERVICE INTERRUPT  
Notes:  
1. This delay occurs only if the MCU exits ACTIVE-  
HALT mode by means of a RESET.  
2. Peripheral clocked with an external clock source  
can still be active.  
3. Only the MCC/RTC interrupt and some specific  
interrupts can exit the MCU from ACTIVE-HALT  
mode (such as external interrupt). Refer to  
Table 8, “Interrupt Mapping,” on page 33 for more  
details.  
4. Before servicing an interrupt, the CC register is  
pushed on the stack. The I[1:0] bits of the CC reg-  
ister are set to the current software priority level of  
the interrupt routine and restored when the CC  
register is popped.  
The safeguard against staying locked in ACTIVE-  
HALT mode is provided by the oscillator interrupt.  
Note: As soon as the interrupt capability of one of  
the oscillators is selected (MCCSR.OIE bit set),  
entering ACTIVE-HALT mode while the Watchdog  
is active does not generate a RESET.  
This means that the device cannot spend more  
than a defined delay in this power saving mode.  
CAUTION: When exiting ACTIVE-HALT mode fol-  
lowing an interrupt, OIE bit of MCCSR register  
must not be cleared before t  
after the inter-  
CPU  
DELAY  
rupt occurs (t  
= 256 or 4096 t  
delay de-  
DELAY  
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ST7232A  
POWER SAVING MODES (Cont’d)  
8.4.2 HALT MODE  
Figure 26. HALT Mode Flow-chart  
The HALT mode is the lowest power consumption  
mode of the MCU. It is entered by executing the  
‘HALT’ instruction when the OIE bit of the Main  
Clock Controller Status register (MCCSR) is  
cleared (see Section 10.2 on page 53 for more de-  
tails on the MCCSR register).  
HALT INSTRUCTION  
(MCCSR.OIE=0)  
ENABLE  
WATCHDOG  
0
DISABLE  
WDGHALT 1)  
1
The MCU can exit HALT mode on reception of ei-  
ther a specific interrupt (see Table 8, “Interrupt  
Mapping,” on page 33) or a RESET. When exiting  
HALT mode by means of a RESET or an interrupt,  
the oscillator is immediately turned on and the 256  
or 4096 CPU cycle delay is used to stabilize the  
oscillator. After the start up delay, the CPU  
resumes operation by servicing the interrupt or by  
fetching the reset vector which woke it up (see Fig-  
ure 26).  
When entering HALT mode, the I[1:0] bits in the  
CC register are forced to ‘10b’to enable interrupts.  
Therefore, if an interrupt is pending, the MCU  
wakes up immediately.  
WATCHDOG  
RESET  
OSCILLATOR  
OFF  
PERIPHERALS 2)  
CPU  
OFF  
OFF  
10  
I[1:0] BITS  
N
RESET  
Y
N
INTERRUPT 3)  
In HALT mode, the main oscillator is turned off  
causing all internal processing to be stopped, in-  
cluding the operation of the on-chip peripherals.  
All peripherals are not clocked except the ones  
which get their clock supply from another clock  
generator (such as an external or auxiliary oscilla-  
tor).  
Y
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
OFF  
ON  
I[1:0] BITS  
XX 4)  
256 OR 4096 CPU CLOCK  
CYCLE DELAY  
The compatibility of Watchdog operation with  
HALT mode is configured by the “WDGHALT” op-  
tion bit of the option byte. The HALT instruction  
when executed while the Watchdog system is en-  
abled, can generate a Watchdog RESET (see  
Section 14.1 on page 145) for more details.  
OSCILLATOR  
PERIPHERALS  
CPU  
ON  
ON  
ON  
I[1:0] BITS  
XX 4)  
Figure 25. HALT Timing Overview  
FETCH RESET VECTOR  
OR SERVICE INTERRUPT  
256 OR 4096 CPU  
CYCLE DELAY  
RUN  
HALT  
RUN  
Notes:  
RESET  
OR  
INTERRUPT  
1. WDGHALT is an option bit. See option byte sec-  
tion for more details.  
HALT  
INSTRUCTION  
[MCCSR.OIE=0]  
2. Peripheral clocked with an external clock source  
can still be active.  
FETCH  
VECTOR  
3. Only some specific interrupts can exit the MCU  
from HALT mode (such as external interrupt). Re-  
fer to Table 8, “Interrupt Mapping,” on page 33 for  
more details.  
4. Before servicing an interrupt, the CC register is  
pushed on the stack. The I[1:0] bits of the CC reg-  
ister are set to the current software priority level of  
the interrupt routine and recovered when the CC  
register is popped.  
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ST7232A  
POWER SAVING MODES (Cont’d)  
8.4.2.1 Halt Mode Recommendations  
– The opcode for the HALT instruction is 0x8E. To  
avoid an unexpected HALT instruction due to a  
program counter failure, it is advised to clear all  
occurrences of the data value 0x8E from memo-  
ry. For example, avoid defining a constant in  
ROM with the value 0x8E.  
– Make sure that an external event is available to  
wake up the microcontroller from Halt mode.  
– When using an external interrupt to wake up the  
microcontroller, reinitialize the corresponding I/O  
as “Input Pull-up with Interrupt” before executing  
the HALT instruction. The main reason for this is  
that the I/O may be wrongly configured due to ex-  
ternal interference or by an unforeseen logical  
condition.  
– As the HALT instruction clears the interrupt mask  
in the CC register to allow interrupts, the user  
may choose to clear all pending interrupt bits be-  
fore executing the HALT instruction. This avoids  
entering other peripheral interrupt routines after  
executing the external interrupt routine corre-  
sponding to the wake-up event (reset or external  
interrupt).  
– For the same reason, reinitialize the level sensi-  
tiveness of each external interrupt as a precau-  
tionary measure.  
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ST7232A  
9 I/O PORTS  
9.1 INTRODUCTION  
Each pin can independently generate an interrupt  
request. The interrupt sensitivity is independently  
programmable using the sensitivity bits in the  
EICR register.  
The I/O ports offer different functional modes:  
– transfer of data through digital inputs and outputs  
and for specific pins:  
Each external interrupt vector is linked to a dedi-  
cated group of I/O port pins (see pinout description  
and interrupt section). If several input pins are se-  
lected simultaneously as interrupt sources, these  
are first detected according to the sensitivity bits in  
the EICR register and then logically ORed.  
– external interrupt generation  
– alternate signal input/output for the on-chip pe-  
ripherals.  
An I/O port contains up to 8 pins. Each pin can be  
programmed independently as digital input (with or  
without interrupt generation) or digital output.  
The external interrupts are hardware interrupts,  
which means that the request latch (not accessible  
directly by the application) is automatically cleared  
when the corresponding interrupt vector is  
fetched. To clear an unwanted pending interrupt  
by software, the sensitivity bits in the EICR register  
must be modified.  
9.2 FUNCTIONAL DESCRIPTION  
Each port has 2 main registers:  
– Data Register (DR)  
– Data Direction Register (DDR)  
and one optional register:  
– Option Register (OR)  
9.2.2 Output Modes  
The output configuration is selected by setting the  
corresponding DDR register bit. In this case, writ-  
ing the DR register applies this digital value to the  
I/O pin through the latch. Then reading the DR reg-  
ister returns the previously stored value.  
Each I/O pin may be programmed using the corre-  
sponding register bits in the DDR and OR regis-  
ters: bit X corresponding to pin X of the port. The  
same correspondence is used for the DR register.  
Two different output modes can be selected by  
software through the OR register: Output push-pull  
and open-drain.  
The following description takes into account the  
OR register, (for specific ports which do not pro-  
vide this register refer to the I/O Port Implementa-  
tion section). The generic I/O block diagram is  
shown in Figure 27  
DR register value and output pin status:  
DR  
0
Push-pull  
Open-drain  
Vss  
V
9.2.1 Input Modes  
SS  
1
V
Floating  
DD  
The input configuration is selected by clearing the  
corresponding DDR register bit.  
9.2.3 Alternate Functions  
In this case, reading the DR register returns the  
digital value applied to the external I/O pin.  
When an on-chip peripheral is configured to use a  
pin, the alternate function is automatically select-  
ed. This alternate function takes priority over the  
standard I/O programming.  
Different input modes can be selected by software  
through the OR register.  
Notes:  
When the signal is coming from an on-chip periph-  
eral, the I/O pin is automatically configured in out-  
put mode (push-pull or open drain according to the  
peripheral).  
1. Writing the DR register modifies the latch value  
but does not affect the pin status.  
2. When switching from input to output mode, the  
DR register has to be written first to drive the cor-  
rect level on the pin as soon as the port is config-  
ured as an output.  
When the signal is going to an on-chip peripheral,  
the I/O pin must be configured in input mode. In  
this case, the pin state is also digitally readable by  
addressing the DR register.  
3. Do not use read/modify/write instructions (BSET  
or BRES) to modify the DR register  
External interrupt function  
Note: Input pull-up configuration can cause unex-  
pected value at the input of the alternate peripheral  
input. When an on-chip peripheral use a pin as in-  
put and output, this pin has to be configured in in-  
put floating mode.  
When an I/O is configured as Input with Interrupt,  
an event on this I/O can generate an external inter-  
rupt request to the CPU.  
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ST7232A  
I/O PORTS (Cont’d)  
Figure 27. I/O Port General Block Diagram  
ALTERNATE  
OUTPUT  
1
0
REGISTER  
ACCESS  
P-BUFFER  
(see table below)  
V
DD  
ALTERNATE  
ENABLE  
PULL-UP  
(see table below)  
DR  
DDR  
OR  
V
DD  
PULL-UP  
CONDITION  
PAD  
If implemented  
OR SEL  
DDR SEL  
DR SEL  
N-BUFFER  
DIODES  
(see table below)  
ANALOG  
INPUT  
CMOS  
SCHMITT  
TRIGGER  
1
0
ALTERNATE  
INPUT  
EXTERNAL  
INTERRUPT  
SOURCE (ei )  
x
Table 10. I/O Port Mode Options  
Configuration Mode  
Diodes  
Pull-Up  
P-Buffer  
to V  
to V  
SS  
DD  
Floating with/without Interrupt  
Input  
Off  
On  
Off  
Pull-up with/without Interrupt  
On  
Push-pull  
On  
Off  
NI  
On  
Off  
NI  
Output  
Open Drain (logic level)  
True Open Drain  
NI (see note)  
Legend: NI - not implemented  
Off - implemented not activated  
On - implemented and activated  
Note: The diode to V is not implemented in the  
DD  
true open drain pads. A local protection between  
the pad and V is implemented to protect the de-  
SS  
vice against positive stress.  
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ST7232A  
I/O PORTS (Cont’d)  
Table 11. I/O Port Configurations  
Hardware Configuration  
DR REGISTER ACCESS  
NOT IMPLEMENTED IN  
TRUE OPEN DRAIN  
I/O PORTS  
V
DD  
PULL-UP  
CONDITION  
R
W
R
PU  
DR  
REGISTER  
DATA BUS  
PAD  
ALTERNATE INPUT  
EXTERNAL INTERRUPT  
SOURCE (ei )  
x
INTERRUPT  
CONDITION  
ANALOG INPUT  
NOT IMPLEMENTED IN  
TRUE OPEN DRAIN  
I/O PORTS  
DR REGISTER ACCESS  
V
DD  
R
PU  
R/W  
DR  
REGISTER  
DATA BUS  
PAD  
ALTERNATE  
ENABLE  
ALTERNATE  
OUTPUT  
NOT IMPLEMENTED IN  
TRUE OPEN DRAIN  
I/O PORTS  
DR REGISTER ACCESS  
V
DD  
R
PU  
R/W  
DR  
REGISTER  
DATA BUS  
PAD  
ALTERNATE  
ENABLE  
ALTERNATE  
OUTPUT  
Notes:  
1. When the I/O port is in input configuration and the associated alternate function is enabled as an output,  
reading the DR register will read the alternate function output status.  
2. When the I/O port is in output configuration and the associated alternate function is enabled as an input,  
the alternate function reads the pin status given by the DR register content.  
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ST7232A  
I/O PORTS (Cont’d)  
CAUTION: The alternate function must not be ac-  
tivated as long as the pin is configured as input  
with interrupt, in order to avoid generating spurious  
interrupts.  
Figure 28. Interrupt I/O Port State Transitions  
01  
00  
10  
11  
Analog alternate function  
INPUT  
floating/pull-up  
interrupt  
INPUT  
floating  
(reset state)  
OUTPUT  
open-drain  
OUTPUT  
push-pull  
When the pin is used as an ADC input, the I/O  
must be configured as floating input. The analog  
multiplexer (controlled by the ADC registers)  
switches the analog voltage present on the select-  
ed pin to the common analog rail which is connect-  
ed to the ADC input.  
= DDR, OR  
XX  
9.4 LOW POWER MODES  
It is recommended not to change the voltage level  
or loading on any port pin while conversion is in  
progress. Furthermore it is recommended not to  
have clocking pins located close to a selected an-  
alog pin.  
Mode  
WAIT  
HALT  
Description  
No effect on I/O ports. External interrupts  
cause the device to exit from WAIT mode.  
No effect on I/O ports. External interrupts  
cause the device to exit from HALT mode.  
WARNING: The analog input voltage level must  
be within the limits stated in the absolute maxi-  
mum ratings.  
9.5 INTERRUPTS  
9.3 I/O PORT IMPLEMENTATION  
The external interrupt event generates an interrupt  
if the corresponding configuration is selected with  
DDR and OR registers and the interrupt mask in  
the CC register is not active (RIM instruction).  
The hardware implementation on each I/O port de-  
pends on the settings in the DDR and OR registers  
and specific feature of the I/O port such as ADC In-  
put or true open drain.  
Enable Exit  
Control from  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Switching these I/O ports from one state to anoth-  
er should be done in a sequence that prevents un-  
wanted side effects. Recommended safe transi-  
tions are illustrated in Figure 28 Other transitions  
are potentially risky and should be avoided, since  
they are likely to present unwanted side-effects  
such as spurious interrupt generation.  
Bit  
Wait  
External interrupt on  
selected external  
event  
DDRx  
ORx  
-
Yes  
Yes  
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ST7232A  
I/O PORTS (Cont’d)  
9.5.1 I/O Port Implementation  
The I/O port register configurations are summa-  
rised as follows.  
PA3, PB3, PF2 (without pull-up)  
MODE  
floating input  
DDR  
OR  
0
Standard Ports  
0
0
1
1
floating interrupt input  
open drain output  
push-pull output  
1
PA5:4, PC7:0, PD5:0,  
PE1:0, PF7:6, 4  
0
1
MODE  
DDR  
OR  
0
floating input  
pull-up input  
0
0
1
1
1
True Open Drain Ports  
PA7:6  
open drain output  
push-pull output  
0
1
MODE  
floating input  
DDR  
0
1
Interrupt Ports  
open drain (high sink ports)  
PB4, PB2:0, PF1:0 (with pull-up)  
MODE  
floating input  
DDR  
OR  
0
0
0
1
1
pull-up interrupt input  
open drain output  
push-pull output  
1
0
1
Table 12. Port Configuration  
Input  
floating  
Output  
Port  
Port A  
Port B  
Pin name  
PA7:6  
OR = 0  
OR = 1  
OR = 0  
OR = 1  
true open-drain  
PA5:4  
PA3  
floating  
floating  
floating  
floating  
floating  
floating  
floating  
floating  
floating  
floating  
pull-up  
open drain  
open drain  
open drain  
open drain  
open drain  
open drain  
open drain  
open drain  
open drain  
open drain  
push-pull  
push-pull  
push-pull  
push-pull  
push-pull  
push-pull  
push-pull  
push-pull  
push-pull  
push-pull  
floating interrupt  
floating interrupt  
pull-up interrupt  
pull-up  
PB3  
PB4, PB2:0  
PC7:0  
PD5:0  
PE1:0  
PF7:6, 4  
PF2  
Port C  
Port D  
Port E  
pull-up  
pull-up  
pull-up  
Port F  
floating interrupt  
pull-up interrupt  
PF1:0  
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ST7232A  
I/O PORTS (Cont’d)  
Table 13. I/O Port Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
Reset Value  
of all I/O port registers  
0
0
0
0
0
0
0
0
0000h  
0001h  
0002h  
0003h  
0004h  
0005h  
0006h  
0007h  
0008h  
0009h  
000Ah  
000Bh  
000Ch  
000Dh  
000Eh  
000Fh  
0010h  
0011h  
PADR  
PADDR  
PAOR  
PBDR  
PBDDR  
PBOR  
PCDR  
PCDDR  
PCOR  
PDDR  
PDDDR  
PDOR  
PEDR  
MSB  
MSB  
MSB  
MSB  
MSB  
MSB  
LSB  
LSB  
LSB  
LSB  
LSB  
LSB  
PEDDR  
PEOR  
PFDR  
PFDDR  
PFOR  
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ST7232A  
10 ON-CHIP PERIPHERALS  
10.1 WATCHDOG TIMER (WDG)  
10.1.1 Introduction  
If the watchdog is activated (the WDGA bit is set)  
and when the 7-bit timer (bits T[6:0]) rolls over  
from 40h to 3Fh (T6 becomes cleared), it initiates  
a reset cycle pulling low the reset pin for typically  
30µs.  
The Watchdog timer is used to detect the occur-  
rence of a software fault, usually generated by ex-  
ternal interference or by unforeseen logical condi-  
tions, which causes the application program to  
abandon its normal sequence. The Watchdog cir-  
cuit generates an MCU reset on expiry of a pro-  
grammed time period, unless the program refresh-  
es the counter’s contents before the T6 bit be-  
comes cleared.  
The application program must write in the  
WDGCR register at regular intervals during normal  
operation to prevent an MCU reset. This down-  
counter is free-running: it counts down even if the  
watchdog is disabled. The value to be stored in the  
WDGCR register must be between FFh and C0h:  
10.1.2 Main Features  
Programmable free-running downcounter  
Programmable reset  
– The WDGA bit is set (watchdog enabled)  
– The T6 bit is set to prevent generating an imme-  
diate reset  
Reset (if watchdog activated) when the T6 bit  
– The T[5:0] bits contain the number of increments  
which represents the time delay before the  
watchdog produces a reset (see Figure 30. Ap-  
proximate Timeout Duration). The timing varies  
between a minimum and a maximum value due  
to the unknown status of the prescaler when writ-  
ing to the WDGCR register (see Figure 31).  
reaches zero  
Optional  
reset  
on  
HALT  
instruction  
(configurable by option byte)  
Hardware Watchdog selectable by option byte  
10.1.3 Functional Description  
Following a reset, the watchdog is disabled. Once  
activated it cannot be disabled, except by a reset.  
The counter value stored in the Watchdog Control  
register (WDGCR bits T[6:0]), is decremented  
every 16384 f  
cycles (approx.), and the  
The T6 bit can be used to generate a software re-  
set (the WDGA bit is set and the T6 bit is cleared).  
OSC2  
length of the timeout period can be programmed  
by the user in 64 increments.  
If the watchdog is activated, the HALT instruction  
will generate a Reset.  
Figure 29. Watchdog Block Diagram  
RESET  
f
OSC2  
MCC/RTC  
WATCHDOG CONTROL REGISTER (WDGCR)  
T5  
DIV 64  
WDGA T6  
T1  
T0  
T4  
T2  
T3  
6-BIT DOWNCOUNTER (CNT)  
12-BIT MCC  
RTC COUNTER  
WDG PRESCALER  
DIV 4  
TB[1:0] bits  
(MCCSR  
Register)  
MSB  
LSB  
0
6 5  
11  
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ST7232A  
WATCHDOG TIMER (Cont’d)  
10.1.4 How to Program the Watchdog Timeout  
more precision is needed, use the formulae in Fig-  
ure 31.  
Figure 30 shows the linear relationship between  
the 6-bit value to be loaded in the Watchdog Coun-  
ter (CNT) and the resulting timeout duration in mil-  
liseconds. This can be used for a quick calculation  
without taking the timing variations into account. If  
Caution: When writing to the WDGCR register, al-  
ways write 1 in the T6 bit to avoid generating an  
immediate reset.  
Figure 30. Approximate Timeout Duration  
3F  
38  
30  
28  
20  
18  
10  
08  
00  
1.5  
18  
34  
50  
65  
82  
98  
114  
128  
Watchdog timeout (ms) @ 8 MHz. f  
OSC2  
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ST7232A  
WATCHDOG TIMER (Cont’d)  
Figure 31. Exact Timeout Duration (t  
and t  
)
max  
min  
WHERE:  
t
t
t
= (LSB + 128) x 64 x t  
min0  
OSC2  
= 16384 x t  
= 125ns if f  
max0  
OSC2  
OSC2  
=8 MHz  
OSC2  
CNT = Value of T[5:0] bits in the WDGCR register (6 bits)  
MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits  
in the MCCSR register  
TB1 Bit  
TB0 Bit  
Selected MCCSR  
Timebase  
MSB  
LSB  
(MCCSR Reg.) (MCCSR Reg.)  
0
0
1
1
0
1
0
1
2ms  
4ms  
4
8
59  
53  
35  
54  
10ms  
25ms  
20  
49  
To calculate the minimum Watchdog Timeout (t ):  
min  
MSB  
4
IF  
THEN  
ELSE  
-------------  
CNT <  
t
= t  
+ 16384 × CNT × t  
min  
min0  
osc2  
4CNT  
----------------  
4CNT  
----------------  
t
= t  
+ 16384 × CNT –  
+ (192 + LSB) × 64 ×  
× t  
min  
min0  
osc2  
MSB  
MSB  
To calculate the maximum Watchdog Timeout (t  
):  
max  
MSB  
4
IF  
-------------  
THEN  
ELSE  
CNT ≤  
t
= t  
+ 16384 × CNT × t  
max  
max0  
osc2  
4CNT  
----------------  
4CNT  
----------------  
t
= t  
+ 16384 × CNT –  
+ (192 + LSB) × 64 ×  
× t  
max  
max0  
osc2  
MSB  
MSB  
Note: In the above formulae, division results must be rounded down to the next integer value.  
Example:  
With 2ms timeout selected in MCCSR register  
Min. Watchdog  
Timeout (ms)  
Max. Watchdog  
Timeout (ms)  
Value of T[5:0] Bits in  
WDGCR Register (Hex.)  
t
t
min  
max  
00  
3F  
1.496  
128  
2.048  
128.552  
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ST7232A  
WATCHDOG TIMER (Cont’d)  
10.1.5 Low Power Modes  
Mode Description  
SLOW No effect on Watchdog.  
WAIT No effect on Watchdog.  
OIE bit in  
MCCSR  
register  
WDGHALT bit  
in Option  
Byte  
No Watchdog reset is generated. The MCU enters Halt mode. The Watch-  
dog counter is decremented once and then stops counting and is no longer  
able to generate a watchdog reset until the MCU receives an external inter-  
rupt or a reset.  
0
0
If an external interrupt is received, the Watchdog restarts counting after 256  
or 4096 CPU clocks. If a reset is generated, the Watchdog is disabled (reset  
state) unless Hardware Watchdog is selected by option byte. For applica-  
tion recommendations see Section 10.1.7 below.  
HALT  
0
1
1
x
A reset is generated.  
No reset is generated. The MCU enters Active Halt mode. The Watchdog  
counter is not decremented. It stop counting. When the MCU receives an  
oscillator interrupt or external interrupt, the Watchdog restarts counting im-  
mediately. When the MCU receives a reset the Watchdog restarts counting  
after 256 or 4096 CPU clocks.  
10.1.6 Hardware Watchdog Option  
10.1.9 Register Description  
If Hardware Watchdog is selected by option byte,  
the watchdog is always active and the WDGA bit in  
the WDGCR is not used. Refer to the Option Byte  
description.  
CONTROL REGISTER (WDGCR)  
Read/Write  
Reset Value: 0111 1111 (7Fh)  
10.1.7 Using Halt Mode with the WDG  
(WDGHALT option)  
7
0
WDGA T6  
T5  
T4  
T3  
T2  
T1  
T0  
The following recommendation applies if Halt  
mode is used when the watchdog is enabled.  
– Before executing the HALT instruction, refresh  
the WDG counter, to avoid an unexpected WDG  
reset immediately after waking up the microcon-  
troller.  
Bit 7 = WDGA Activation bit.  
This bit is set by software and only cleared by  
hardware after a reset. When WDGA = 1, the  
watchdog can generate a reset.  
0: Watchdog disabled  
1: Watchdog enabled  
10.1.8 Interrupts  
None.  
Note: This bit is not used if the hardware watch-  
dog option is enabled by option byte.  
Bit 6:0 = T[6:0] 7-bit counter (MSB to LSB).  
These bits contain the value of the watchdog  
counter. It is decremented every 16384 f  
cles (approx.). A reset is produced when it rolls  
over from 40h to 3Fh (T6 becomes cleared).  
cy-  
OSC2  
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ST7232A  
Table 14. Watchdog Timer Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
WDGCR  
Reset Value  
WDGA  
0
T6  
1
T5  
1
T4  
1
T3  
1
T2  
1
T1  
1
T0  
1
002Ah  
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ST7232A  
10.2  
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC)  
The Main Clock Controller consists of three differ-  
ent functions:  
external devices. It is controlled by the MCO bit in  
the MCCSR register.  
CAUTION: When selected, the clock out pin sus-  
pends the clock during ACTIVE-HALT mode.  
a programmable CPU clock prescaler  
a clock-out signal to supply external devices  
10.2.3  
Real Time Clock Timer (RTC)  
a real time clock timer with interrupt capability  
The counter of the real time clock timer allows an  
interrupt to be generated based on an accurate  
real time clock. Four different time bases depend-  
Each function can be used independently and si-  
multaneously.  
10.2.1  
Programmable CPU Clock Prescaler  
ing directly on f  
are available. The whole  
OSC2  
functionality is controlled by four bits of the MCC-  
SR register: TB[1:0], OIE and OIF.  
The programmable CPU clock prescaler supplies  
the clock for the ST7 CPU and its internal periph-  
erals. It manages SLOW power saving mode (See  
Section 8.2 SLOW MODE for more details).  
When the RTC interrupt is enabled (OIE bit set),  
the ST7 enters ACTIVE-HALT mode when the  
HALT instruction is executed. See Section 8.4 AC-  
TIVE-HALT AND HALT MODES for more details.  
The prescaler selects the f  
main clock frequen-  
CPU  
cy and is controlled by three bits in the MCCSR  
register: CP[1:0] and SMS.  
10.2.4  
Beeper  
10.2.2  
Clock-out Capability  
The clock-out capability is an alternate function of  
an I/O port pin that outputs a f clock to drive  
The beep function is controlled by the MCCBCR  
register. It can output three selectable frequencies  
on the BEEP pin (I/O port alternate function).  
OSC2  
Figure 32.  
Main Clock Controller (MCC/RTC) Block Diagram  
BC1 BC0  
MCCBCR  
BEEP  
MCO  
BEEP SIGNAL  
SELECTION  
12-BIT MCC RTC  
COUNTER  
TO  
DIV 64  
WATCHDOG  
TIMER  
MCO CP1 CP0 SMS TB1 TB0 OIE OIF  
MCCSR  
MCC/RTC INTERRUPT  
fCPU  
fOSC2  
DIV 2, 4, 8, 16  
1
0
CPU CLOCK  
TO CPU AND  
PERIPHERALS  
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ST7232A  
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)  
10.2.5  
Low Power Modes  
Bit 6:5 = CP[1:0] CPU clock prescaler  
Mode  
Description  
These bits select the CPU clock prescaler which is  
applied in the different slow modes. Their action is  
conditioned by the setting of the SMS bit. These  
two bits are set and cleared by software  
No effect on MCC/RTC peripheral.  
MCC/RTC interrupt cause the device to exit  
from WAIT mode.  
WAIT  
No effect on MCC/RTC counter (OIE bit is  
f
in SLOW mode  
CP1  
CP0  
ACTIVE- set), the registers are frozen.  
CPU  
HALT  
MCC/RTC interrupt cause the device to exit  
from ACTIVE-HALT mode.  
f
f
f
/ 2  
/ 4  
0
0
1
1
0
1
0
1
OSC2  
OSC2  
OSC2  
MCC/RTC counter and registers are frozen.  
MCC/RTC operation resumes when the  
MCU is woken up by an interrupt with “exit  
from HALT” capability.  
/ 8  
HALT  
f
/ 16  
OSC2  
10.2.6  
Bit 4 = SMS Slow mode select  
This bit is set and cleared by software.  
0: Normal mode. f = f  
Interrupts  
The MCC/RTC interrupt event generates an inter-  
rupt if the OIE bit of the MCCSR register is set and  
the interrupt mask in the CC register is not active  
(RIM instruction).  
OSC2  
CPU  
1: Slow mode. f  
is given by CP1, CP0  
CPU  
See Section 8.2 SLOW MODE and Section 10.2  
MAIN CLOCK CONTROLLER WITH REAL TIME  
CLOCK AND BEEPER (MCC/RTC) for more de-  
tails.  
Enable Exit  
Control from  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Bit  
Wait  
Time base overflow  
event  
1)  
Bit 3:2 = TB[1:0] Time base control  
OIF  
OIE  
Yes  
No  
These bits select the programmable divider time  
base. They are set and cleared by software.  
Note:  
The MCC/RTC interrupt wakes up the MCU from  
ACTIVE-HALT mode, not from HALT mode.  
Time Base  
Counter  
TB1 TB0  
Prescaler  
f
=4MHz  
f
=8MHz  
OSC2  
OSC2  
16000  
32000  
80000  
200000  
4ms  
2ms  
4ms  
0
0
1
1
0
1
0
1
8ms  
20ms  
50ms  
10.2.7  
Register Description  
10ms  
25ms  
MCC CONTROL/STATUS REGISTER (MCCSR)  
Read/Write  
Reset Value: 0000 0000 (00h  
)
A modification of the time base is taken into ac-  
count at the end of the current period (previously  
set) to avoid an unwanted time shift. This allows to  
use this time base as a real time clock.  
7
0
MCO CP1 CP0 SMS TB1 TB0 OIE OIF  
Bit 1 = OIE Oscillator interrupt enable  
This bit set and cleared by software.  
0: Oscillator interrupt disabled  
Bit 7 = MCO Main clock out selection  
This bit enables the MCO alternate function on the  
PF0 I/O port. It is set and cleared by software.  
0: MCO alternate function disabled (I/O pin free for  
general-purpose I/O)  
1: Oscillator interrupt enabled  
This interrupt can be used to exit from ACTIVE-  
HALT mode.  
1: MCO alternate function enabled (f  
port)  
on I/O  
CPU  
When this bit is set, calling the ST7 software HALT  
instruction enters the ACTIVE-HALT power saving  
mode  
.
Note: To reduce power consumption, the MCO  
function is not active in ACTIVE-HALT mode.  
54/157  
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ST7232A  
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)  
MCC BEEP CONTROL REGISTER (MCCBCR)  
Read/Write  
Bit 0 = OIF Oscillator interrupt flag  
This bit is set by hardware and cleared by software  
reading the MCCSR register. It indicates when set  
that the main oscillator has reached the selected  
elapsed time (TB1:0).  
Reset Value: 0000 0000 (00h)  
7
0
0
0: Timeout not reached  
1: Timeout reached  
0
0
0
0
0
BC1 BC0  
CAUTION: The BRES and BSET instructions  
must not be used on the MCCSR register to avoid  
unintentionally clearing the OIF bit.  
Bit 7:2 = Reserved, must be kept cleared.  
Bit 1:0 = BC[1:0] Beep control  
These 2 bits select the PF1 pin beep capability.  
BC1  
BC0  
Beep mode with f  
=8MHz  
OSC2  
0
0
1
1
0
1
0
1
Off  
~2-KHz  
Output  
Beep signal  
~50% duty cycle  
~1-KHz  
~500-Hz  
The beep output signal is available in ACTIVE-  
HALT mode but has to be disabled to reduce the  
consumption.  
Table 15. Main Clock Controller Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
MCCSR  
Reset Value  
MCO  
0
CP1  
0
CP0  
0
SMS  
0
TB1  
0
TB0  
0
OIE  
0
OIF  
0
002Ch  
002Dh  
MCCBCR  
Reset Value  
BC1  
0
BC0  
0
0
0
0
0
0
0
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ST7232A  
10.3 16-BIT TIMER  
10.3.1 Introduction  
When reading an input signal on a non-bonded  
pin, the value will always be ‘1’.  
The timer consists of a 16-bit free-running counter  
driven by a programmable prescaler.  
10.3.3 Functional Description  
10.3.3.1 Counter  
It may be used for a variety of purposes, including  
pulse length measurement of up to two input sig-  
nals (input capture) or generation of up to two out-  
put waveforms (output compare and PWM).  
The main block of the Programmable Timer is a  
16-bit free running upcounter and its associated  
16-bit registers. The 16-bit registers are made up  
of two 8-bit registers called high & low.  
Pulse lengths and waveform periods can be mod-  
ulated from a few microseconds to several milli-  
seconds using the timer prescaler and the CPU  
clock prescaler.  
Counter Register (CR):  
– Counter High Register (CHR) is the most sig-  
nificant byte (MS Byte).  
Some ST7 devices have two on-chip 16-bit timers.  
They are completely independent, and do not  
share any resources. They are synchronized after  
a MCU reset as long as the timer clock frequen-  
cies are not modified.  
– Counter Low Register (CLR) is the least sig-  
nificant byte (LS Byte).  
Alternate Counter Register (ACR)  
– Alternate Counter High Register (ACHR) is  
the most significant byte (MS Byte).  
This description covers one or two 16-bit timers. In  
ST7 devices with two timers, register names are  
prefixed with TA (Timer A) or TB (Timer B).  
– Alternate Counter Low Register (ACLR) is the  
least significant byte (LS Byte).  
These two read-only 16-bit registers contain the  
same value but with the difference that reading the  
ACLR register does not clear the TOF bit (Timer  
overflow flag), located in the Status register, (SR),  
(see note at the end of paragraph titled 16-bit read  
sequence).  
10.3.2 Main Features  
Programmableprescaler:fCPU dividedby2,4or8.  
Overflow status flag and maskable interrupt  
External clock input (must be at least 4 times  
slowerthantheCPUclockspeed)withthechoice  
of active edge  
1 or 2 Output Compare functions each with:  
– 2 dedicated 16-bit registers  
Writing in the CLR register or ACLR register resets  
the free running counter to the FFFCh value.  
Both counters have a reset value of FFFCh (this is  
the only value which is reloaded in the 16-bit tim-  
er). The reset value of both counters is also  
FFFCh in One Pulse mode and PWM mode.  
– 2 dedicated programmable signals  
– 2 dedicated status flags  
– 1 dedicated maskable interrupt  
1 or 2 Input Capture functions each with:  
– 2 dedicated 16-bit registers  
The timer clock depends on the clock control bits  
of the CR2 register, as illustrated in Table 16 Clock  
Control Bits. The value in the counter register re-  
peats every 131072, 262144 or 524288 CPU clock  
cycles depending on the CC[1:0] bits.  
– 2 dedicated active edge selection signals  
– 2 dedicated status flags  
The timer frequency can be f  
or an external frequency.  
/2, f  
/4, f  
/8  
CPU  
CPU  
CPU  
– 1 dedicated maskable interrupt  
Pulse width modulation mode (PWM)  
One pulse mode  
Caution: In Flash devices, Timer A functionality  
has the following restrictions:  
Reduced Power Mode  
5 alternate functions on I/O ports (ICAP1, ICAP2,  
– TAOC2HR and TAOC2LR registers are write  
only  
OCMP1, OCMP2, EXTCLK)*  
– Input Capture 2 is not implemented  
The Block Diagram is shown in Figure 33.  
– The corresponding interrupts cannot be used  
(ICF2, OCF2 forced by hardware to zero)  
*Note: Some timer pins may not be available (not  
bonded) in some ST7 devices. Refer to the device  
pin out description.  
56/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
Figure 33. Timer Block Diagram  
ST7 INTERNAL BUS  
f
CPU  
MCU-PERIPHERAL INTERFACE  
8 low  
8-bit  
8 high  
8
8
8
8
8
8
8
8
buffer  
EXEDG  
16  
INPUT  
CAPTURE  
REGISTER  
INPUT  
CAPTURE  
REGISTER  
OUTPUT  
COMPARE  
REGISTER  
OUTPUT  
COMPARE  
REGISTER  
1/2  
1/4  
1/8  
COUNTER  
REGISTER  
1
1
2
2
ALTERNATE  
COUNTER  
REGISTER  
EXTCLK  
pin  
16  
16  
16  
CC[1:0]  
TIMER INTERNAL BUS  
16 16  
OVERFLOW  
DETECT  
EDGE DETECT  
CIRCUIT1  
OUTPUT COMPARE  
CIRCUIT  
ICAP1  
pin  
CIRCUIT  
6
EDGE DETECT  
CIRCUIT2  
ICAP2  
pin  
OCMP1  
pin  
LATCH1  
LATCH2  
0
ICF1 OCF1 TOF ICF2 OCF2  
0
TIMD  
(Control/Status Register)  
OCMP2  
pin  
CSR  
EXEDG  
ICIE OCIE TOIE FOLV2 FOLV1OLVL2 IEDG1 OLVL1  
OC1E  
OPM PWM CC1 CC0 IEDG2  
OC2E  
(Control Register 1) CR1  
(Control Register 2) CR2  
(See note)  
Note: If IC, OC and TO interrupt requests have separate vectors  
then the last OR is not present (See device Interrupt Vector Table)  
TIMER INTERRUPT  
57/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
16-bit read sequence: (from either the Counter  
Register or the Alternate Counter Register).  
Clearing the overflow interrupt request is done in  
two steps:  
1. Reading the SR register while the TOF bit is set.  
2. An access (read or write) to the CLR register.  
Beginning of the sequence  
Read  
LS Byte  
Notes: The TOF bit is not cleared by accesses to  
ACLR register. The advantage of accessing the  
ACLR register rather than the CLR register is that  
it allows simultaneous use of the overflow function  
and reading the free running counter at random  
times (for example, to measure elapsed time) with-  
out the risk of clearing the TOF bit erroneously.  
MS Byte  
At t0  
is buffered  
Other  
instructions  
Returns the buffered  
LS Byte value at t0  
Read  
LS Byte  
At t0 +t  
The timer is not affected by WAIT mode.  
In HALT mode, the counter stops counting until the  
mode is exited. Counting then resumes from the  
previous count (MCU awakened by an interrupt) or  
from the reset count (MCU awakened by a Reset).  
Sequence completed  
The user must read the MS Byte first, then the LS  
Byte value is buffered automatically.  
This buffered value remains unchanged until the  
16-bit read sequence is completed, even if the  
user reads the MS Byte several times.  
10.3.3.2 External Clock  
The external clock (where available) is selected if  
CC0=1 and CC1=1 in the CR2 register.  
After a complete reading sequence, if only the  
CLR register or ACLR register are read, they re-  
turn the LS Byte of the count value at the time of  
the read.  
The status of the EXEDG bit in the CR2 register  
determines the type of level transition on the exter-  
nal clock pin EXTCLK that will trigger the free run-  
ning counter.  
Whatever the timer mode used (input capture, out-  
put compare, one pulse mode or PWM mode) an  
overflow occurs when the counter rolls over from  
FFFFh to 0000h then:  
The counter is synchronized with the falling edge  
of the internal CPU clock.  
A minimum of four falling edges of the CPU clock  
must occur between two consecutive active edges  
of the external clock; thus the external clock fre-  
quency must be less than a quarter of the CPU  
clock frequency.  
– The TOF bit of the SR register is set.  
– A timer interrupt is generated if:  
– TOIE bit of the CR1 register is set and  
– I bit of the CC register is cleared.  
If one of these conditions is false, the interrupt re-  
mains pending to be issued as soon as they are  
both true.  
58/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
Figure 34. Counter Timing Diagram, internal clock divided by 2  
CPU CLOCK  
INTERNAL RESET  
TIMER CLOCK  
FFFD FFFE FFFF 0000 0001 0002 0003  
COUNTER REGISTER  
TIMER OVERFLOW FLAG (TOF)  
Figure 35. Counter Timing Diagram, internal clock divided by 4  
CPU CLOCK  
INTERNAL RESET  
TIMER CLOCK  
FFFC  
FFFD  
0000  
0001  
COUNTER REGISTER  
TIMER OVERFLOW FLAG (TOF)  
Figure 36. Counter Timing Diagram, internal clock divided by 8  
CPU CLOCK  
INTERNAL RESET  
TIMER CLOCK  
0000  
FFFC  
FFFD  
COUNTER REGISTER  
TIMER OVERFLOW FLAG (TOF)  
Note: The MCU is in reset state when the internal reset signal is high, when it is low the MCU is running.  
59/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
10.3.3.3 Input Capture  
When an input capture occurs:  
In this section, the index, i, may be 1 or 2 because  
there are 2 input capture functions in the 16-bit  
timer.  
– ICFi bit is set.  
– The ICiR register contains the value of the free  
running counter on the active transition on the  
ICAPi pin (see Figure 38).  
The two 16-bit input capture registers (IC1R and  
IC2R) are used to latch the value of the free run-  
ning counter after a transition is detected on the  
ICAPi pin (see figure 5).  
– A timer interrupt is generated if the ICIE bit is set  
and the I bit is cleared in the CC register. Other-  
wise, the interrupt remains pending until both  
conditions become true.  
MS Byte  
LS Byte  
ICiR  
ICiHR  
ICiLR  
Clearing the Input Capture interrupt request (i.e.  
clearing the ICFi bit) is done in two steps:  
ICiR register is a read-only register.  
1. Reading the SR register while the ICFi bit is set.  
2. An access (read or write) to the ICiLR register.  
The active transition is software programmable  
through the IEDGi bit of Control Registers (CRi).  
Timing resolution is one count of the free running  
Notes:  
counter: (f  
/CC[1:0]).  
CPU  
1. After reading the ICiHR register, transfer of  
input capture data is inhibited and ICFi will  
never be set until the ICiLR register is also  
read.  
Procedure:  
To use the input capture function select the follow-  
ing in the CR2 register:  
2. The ICiR register contains the free running  
counter value which corresponds to the most  
recent input capture.  
– Select the timer clock (CC[1:0]) (see Table 16  
Clock Control Bits).  
3. The 2 input capture functions can be used  
together even if the timer also uses the 2 output  
compare functions.  
– Select the edge of the active transition on the  
ICAP2 pin with the IEDG2 bit (the ICAP2 pin  
must be configured as floating input or input with  
pull-up without interrupt if this configuration is  
available).  
4. In One pulse Mode and PWM mode only Input  
Capture 2 can be used.  
And select the following in the CR1 register:  
5. The alternate inputs (ICAP1 & ICAP2) are  
always directly connected to the timer. So any  
transitions on these pins activates the input  
capture function.  
– Set the ICIE bit to generate an interrupt after an  
input capture coming from either the ICAP1 pin  
or the ICAP2 pin  
Moreover if one of the ICAPi pins is configured  
as an input and the second one as an output,  
an interrupt can be generated if the user tog-  
gles the output pin and if the ICIE bit is set.  
This can be avoided if the input capture func-  
tion i is disabled by reading the ICiHR (see note  
1).  
– Select the edge of the active transition on the  
ICAP1 pin with the IEDG1 bit (the ICAP1pin must  
be configured as floating input or input with pull-  
up without interrupt if this configuration is availa-  
ble).  
6. The TOF bit can be used with interrupt genera-  
tion in order to measure events that go beyond  
the timer range (FFFFh).  
7. In Flash devices, the ICAP2 registers  
(TAIC2HR, TAIC2LR) are not available on  
Timer A. The corresponding interrupts cannot  
be used (ICF2 is forced by hardware to 0).  
60/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
Figure 37. Input Capture Block Diagram  
ICAP1  
pin  
(Control Register 1) CR1  
EDGE DETECT  
CIRCUIT2  
EDGE DETECT  
CIRCUIT1  
ICIE  
IEDG1  
ICAP2  
pin  
(Status Register) SR  
ICF1  
ICF2  
0
0
0
IC2R Register  
IC1R Register  
(Control Register 2) CR2  
16-BIT  
16-BIT FREE RUNNING  
COUNTER  
IEDG2  
CC0  
CC1  
Figure 38. Input Capture Timing Diagram  
TIMER CLOCK  
FF01  
FF02  
FF03  
COUNTER REGISTER  
ICAPi PIN  
ICAPi FLAG  
FF03  
ICAPi REGISTER  
Note: The rising edge is the active edge.  
61/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
10.3.3.4 Output Compare  
– The OCMPi pin takes OLVLi bit value (OCMPi  
pin latch is forced low during reset).  
In this section, the index, i, may be 1 or 2 because  
there are 2 output compare functions in the 16-bit  
timer.  
– A timer interrupt is generated if the OCIE bit is  
set in the CR1 register and the I bit is cleared in  
the CC register (CC).  
This function can be used to control an output  
waveform or indicate when a period of time has  
elapsed.  
The OCiR register value required for a specific tim-  
ing application can be calculated using the follow-  
ing formula:  
When a match is found between the Output Com-  
pare register and the free running counter, the out-  
put compare function:  
– Assigns pins with a programmable value if the  
t f  
* CPU  
PRESC  
OCiR =  
OCiE bit is set  
– Sets a flag in the status register  
– Generates an interrupt if enabled  
Where:  
t  
= Output compare period (in seconds)  
= CPU clock frequency (in hertz)  
Two 16-bit registers Output Compare Register 1  
(OC1R) and Output Compare Register 2 (OC2R)  
contain the value to be compared to the counter  
register each timer clock cycle.  
f
CPU  
= Timer prescaler factor (2, 4 or 8 de-  
pending on CC[1:0] bits, see Table 16  
Clock Control Bits)  
PRESC  
MS Byte  
LS Byte  
OCiR  
OCiHR  
OCiLR  
If the timer clock is an external clock, the formula  
is:  
These registers are readable and writable and are  
not affected by the timer hardware. A reset event  
changes the OCiR value to 8000h.  
OCiR = t f  
* EXT  
Timing resolution is one count of the free running  
Where:  
counter: (f  
).  
CC[1:0]  
CPU/  
t  
= Output compare period (in seconds)  
= External timer clock frequency (in hertz)  
f
EXT  
Procedure:  
To use the output compare function, select the fol-  
lowing in the CR2 register:  
Clearing the output compare interrupt request (i.e.  
clearing the OCFi bit) is done by:  
– Set the OCiE bit if an output is needed then the  
OCMPi pin is dedicated to the output compare i  
signal.  
1. Reading the SR register while the OCFi bit is  
set.  
2. An access (read or write) to the OCiLR register.  
– Select the timer clock (CC[1:0]) (see Table 16  
Clock Control Bits).  
The following procedure is recommended to pre-  
vent the OCFi bit from being set between the time  
it is read and the write to the OCiR register:  
And select the following in the CR1 register:  
– Select the OLVLi bit to applied to the OCMPi pins  
after the match occurs.  
– Write to the OCiHR register (further compares  
are inhibited).  
– Set the OCIE bit to generate an interrupt if it is  
needed.  
– Read the SR register (first step of the clearance  
of the OCFi bit, which may be already set).  
When a match is found between OCRi register  
and CR register:  
– Write to the OCiLR register (enables the output  
compare function and clears the OCFi bit).  
– OCFi bit is set.  
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ST7232A  
16-BIT TIMER (Cont’d)  
Notes:  
6. In Flash devices, the TAOC2HR, TAOC2LR  
registers are "write only" in Timer A. The corre-  
sponding event cannot be generated (OCF2 is  
forced by hardware to 0).  
1. After a processor write cycle to the OCiHR reg-  
ister, the output compare function is inhibited  
until the OCiLR register is also written.  
Forced Compare Output capability  
2. If the OCiE bit is not set, the OCMPi pin is a  
general I/O port and the OLVLi bit will not  
appear when a match is found but an interrupt  
could be generated if the OCIE bit is set.  
When the FOLVi bit is set by software, the OLVLi  
bit is copied to the OCMPi pin. The OLVi bit has to  
be toggled in order to toggle the OCMPi pin when  
it is enabled (OCiE bit=1). The OCFi bit is then not  
set by hardware, and thus no interrupt request is  
generated.  
3. When the timer clock is f  
/2, OCFi and  
CPU  
OCMPi are set while the counter value equals  
the OCiR register value (see Figure 40 on page  
64). This behaviour is the same in OPM or  
PWM mode.  
The FOLVLi bits have no effect in both one pulse  
mode and PWM mode.  
When the timer clock is f  
/4, f  
/8 or in  
CPU  
CPU  
external clock mode, OCFi and OCMPi are set  
while the counter value equals the OCiR regis-  
ter value plus 1 (see Figure 41 on page 64).  
4. The output compare functions can be used both  
for generating external events on the OCMPi  
pins even if the input capture mode is also  
used.  
5. The value in the 16-bit OCiR register and the  
OLVi bit should be changed after each suc-  
cessful comparison in order to control an output  
waveform or establish a new elapsed timeout.  
Figure 39. Output Compare Block Diagram  
16 BIT FREE RUNNING  
OC1E  
CC1 CC0  
OC2E  
COUNTER  
(Control Register 2) CR2  
16-bit  
(Control Register 1) CR1  
OUTPUT COMPARE  
CIRCUIT  
Latch  
1
OCIE  
FOLV2 FOLV1OLVL2  
OLVL1  
OCMP1  
Pin  
16-bit  
16-bit  
Latch  
2
OCMP2  
Pin  
OC1R Register  
OCF1  
OCF2  
0
0
0
OC2R Register  
(Status Register) SR  
63/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
Figure 40. Output Compare Timing Diagram, f  
=f  
/2  
TIMER  
CPU  
INTERNAL CPU CLOCK  
TIMER CLOCK  
COUNTER REGISTER  
2ECF 2ED0 2ED1 2ED2  
2ED3  
2ED4  
2ED3  
OUTPUT COMPARE REGISTER i (OCRi)  
OUTPUT COMPARE FLAG i (OCFi)  
OCMPi PIN (OLVLi=1)  
Figure 41. Output Compare Timing Diagram, f  
=f  
/4  
TIMER  
CPU  
INTERNAL CPU CLOCK  
TIMER CLOCK  
2ECF 2ED0 2ED1 2ED2  
2ED3  
2ED4  
2ED3  
COUNTER REGISTER  
OUTPUT COMPARE REGISTER i (OCRi)  
COMPARE REGISTER i LATCH  
OUTPUT COMPARE FLAG i (OCFi)  
OCMPi PIN (OLVLi=1)  
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1
ST7232A  
16-BIT TIMER (Cont’d)  
10.3.3.5 One Pulse Mode  
Clearing the Input Capture interrupt request (i.e.  
clearing the ICFi bit) is done in two steps:  
One Pulse mode enables the generation of a  
pulse when an external event occurs. This mode is  
selected via the OPM bit in the CR2 register.  
1. Reading the SR register while the ICFi bit is set.  
2. An access (read or write) to the ICiLR register.  
The one pulse mode uses the Input Capture1  
function and the Output Compare1 function.  
The OC1R register value required for a specific  
timing application can be calculated using the fol-  
lowing formula:  
Procedure:  
t f  
To use one pulse mode:  
* CPU  
- 5  
OCiR Value =  
1. Load the OC1R register with the value corre-  
sponding to the length of the pulse (see the for-  
mula in the opposite column).  
PRESC  
Where:  
t
= Pulse period (in seconds)  
2. Select the following in the CR1 register:  
f
= CPU clock frequency (in hertz)  
CPU  
– Using the OLVL1 bit, select the level to be ap-  
plied to the OCMP1 pin after the pulse.  
= Timer prescaler factor (2, 4 or 8 depend-  
ing on the CC[1:0] bits, see Table 16  
Clock Control Bits)  
PRESC  
– Using the OLVL2 bit, select the level to be ap-  
plied to the OCMP1 pin during the pulse.  
If the timer clock is an external clock the formula is:  
– Select the edge of the active transition on the  
ICAP1 pin with the IEDG1 bit (the ICAP1 pin  
must be configured as floating input).  
OCiR = t fEXT -5  
*
Where:  
t
3. Select the following in the CR2 register:  
= Pulse period (in seconds)  
– Set the OC1E bit, the OCMP1 pin is then ded-  
icated to the Output Compare 1 function.  
f
= External timer clock frequency (in hertz)  
EXT  
– Set the OPM bit.  
When the value of the counter is equal to the value  
of the contents of the OC1R register, the OLVL1  
bit is output on the OCMP1 pin, (See Figure 42).  
– Select the timer clock CC[1:0] (see Table 16  
Clock Control Bits).  
Notes:  
One pulse mode cycle  
1. The OCF1 bit cannot be set by hardware in one  
pulse mode but the OCF2 bit can generate an  
Output Compare interrupt.  
ICR1 = Counter  
When  
OCMP1 = OLVL2  
event occurs  
2. When the Pulse Width Modulation (PWM) and  
One Pulse Mode (OPM) bits are both set, the  
PWM mode is the only active one.  
on ICAP1  
Counter is reset  
to FFFCh  
3. If OLVL1=OLVL2 a continuous signal will be  
seen on the OCMP1 pin.  
ICF1 bit is set  
When  
4. The ICAP1 pin can not be used to perform input  
capture. The ICAP2 pin can be used to perform  
input capture (ICF2 can be set and IC2R can be  
loaded) but the user must take care that the  
counter is reset each time a valid edge occurs  
on the ICAP1 pin and ICF1 can also generates  
interrupt if ICIE is set.  
Counter  
OCMP1 = OLVL1  
= OC1R  
Then, on a valid event on the ICAP1 pin, the coun-  
ter is initialized to FFFCh and OLVL2 bit is loaded  
on the OCMP1 pin, the ICF1 bit is set and the val-  
ue FFFDh is loaded in the IC1R register.  
5. When one pulse mode is used OC1R is dedi-  
cated to this mode. Nevertheless OC2R and  
OCF2 can be used to indicate a period of time  
has been elapsed but cannot generate an out-  
put waveform because the level OLVL2 is dedi-  
cated to the one pulse mode.  
Because the ICF1 bit is set when an active edge  
occurs, an interrupt can be generated if the ICIE  
bit is set.  
6. In Flash devices, Timer A OCF2 bit is forced by  
hardware to 0.  
65/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
Figure 42. One Pulse Mode Timing Example  
2ED3  
01F8  
IC1R  
FFFC FFFD FFFE  
2ED0 2ED1 2ED2  
2ED3  
FFFC FFFD  
01F8  
COUNTER  
ICAP1  
OLVL2  
OLVL1  
OLVL2  
OCMP1  
compare1  
Note: IEDG1=1, OC1R=2ED0h, OLVL1=0, OLVL2=1  
Figure 43. Pulse Width Modulation Mode Timing Example with 2 Output Compare Functions  
2ED0 2ED1 2ED2  
34E2 FFFC  
FFFC FFFD FFFE  
34E2  
COUNTER  
OCMP1  
OLVL2  
OLVL1  
OLVL2  
compare2  
compare1  
compare2  
Note: OC1R=2ED0h, OC2R=34E2, OLVL1=0, OLVL2= 1  
66/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
10.3.3.6 Pulse Width Modulation Mode  
If OLVL1=1 and OLVL2=0 the length of the posi-  
tive pulse is the difference between the OC2R and  
OC1R registers.  
Pulse Width Modulation (PWM) mode enables the  
generation of a signal with a frequency and pulse  
length determined by the value of the OC1R and  
OC2R registers.  
If OLVL1=OLVL2 a continuous signal will be seen  
on the OCMP1 pin.  
Pulse Width Modulation mode uses the complete  
Output Compare 1 function plus the OC2R regis-  
ter, and so this functionality can not be used when  
PWM mode is activated.  
The OCiR register value required for a specific tim-  
ing application can be calculated using the follow-  
ing formula:  
t * fCPU  
- 5  
OCiR Value =  
In PWM mode, double buffering is implemented on  
the output compare registers. Any new values writ-  
ten in the OC1R and OC2R registers are taken  
into account only at the end of the PWM period  
(OC2) to avoid spikes on the PWM output pin  
(OCMP1).  
PRESC  
Where:  
t
= Signal or pulse period (in seconds)  
= CPU clock frequency (in hertz)  
f
CPU  
= Timer prescaler factor (2, 4 or 8 depend-  
ing on CC[1:0] bits, see Table 16)  
PRESC  
Procedure  
If the timer clock is an external clock the formula is:  
To use pulse width modulation mode:  
OCiR = t fEXT -5  
1. Load the OC2R register with the value corre-  
sponding to the period of the signal using the  
formula in the opposite column.  
*
Where:  
t
f
= Signal or pulse period (in seconds)  
2. Load the OC1R register with the value corre-  
sponding to the period of the pulse if (OLVL1=0  
and OLVL2=1) using the formula in the oppo-  
site column.  
= External timer clock frequency (in hertz)  
EXT  
The Output Compare 2 event causes the counter  
to be initialized to FFFCh (See Figure 43)  
3. Select the following in the CR1 register:  
Notes:  
– Using the OLVL1 bit, select the level to be ap-  
plied to the OCMP1 pin after a successful  
comparison with the OC1R register.  
1. After a write instruction to the OCiHR register,  
the output compare function is inhibited until the  
OCiLR register is also written.  
– Using the OLVL2 bit, select the level to be ap-  
plied to the OCMP1 pin after a successful  
comparison with the OC2R register.  
2. The OCF1 and OCF2 bits cannot be set by  
hardware in PWM mode therefore the Output  
Compare interrupt is inhibited.  
4. Select the following in the CR2 register:  
3. The ICF1 bit is set by hardware when the coun-  
ter reaches the OC2R value and can produce a  
timer interrupt if the ICIE bit is set and the I bit is  
cleared.  
– Set OC1E bit: the OCMP1 pin is then dedicat-  
ed to the output compare 1 function.  
– Set the PWM bit.  
4. In PWM mode the ICAP1 pin can not be used  
to perform input capture because it is discon-  
nected to the timer. The ICAP2 pin can be used  
to perform input capture (ICF2 can be set and  
IC2R can be loaded) but the user must take  
care that the counter is reset each period and  
ICF1 can also generates interrupt if ICIE is set.  
– Select the timer clock (CC[1:0]) (see Table 16  
Clock Control Bits).  
Pulse Width Modulation cycle  
When  
Counter  
= OC1R  
OCMP1 = OLVL1  
5. When the Pulse Width Modulation (PWM) and  
One Pulse Mode (OPM) bits are both set, the  
PWM mode is the only active one.  
OCMP1 = OLVL2  
When  
Counter  
= OC2R  
Counter is reset  
to FFFCh  
ICF1 bit is set  
67/157  
1
ST7232A  
16-BIT TIMER (Cont’d)  
10.3.4 Low Power Modes  
Mode  
Description  
No effect on 16-bit Timer.  
Timer interrupts cause the device to exit from WAIT mode.  
WAIT  
16-bit Timer registers are frozen.  
In HALT mode, the counter stops counting until Halt mode is exited. Counting resumes from the previous  
count when the MCU is woken up by an interrupt with “exit from HALT mode” capability or from the counter  
reset value when the MCU is woken up by a RESET.  
HALT  
If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is armed. Consequent-  
ly, when the MCU is woken up by an interrupt with “exit from HALT mode” capability, the ICFi bit is set, and  
the counter value present when exiting from HALT mode is captured into the ICiR register.  
10.3.5 Interrupts  
Enable  
Control from  
Bit  
Exit  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Wait  
Yes  
Yes  
Yes  
Yes  
Yes  
Input Capture 1 event/Counter reset in PWM mode  
Input Capture 2 event  
ICF1  
ICF2  
No  
No  
No  
No  
No  
ICIE  
Output Compare 1 event (not available in PWM mode)  
Output Compare 2 event (not available in PWM mode)  
Timer Overflow event  
OCF1  
OCF2  
TOF  
OCIE  
TOIE  
Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chap-  
ter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt  
mask in the CC register is reset (RIM instruction).  
10.3.6 Summary of Timer modes  
TIMER RESOURCES  
MODES  
Input Capture 1  
Input Capture 2  
Output Compare 1 Output Compare 2  
2)  
Input Capture (1 and/or 2)  
Output Compare (1 and/or 2)  
One Pulse Mode  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
1)  
3)  
2)  
Not Recommended  
Not Recommended  
Partially  
No  
PWM Mode  
No  
No  
1) See note 4 in Section 10.3.3.5 One Pulse Mode  
2) See note 5 and 6 in Section 10.3.3.5 One Pulse Mode  
3) See note 4 in Section 10.3.3.6 Pulse Width Modulation Mode  
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ST7232A  
16-BIT TIMER (Cont’d)  
10.3.7 Register Description  
Bit 4 = FOLV2 Forced Output Compare 2.  
This bit is set and cleared by software.  
0: No effect on the OCMP2 pin.  
Each Timer is associated with three control and  
status registers, and with six pairs of data registers  
(16-bit values) relating to the two input captures,  
the two output compares, the counter and the al-  
ternate counter.  
1:Forces the OLVL2 bit to be copied to the  
OCMP2 pin, if the OC2E bit is set and even if  
there is no successful comparison.  
Bit 3 = FOLV1 Forced Output Compare 1.  
This bit is set and cleared by software.  
0: No effect on the OCMP1 pin.  
CONTROL REGISTER 1 (CR1)  
Read/Write  
1: Forces OLVL1 to be copied to the OCMP1 pin, if  
the OC1E bit is set and even if there is no suc-  
cessful comparison.  
Reset Value: 0000 0000 (00h)  
7
0
ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1  
Bit 2 = OLVL2 Output Level 2.  
This bit is copied to the OCMP2 pin whenever a  
successful comparison occurs with the OC2R reg-  
ister and OCxE is set in the CR2 register. This val-  
ue is copied to the OCMP1 pin in One Pulse Mode  
and Pulse Width Modulation mode.  
Bit 7 = ICIE Input Capture Interrupt Enable.  
0: Interrupt is inhibited.  
1: A timer interrupt is generated whenever the  
ICF1 or ICF2 bit of the SR register is set.  
Bit 6 = OCIE Output Compare Interrupt Enable.  
0: Interrupt is inhibited.  
1: A timer interrupt is generated whenever the  
OCF1 or OCF2 bit of the SR register is set.  
Bit 1 = IEDG1 Input Edge 1.  
This bit determines which type of level transition  
on the ICAP1 pin will trigger the capture.  
0: A falling edge triggers the capture.  
1: A rising edge triggers the capture.  
Bit 5 = TOIE Timer Overflow Interrupt Enable.  
0: Interrupt is inhibited.  
1: A timer interrupt is enabled whenever the TOF  
bit of the SR register is set.  
Bit 0 = OLVL1 Output Level 1.  
The OLVL1 bit is copied to the OCMP1 pin when-  
ever a successful comparison occurs with the  
OC1R register and the OC1E bit is set in the CR2  
register.  
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ST7232A  
16-BIT TIMER (Cont’d)  
CONTROL REGISTER 2 (CR2)  
Read/Write  
Bit 4 = PWM Pulse Width Modulation.  
0: PWM mode is not active.  
1: PWM mode is active, the OCMP1 pin outputs a  
programmable cyclic signal; the length of the  
pulse depends on the value of OC1R register;  
the period depends on the value of OC2R regis-  
ter.  
Reset Value: 0000 0000 (00h)  
7
0
OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG  
Bit 3, 2 = CC[1:0] Clock Control.  
Bit 7 = OC1E Output Compare 1 Pin Enable.  
This bit is used only to output the signal from the  
timer on the OCMP1 pin (OLV1 in Output Com-  
pare mode, both OLV1 and OLV2 in PWM and  
one-pulse mode). Whatever the value of the OC1E  
bit, the Output Compare 1 function of the timer re-  
mains active.  
0: OCMP1 pin alternate function disabled (I/O pin  
free for general-purpose I/O).  
1: OCMP1 pin alternate function enabled.  
The timer clock mode depends on these bits:  
Table 16. Clock Control Bits  
Timer Clock  
fCPU / 4  
CC1  
CC0  
0
0
1
0
1
0
fCPU / 2  
fCPU / 8  
External Clock (where  
available)  
1
1
Bit 6 = OC2E Output Compare 2 Pin Enable.  
This bit is used only to output the signal from the  
timer on the OCMP2 pin (OLV2 in Output Com-  
pare mode). Whatever the value of the OC2E bit,  
the Output Compare 2 function of the timer re-  
mains active.  
0: OCMP2 pin alternate function disabled (I/O pin  
free for general-purpose I/O).  
1: OCMP2 pin alternate function enabled.  
Note: If the external clock pin is not available, pro-  
gramming the external clock configuration stops  
the counter.  
Bit 1 = IEDG2 Input Edge 2.  
This bit determines which type of level transition  
on the ICAP2 pin will trigger the capture.  
0: A falling edge triggers the capture.  
1: A rising edge triggers the capture.  
Bit 5 = OPM One Pulse Mode.  
0: One Pulse Mode is not active.  
1: One Pulse Mode is active, the ICAP1 pin can be  
used to trigger one pulse on the OCMP1 pin; the  
active transition is given by the IEDG1 bit. The  
length of the generated pulse depends on the  
contents of the OC1R register.  
Bit 0 = EXEDG External Clock Edge.  
This bit determines which type of level transition  
on the external clock pin EXTCLK will trigger the  
counter register.  
0: A falling edge triggers the counter register.  
1: A rising edge triggers the counter register.  
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ST7232A  
16-BIT TIMER (Cont’d)  
CONTROL/STATUS REGISTER (CSR)  
Read Only (except bit 2 R/W)  
Reset Value: xxxx x0xx (xxh)  
7
Note: Reading or writing the ACLR register does  
not clear TOF.  
Bit 4 = ICF2 Input Capture Flag 2.  
0: No input capture (reset value).  
1: An input capture has occurred on the ICAP2  
pin. To clear this bit, first read the SR register,  
then read or write the low byte of the IC2R  
(IC2LR) register.  
0
0
ICF1 OCF1 TOF ICF2 OCF2 TIMD  
0
Bit 7 = ICF1 Input Capture Flag 1.  
0: No input capture (reset value).  
1: An input capture has occurred on the ICAP1 pin  
or the counter has reached the OC2R value in  
PWM mode. To clear this bit, first read the SR  
register, then read or write the low byte of the  
IC1R (IC1LR) register.  
Bit 3 = OCF2 Output Compare Flag 2.  
0: No match (reset value).  
1: The content of the free running counter has  
matched the content of the OC2R register. To  
clear this bit, first read the SR register, then read  
or write the low byte of the OC2R (OC2LR) reg-  
ister.  
Bit 6 = OCF1 Output Compare Flag 1.  
0: No match (reset value).  
1: The content of the free running counter has  
matched the content of the OC1R register. To  
clear this bit, first read the SR register, then read  
or write the low byte of the OC1R (OC1LR) reg-  
ister.  
Bit 2 = TIMD Timer disable.  
This bit is set and cleared by software. When set, it  
freezes the timer prescaler and counter and disa-  
bled the output functions (OCMP1 and OCMP2  
pins) to reduce power consumption. Access to the  
timer registers is still available, allowing the timer  
configuration to be changed, or the counter reset,  
while it is disabled.  
Bit 5 = TOF Timer Overflow Flag.  
0: No timer overflow (reset value).  
1:The free running counter rolled over from FFFFh  
to 0000h. To clear this bit, first read the SR reg-  
ister, then read or write the low byte of the CR  
(CLR) register.  
0: Timer enabled  
1: Timer prescaler, counter and outputs disabled  
Bits 1:0 = Reserved, must be kept cleared.  
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ST7232A  
16-BIT TIMER (Cont’d)  
INPUT CAPTURE 1 HIGH REGISTER (IC1HR)  
OUTPUT COMPARE  
(OC1HR)  
1
HIGH REGISTER  
Read Only  
Reset Value: Undefined  
Read/Write  
Reset Value: 1000 0000 (80h)  
This is an 8-bit read only register that contains the  
high part of the counter value (transferred by the  
input capture 1 event).  
This is an 8-bit register that contains the high part  
of the value to be compared to the CHR register.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
INPUT CAPTURE 1 LOW REGISTER (IC1LR)  
OUTPUT COMPARE  
(OC1LR)  
1
LOW REGISTER  
Read Only  
Reset Value: Undefined  
Read/Write  
Reset Value: 0000 0000 (00h)  
This is an 8-bit read only register that contains the  
low part of the counter value (transferred by the in-  
put capture 1 event).  
This is an 8-bit register that contains the low part of  
the value to be compared to the CLR register.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
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1
ST7232A  
16-BIT TIMER (Cont’d)  
OUTPUT COMPARE  
(OC2HR)  
2
HIGH REGISTER  
COUNTER HIGH REGISTER (CHR)  
Read Only  
Reset Value: 1111 1111 (FFh)  
Read/Write  
Reset Value: 1000 0000 (80h)  
This is an 8-bit register that contains the high part  
of the counter value.  
This is an 8-bit register that contains the high part  
of the value to be compared to the CHR register.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
COUNTER LOW REGISTER (CLR)  
OUTPUT COMPARE  
(OC2LR)  
2
LOW REGISTER  
Read Only  
Reset Value: 1111 1100 (FCh)  
Read/Write  
Reset Value: 0000 0000 (00h)  
This is an 8-bit register that contains the low part of  
the counter value. A write to this register resets the  
counter. An access to this register after accessing  
the CSR register clears the TOF bit.  
This is an 8-bit register that contains the low part of  
the value to be compared to the CLR register.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
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1
ST7232A  
16-BIT TIMER (Cont’d)  
ALTERNATE COUNTER HIGH REGISTER  
INPUT CAPTURE 2 HIGH REGISTER (IC2HR)  
Read Only  
(ACHR)  
Read Only  
Reset Value: 1111 1111 (FFh)  
Reset Value: Undefined  
This is an 8-bit read only register that contains the  
high part of the counter value (transferred by the  
Input Capture 2 event).  
This is an 8-bit register that contains the high part  
of the counter value.  
7
0
7
0
MSB  
LSB  
MSB  
LSB  
ALTERNATE COUNTER LOW REGISTER  
INPUT CAPTURE 2 LOW REGISTER (IC2LR)  
Read Only  
(ACLR)  
Read Only  
Reset Value: 1111 1100 (FCh)  
Reset Value: Undefined  
This is an 8-bit read only register that contains the  
low part of the counter value (transferred by the In-  
put Capture 2 event).  
This is an 8-bit register that contains the low part of  
the counter value. A write to this register resets the  
counter. An access to this register after an access  
to CSR register does not clear the TOF bit in the  
CSR register.  
7
0
MSB  
LSB  
7
0
MSB  
LSB  
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ST7232A  
16-BIT TIMER (Cont’d)  
Table 17. 16-Bit Timer Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
Timer A: 32 CR1  
Timer B: 42 Reset Value  
ICIE  
0
OCIE  
0
TOIE  
0
FOLV2  
0
FOLV1  
0
OLVL2  
0
IEDG1  
0
OLVL1  
0
Timer A: 31 CR2  
Timer B: 41 Reset Value  
OC1E  
0
OC2E  
0
OPM  
0
PWM  
0
CC1  
0
CC0  
0
IEDG2  
0
EXEDG  
0
Timer A: 33 CSR  
Timer B: 43 Reset Value  
ICF1  
x
OCF1  
x
TOF  
x
ICF2  
x
OCF2  
x
TIMD  
0
-
x
-
x
Timer A: 34 IC1HR  
Timer B: 44 Reset Value  
MSB  
x
LSB  
x
x
x
0
0
0
0
1
1
1
1
x
x
x
x
0
0
0
0
1
1
1
1
x
x
x
x
0
0
0
0
1
1
1
1
x
x
x
x
0
0
0
0
1
1
1
1
x
x
x
x
0
0
0
0
1
1
1
1
x
x
x
x
0
0
0
0
1
0
1
0
x
x
Timer A: 35 IC1LR  
Timer B: 45 Reset Value  
MSB  
x
LSB  
x
Timer A: 36 OC1HR  
Timer B: 46 Reset Value  
MSB  
1
LSB  
0
Timer A: 37 OC1LR  
Timer B: 47 Reset Value  
MSB  
0
LSB  
0
Timer A: 3E OC2HR  
Timer B: 4E Reset Value  
MSB  
1
LSB  
0
Timer A: 3F OC2LR  
Timer B: 4F Reset Value  
MSB  
0
LSB  
0
Timer A: 38 CHR  
Timer B: 48 Reset Value  
MSB  
1
LSB  
1
Timer A: 39 CLR  
Timer B: 49 Reset Value  
MSB  
1
LSB  
0
Timer A: 3A ACHR  
Timer B: 4A Reset Value  
MSB  
1
LSB  
1
Timer A: 3B ACLR  
Timer B: 4B Reset Value  
MSB  
1
LSB  
0
Timer A: 3C IC2HR  
Timer B: 4C Reset Value  
MSB  
x
LSB  
x
Timer A: 3D IC2LR  
Timer B: 4D Reset Value  
MSB  
x
LSB  
x
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ST7232A  
10.4 SERIAL PERIPHERAL INTERFACE (SPI)  
10.4.1 Introduction  
Note: In slave mode, continuous transmission is  
not possible at maximum frequency due to the  
software overhead for clearing status flags and to  
initiate the next transmission sequence.  
The Serial Peripheral Interface (SPI) allows full-  
duplex, synchronous, serial communication with  
external devices. An SPI system may consist of a  
master and one or more slaves however the SPI  
interface can not be a master in a multi-master  
system.  
10.4.3 General Description  
Figure 44 shows the serial peripheral interface  
(SPI) block diagram. There are 3 registers:  
10.4.2 Main Features  
– SPI Control Register (SPICR)  
– SPI Control/Status Register (SPICSR)  
– SPI Data Register (SPIDR)  
Full duplex synchronous transfers (on 3 lines)  
Simplex synchronous transfers (on 2 lines)  
Master or slave operation  
The SPI is connected to external devices through  
4 pins:  
Six master mode frequencies (f  
/4 max.)  
CPU  
f  
/2 max. slave mode frequency (see note)  
CPU  
– MISO: Master In / Slave Out data  
– MOSI: Master Out / Slave In data  
SS Management by software or hardware  
Programmable clock polarity and phase  
End of transfer interrupt flag  
– SCK: Serial Clock out by SPI masters and in-  
put by SPI slaves  
Write collision, Master Mode Fault and Overrun  
flags  
Figure 44. Serial Peripheral Interface Block Diagram  
Data/Address Bus  
Read  
SPIDR  
Interrupt  
request  
Read Buffer  
MOSI  
7
0
SPICSR  
MISO  
8-Bit Shift Register  
SPIF WCOL OVR MODF  
0
SOD SSM SSI  
Write  
SOD  
bit  
1
SS  
SPI  
STATE  
0
SCK  
CONTROL  
7
0
SPICR  
MSTR  
SPR0  
SPIE SPE SPR2  
CPOL CPHA SPR1  
MASTER  
CONTROL  
SERIAL CLOCK  
GENERATOR  
SS  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
– SS: Slave select:  
The communication is always initiated by the mas-  
ter. When the master device transmits data to a  
slave device via MOSI pin, the slave device re-  
sponds by sending data to the master device via  
the MISO pin. This implies full duplex communica-  
tion with both data out and data in synchronized  
with the same clock signal (which is provided by  
the master device via the SCK pin).  
This input signal acts as a ‘chip select’ to let  
the SPI master communicate with slaves indi-  
vidually and to avoid contention on the data  
lines. Slave SS inputs can be driven by stand-  
ard I/O ports on the master MCU.  
10.4.3.1 Functional Description  
A basic example of interconnections between a  
single master and a single slave is illustrated in  
Figure 45.  
To use a single data line, the MISO and MOSI pins  
must be connected at each node ( in this case only  
simplex communication is possible).  
The MOSI pins are connected together and the  
MISO pins are connected together. In this way  
data is transferred serially between master and  
slave (most significant bit first).  
Four possible data/clock timing relationships may  
be chosen (see Figure 48) but master and slave  
must be programmed with the same timing mode.  
Figure 45. Single Master/ Single Slave Application  
SLAVE  
MASTER  
MSBit  
LSBit  
MSBit  
LSBit  
MISO  
MOSI  
MISO  
MOSI  
8-BIT SHIFT REGISTER  
8-BIT SHIFT REGISTER  
SPI  
CLOCK  
GENERATOR  
SCK  
SS  
SCK  
SS  
+5V  
Not used if SS is managed  
by software  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.3.2 Slave Select Management  
In Slave Mode:  
As an alternative to using the SS pin to control the  
Slave Select signal, the application can choose to  
manage the Slave Select signal by software. This  
is configured by the SSM bit in the SPICSR regis-  
ter (see Figure 47)  
There are two cases depending on the data/clock  
timing relationship (see Figure 46):  
If CPHA=1 (data latched on 2nd clock edge):  
– SS internal must be held low during the entire  
transmission. This implies that in single slave  
applications the SS pin either can be tied to  
In software management, the external SS pin is  
free for other application uses and the internal SS  
signal level is driven by writing to the SSI bit in the  
SPICSR register.  
V
, or made free for standard I/O by manag-  
SS  
ing the SS function by software (SSM= 1 and  
SSI=0 in the in the SPICSR register)  
If CPHA=0 (data latched on 1st clock edge):  
In Master mode:  
– SS internal must be held low during byte  
transmission and pulled high between each  
byte to allow the slave to write to the shift reg-  
ister. If SS is not pulled high, a Write Collision  
error will occur when the slave writes to the  
shift register (see Section 10.4.5.3).  
– SS internal must be held high continuously  
Figure 46. Generic SS Timing Diagram  
Byte 3  
Byte 2  
MOSI/MISO  
Master SS  
Byte 1  
Slave SS  
(if CPHA=0)  
Slave SS  
(if CPHA=1)  
Figure 47. Hardware/Software Slave Select Management  
SSM bit  
SSI bit  
1
0
SS internal  
SS external pin  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.3.3 Master Mode Operation  
Note: While the SPIF bit is set, all writes to the  
SPIDR register are inhibited until the SPICSR reg-  
ister is read.  
In master mode, the serial clock is output on the  
SCK pin. The clock frequency, polarity and phase  
are configured by software (refer to the description  
of the SPICSR register).  
10.4.3.5 Slave Mode Operation  
In slave mode, the serial clock is received on the  
SCK pin from the master device.  
Note: The idle state of SCK must correspond to  
the polarity selected in the SPICSR register (by  
pulling up SCK if CPOL=1 or pulling down SCK if  
CPOL=0).  
To operate the SPI in slave mode:  
1. Write to the SPICSR register to perform the fol-  
lowing actions:  
To operate the SPI in master mode, perform the  
following steps in order (if the SPICSR register is  
not written first, the SPICR register setting (MSTR  
bit) may be not taken into account):  
– Select the clock polarity and clock phase by  
configuring the CPOL and CPHA bits (see  
Figure 48).  
Note: The slave must have the same CPOL  
and CPHA settings as the master.  
1. Write to the SPICR register:  
– Manage the SS pin as described in Section  
10.4.3.2 and Figure 46. If CPHA=1 SS must  
be held low continuously. If CPHA=0 SS must  
be held low during byte transmission and  
pulled up between each byte to let the slave  
write in the shift register.  
– Select the clock frequency by configuring the  
SPR[2:0] bits.  
– Select the clock polarity and clock phase by  
configuring the CPOL and CPHA bits. Figure  
48 shows the four possible configurations.  
Note: The slave must have the same CPOL  
and CPHA settings as the master.  
2. Write to the SPICR register to clear the MSTR  
bit and set the SPE bit to enable the SPI I/O  
functions.  
2. Write to the SPICSR register:  
– Either set the SSM bit and set the SSI bit or  
clear the SSM bit and tie the SS pin high for  
the complete byte transmit sequence.  
10.4.3.6 Slave Mode Transmit Sequence  
When software writes to the SPIDR register, the  
data byte is loaded into the 8-bit shift register and  
then shifted out serially to the MISO pin most sig-  
nificant bit first.  
3. Write to the SPICR register:  
– Set the MSTR and SPE bits  
Note: MSTR and SPE bits remain set only if  
SS is high).  
The transmit sequence begins when the slave de-  
vice receives the clock signal and the most signifi-  
cant bit of the data on its MOSI pin.  
The transmit sequence begins when software  
writes a byte in the SPIDR register.  
10.4.3.4 Master Mode Transmit Sequence  
When data transfer is complete:  
– The SPIF bit is set by hardware  
When software writes to the SPIDR register, the  
data byte is loaded into the 8-bit shift register and  
then shifted out serially to the MOSI pin most sig-  
nificant bit first.  
– An interrupt request is generated if SPIE bit is  
set and interrupt mask in the CCR register is  
cleared.  
When data transfer is complete:  
– The SPIF bit is set by hardware  
Clearing the SPIF bit is performed by the following  
software sequence:  
– An interrupt request is generated if the SPIE  
bit is set and the interrupt mask in the CCR  
register is cleared.  
1. An access to the SPICSR register while the  
SPIF bit is set.  
2. A write or a read to the SPIDR register.  
Clearing the SPIF bit is performed by the following  
software sequence:  
Notes: While the SPIF bit is set, all writes to the  
SPIDR register are inhibited until the SPICSR reg-  
ister is read.  
1. An access to the SPICSR register while the  
SPIF bit is set  
The SPIF bit can be cleared during a second  
transmission; however, it must be cleared before  
the second SPIF bit in order to prevent an Overrun  
condition (see Section 10.4.5.2).  
2. A read to the SPIDR register.  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.4 Clock Phase and Clock Polarity  
Figure 48, shows an SPI transfer with the four  
combinations of the CPHA and CPOL bits. The di-  
agram may be interpreted as a master or slave  
timing diagram where the SCK pin, the MISO pin,  
the MOSI pin are directly connected between the  
master and the slave device.  
Four possible timing relationships may be chosen  
by software, using the CPOL and CPHA bits (See  
Figure 48).  
Note: The idle state of SCK must correspond to  
the polarity selected in the SPICSR register (by  
pulling up SCK if CPOL=1 or pulling down SCK if  
CPOL=0).  
Note: If CPOL is changed at the communication  
byte boundaries, the SPI must be disabled by re-  
setting the SPE bit.  
The combination of the CPOL clock polarity and  
CPHA (clock phase) bits selects the data capture  
clock edge  
Figure 48. Data Clock Timing Diagram  
CPHA =1  
SCK  
(CPOL = 1)  
SCK  
(CPOL = 0)  
Bit 4  
Bit 4  
Bit3  
Bit3  
Bit 2  
Bit 2  
Bit 1  
Bit 1  
LSBit  
LSBit  
MSBit Bit 6  
MSBit Bit 6  
Bit 5  
Bit 5  
MISO  
(from master)  
MOSI  
(from slave)  
SS  
(to slave)  
CAPTURE STROBE  
CPHA =0  
SCK  
(CPOL = 1)  
SCK  
(CPOL = 0)  
Bit 4  
Bit 4  
Bit3  
Bit 2  
Bit 2  
Bit 1  
Bit 1  
LSBit  
LSBit  
MISO  
(from master)  
MSBit Bit 6  
MSBit Bit 6  
Bit 5  
Bit 5  
Bit3  
MOSI  
(from slave)  
SS  
(to slave)  
CAPTURE STROBE  
Note: This figure should not be used as a replacement for parametric information.  
Refer to the Electrical Characteristics chapter.  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.5 Error Flags  
not cleared the SPIF bit issued from the previously  
transmitted byte.  
10.4.5.1 Master Mode Fault (MODF)  
When an Overrun occurs:  
Master mode fault occurs when the master device  
has its SS pin pulled low.  
– The OVR bit is set and an interrupt request is  
generated if the SPIE bit is set.  
When a Master mode fault occurs:  
In this case, the receiver buffer contains the byte  
sent after the SPIF bit was last cleared. A read to  
the SPIDR register returns this byte. All other  
bytes are lost.  
– The MODF bit is set and an SPI interrupt re-  
quest is generated if the SPIE bit is set.  
– The SPE bit is reset. This blocks all output  
from the device and disables the SPI periph-  
eral.  
The OVR bit is cleared by reading the SPICSR  
register.  
– The MSTR bit is reset, thus forcing the device  
into slave mode.  
10.4.5.3 Write Collision Error (WCOL)  
A write collision occurs when the software tries to  
write to the SPIDR register while a data transfer is  
taking place with an external device. When this  
happens, the transfer continues uninterrupted;  
and the software write will be unsuccessful.  
Clearing the MODF bit is done through a software  
sequence:  
1. A read access to the SPICSR register while the  
MODF bit is set.  
2. A write to the SPICR register.  
Write collisions can occur both in master and slave  
mode. See also Section 10.4.3.2 Slave Select  
Management.  
Notes: To avoid any conflicts in an application  
with multiple slaves, the SS pin must be pulled  
high during the MODF bit clearing sequence. The  
SPE and MSTR bits may be restored to their orig-  
inal state during or after this clearing sequence.  
Note: a "read collision" will never occur since the  
received data byte is placed in a buffer in which  
access is always synchronous with the MCU oper-  
ation.  
Hardware does not allow the user to set the SPE  
and MSTR bits while the MODF bit is set except in  
the MODF bit clearing sequence.  
The WCOL bit in the SPICSR register is set if a  
write collision occurs.  
10.4.5.2 Overrun Condition (OVR)  
No SPI interrupt is generated when the WCOL bit  
is set (the WCOL bit is a status flag only).  
An overrun condition occurs, when the master de-  
vice has sent a data byte and the slave device has  
Clearing the WCOL bit is done through a software  
sequence (see Figure 49).  
Figure 49. Clearing the WCOL bit (Write Collision Flag) Software Sequence  
Clearing sequence after SPIF = 1 (end of a data byte transfer)  
Read SPICSR  
1st Step  
RESULT  
SPIF =0  
WCOL=0  
2nd Step  
Read SPIDR  
Clearing sequence before SPIF = 1 (during a data byte transfer)  
Read SPICSR  
1st Step  
Note: Writing to the SPIDR regis-  
ter instead of reading it does not  
reset the WCOL bit  
RESULT  
2nd Step  
Read SPIDR  
WCOL=0  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.5.4 Single Master Systems  
Note: To prevent a bus conflict on the MISO line  
the master allows only one active slave device  
during a transmission.  
A typical single master system may be configured,  
using an MCU as the master and four MCUs as  
slaves (see Figure 50).  
For more security, the slave device may respond  
to the master with the received data byte. Then the  
master will receive the previous byte back from the  
slave device if all MISO and MOSI pins are con-  
nected and the slave has not written to its SPIDR  
register.  
The master device selects the individual slave de-  
vices by using four pins of a parallel port to control  
the four SS pins of the slave devices.  
The SS pins are pulled high during reset since the  
master device ports will be forced to be inputs at  
that time, thus disabling the slave devices.  
Other transmission security methods can use  
ports for handshake lines or data bytes with com-  
mand fields.  
Figure 50. Single Master / Multiple Slave Configuration  
SS  
SS  
SS  
SS  
SCK  
SCK  
Slave  
SCK  
Slave  
MCU  
SCK  
Slave  
MCU  
Slave  
MCU  
MCU  
MOSI MISO  
MOSI MISO  
MOSI MISO  
MOSI MISO  
MOSI MISO  
SCK  
Master  
MCU  
5V  
SS  
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SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.6 Low Power Modes  
Note: When waking up from Halt mode, if the SPI  
remains in Slave mode, it is recommended to per-  
form an extra communications cycle to bring the  
SPI from Halt mode state to normal state. If the  
SPI exits from Slave mode, it returns to normal  
state immediately.  
Mode  
Description  
No effect on SPI.  
WAIT  
SPI interrupt events cause the device to exit  
from WAIT mode.  
SPI registers are frozen.  
Caution: The SPI can wake up the ST7 from Halt  
mode only if the Slave Select signal (external SS  
pin or the SSI bit in the SPICSR register) is low  
when the ST7 enters Halt mode. So if Slave selec-  
tion is configured as external (see Section  
10.4.3.2), make sure the master drives a low level  
on the SS pin when the slave enters Halt mode.  
In HALT mode, the SPI is inactive. SPI oper-  
ation resumes when the MCU is woken up by  
an interrupt with “exit from HALT mode” ca-  
pability. The data received is subsequently  
read from the SPIDR register when the soft-  
ware is running (interrupt vector fetching). If  
several data are received before the wake-  
up event, then an overrun error is generated.  
This error can be detected after the fetch of  
the interrupt routine that woke up the device.  
HALT  
10.4.7 Interrupts  
Enable  
Control from  
Bit  
Exit  
Exit  
from  
Halt  
Event  
Flag  
Interrupt Event  
Wait  
10.4.6.1 Using the SPI to wakeup the MCU from  
Halt mode  
SPI End of Transfer  
Event  
SPIF  
Yes  
Yes  
In slave configuration, the SPI is able to wakeup  
the ST7 device from HALT mode through a SPIF  
interrupt. The data received is subsequently read  
from the SPIDR register when the software is run-  
ning (interrupt vector fetch). If multiple data trans-  
fers have been performed before software clears  
the SPIF bit, then the OVR bit is set by hardware.  
Master Mode Fault  
Event  
SPIE  
MODF  
OVR  
Yes  
Yes  
No  
No  
Overrun Error  
Note: The SPI interrupt events are connected to  
the same interrupt vector (see Interrupts chapter).  
They generate an interrupt if the corresponding  
Enable Control Bit is set and the interrupt mask in  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
10.4.8 Register Description  
CONTROL REGISTER (SPICR)  
Read/Write  
Bit 3 = CPOL Clock Polarity.  
This bit is set and cleared by software. This bit de-  
termines the idle state of the serial Clock. The  
CPOL bit affects both the master and slave  
modes.  
Reset Value: 0000 xxxx (0xh)  
7
0
SPIE SPE SPR2 MSTR CPOL CPHA SPR1 SPR0  
0: SCK pin has a low level idle state  
1: SCK pin has a high level idle state  
Note: If CPOL is changed at the communication  
byte boundaries, the SPI must be disabled by re-  
setting the SPE bit.  
Bit 7 = SPIE Serial Peripheral Interrupt Enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SPI interrupt is generated whenever  
SPIF=1, MODF=1 or OVR=1 in the SPICSR  
register  
Bit 2 = CPHA Clock Phase.  
This bit is set and cleared by software.  
0: The first clock transition is the first data capture  
edge.  
1: The second clock transition is the first capture  
edge.  
Bit 6 = SPE Serial Peripheral Output Enable.  
This bit is set and cleared by software. It is also  
cleared by hardware when, in master mode, SS=0  
(see Section 10.4.5.1 Master Mode Fault  
(MODF)). The SPE bit is cleared by reset, so the  
SPI peripheral is not initially connected to the ex-  
ternal pins.  
Note: The slave must have the same CPOL and  
CPHA settings as the master.  
Bits 1:0 = SPR[1:0] Serial Clock Frequency.  
These bits are set and cleared by software. Used  
with the SPR2 bit, they select the baud rate of the  
SPI serial clock SCK output by the SPI in master  
mode.  
0: I/O pins free for general purpose I/O  
1: SPI I/O pin alternate functions enabled  
Bit 5 = SPR2 Divider Enable.  
Note: These 2 bits have no effect in slave mode.  
This bit is set and cleared by software and is  
cleared by reset. It is used with the SPR[1:0] bits to  
set the baud rate. Refer to Table 18 SPI Master  
mode SCK Frequency.  
Table 18. SPI Master mode SCK Frequency  
Serial Clock  
SPR2 SPR1 SPR0  
0: Divider by 2 enabled  
1: Divider by 2 disabled  
f
f
/4  
/8  
1
0
0
1
0
0
0
0
0
1
1
1
0
0
1
0
0
1
CPU  
CPU  
Note: This bit has no effect in slave mode.  
f
f
f
/16  
/32  
/64  
CPU  
CPU  
CPU  
Bit 4 = MSTR Master Mode.  
This bit is set and cleared by software. It is also  
cleared by hardware when, in master mode, SS=0  
(see Section 10.4.5.1 Master Mode Fault  
(MODF)).  
f
/128  
CPU  
0: Slave mode  
1: Master mode. The function of the SCK pin  
changes from an input to an output and the func-  
tions of the MISO and MOSI pins are reversed.  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
CONTROL/STATUS REGISTER (SPICSR)  
Read/Write (some bits Read Only)  
Reset Value: 0000 0000 (00h)  
Bit 3 = Reserved, must be kept cleared.  
Bit 2 = SOD SPI Output Disable.  
7
0
This bit is set and cleared by software. When set, it  
disables the alternate function of the SPI output  
(MOSI in master mode / MISO in slave mode)  
0: SPI output enabled (if SPE=1)  
SPIF  
WCOL OVR MODF  
-
SOD SSM SSI  
1: SPI output disabled  
Bit 7 = SPIF Serial Peripheral Data Transfer Flag  
(Read only).  
Bit 1 = SSM SS Management.  
This bit is set by hardware when a transfer has  
been completed. An interrupt is generated if  
SPIE=1 in the SPICR register. It is cleared by a  
software sequence (an access to the SPICSR  
register followed by a write or a read to the  
SPIDR register).  
This bit is set and cleared by software. When set, it  
disables the alternate function of the SPI SS pin  
and uses the SSI bit value instead. See Section  
10.4.3.2 Slave Select Management.  
0: Hardware management (SS managed by exter-  
nal pin)  
0: Data transfer is in progress or the flag has been  
cleared.  
1: Data transfer between the device and an exter-  
nal device has been completed.  
1: Software management (internal SS signal con-  
trolled by SSI bit. External SS pin free for gener-  
al-purpose I/O)  
Note: While the SPIF bit is set, all writes to the  
SPIDR register are inhibited until the SPICSR reg-  
ister is read.  
Bit 0 = SSI SS Internal Mode.  
This bit is set and cleared by software. It acts as a  
‘chip select’ by controlling the level of the SS slave  
select signal when the SSM bit is set.  
0 : Slave selected  
Bit 6 = WCOL Write Collision status (Read only).  
This bit is set by hardware when a write to the  
SPIDR register is done during a transmit se-  
quence. It is cleared by a software sequence (see  
Figure 49).  
0: No write collision occurred  
1: A write collision has been detected  
1 : Slave deselected  
DATA I/O REGISTER (SPIDR)  
Read/Write  
Reset Value: Undefined  
7
0
Bit 5 = OVR SPI Overrun error (Read only).  
This bit is set by hardware when the byte currently  
being received in the shift register is ready to be  
transferred into the SPIDR register while SPIF = 1  
(See Section 10.4.5.2). An interrupt is generated if  
SPIE = 1 in SPICR register. The OVR bit is cleared  
by software reading the SPICSR register.  
0: No overrun error  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
The SPIDR register is used to transmit and receive  
data on the serial bus. In a master device, a write  
to this register will initiate transmission/reception  
of another byte.  
1: Overrun error detected  
Notes: During the last clock cycle the SPIF bit is  
set, a copy of the received data byte in the shift  
register is moved to a buffer. When the user reads  
the serial peripheral data I/O register, the buffer is  
actually being read.  
Bit 4 = MODF Mode Fault flag (Read only).  
This bit is set by hardware when the SS pin is  
pulled low in master mode (see Section 10.4.5.1  
Master Mode Fault (MODF)). An SPI interrupt can  
be generated if SPIE=1 in the SPICSR register.  
This bit is cleared by a software sequence (An ac-  
cess to the SPICR register while MODF=1 fol-  
lowed by a write to the SPICR register).  
While the SPIF bit is set, all writes to the SPIDR  
register are inhibited until the SPICSR register is  
read.  
Warning: A write to the SPIDR register places  
data directly into the shift register for transmission.  
0: No master mode fault detected  
1: A fault in master mode has been detected  
A read to the SPIDR register returns the value lo-  
cated in the buffer and not the content of the shift  
register (see Figure 44).  
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ST7232A  
SERIAL PERIPHERAL INTERFACE (Cont’d)  
Table 19. SPI Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
SPIDR  
Reset Value  
MSB  
x
LSB  
x
0021h  
0022h  
0023h  
x
x
x
x
x
x
SPICR  
Reset Value  
SPIE  
0
SPE  
0
SPR2  
0
MSTR  
0
CPOL  
x
CPHA  
x
SPR1  
x
SPR0  
x
SPICSR  
Reset Value  
SPIF  
0
WCOL  
0
OR  
0
MODF  
0
SOD  
0
SSM  
0
SSI  
0
0
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ST7232A  
10.5 SERIAL COMMUNICATIONS INTERFACE (SCI)  
10.5.1 Introduction  
10.5.3 General Description  
The Serial Communications Interface (SCI) offers  
a flexible means of full-duplex data exchange with  
external equipment requiring an industry standard  
NRZ asynchronous serial data format. The SCI of-  
fers a very wide range of baud rates using two  
baud rate generator systems.  
The interface is externally connected to another  
device by two pins (see Figure 52):  
– TDO: Transmit Data Output. When the transmit-  
ter and the receiver are disabled, the output pin  
returns to its I/O port configuration. When the  
transmitter and/or the receiver are enabled and  
nothing is to be transmitted, the TDO pin is at  
high level.  
10.5.2 Main Features  
Full duplex, asynchronous communications  
NRZ standard format (Mark/Space)  
Dual baud rate generator systems  
– RDI: Receive Data Input is the serial data input.  
Oversampling techniques are used for data re-  
covery by discriminating between valid incoming  
data and noise.  
Independently programmable transmit and  
receive baud rates up to 500K baud.  
Through these pins, serial data is transmitted and  
received as frames comprising:  
Programmable data word length (8 or 9 bits)  
Receive buffer full, Transmit buffer empty and  
– An Idle Line prior to transmission or reception  
– A start bit  
End of Transmission flags  
Two receiver wake-up modes:  
– Address bit (MSB)  
– A data word (8 or 9 bits) least significant bit first  
– A Stop bit indicating that the frame is complete.  
Thisinterfaceusestwotypesofbaudrategenerator:  
– Idle line  
Mutingfunctionformultiprocessorconfigurations  
– A conventional type for commonly-used baud  
rates,  
Separate enable bits for Transmitter and  
Receiver  
– An extended type with a prescaler offering a very  
wide range of baud rates even with non-standard  
oscillator frequencies.  
Four error detection flags:  
– Overrun error  
– Noise error  
– Frame error  
– Parity error  
Five interrupt sources with flags:  
– Transmit data register empty  
– Transmission complete  
– Receive data register full  
– Idle line received  
– Overrun error detected  
Parity control:  
– Transmits parity bit  
– Checks parity of received data byte  
Reduced power consumption mode  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Figure 51. SCI Block Diagram  
Write  
Read  
(DATA REGISTER) DR  
Received Data Register (RDR)  
Received Shift Register  
Transmit Data Register (TDR)  
TDO  
Transmit Shift Register  
RDI  
CR1  
R8 T8 SCID  
M WAKE PCE PS PIE  
WAKE  
UP  
TRANSMIT  
CONTROL  
RECEIVER  
CLOCK  
RECEIVER  
CONTROL  
UNIT  
CR2  
SR  
TIE TCIE RIE ILIE TE RE RWU SBK  
TDRE TC RDRF IDLE OR NF FE  
PE  
SCI  
INTERRUPT  
CONTROL  
TRANSMITTER  
CLOCK  
TRANSMITTER RATE  
CONTROL  
f
CPU  
/PR  
/16  
BRR  
SCP1  
SCT2  
SCT1SCT0SCR2 SCR1SCR0  
SCP0  
RECEIVER RATE  
CONTROL  
CONVENTIONAL BAUD RATE GENERATOR  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.4 Functional Description  
10.5.4.1 Serial Data Format  
The block diagram of the Serial Control Interface,  
is shown in Figure 51. It contains 6 dedicated reg-  
isters:  
Word length may be selected as being either 8 or 9  
bits by programming the M bit in the SCICR1 reg-  
ister (see Figure 51).  
– Two control registers (SCICR1 & SCICR2)  
– A status register (SCISR)  
The TDO pin is in low state during the start bit.  
The TDO pin is in high state during the stop bit.  
– A baud rate register (SCIBRR)  
An Idle character is interpreted as an entire frame  
of “1”s followed by the start bit of the next frame  
which contains data.  
– An extended prescaler receiver register (SCIER-  
PR)  
A Break character is interpreted on receiving “0”s  
for some multiple of the frame period. At the end of  
the last break frame the transmitter inserts an ex-  
tra “1” bit to acknowledge the start bit.  
– An extended prescaler transmitter register (SCI-  
ETPR)  
Refer to the register descriptions in Section  
10.5.7for the definitions of each bit.  
Transmission and reception are driven by their  
own baud rate generator.  
Figure 52. Word Length Programming  
9-bit Word length (M bit is set)  
Possible  
Next Data Frame  
Parity  
Data Frame  
Start  
Bit  
Next  
Start  
Bit  
Stop  
Bit  
Bit2  
Bit6  
Bit3  
Bit4  
Bit5  
Bit7  
Bit8  
Bit0 Bit1  
Bit  
Start  
Bit  
Idle Frame  
Start  
Bit  
Extra  
’1’  
Break Frame  
8-bit Word length (M bit is reset)  
Possible  
Parity  
Next Data Frame  
Data Frame  
Bit  
Next  
Start  
Bit  
Start  
Bit  
Stop  
Bit  
Bit2  
Bit1  
Bit3  
Bit4  
Bit5  
Bit6  
Bit0  
Bit7  
Start  
Bit  
Idle Frame  
Start  
Bit  
Extra  
’1’  
Break Frame  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.4.2 Transmitter  
When a frame transmission is complete (after the  
stop bit) the TC bit is set and an interrupt is gener-  
ated if the TCIE is set and the I bit is cleared in the  
CCR register.  
The transmitter can send data words of either 8 or  
9 bits depending on the M bit status. When the M  
bit is set, word length is 9 bits and the 9th bit (the  
MSB) has to be stored in the T8 bit in the SCICR1  
register.  
Clearing the TC bit is performed by the following  
software sequence:  
1. An access to the SCISR register  
2. A write to the SCIDR register  
Character Transmission  
During an SCI transmission, data shifts out least  
significant bit first on the TDO pin. In this mode,  
the SCIDR register consists of a buffer (TDR) be-  
tween the internal bus and the transmit shift regis-  
ter (see Figure 51).  
Note: The TDRE and TC bits are cleared by the  
same software sequence.  
Break Characters  
Setting the SBK bit loads the shift register with a  
break character. The break frame length depends  
on the M bit (see Figure 52).  
Procedure  
– Select the M bit to define the word length.  
As long as the SBK bit is set, the SCI send break  
frames to the TDO pin. After clearing this bit by  
software the SCI insert a logic 1 bit at the end of  
the last break frame to guarantee the recognition  
of the start bit of the next frame.  
– Select the desired baud rate using the SCIBRR  
and the SCIETPR registers.  
– Set the TE bit to assign the TDO pin to the alter-  
nate function and to send a idle frame as first  
transmission.  
Idle Characters  
– Access the SCISR register and write the data to  
send in the SCIDR register (this sequence clears  
the TDRE bit). Repeat this sequence for each  
data to be transmitted.  
Setting the TE bit drives the SCI to send an idle  
frame before the first data frame.  
Clearing and then setting the TE bit during a trans-  
mission sends an idle frame after the current word.  
Clearing the TDRE bit is always performed by the  
following software sequence:  
1. An access to the SCISR register  
2. A write to the SCIDR register  
Note: Resetting and setting the TE bit causes the  
data in the TDR register to be lost. Therefore the  
best time to toggle the TE bit is when the TDRE bit  
is set i.e. before writing the next byte in the SCIDR.  
The TDRE bit is set by hardware and it indicates:  
– The TDR register is empty.  
– The data transfer is beginning.  
– The next data can be written in the SCIDR regis-  
ter without overwriting the previous data.  
This flag generates an interrupt if the TIE bit is set  
and the I bit is cleared in the CCR register.  
When a transmission is taking place, a write in-  
struction to the SCIDR register stores the data in  
the TDR register and which is copied in the shift  
register at the end of the current transmission.  
When no transmission is taking place, a write in-  
struction to the SCIDR register places the data di-  
rectly in the shift register, the data transmission  
starts, and the TDRE bit is immediately set.  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.4.3 Receiver  
RDR register as long as the RDRF bit is not  
cleared.  
The SCI can receive data words of either 8 or 9  
bits. When the M bit is set, word length is 9 bits  
and the MSB is stored in the R8 bit in the SCICR1  
register.  
When a overrun error occurs:  
– The OR bit is set.  
– The RDR content will not be lost.  
– The shift register will be overwritten.  
Character reception  
During a SCI reception, data shifts in least signifi-  
cant bit first through the RDI pin. In this mode, the  
SCIDR register consists or a buffer (RDR) be-  
tween the internal bus and the received shift regis-  
ter (see Figure 51).  
– An interrupt is generated if the RIE bit is set and  
the I bit is cleared in the CCR register.  
The OR bit is reset by an access to the SCISR reg-  
ister followed by a SCIDR register read operation.  
Procedure  
Noise Error  
– Select the M bit to define the word length.  
Oversampling techniques are used for data recov-  
ery by discriminating between valid incoming data  
and noise. Normal data bits are considered valid if  
three consecutive samples (8th, 9th, 10th) have  
the same bit value, otherwise the NF flag is set. In  
the case of start bit detection, the NF flag is set on  
the basis of an algorithm combining both valid  
edge detection and three samples (8th, 9th, 10th).  
Therefore, to prevent the NF flag getting set during  
start bit reception, there should be a valid edge de-  
tection as well as three valid samples.  
– Select the desired baud rate using the SCIBRR  
and the SCIERPR registers.  
– Set the RE bit, this enables the receiver which  
begins searching for a start bit.  
When a character is received:  
– The RDRF bit is set. It indicates that the content  
of the shift register is transferred to the RDR.  
– An interrupt is generated if the RIE bit is set and  
the I bit is cleared in the CCR register.  
When noise is detected in a frame:  
– The error flags can be set if a frame error, noise  
or an overrun error has been detected during re-  
ception.  
– The NF flag is set at the rising edge of the RDRF  
bit.  
– Data is transferred from the Shift register to the  
SCIDR register.  
Clearing the RDRF bit is performed by the following  
software sequence done by:  
– No interrupt is generated. However this bit rises  
at the same time as the RDRF bit which itself  
generates an interrupt.  
1. An access to the SCISR register  
2. A read to the SCIDR register.  
The RDRF bit must be cleared before the end of the  
reception of the next character to avoid an overrun  
error.  
The NF flag is reset by a SCISR register read op-  
eration followed by a SCIDR register read opera-  
tion.  
Break Character  
During reception, if a false start bit is detected (e.g.  
8th, 9th, 10th samples are 011,101,110), the  
frame is discarded and the receiving sequence is  
not started for this frame. There is no RDRF bit set  
for this frame and the NF flag is set internally (not  
accessible to the user). This NF flag is accessible  
along with the RDRF bit when a next valid frame is  
received.  
When a break character is received, the SPI han-  
dles it as a framing error.  
Idle Character  
When a idle frame is detected, there is the same  
procedure as a data received character plus an in-  
terrupt if the ILIE bit is set and the I bit is cleared in  
the CCR register.  
Note: If the application Start Bit is not long enough  
to match the above requirements, then the NF  
Flag may get set due to the short Start Bit. In this  
case, the NF flag may be ignored by the applica-  
tion software when the first valid byte is received.  
Overrun Error  
An overrun error occurs when a character is re-  
ceived when RDRF has not been reset. Data can  
not be transferred from the shift register to the  
See also Section 10.5.4.10.  
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1
ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Figure 53. SCI Baud Rate and Extended Prescaler Block Diagram  
TRANSMITTER  
CLOCK  
EXTENDED PRESCALER TRANSMITTER RATE CONTROL  
SCIETPR  
EXTENDED TRANSMITTER PRESCALER REGISTER  
SCIERPR  
EXTENDED RECEIVER PRESCALER REGISTER  
RECEIVER  
CLOCK  
EXTENDED PRESCALER RECEIVER RATE CONTROL  
EXTENDED PRESCALER  
f
CPU  
TRANSMITTER RATE  
CONTROL  
/PR  
/16  
SCIBRR  
SCP1  
SCT2  
SCT1SCT0SCR2 SCR1SCR0  
SCP0  
RECEIVER RATE  
CONTROL  
CONVENTIONAL BAUD RATE GENERATOR  
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1
ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
Framing Error  
Note: the extended prescaler is activated by set-  
ting the SCIETPR or SCIERPR register to a value  
other than zero. The baud rates are calculated as  
follows:  
A framing error is detected when:  
– The stop bit is not recognized on reception at the  
expected time, following either a de-synchroni-  
zation or excessive noise.  
f
f
CPU  
CPU  
Rx =  
16 ERPR*(PR*RR)  
Tx =  
16 ETPR*(PR*TR)  
– A break is received.  
*
*
When the framing error is detected:  
– the FE bit is set by hardware  
with:  
– Data is transferred from the Shift register to the  
SCIDR register.  
ETPR = 1,..,255 (see SCIETPR register)  
ERPR = 1,.. 255 (see SCIERPR register)  
10.5.4.6 Receiver Muting and Wake-up Feature  
– No interrupt is generated. However this bit rises  
at the same time as the RDRF bit which itself  
generates an interrupt.  
In multiprocessor configurations it is often desira-  
ble that only the intended message recipient  
should actively receive the full message contents,  
thus reducing redundant SCI service overhead for  
all non addressed receivers.  
The FE bit is reset by a SCISR register read oper-  
ation followed by a SCIDR register read operation.  
10.5.4.4 Conventional Baud Rate Generation  
The baud rate for the receiver and transmitter (Rx  
and Tx) are set independently and calculated as  
follows:  
The non addressed devices may be placed in  
sleep mode by means of the muting function.  
Setting the RWU bit by software puts the SCI in  
sleep mode:  
f
f
CPU  
CPU  
Rx =  
Tx =  
All the reception status bits can not be set.  
All the receive interrupts are inhibited.  
(16 PR) RR  
(16 PR) TR  
*
*
*
*
with:  
A muted receiver may be awakened by one of the  
following two ways:  
PR = 1, 3, 4 or 13 (see SCP[1:0] bits)  
TR = 1, 2, 4, 8, 16, 32, 64,128  
(see SCT[2:0] bits)  
– by Idle Line detection if the WAKE bit is reset,  
– by Address Mark detection if the WAKE bit is set.  
RR = 1, 2, 4, 8, 16, 32, 64,128  
(see SCR[2:0] bits)  
Receiver wakes-up by Idle Line detection when  
the Receive line has recognised an Idle Frame.  
Then the RWU bit is reset by hardware but the  
IDLE bit is not set.  
All these bits are in the SCIBRR register.  
Example: If f is 8 MHz (normal mode) and if  
CPU  
Receiver wakes-up by Address Mark detection  
when it received a “1” as the most significant bit of  
a word, thus indicating that the message is an ad-  
dress. The reception of this particular word wakes  
up the receiver, resets the RWU bit and sets the  
RDRF bit, which allows the receiver to receive this  
word normally and to use it as an address word.  
PR=13 and TR=RR=1, the transmit and receive  
baud rates are 38400 baud.  
Note: the baud rate registers MUST NOT be  
changed while the transmitter or the receiver is en-  
abled.  
10.5.4.5 Extended Baud Rate Generation  
The extended prescaler option gives a very fine  
tuning on the baud rate, using a 255 value prescal-  
er, whereas the conventional Baud Rate Genera-  
tor retains industry standard software compatibili-  
ty.  
Caution: In Mute mode, do not write to the  
SCICR2 register. If the SCI is in Mute mode during  
the read operation (RWU=1) and a address mark  
wake up event occurs (RWU is reset) before the  
write operation, the RWU bit will be set again by  
this write operation. Consequently the address  
byte is lost and the SCI is not woken up from Mute  
mode.  
The extended baud rate generator block diagram  
is described in the Figure 53.  
The output clock rate sent to the transmitter or to  
the receiver will be the output from the 16 divider  
divided by a factor ranging from 1 to 255 set in the  
SCIERPR or the SCIETPR register.  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.4.7 Parity Control  
even number of “1s” if even parity is selected  
(PS=0) or an odd number of “1s” if odd parity is se-  
lected (PS=1). If the parity check fails, the PE flag  
is set in the SCISR register and an interrupt is gen-  
erated if PIE is set in the SCICR1 register.  
Parity control (generation of parity bit in transmis-  
sion and parity checking in reception) can be ena-  
bled by setting the PCE bit in the SCICR1 register.  
Depending on the frame length defined by the M  
bit, the possible SCI frame formats are as listed in  
Table 20.  
10.5.4.8 SCI Clock Tolerance  
During reception, each bit is sampled 16 times.  
The majority of the 8th, 9th and 10th samples is  
considered as the bit value. For a valid bit detec-  
tion, all the three samples should have the same  
value otherwise the noise flag (NF) is set. For ex-  
ample: if the 8th, 9th and 10th samples are 0, 1  
and 1 respectively, then the bit value will be “1”,  
but the Noise Flag bit is be set because the three  
samples values are not the same.  
Table 20. Frame Formats  
M bit  
PCE bit  
SCI frame  
0
0
1
1
0
1
0
1
| SB | 8 bit data | STB |  
| SB | 7-bit data | PB | STB |  
| SB | 9-bit data | STB |  
| SB | 8-bit data PB | STB |  
Legend: SB = Start Bit, STB = Stop Bit,  
PB = Parity Bit  
Consequently, the bit length must be long enough  
so that the 8th, 9th and 10th samples have the de-  
sired bit value. This means the clock frequency  
should not vary more than 6/16 (37.5%) within one  
bit. The sampling clock is resynchronized at each  
start bit, so that when receiving 10 bits (one start  
bit, 1 data byte, 1 stop bit), the clock deviation  
must not exceed 3.75%.  
Note: In case of wake up by an address mark, the  
MSB bit of the data is taken into account and not  
the parity bit  
Even parity: the parity bit is calculated to obtain  
an even number of “1s” inside the frame made of  
the 7 or 8 LSB bits (depending on whether M is  
equal to 0 or 1) and the parity bit.  
Note: The internal sampling clock of the microcon-  
troller samples the pin value on every falling edge.  
Therefore, the internal sampling clock and the time  
the application expects the sampling to take place  
may be out of sync. For example: If the baud rate  
is 15.625 kbaud (bit length is 64µs), then the 8th,  
9th and 10th samples will be at 28µs, 32µs & 36µs  
respectively (the first sample starting ideally at  
0µs). But if the falling edge of the internal clock oc-  
curs just before the pin value changes, the sam-  
ples would then be out of sync by ~4us. This  
means the entire bit length must be at least 40µs  
(36µs for the 10th sample + 4µs for synchroniza-  
tion with the internal sampling clock).  
Ex: data=00110101; 4 bits set => parity bit will be  
0 if even parity is selected (PS bit = 0).  
Odd parity: the parity bit is calculated to obtain an  
odd number of “1s” inside the frame made of the 7  
or 8 LSB bits (depending on whether M is equal to  
0 or 1) and the parity bit.  
Ex: data=00110101; 4 bits set => parity bit will be  
1 if odd parity is selected (PS bit = 1).  
Transmission mode: If the PCE bit is set then the  
MSB bit of the data written in the data register is  
not transmitted but is changed by the parity bit.  
Reception mode: If the PCE bit is set then the in-  
terface checks if the received data byte has an  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.4.9 Clock Deviation Causes  
10.5.4.10 Noise Error Causes  
The causes which contribute to the total deviation  
are:  
See also description of Noise error in Section  
10.5.4.3.  
– D  
: Deviation due to transmitter error (Local  
Start bit  
TRA  
oscillator error of the transmitter or the trans-  
mitter is transmitting at a different baud rate).  
The noise flag (NF) is set during start bit reception  
if one of the following conditions occurs:  
– D  
: Error due to the baud rate quantisa-  
QUANT  
1. A valid falling edge is not detected. A falling  
edge is considered to be valid if the 3 consecu-  
tive samples before the falling edge occurs are  
detected as '1' and, after the falling edge  
occurs, during the sampling of the 16 samples,  
if one of the samples numbered 3, 5 or 7 is  
detected as a “1”.  
tion of the receiver.  
– D  
: Deviation of the local oscillator of the  
REC  
receiver: This deviation can occur during the  
reception of one complete SCI message as-  
suming that the deviation has been compen-  
sated at the beginning of the message.  
– D  
: Deviation due to the transmission line  
2. During sampling of the 16 samples, if one of the  
samples numbered 8, 9 or 10 is detected as a  
“1”.  
TCL  
(generally due to the transceivers)  
All the deviations of the system should be added  
and compared to the SCI clock tolerance:  
Therefore, a valid Start Bit must satisfy both the  
above conditions to prevent the Noise Flag getting  
set.  
D
+ D  
+ D  
+ D  
< 3.75%  
TCL  
TRA  
QUANT  
REC  
Data Bits  
The noise flag (NF) is set during normal data bit re-  
ception if the following condition occurs:  
– During the sampling of 16 samples, if all three  
samples numbered 8, 9 and10 are not the same.  
The majority of the 8th, 9th and 10th samples is  
considered as the bit value.  
Therefore, a valid Data Bit must have samples 8, 9  
and 10 at the same value to prevent the Noise  
Flag getting set.  
Figure 54. Bit Sampling in Reception Mode  
RDI LINE  
sampled values  
Sample  
clock  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16  
6/16  
7/16  
7/16  
One bit time  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.5 Low Power Modes  
Enable Exit  
Control from from  
Exit  
Event  
Flag  
Interrupt Event  
Mode  
Description  
Bit  
Wait  
Halt  
No effect on SCI.  
Transmit Data Register  
Empty  
TDRE  
TC  
TIE  
Yes  
No  
WAIT  
SCI interrupts cause the device to exit  
from Wait mode.  
Transmission Com-  
plete  
TCIE  
RIE  
Yes  
Yes  
No  
No  
SCI registers are frozen.  
Received Data Ready  
to be Read  
RDRF  
In Halt mode, the SCI stops transmit-  
ting/receiving until Halt mode is exit-  
ed.  
HALT  
Overrun Error Detected OR  
Yes  
Yes  
Yes  
No  
No  
No  
Idle Line Detected  
Parity Error  
IDLE  
PE  
ILIE  
PIE  
10.5.6 Interrupts  
The SCI interrupt events are connected to the  
same interrupt vector.  
rupt mask in the CC register is reset (RIM instruc-  
tion).  
These events generate an interrupt if the corre-  
sponding Enable Control Bit is set and the inter-  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
10.5.7 Register Description  
Note: The IDLE bit will not be set again until the  
RDRF bit has been set itself (i.e. a new idle line oc-  
curs).  
STATUS REGISTER (SCISR)  
Read Only  
Reset Value: 1100 0000 (C0h)  
Bit 3 = OR Overrun error.  
7
0
This bit is set by hardware when the word currently  
being received in the shift register is ready to be  
transferred into the RDR register while RDRF=1.  
An interrupt is generated if RIE=1 in the SCICR2  
register. It is cleared by a software sequence (an  
access to the SCISR register followed by a read to  
the SCIDR register).  
TDRE  
TC  
RDRF IDLE  
OR  
NF  
FE  
PE  
Bit 7 = TDRE Transmit data register empty.  
This bit is set by hardware when the content of the  
TDR register has been transferred into the shift  
register. An interrupt is generated if the TIE bit=1  
in the SCICR2 register. It is cleared by a software  
sequence (an access to the SCISR register fol-  
lowed by a write to the SCIDR register).  
0: No Overrun error  
1: Overrun error is detected  
Note: When this bit is set RDR register content will  
not be lost but the shift register will be overwritten.  
0: Data is not transferred to the shift register  
1: Data is transferred to the shift register  
Bit 2 = NF Noise flag.  
Note: Data will not be transferred to the shift reg-  
This bit is set by hardware when noise is detected  
on a received frame. It is cleared by a software se-  
quence (an access to the SCISR register followed  
by a read to the SCIDR register).  
0: No noise is detected  
ister unless the TDRE bit is cleared.  
Bit 6 = TC Transmission complete.  
This bit is set by hardware when transmission of a  
frame containing Data is complete. An interrupt is  
generated if TCIE=1 in the SCICR2 register. It is  
cleared by a software sequence (an access to the  
SCISR register followed by a write to the SCIDR  
register).  
1: Noise is detected  
Note: This bit does not generate interrupt as it ap-  
pears at the same time as the RDRF bit which it-  
self generates an interrupt.  
0: Transmission is not complete  
1: Transmission is complete  
Bit 1 = FE Framing error.  
This bit is set by hardware when a de-synchroniza-  
tion, excessive noise or a break character is de-  
tected. It is cleared by a software sequence (an  
access to the SCISR register followed by a read to  
the SCIDR register).  
Note: TC is not set after the transmission of a Pre-  
amble or a Break.  
Bit 5 = RDRF Received data ready flag.  
This bit is set by hardware when the content of the  
RDR register has been transferred to the SCIDR  
register. An interrupt is generated if RIE=1 in the  
SCICR2 register. It is cleared by a software se-  
quence (an access to the SCISR register followed  
by a read to the SCIDR register).  
0: No Framing error is detected  
1: Framing error or break character is detected  
Note: This bit does not generate interrupt as it ap-  
pears at the same time as the RDRF bit which it-  
self generates an interrupt. If the word currently  
being transferred causes both frame error and  
overrun error, it will be transferred and only the OR  
bit will be set.  
0: Data is not received  
1: Received data is ready to be read  
Bit 4 = IDLE Idle line detect.  
This bit is set by hardware when a Idle Line is de-  
tected. An interrupt is generated if the ILIE=1 in  
the SCICR2 register. It is cleared by a software se-  
quence (an access to the SCISR register followed  
by a read to the SCIDR register).  
Bit 0 = PE Parity error.  
This bit is set by hardware when a parity error oc-  
curs in receiver mode. It is cleared by a software  
sequence (a read to the status register followed by  
an access to the SCIDR data register). An inter-  
rupt is generated if PIE=1 in the SCICR1 register.  
0: No parity error  
0: No Idle Line is detected  
1: Idle Line is detected  
1: Parity error  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
CONTROL REGISTER 1 (SCICR1)  
Read/Write  
Bit 3 = WAKE Wake-Up method.  
This bit determines the SCI Wake-Up method, it is  
set or cleared by software.  
0: Idle Line  
Reset Value: x000 0000 (x0h)  
7
0
1: Address Mark  
R8  
T8  
SCID  
M
WAKE PCE  
PS  
PIE  
Bit 2 = PCE Parity control enable.  
This bit selects the hardware parity control (gener-  
ation and detection). When the parity control is en-  
abled, the computed parity is inserted at the MSB  
position (9th bit if M=1; 8th bit if M=0) and parity is  
checked on the received data. This bit is set and  
cleared by software. Once it is set, PCE is active  
after the current byte (in reception and in transmis-  
sion).  
Bit 7 = R8 Receive data bit 8.  
This bit is used to store the 9th bit of the received  
word when M=1.  
Bit 6 = T8 Transmit data bit 8.  
This bit is used to store the 9th bit of the transmit-  
ted word when M=1.  
0: Parity control disabled  
1: Parity control enabled  
Bit 5 = SCID Disabled for low power consumption  
When this bit is set the SCI prescalers and outputs  
are stopped and the end of the current byte trans-  
fer in order to reduce power consumption.This bit  
is set and cleared by software.  
0: SCI enabled  
1: SCI prescaler and outputs disabled  
Bit 1 = PS Parity selection.  
This bit selects the odd or even parity when the  
parity generation/detection is enabled (PCE bit  
set). It is set and cleared by software. The parity  
will be selected after the current byte.  
0: Even parity  
1: Odd parity  
Bit 4 = M Word length.  
This bit determines the word length. It is set or  
cleared by software.  
0: 1 Start bit, 8 Data bits, 1 Stop bit  
1: 1 Start bit, 9 Data bits, 1 Stop bit  
Bit 0 = PIE Parity interrupt enable.  
This bit enables the interrupt capability of the hard-  
ware parity control when a parity error is detected  
(PE bit set). It is set and cleared by software.  
0: Parity error interrupt disabled  
Note: The M bit must not be modified during a data  
transfer (both transmission and reception).  
1: Parity error interrupt enabled.  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
CONTROL REGISTER 2 (SCICR2)  
Read/Write  
Notes:  
– During transmission, a “0” pulse on the TE bit  
(“0” followed by “1”) sends a preamble (idle line)  
after the current word.  
Reset Value: 0000 0000 (00h)  
7
0
– When TE is set there is a 1 bit-time delay before  
the transmission starts.  
TIE  
TCIE  
RIE  
ILIE  
TE  
RE  
RWU  
SBK  
Caution: The TDO pin is free for general purpose  
I/O only when the TE and RE bits are both cleared  
(or if TE is never set).  
Bit 7 = TIE Transmitter interrupt enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever  
TDRE=1 in the SCISR register  
Bit 2 = RE Receiver enable.  
This bit enables the receiver. It is set and cleared  
by software.  
0: Receiver is disabled  
1: Receiver is enabled and begins searching for a  
start bit  
Bit 6 = TCIE Transmission complete interrupt ena-  
ble  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever TC=1 in  
the SCISR register  
Bit 1 = RWU Receiver wake-up.  
This bit determines if the SCI is in mute mode or  
not. It is set and cleared by software and can be  
cleared by hardware when a wake-up sequence is  
recognized.  
Bit 5 = RIE Receiver interrupt enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever OR=1  
or RDRF=1 in the SCISR register  
0: Receiver in Active mode  
1: Receiver in Mute mode  
Note: Before selecting Mute mode (setting the  
RWU bit), the SCI must receive some data first,  
otherwise it cannot function in Mute mode with  
wakeup by idle line detection.  
Bit 4 = ILIE Idle line interrupt enable.  
This bit is set and cleared by software.  
0: Interrupt is inhibited  
1: An SCI interrupt is generated whenever IDLE=1  
in the SCISR register.  
Bit 0 = SBK Send break.  
This bit set is used to send break characters. It is  
set and cleared by software.  
0: No break character is transmitted  
1: Break characters are transmitted  
Bit 3 = TE Transmitter enable.  
This bit enables the transmitter. It is set and  
cleared by software.  
Note: If the SBK bit is set to “1” and then to “0”, the  
transmitter will send a BREAK word at the end of  
the current word.  
0: Transmitter is disabled  
1: Transmitter is enabled  
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ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
DATA REGISTER (SCIDR)  
Read/Write  
Bits 5:3 = SCT[2:0] SCI Transmitter rate divisor  
These 3 bits, in conjunction with the SCP1 & SCP0  
bits define the total division applied to the bus  
clock to yield the transmit rate clock in convention-  
al Baud Rate Generator mode.  
Reset Value: Undefined  
Contains the Received or Transmitted data char-  
acter, depending on whether it is read from or writ-  
ten to.  
TR dividing factor  
SCT2  
SCT1  
SCT0  
1
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
7
0
4
DR7  
DR6  
DR5  
DR4  
DR3  
DR2  
DR1  
DR0  
8
16  
32  
64  
128  
The Data register performs a double function (read  
and write) since it is composed of two registers,  
one for transmission (TDR) and one for reception  
(RDR).  
The TDR register provides the parallel interface  
between the internal bus and the output shift reg-  
ister (see Figure 51).  
The RDR register provides the parallel interface  
between the input shift register and the internal  
bus (see Figure 51).  
Bits 2:0 = SCR[2:0] SCI Receiver rate divisor.  
These 3 bits, in conjunction with the SCP[1:0] bits  
define the total division applied to the bus clock to  
yield the receive rate clock in conventional Baud  
Rate Generator mode.  
RR Dividing factor  
SCR2  
SCR1  
SCR0  
BAUD RATE REGISTER (SCIBRR)  
Read/Write  
1
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reset Value: 0000 0000 (00h)  
4
7
0
8
16  
32  
64  
128  
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1 SCR0  
Bits 7:6= SCP[1:0] First SCI Prescaler  
These 2 prescaling bits allow several standard  
clock division ranges:  
PR Prescaling factor  
SCP1  
SCP0  
1
3
0
0
1
1
0
1
0
1
4
13  
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1
ST7232A  
SERIAL COMMUNICATIONS INTERFACE (Cont’d)  
EXTENDED RECEIVE PRESCALER DIVISION  
REGISTER (SCIERPR)  
EXTENDED TRANSMIT PRESCALER DIVISION  
REGISTER (SCIETPR)  
Read/Write  
Read/Write  
Reset Value: 0000 0000 (00h)  
Reset Value:0000 0000 (00h)  
Allows setting of the Extended Prescaler rate divi-  
sion factor for the receive circuit.  
Allows setting of the External Prescaler rate divi-  
sion factor for the transmit circuit.  
7
0
7
0
ERPR ERPR ERPR ERPR ERPR ERPR ERPR ERPR  
ETPR ETPR ETPR ETPR ETPR ETPR ETPR ETPR  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Bits 7:0 = ERPR[7:0] 8-bit Extended Receive  
Prescaler Register.  
Bits 7:0 = ETPR[7:0] 8-bit Extended Transmit  
Prescaler Register.  
The extended Baud Rate Generator is activated  
when a value different from 00h is stored in this  
register. Therefore the clock frequency issued  
from the 16 divider (see Figure 53) is divided by  
the binary factor set in the SCIERPR register (in  
the range 1 to 255).  
The extended Baud Rate Generator is activated  
when a value different from 00h is stored in this  
register. Therefore the clock frequency issued  
from the 16 divider (see Figure 53) is divided by  
the binary factor set in the SCIETPR register (in  
the range 1 to 255).  
The extended baud rate generator is not used af-  
ter a reset.  
The extended baud rate generator is not used af-  
ter a reset.  
Table 21. Baudrate Selection  
Conditions  
Baud  
Rate  
Symbol  
Parameter  
Standard  
Unit  
Accuracy  
vs. Standard  
Prescaler  
f
CPU  
Conventional Mode  
TR (or RR)=128, PR=13  
TR (or RR)= 32, PR=13  
TR (or RR)= 16, PR=13  
TR (or RR)= 8, PR=13  
TR (or RR)= 4, PR=13  
TR (or RR)= 16, PR= 3  
TR (or RR)= 2, PR=13  
TR (or RR)= 1, PR=13  
300  
~300.48  
1200 ~1201.92  
2400 ~2403.84  
4800 ~4807.69  
9600 ~9615.38  
10400 ~10416.67  
19200 ~19230.77  
38400 ~38461.54  
~0.16%  
~0.79%  
f
f
Tx  
Communication frequency 8MHz  
Hz  
Rx  
Extended Mode  
ETPR (or ERPR) = 35,  
TR (or RR)= 1, PR=1  
14400 ~14285.71  
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ST7232A  
SERIAL COMMUNICATION INTERFACE (Cont’d)  
Table 22. SCI Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
SCISR  
Reset Value  
TDRE  
1
TC  
1
RDRF  
0
IDLE  
0
OR  
0
NF  
0
FE  
0
PE  
0
0050h  
0051h  
0052h  
0053h  
0054h  
0055h  
0057h  
SCIDR  
Reset Value  
MSB  
x
LSB  
x
x
x
x
x
x
x
SCIBRR  
Reset Value  
SCP1  
0
SCP0  
0
SCT2  
0
SCT1  
0
SCT0  
0
SCR2  
0
SCR1  
0
SCR0  
0
SCICR1  
Reset Value  
R8  
x
T8  
0
SCID  
0
M
0
WAKE  
0
PCE  
0
PS  
0
PIE  
0
SCICR2  
Reset Value  
TIE  
0
TCIE  
0
RIE  
0
ILIE  
0
TE  
0
RE  
0
RWU  
0
SBK  
0
SCIERPR  
Reset Value  
MSB  
0
LSB  
0
0
0
0
0
0
0
0
0
0
0
0
0
SCIPETPR  
Reset Value  
MSB  
0
LSB  
0
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ST7232A  
10.6 10-BIT A/D CONVERTER (ADC)  
10.6.1 Introduction  
10.6.2 Main Features  
10-bit conversion  
Up to 16 channels with multiplexed input  
Linear successive approximation  
Data register (DR) which contains the results  
Conversion complete status flag  
On/off bit (to reduce consumption)  
The block diagram is shown in Figure 55.  
The on-chip Analog to Digital Converter (ADC) pe-  
ripheral is a 10-bit, successive approximation con-  
verter with internal sample and hold circuitry. This  
peripheral has up to 16 multiplexed analog input  
channels (refer to device pin out description) that  
allow the peripheral to convert the analog voltage  
levels from up to 16 different sources.  
The result of the conversion is stored in a 10-bit  
Data Register. The A/D converter is controlled  
through a Control/Status Register.  
Figure 55. ADC Block Diagram  
f
CPU  
DIV 4  
DIV 2  
0
1
f
ADC  
CH3  
EOC SPEEDADON  
0
CH2 CH1 CH0  
ADCCSR  
4
AIN0  
AIN1  
ANALOG TO DIGITAL  
CONVERTER  
ANALOG  
MUX  
AINx  
ADCDRH  
D9 D8 D7 D6 D5 D4  
D3  
D2  
ADCDRL  
0
0
0
0
0
0
D1  
D0  
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ST7232A  
10-BIT A/D CONVERTER (ADC) (Cont’d)  
10.6.3 Functional Description  
The conversion is monotonic, meaning that the re-  
sult never decreases if the analog input does not  
and never increases if the analog input does not.  
To read the 10 bits, perform the following steps:  
1. Poll the EOC bit  
2. Read the ADCDRL register  
If the input voltage (V ) is greater than V  
AIN  
AREF  
3. Read the ADCDRH register. This clears EOC  
automatically.  
(high-level voltage reference) then the conversion  
result is FFh in the ADCDRH register and 03h in  
the ADCDRL register (without overflow indication).  
Note: The data is not latched, so both the low and  
the high data register must be read before the next  
conversion is complete, so it is recommended to  
disable interrupts while reading the conversion re-  
sult.  
If the input voltage (V ) is lower than V  
(low-  
SSA  
AIN  
level voltage reference) then the conversion result  
in the ADCDRH and ADCDRL registers is 00 00h.  
The A/D converter is linear and the digital result of  
the conversion is stored in the ADCDRH and AD-  
CDRL registers. The accuracy of the conversion is  
described in the Electrical Characteristics Section.  
To read only 8 bits, perform the following steps:  
1. Poll the EOC bit  
2. Read the ADCDRH register. This clears EOC  
automatically.  
R
is the maximum recommended impedance  
AIN  
for an analog input signal. If the impedance is too  
high, this will result in a loss of accuracy due to  
leakage and sampling not being completed in the  
alloted time.  
10.6.3.3 Changing the conversion channel  
The application can change channels during con-  
version. When software modifies the CH[3:0] bits  
in the ADCCSR register, the current conversion is  
stopped, the EOC bit is cleared, and the A/D con-  
verter starts converting the newly selected chan-  
nel.  
10.6.3.1 A/D Converter Configuration  
The analog input ports must be configured as in-  
put, no pull-up, no interrupt. Refer to the «I/O  
ports» chapter. Using these pins as analog inputs  
does not affect the ability of the port to be read as  
a logic input.  
10.6.4 Low Power Modes  
Note: The A/D converter may be disabled by re-  
setting the ADON bit. This feature allows reduced  
power consumption when no conversion is need-  
ed.  
In the ADCCSR register:  
– Select the CS[3:0] bits to assign the analog  
channel to convert.  
10.6.3.2 Starting the Conversion  
Mode  
Description  
WAIT  
No effect on A/D Converter  
A/D Converter disabled.  
In the ADCCSR register:  
– Set the ADON bit to enable the A/D converter  
and to start the conversion. From this time on,  
the ADC performs a continuous conversion of  
the selected channel.  
After wakeup from Halt mode, the A/D  
Converter requires a stabilization time  
HALT  
t
(see Electrical Characteristics)  
STAB  
before accurate conversions can be  
performed.  
When a conversion is complete:  
– The EOC bit is set by hardware.  
– The result is in the ADCDR registers.  
A read to the ADCDRH resets the EOC bit.  
10.6.5 Interrupts  
None.  
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ST7232A  
10-BIT A/D CONVERTER (ADC) (Cont’d)  
10.6.6 Register Description  
CONTROL/STATUS REGISTER (ADCCSR)  
Read/Write (Except bit 7 read only)  
Reset Value: 0000 0000 (00h)  
Bit 3:0 = CH[3:0] Channel Selection  
These bits are set and cleared by software. They  
select the analog input to convert.  
Channel Pin*  
CH3 CH2 CH1 CH0  
7
0
AIN0  
AIN1  
AIN2  
AIN3  
AIN4  
AIN5  
AIN6  
AIN7  
AIN8  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
EOC SPEED ADON  
0
CH3  
CH2  
CH1  
CH0  
Bit 7 = EOC End of Conversion  
This bit is set by hardware. It is cleared by hard-  
ware when software reads the ADCDRH register  
or writes to any bit of the ADCCSR register.  
0: Conversion is not complete  
1: Conversion complete  
AIN9  
AIN10  
AIN11  
AIN12  
AIN13  
AIN14  
AIN15  
Bit 6 = SPEED ADC clock selection  
This bit is set and cleared by software.  
0: f  
1: f  
= f  
= f  
/4  
/2  
ADC  
ADC  
CPU  
CPU  
*The number of channels is device dependent. Refer to  
the device pinout description.  
Bit 5 = ADON A/D Converter on  
This bit is set and cleared by software.  
0: Disable ADC and stop conversion  
1: Enable ADC and start conversion  
DATA REGISTER (ADCDRH)  
Read Only  
Bit 4 = Reserved. Must be kept cleared.  
Reset Value: 0000 0000 (00h)  
7
0
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
Bit 7:0 = D[9:2] MSB of Converted Analog Value  
DATA REGISTER (ADCDRL)  
Read Only  
Reset Value: 0000 0000 (00h)  
7
0
0
0
0
0
0
0
D1  
D0  
Bit 7:2 = Reserved. Forced by hardware to 0.  
Bit 1:0 = D[1:0] LSB of Converted Analog Value  
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ST7232A  
10-BIT A/D CONVERTER (Cont’d)  
Table 23. ADC Register Map and Reset Values  
Address  
(Hex.)  
Register  
Label  
7
6
5
4
3
2
1
0
ADCCSR  
Reset Value  
EOC  
0
SPEED  
0
ADON  
0
CH3  
0
CH2  
0
CH1  
0
CH0  
0
0070h  
0071h  
0072h  
0
ADCDRH  
Reset Value  
D9  
0
D8  
0
D7  
0
D6  
0
D5  
0
D4  
0
D3  
0
D2  
0
ADCDRL  
Reset Value  
D1  
0
D0  
0
0
0
0
0
0
0
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ST7232A  
11 INSTRUCTION SET  
11.1 CPU ADDRESSING MODES  
so, most of the addressing modes may be subdi-  
vided in two sub-modes called long and short:  
The CPU features 17 different addressing modes  
which can be classified in 7 main groups:  
– Long addressing mode is more powerful be-  
cause it can use the full 64 Kbyte address space,  
however it uses more bytes and more CPU cy-  
cles.  
Addressing Mode  
Inherent  
Example  
nop  
– Short addressing mode is less powerful because  
it can generally only access page zero (0000h -  
00FFh range), but the instruction size is more  
compact, and faster. All memory to memory in-  
structions use short addressing modes only  
(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,  
INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)  
Immediate  
Direct  
ld A,#$55  
ld A,$55  
ld A,($55,X)  
ld A,([$55],X)  
jrne loop  
Indexed  
Indirect  
Relative  
Bit operation  
bset byte,#5  
The ST7 Assembler optimizes the use of long and  
short addressing modes.  
The CPU Instruction set is designed to minimize  
the number of bytes required per instruction: To do  
Table 24. CPU Addressing Mode Overview  
Pointer  
Address  
(Hex.)  
Pointer Size  
(Hex.)  
Length  
(Bytes)  
Mode  
Syntax  
Destination  
Inherent  
Immediate  
Short  
Long  
nop  
+ 0  
ld A,#$55  
+ 1  
+ 1  
+ 2  
+ 0  
+ 1  
+ 2  
+ 2  
+ 2  
+ 2  
+ 2  
+ 1  
+ 2  
+ 1  
+ 2  
+ 2  
+ 3  
Direct  
Direct  
Direct  
Direct  
Direct  
Indirect  
Indirect  
ld A,$10  
00..FF  
ld A,$1000  
ld A,(X)  
0000..FFFF  
00..FF  
No Offset  
Short  
Long  
Indexed  
Indexed  
Indexed  
ld A,($10,X)  
ld A,($1000,X)  
ld A,[$10]  
00..1FE  
0000..FFFF  
00..FF  
Short  
Long  
00..FF  
byte  
word  
byte  
word  
ld A,[$10.w]  
ld A,([$10],X)  
ld A,([$10.w],X)  
jrne loop  
0000..FFFF 00..FF  
00..1FE 00..FF  
Short  
Long  
Indirect Indexed  
Indirect Indexed  
Direct  
0000..FFFF 00..FF  
PC+/-127  
Relative  
Relative  
Bit  
Indirect  
jrne [$10]  
PC+/-127  
00..FF  
00..FF  
00..FF  
00..FF  
00..FF  
00..FF  
00..FF  
byte  
byte  
byte  
Direct  
bset $10,#7  
bset [$10],#7  
Bit  
Indirect  
Bit  
Direct  
Relative btjt $10,#7,skip  
Bit  
Indirect Relative btjt [$10],#7,skip  
107/157  
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ST7232A  
INSTRUCTION SET OVERVIEW (Cont’d)  
11.1.1 Inherent  
11.1.3 Direct  
All Inherent instructions consist of a single byte.  
The opcode fully specifies all the required informa-  
tion for the CPU to process the operation.  
In Direct instructions, the operands are referenced  
by their memory address.  
The direct addressing mode consists of two sub-  
modes:  
Inherent Instruction  
Function  
No operation  
Direct (short)  
NOP  
The address is a byte, thus requires only one byte  
after the opcode, but only allows 00 - FF address-  
ing space.  
TRAP  
S/W Interrupt  
Wait For Interrupt (Low Pow-  
er Mode)  
WFI  
Direct (long)  
Halt Oscillator (Lowest Power  
Mode)  
HALT  
The address is a word, thus allowing 64 Kbyte ad-  
dressing space, but requires 2 bytes after the op-  
code.  
RET  
Sub-routine Return  
Interrupt Sub-routine Return  
Set Interrupt Mask (level 3)  
Reset Interrupt Mask (level 0)  
Set Carry Flag  
IRET  
SIM  
11.1.4 Indexed (No Offset, Short, Long)  
RIM  
In this mode, the operand is referenced by its  
memory address, which is defined by the unsigned  
addition of an index register (X or Y) with an offset.  
SCF  
RCF  
Reset Carry Flag  
RSP  
Reset Stack Pointer  
Load  
The indirect addressing mode consists of three  
sub-modes:  
LD  
CLR  
Clear  
Indexed (No Offset)  
PUSH/POP  
INC/DEC  
TNZ  
Push/Pop to/from the stack  
Increment/Decrement  
Test Negative or Zero  
1 or 2 Complement  
Byte Multiplication  
There is no offset, (no extra byte after the opcode),  
and allows 00 - FF addressing space.  
Indexed (Short)  
CPL, NEG  
MUL  
The offset is a byte, thus requires only one byte af-  
ter the opcode and allows 00 - 1FE addressing  
space.  
SLL, SRL, SRA, RLC,  
RRC  
Shift and Rotate Operations  
Swap Nibbles  
Indexed (long)  
SWAP  
The offset is a word, thus allowing 64 Kbyte ad-  
dressing space and requires 2 bytes after the op-  
code.  
11.1.2 Immediate  
Immediate instructions have two bytes, the first  
byte contains the opcode, the second byte con-  
tains the operand value.  
11.1.5 Indirect (Short, Long)  
The required data byte to do the operation is found  
by its memory address, located in memory (point-  
er).  
Immediate Instruction  
Function  
LD  
Load  
The pointer address follows the opcode. The indi-  
rect addressing mode consists of two sub-modes:  
CP  
Compare  
BCP  
Bit Compare  
Indirect (short)  
AND, OR, XOR  
ADC, ADD, SUB, SBC  
Logical Operations  
Arithmetic Operations  
The pointer address is a byte, the pointer size is a  
byte, thus allowing 00 - FF addressing space, and  
requires 1 byte after the opcode.  
Indirect (long)  
The pointer address is a byte, the pointer size is a  
word, thus allowing 64 Kbyte addressing space,  
and requires 1 byte after the opcode.  
108/157  
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ST7232A  
INSTRUCTION SET OVERVIEW (Cont’d)  
11.1.6 Indirect Indexed (Short, Long)  
11.1.7 Relative mode (Direct, Indirect)  
This is a combination of indirect and short indexed  
addressing modes. The operand is referenced by  
its memory address, which is defined by the un-  
signed addition of an index register value (X or Y)  
with a pointer value located in memory. The point-  
er address follows the opcode.  
This addressing mode is used to modify the PC  
register value, by adding an 8-bit signed offset to  
it.  
Available Relative  
Direct/Indirect  
Instructions  
Function  
The indirect indexed addressing mode consists of  
two sub-modes:  
JRxx  
CALLR  
Conditional Jump  
Call Relative  
Indirect Indexed (Short)  
The pointer address is a byte, the pointer size is a  
byte, thus allowing 00 - 1FE addressing space,  
and requires 1 byte after the opcode.  
The relative addressing mode consists of two sub-  
modes:  
Relative (Direct)  
Indirect Indexed (Long)  
The offset is following the opcode.  
Relative (Indirect)  
The pointer address is a byte, the pointer size is a  
word, thus allowing 64 Kbyte addressing space,  
and requires 1 byte after the opcode.  
The offset is defined in memory, which address  
follows the opcode.  
Table 25. Instructions Supporting Direct,  
Indexed, Indirect and Indirect Indexed  
Addressing Modes  
Long and Short  
Function  
Instructions  
LD  
Load  
CP  
Compare  
AND, OR, XOR  
Logical Operations  
Arithmetic Additions/Sub-  
stractions operations  
ADC, ADD, SUB, SBC  
BCP  
Bit Compare  
Short Instructions  
Only  
Function  
CLR  
Clear  
INC, DEC  
TNZ  
Increment/Decrement  
Test Negative or Zero  
1 or 2 Complement  
Bit Operations  
CPL, NEG  
BSET, BRES  
Bit Test and Jump Opera-  
tions  
BTJT, BTJF  
SLL, SRL, SRA, RLC,  
RRC  
Shift and Rotate Opera-  
tions  
SWAP  
Swap Nibbles  
CALL, JP  
Call or Jump subroutine  
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ST7232A  
INSTRUCTION SET OVERVIEW (Cont’d)  
11.2 INSTRUCTION GROUPS  
The ST7 family devices use an Instruction Set  
consisting of 63 instructions. The instructions may  
be subdivided into 13 main groups as illustrated in  
the following table:  
Load and Transfer  
LD  
CLR  
POP  
DEC  
TNZ  
OR  
Stack operation  
PUSH  
INC  
RSP  
BCP  
Increment/Decrement  
Compare and Tests  
Logical operations  
CP  
AND  
BSET  
BTJT  
ADC  
SLL  
XOR  
CPL  
NEG  
Bit Operation  
BRES  
BTJF  
ADD  
SRL  
JRT  
Conditional Bit Test and Branch  
Arithmetic operations  
Shift and Rotates  
SUB  
SRA  
JRF  
SBC  
RLC  
JP  
MUL  
RRC  
CALL  
SWAP  
CALLR  
SLA  
Unconditional Jump or Call  
Conditional Branch  
JRA  
JRxx  
TRAP  
SIM  
NOP  
RET  
Interruption management  
Condition Code Flag modification  
WFI  
RIM  
HALT  
SCF  
IRET  
RCF  
Using a pre-byte  
The instructions are described with one to four op-  
codes.  
These prebytes enable instruction in Y as well as  
indirect addressing modes to be implemented.  
They precede the opcode of the instruction in X or  
the instruction using direct addressing mode. The  
prebytes are:  
In order to extend the number of available op-  
codes for an 8-bit CPU (256 opcodes), three differ-  
ent prebyte opcodes are defined. These prebytes  
modify the meaning of the instruction they pre-  
cede.  
PDY 90  
Replace an X based instruction  
using immediate, direct, indexed, or inherent ad-  
dressing mode by a Y one.  
The whole instruction becomes:  
PIX 92  
Replace an instruction using di-  
PC-2  
PC-1  
PC  
End of previous instruction  
Prebyte  
rect, direct bit, or direct relative addressing mode  
to an instruction using the corresponding indirect  
addressing mode.  
opcode  
It also changes an instruction using X indexed ad-  
dressing mode to an instruction using indirect X in-  
dexed addressing mode.  
PC+1  
Additional word (0 to 2) according  
to the number of bytes required to compute the ef-  
fective address  
PIY 91  
Replace an instruction using X in-  
direct indexed addressing mode by a Y one.  
110/157  
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ST7232A  
INSTRUCTION SET OVERVIEW (Cont’d)  
Mnemo  
ADC  
ADD  
AND  
BCP  
Description  
Add with Carry  
Function/Example  
A = A + M + C  
A = A + M  
Dst  
Src  
I1  
H
H
H
I0  
N
N
N
N
N
Z
Z
Z
Z
Z
C
C
C
A
M
Addition  
A
M
M
M
Logical And  
A = A . M  
A
Bit compare A, Memory  
Bit Reset  
tst (A . M)  
A
BRES  
BSET  
BTJF  
BTJT  
CALL  
CALLR  
CLR  
bres Byte, #3  
bset Byte, #3  
btjf Byte, #3, Jmp1  
btjt Byte, #3, Jmp1  
M
M
M
M
Bit Set  
Jump if bit is false (0)  
Jump if bit is true (1)  
Call subroutine  
Call subroutine relative  
Clear  
C
C
reg, M  
reg  
0
N
N
N
1
Z
Z
Z
CP  
Arithmetic Compare  
One Complement  
Decrement  
tst(Reg - M)  
A = FFH-A  
dec Y  
M
C
1
CPL  
reg, M  
reg, M  
DEC  
HALT  
IRET  
INC  
Halt  
1
0
Interrupt routine return  
Increment  
Pop CC, A, X, PC  
inc X  
I1  
H
I0  
N
N
Z
Z
C
reg, M  
JP  
Absolute Jump  
Jump relative always  
Jump relative  
jp [TBL.w]  
JRA  
JRT  
JRF  
Never jump  
jrf *  
JRIH  
JRIL  
Jump if ext. INT pin = 1  
Jump if ext. INT pin = 0  
Jump if H = 1  
(ext. INT pin high)  
(ext. INT pin low)  
H = 1 ?  
JRH  
JRNH  
JRM  
Jump if H = 0  
H = 0 ?  
Jump if I1:0 = 11  
Jump if I1:0 <> 11  
Jump if N = 1 (minus)  
Jump if N = 0 (plus)  
Jump if Z = 1 (equal)  
I1:0 = 11 ?  
I1:0 <> 11 ?  
N = 1 ?  
JRNM  
JRMI  
JRPL  
JREQ  
JRNE  
JRC  
N = 0 ?  
Z = 1 ?  
Jump if Z = 0 (not equal) Z = 0 ?  
Jump if C = 1  
Jump if C = 0  
Jump if C = 1  
C = 1 ?  
JRNC  
JRULT  
C = 0 ?  
Unsigned <  
Jmp if unsigned >=  
Unsigned >  
JRUGE Jump if C = 0  
JRUGT Jump if (C + Z = 0)  
111/157  
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ST7232A  
INSTRUCTION SET OVERVIEW (Cont’d)  
Mnemo  
JRULE  
LD  
Description  
Jump if (C + Z = 1)  
Load  
Function/Example  
Unsigned <=  
dst <= src  
Dst  
Src  
I1  
H
I0  
N
N
N
N
N
Z
Z
Z
Z
Z
C
reg, M  
A, X, Y  
reg, M  
M, reg  
X, Y, A  
MUL  
NEG  
NOP  
OR  
Multiply  
X,A = X * A  
neg $10  
0
0
Negate (2's compl)  
No Operation  
OR operation  
C
A = A + M  
pop reg  
pop CC  
push Y  
C = 0  
A
M
reg  
CC  
M
M
POP  
Pop from the Stack  
M
I1  
1
H
I0  
0
C
0
PUSH  
RCF  
RET  
RIM  
Push onto the Stack  
Reset carry flag  
Subroutine Return  
Enable Interrupts  
Rotate left true C  
Rotate right true C  
Reset Stack Pointer  
Substract with Carry  
Set carry flag  
reg, CC  
I1:0 = 10 (level 0)  
C <= A <= C  
C => A => C  
S = Max allowed  
A = A - M - C  
C = 1  
RLC  
RRC  
RSP  
SBC  
SCF  
SIM  
reg, M  
reg, M  
N
N
Z
Z
C
C
A
M
N
Z
C
1
Disable Interrupts  
Shift left Arithmetic  
Shift left Logic  
I1:0 = 11 (level 3)  
C <= A <= 0  
C <= A <= 0  
0 => A => C  
A7 => A => C  
A = A - M  
1
1
SLA  
reg, M  
reg, M  
reg, M  
reg, M  
A
N
N
0
Z
Z
Z
Z
Z
Z
Z
C
C
C
C
C
SLL  
SRL  
SRA  
SUB  
SWAP  
TNZ  
TRAP  
WFI  
Shift right Logic  
Shift right Arithmetic  
Substraction  
N
N
N
N
M
M
SWAP nibbles  
A7-A4 <=> A3-A0  
tnz lbl1  
reg, M  
Test for Neg & Zero  
S/W trap  
S/W interrupt  
1
1
1
0
Wait for Interrupt  
Exclusive OR  
XOR  
A = A XOR M  
A
N
Z
112/157  
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ST7232A  
12 ELECTRICAL CHARACTERISTICS  
12.1 PARAMETER CONDITIONS  
Unless otherwise specified, all voltages are re-  
ferred to V  
.
SS  
12.1.5 Pin input voltage  
12.1.1 Minimum and Maximum values  
The input voltage measurement on a pin of the de-  
vice is described in Figure 57.  
Unless otherwise specified the minimum and max-  
imum values are guaranteed in the worst condi-  
tions of ambient temperature, supply voltage and  
frequencies by tests in production on 100% of the  
Figure 57. Pin input voltage  
devices with an ambient temperature at T =25°C  
A
and T =T max (given by the selected temperature  
A
A
ST7 PIN  
range).  
Data based on characterization results, design  
simulation and/or technology characteristics are  
indicated in the table footnotes and are not tested  
in production. Based on characterization, the min-  
imum and maximum values refer to sample tests  
and represent the mean value plus or minus three  
times the standard deviation (mean 3Σ).  
V
IN  
12.1.2 Typical values  
Unless otherwise specified, typical data are based  
on T =25°C, V =5V. They are given only as de-  
A
DD  
sign guidelines and are not tested.  
12.1.3 Typical curves  
Unless otherwise specified, all typical curves are  
given only as design guidelines and are not tested.  
12.1.4 Loading capacitor  
The loading conditions used for pin parameter  
measurement are shown in Figure 56.  
Figure 56. Pin loading conditions  
ST7 PIN  
C
L
113/157  
1
ST7232A  
12.2 ABSOLUTE MAXIMUM RATINGS  
Stresses above those listed as “absolute maxi-  
mum ratings” may cause permanent damage to  
the device. This is a stress rating only and func-  
tional operation of the device under these condi-  
tions is not implied. Exposure to maximum rating  
conditions for extended periods may affect device  
reliability.  
12.2.1 Voltage Characteristics  
Symbol  
Ratings  
Maximum value  
Unit  
V
- V  
- V  
Supply voltage  
6.5  
DD  
SS  
SS  
V
Programming Voltage  
13  
PP  
V
Input Voltage on true open drain pin  
VSS-0.3 to 6.5  
1) & 2)  
V
IN  
Input voltage on any other pin  
VSS-0.3 to VDD+0.3  
|V  
| and |V  
|
SSx  
Variations between different digital power pins  
Variations between digital and analog ground pins  
Electro-static discharge voltage (Human Body Model)  
Electro-static discharge voltage (Machine Model)  
50  
50  
DDx  
mV  
|V  
- V  
|
SSA  
SSx  
V
ESD(HBM)  
see Section 12.7.3 on page 127  
V
ESD(MM)  
12.2.2 Current Characteristics  
Symbol  
Ratings  
Maximum value  
Unit  
Total current into V power lines  
(source)  
DD  
I
32-pin devices  
32-pin devices  
75  
mA  
3)  
VDD  
Total current out of V ground lines  
SS  
I
75  
mA  
3)  
VSS  
(sink)  
Output current sunk by any standard I/O and control pin  
Output current sunk by any high sink I/O pin  
25  
50  
- 25  
5
I
IO  
Output current source by any I/Os and control pin  
Injected current on V pin  
PP  
Injected current on RESET pin  
5
mA  
2) & 4)  
I
Injected current on OSC1 and OSC2 pins  
Injected current on Flash device pin PB0  
5
INJ(PIN)  
+5  
5
5) & 6)  
Injected current on any other pin  
2)  
5)  
ΣI  
Total injected current (sum of all I/O and control pins)  
25  
INJ(PIN)  
Notes:  
1. Directly connecting the RESET and I/O pins to V or V could damage the device if an unintentional internal reset  
DD  
SS  
is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter).  
To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7kfor  
RESET, 10kfor I/Os). For the same reason, unused I/O pins must not be directly tied to V or V  
.
DD  
SS  
2. I  
must never be exceeded. This is implicitly insured if V maximum is respected. If V maximum cannot be  
INJ(PIN)  
IN  
INJ(PIN)  
IN  
respected, the injection current must be limited externally to the I  
value. A positive injection is induced by V >V  
IN DD  
while a negative injection is induced by V <V . For true open-drain pads, there is no positive injection current, and the  
corresponding V maximum must always be respected  
IN  
SS  
IN  
3. All power (V ) and ground (V ) lines must always be connected to the external supply.  
DD  
SS  
4. Negative injection disturbs the analog performance of the device. See note in “ADC Accuracy” on page 140.  
For best reliability, it is recommended to avoid negative injection of more than 1.6mA.  
5. When several inputs are submitted to a current injection, the maximum ΣI  
is the absolute sum of the positive  
INJ(PIN)  
and negative injected currents (instantaneous values). These results are based on characterisation with ΣI  
maxi-  
INJ(PIN)  
mum current injection on four I/O port pins of the device.  
6. True open drain I/O port pins do not accept positive injection.  
114/157  
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ST7232A  
12.2.3 Thermal Characteristics  
Symbol  
Ratings  
Value  
Unit  
T
Storage temperature range  
-65 to +150  
°C  
STG  
T
Maximum junction temperature (see Section 13.2 THERMAL CHARACTERISTICS)  
J
12.3 OPERATING CONDITIONS  
12.3.1 Operating Conditions  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
f
Internal clock frequency  
0
8
MHz  
CPU  
Operating voltage (except Flash Write/  
Erase)  
3.8  
5.5  
V
V
DD  
Operating Voltage for Flash Write/Erase  
Ambient temperature range  
V
= 11.4 to 12.6V  
4.5  
0
5.5  
70  
PP  
1 Suffix Version  
5 Suffix Version  
-10  
-40  
-40  
-40  
85  
T
6 or A Suffix Versions  
85  
°C  
A
B
C
105  
125  
Figure 58. f  
Max Versus VDD  
CPU  
f
[MHz]  
CPU  
FUNCTIONALITY  
GUARANTEED  
IN THIS AREA  
(UNLESS  
OTHERWISE  
SPECIFIED  
IN THE TABLES  
OF PARAMETRIC  
DATA)  
8
6
FUNCTIONALITY  
NOT GUARANTEED  
IN THIS AREA  
4
2
1
0
3.5  
3.8 4.0  
4.5  
5.5  
SUPPLY VOLTAGE [V]  
Note: Some temperature ranges are only available with a specific package and memory size. Refer to Or-  
dering Information.  
Warning: Do not connect 12V to V before V is powered on, as this may damage the device.  
PP  
DD  
115/157  
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ST7232A  
12.4 SUPPLY CURRENT CHARACTERISTICS  
The following current consumption specified for the ST7 functional operating modes over temperature  
range does not take into account the clock source current consumption. To get the total device consump-  
tion, the two current values must be added (except for HALT mode for which the clock is stopped).  
12.4.1 CURRENT CONSUMPTION  
Flash Devices  
ROM Devices  
Symbol  
Parameter  
Conditions  
Unit  
1)  
1)  
Typ  
Max  
Typ  
Max  
f
f
f
f
=2MHz, f  
=1MHz  
=2MHz  
=4MHz  
1
2.3  
3.5  
5.3  
7.0  
1.3  
2.0  
3.6  
7.1  
2.0  
3.0  
5
OSC  
OSC  
OSC  
OSC  
CPU  
CPU  
CPU  
=4MHz, f  
=8MHz, f  
1.4  
2.4  
4.4  
2)  
Supply current in RUN mode  
mA  
=16MHz, f  
=8MHz  
10  
CPU  
f
f
f
f
=2MHz, f  
=4MHz, f  
=8MHz, f  
=62.5kHz  
=125kHz  
=250kHz  
0.48  
0.53  
0.63  
0.80  
1
0.6  
0.7  
0.8  
1.1  
1.8  
2.1  
2.4  
3.0  
OSC  
OSC  
OSC  
OSC  
CPU  
CPU  
CPU  
1.1  
1.2  
1.4  
2)  
2)  
Supply current in SLOW mode  
Supply current in WAIT mode  
mA  
mA  
=16MHz, f  
=500kHz  
CPU  
f
f
f
f
=2MHz, f  
=4MHz, f  
=8MHz, f  
=1MHz  
=2MHz  
=4MHz  
=8MHz  
0.6  
0.9  
1.3  
2.3  
1.8  
2.2  
2.6  
3.6  
1
1.3  
2.0  
3.3  
6
OSC  
OSC  
OSC  
OSC  
CPU  
CPU  
CPU  
1.5  
2.5  
4.5  
=16MHz, f  
I
CPU  
DD  
f
f
f
f
=2MHz, f  
=4MHz, f  
=8MHz, f  
=62.5kHz  
=125kHz  
=250kHz  
430  
470  
530  
660  
950  
70  
200  
300  
OSC  
OSC  
OSC  
OSC  
CPU  
CPU  
CPU  
Supply current in SLOW WAIT  
mode  
1000  
1050  
1200  
100  
200  
350  
µA  
µA  
2)  
600  
=16MHz, f  
=500kHz  
1200  
CPU  
-40°CT +85°C  
<1  
5
10  
50  
<1  
<1  
10  
50  
A
3)  
Supply current in HALT mode  
-40°CT +125°C  
A
f
=2MHz  
=4MHz  
=8MHz  
=16MHz  
60  
160  
200  
300  
500  
22  
44  
86  
30  
60  
120  
300  
OSC  
OSC  
OSC  
OSC  
Supply current in ACTIVE-HALT f  
mode  
100  
180  
340  
µA  
4)  
f
f
170  
Notes:  
1. Data based on characterization results, tested in production at V max. and f  
max.  
CPU  
DD  
2. Measurements are done in the following conditions:  
- Progam executed from RAM, CPU running with RAM access. The increase in consumption when executing from Flash  
is 50%.  
- All I/O pins in input mode with a static value at V or V (no load)  
DD  
SS  
- All peripherals in reset state.  
- Clock input (OSC1) driven by external square wave.  
- In SLOW and SLOW WAIT mode, f is based on f  
divided by 32.  
OSC  
CPU  
To obtain the total current consumption of the device, add the clock source (Section 12.5.3) and the peripheral power  
consumption (Section 12.4.3).  
3. All I/O pins in push-pull 0 mode (when applicable) with a static value at V or V (no load). Data based on charac-  
DD  
SS  
terization results, tested in production at V max. and f  
max.  
DD  
CPU  
4. Data based on characterisation results, not tested in production. All I/O pins in push-pull 0 mode (when applicable) with  
a static value at V or V (no load); clock input (OSC1) driven by external square wave. To obtain the total current  
DD  
SS  
consumption of the device, add the clock source consumption (Section 12.5.3).  
116/157  
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ST7232A  
SUPPLY CURRENT CHARACTERISTICS (Cont’d)  
12.4.1.1 Power Consumption vs f : Flash Devices  
CPU  
Figure 59. Typical I in RUN mode  
Figure 61. Typical I in WAIT mode  
DD  
DD  
3.5  
3
6
5
4
3
2
1
0
2.5  
2
2MHZ  
4MHz  
8MHz  
16MHz  
2MHZ  
4MHz  
8MHz  
16MHz  
1.5  
1
0.5  
0
Vdd (V)  
Vdd (V)  
Figure 60. Typical I in SLOW mode  
Figure 62. Typ. I in SLOW-WAIT mode  
DD  
DD  
1.2  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.8  
0.6  
0.4  
0.2  
0
2MHZ  
4MHz  
8MHz  
16MHz  
2MHZ  
4MHz  
8MHz  
16MHz  
Vdd (V)  
Vdd (V)  
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ST7232A  
SUPPLY CURRENT CHARACTERISTICS (Cont’d)  
12.4.2 Supply and Clock Managers  
The previous current consumption specified for the ST7 functional operating modes over temperature  
range does not take into account the clock source current consumption. To get the total device consump-  
tion, the two current values must be added (except for HALT mode).  
Symbol  
Parameter  
Conditions  
Typ  
Max  
Unit  
see Section  
12.5.3 on page  
121  
1) & 2)  
I
Supply current of resonator oscillator  
µA  
DD(RES)  
µA  
I
PLL supply current  
V
= 5V  
DD  
360  
DD(PLL)  
Notes:  
1. Data based on characterization results done with the external components specified in Section 12.5.3 , not tested in  
production.  
2. As the oscillator is based on a current source, the consumption does not depend on the voltage.  
118/157  
1
ST7232A  
SUPPLY CURRENT CHARACTERISTICS (Cont’d)  
12.4.3 On-Chip Peripherals  
T = 25°C f  
=4MHz.  
A
CPU  
Symbol  
Parameter  
Conditions  
=5.0V  
Typ  
50  
Unit  
1)  
I
16-bit Timer supply current  
V
V
V
V
DD(TIM)  
DD  
DD  
DD  
DD  
2)  
I
SPI supply current  
=5.0V  
400  
400  
400  
DD(SPI)  
µA  
3)  
I
SCI supply current  
=5.0V  
DD(SCI)  
4)  
I
ADC supply current when converting  
=5.0V  
DD(ADC)  
Notes:  
1. Data based on a differential I measurement between reset configuration (timer counter running at f  
/4) and timer  
DD  
CPU  
counter stopped (only TIMD bit set). Data valid for one timer.  
2. Data based on a differential I measurement between reset configuration (SPI disabled) and a permanent SPI master  
DD  
communication at maximum speed (data sent equal to 55h). This measurement includes the pad toggling consump-  
tion.  
3. Data based on a differential I measurement between SCI low power state (SCID=1) and a permanent SCI data trans-  
DD  
mit sequence.  
4. Data based on a differential I measurement between reset configuration and continuous A/D conversions.  
DD  
119/157  
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ST7232A  
12.5 CLOCK AND TIMING CHARACTERISTICS  
Subject to general operating conditions for V , f  
, and T .  
DD CPU  
A
12.5.1 General Timings  
1)  
Symbol  
Parameter  
Conditions  
Min  
2
Typ  
Max  
12  
Unit  
tCPU  
ns  
3
t
Instruction cycle time  
c(INST)  
f
f
=8MHz  
250  
10  
375  
1500  
22  
CPU  
CPU  
2)  
tCPU  
µs  
Interrupt reaction time  
t
v(IT)  
t
= t  
+ 10  
c(INST)  
=8MHz  
1.25  
2.75  
v(IT)  
12.5.2 External Clock Source  
Symbol  
Parameter  
Conditions  
Min  
-1  
Typ  
Max  
Unit  
V
OSC1 input pin high level voltage  
OSC1 input pin low level voltage  
V
V
DD  
OSC1H  
DD  
V
V
V
V
+1  
SS  
OSC1L  
SS  
t
t
3)  
w(OSC1H)  
see Figure 63  
OSC1 high or low time  
5
w(OSC1L)  
ns  
t
t
3)  
r(OSC1)  
OSC1 rise or fall time  
15  
1
f(OSC1)  
I
OSC1 Input leakage current  
V
V V  
DD  
µA  
L
SS  
IN  
Figure 63. Typical Application with an External Clock Source  
90%  
V
V
OSC1H  
OSC1L  
10%  
t
t
w(OSC1H)  
t
t
w(OSC1L)  
f(OSC1)  
r(OSC1)  
OSC2  
Not connected internally  
f
OSC  
EXTERNAL  
CLOCK SOURCE  
I
L
OSC1  
ST72XXX  
Notes:  
1. Data based on typical application software.  
2. Time measured between interrupt event and interrupt vector fetch. tc(INST) is the number of tCPU cycles needed to finish  
the current instruction execution.  
3. Data based on design simulation and/or technology characteristics, not tested in production.  
120/157  
1
ST7232A  
CLOCK AND TIMING CHARACTERISTICS (Cont’d)  
12.5.3 Crystal and Ceramic Resonator Oscillators  
The ST7 internal clock can be supplied with four  
different Crystal/Ceramic resonator oscillators. All  
the information given in this paragraph are based  
on characterization results with specified typical  
external components. In the application, the reso-  
nator and the load capacitors have to be placed as  
close as possible to the oscillator pins in order to  
minimize output distortion and start-up stabiliza-  
tion time. Refer to the crystal/ceramic resonator  
manufacturer for more details (frequency, pack-  
age, accuracy...).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
MHz  
kΩ  
LP: Low power oscillator  
1
2
4
8
MP: Medium power oscillator  
MS: Medium speed oscillator  
HS: High speed oscillator  
>2  
>4  
>8  
1)  
f
Oscillator Frequency  
OSC  
16  
2)  
R
Feedback resistor  
20  
40  
F
R =200Ω  
LP oscillator  
MP oscillator  
MS oscillator  
HS oscillator  
22  
22  
18  
15  
56  
46  
33  
33  
S
Recommended load capacitance ver-  
sus equivalent serial resistance of the  
C
C
R =200Ω  
L1  
L2  
S
pF  
R =200Ω  
S
crystal or ceramic resonator (R )  
S
R =100Ω  
S
Symbol  
Parameter  
Conditions  
Typ  
Max  
Unit  
V =V  
LP oscillator  
MP oscillator  
MS oscillator  
HS oscillator  
80  
150  
250  
460  
910  
IN  
SS  
160  
310  
610  
i
OSC2 driving current  
µA  
2
Figure 64. Typical Application with a Crystal or Ceramic Resonator  
WHEN RESONATOR WITH  
INTEGRATED CAPACITORS  
i
2
f
OSC  
C
L1  
OSC1  
OSC2  
RESONATOR  
R
F
C
L2  
ST72XXX  
Notes:  
1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small R value.  
S
Refer to crystal/ceramic resonator manufacturer for more details.  
2. Data based on characterisation results, not tested in production.  
121/157  
1
ST7232A  
CLOCK AND TIMING CHARACTERISTICS (Cont’d)  
Typical Ceramic Resonators (information for guidance only)  
C
C
L2  
t
L1  
SU(osc)  
2)  
Oscil.  
3)  
1)  
[ms]  
[pF] [pF]  
22 22  
22 22  
33 33  
33 33  
Reference  
CSA2.00MG  
CSA4.00MG  
CSA8.00MTZ  
Freq.  
2MHz  
4MHz  
8MHz  
16MHz  
Characteristic  
LP  
MP  
MS  
HS  
f  
f  
f  
f  
=[ 0.5%  
=[ 0.5%  
=[ 0.5%  
=[ 0.5%  
, 0.3% , 0.3%  
, x.x%  
, x.x%  
, x.x%  
, x.x%  
]
]
]
]
4
2
OSC  
OSC  
OSC  
OSC  
tolerance  
tolerance  
tolerance  
tolerance  
Ta  
aging  
aging  
aging  
aging  
correl  
correl  
correl  
correl  
, 0.3% , 0.3%  
Ta  
, 0.5% , 0.3%  
1
Ta  
4)  
CSA16.00MXZ040  
, 0.3% , 0.3%  
0.7  
Ta  
Notes:  
1. Resonator characteristics given by the ceramic resonator manufacturer.  
2. t  
is the typical oscillator start-up time measured between V =2.8V and the fetch of the first instruction (with a  
SU(OSC)  
DD  
quick V ramp-up from 0 to 5V (<50µs).  
DD  
3. Resonators all have different characteristics. Contact the manufacturer to obtain the appropriate values of external  
components and to verify oscillator performance.  
4. 3rd overtone resonators require specific validation by the resonator manufacturer.  
122/157  
1
ST7232A  
CLOCK CHARACTERISTICS (Cont’d)  
12.5.4 PLL Characteristics  
Symbol  
Parameter  
Conditions  
= 4 MHz.  
OSC  
Min  
Typ  
Max  
4
Unit  
MHz  
%
f
PLL input frequency range  
2
OSC  
1)  
f  
/ f  
Instantaneous PLL jitter  
f
0.7  
2
CPU CPU  
Note:  
1. Data characterized but not tested.  
The user must take the PLL jitter into account in the application (for example in serial communication or  
sampling of high frequency signals). The PLL jitter is a periodic effect, which is integrated over several  
CPU cycles. Therefore the longer the period of the application signal, the less it will be impacted by the  
PLL jitter.  
Figure 65 shows the PLL jitter integrated on application signals in the range 125kHz to 2MHz. At frequen-  
cies of less than 125KHz, the jitter is negligible.  
1
Figure 65. Integrated PLL Jitter vs signal frequency  
+/-Jitter (%)  
1.2  
max  
typ  
1
0.8  
0.6  
0.4  
0.2  
0
4 MHz 2 MHz 1 MHz 500 kHz 250 kHz 125 kHz  
Application Frequency  
Note 1: Measurement conditions: f  
= 8MHz.  
CPU  
123/157  
1
ST7232A  
12.6 MEMORY CHARACTERISTICS  
12.6.1 RAM and Hardware Registers  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
1)  
V
Data retention mode  
HALT mode (or RESET)  
1.6  
V
RM  
12.6.2 FLASH Memory  
DUAL VOLTAGE HDFLASH MEMORY  
2)  
2)  
Symbol  
Parameter  
Conditions  
Read mode  
Min  
0
Typ  
Max  
8
Unit  
f
Operating frequency  
MHz  
CPU  
Write / Erase mode  
4.5V VDD 5.5V  
Write / Erase  
1
8
3)  
V
Programming voltage  
11.4  
12.6  
V
mA  
PP  
4)  
I
Supply current  
0
DD  
Read (V =12V)  
200  
30  
µA  
PP  
4)  
I
V
current  
PP  
PP  
Write / Erase  
mA  
t
t
Internal V stabilization time  
10  
µs  
VPP  
PP  
Data retention  
T =85°C  
40  
years  
cycles  
RET  
A
N
Write erase cycles  
T =25°C  
100  
RW  
A
T
Programming or erasing tempera-  
ture range  
PROG  
-40  
25  
85  
°C  
T
ERASE  
Notes:  
1. Minimum V supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware reg-  
DD  
isters (only in HALT mode). Not tested in production.  
2. Data based on characterization results, not tested in production.  
3. V must be applied only during the programming or erasing operation and not permanently for reliability reasons.  
PP  
4. Data based on simulation results, not tested in production.  
124/157  
1
ST7232A  
12.7 EMC CHARACTERISTICS  
should be noted that good EMC performance is  
highly dependent on the user application and the  
software in particular.  
Susceptibility tests are performed on a sample ba-  
sis during product characterization.  
Therefore it is recommended that the user applies  
EMC software optimization and prequalification  
tests in relation with the EMC level requested for  
his application.  
12.7.1 Functional EMS (Electro Magnetic  
Susceptibility)  
Based on a simple running application on the  
product (toggling 2 LEDs through I/O ports), the  
product is stressed by two electro magnetic events  
until a failure occurs (indicated by the LEDs).  
ESD: Electro-Static Discharge (positive and  
negative) is applied on all pins of the device until  
a functional disturbance occurs. This test  
conforms with the IEC 1000-4-2 standard.  
Software recommendations:  
The software flowchart must include the manage-  
ment of runaway conditions such as:  
– Corrupted program counter  
– Unexpected reset  
– Critical Data corruption (control registers...)  
Prequalification trials:  
FTB: A Burst of Fast Transient voltage (positive  
and negative) is applied to V and V through  
DD  
SS  
a 100pF capacitor, until a functional disturbance  
occurs. This test conforms with the IEC 1000-4-  
4 standard.  
Most of the common failures (unexpected reset  
and program counter corruption) can be repro-  
duced by manually forcing a low state on the RE-  
SET pin or the Oscillator pins for 1 second.  
A device reset allows normal operations to be re-  
sumed. The test results are given in the table be-  
low based on the EMS levels and classes defined  
in application note AN1709.  
To complete these trials, ESD stress can be ap-  
plied directly on the device, over the range of  
specification values. When unexpected behaviour  
is detected, the software can be hardened to pre-  
vent unrecoverable errors occurring (see applica-  
tion note AN1015)  
12.7.1.1 Designing hardened software to avoid  
noise problems  
EMC characterization and optimization are per-  
formed at component level with a typical applica-  
tion environment and simplified MCU software. It  
.
Level/  
Symbol  
Parameter  
Conditions  
Class  
ROM device, V =5V, T =+25°C, f  
O-  
DD  
A
Voltage limits to be applied on any I/O pin to induce a  
functional disturbance  
4A  
4B  
=8MHz conforms to IEC 1000-4-2  
SC  
V
FESD  
Flash device, V =5V, T =+25°C, f  
O-  
DD  
A
=8MHz conforms to IEC 1000-4-2  
SC  
Fast transient voltage burst limits to be applied  
V
=5V, T =+25°C, f  
=8MHz  
OSC  
DD  
A
V
through 100pF on V and V pins to induce a func-  
4A  
FFTB  
DD  
DD  
conforms to IEC 1000-4-4  
tional disturbance  
125/157  
1
ST7232A  
EMC CHARACTERISTICS (Cont’d)  
12.7.2 Electro Magnetic Interference (EMI)  
Based on a simple application running on the  
product (toggling 2 LEDs through the I/O ports),  
the product is monitored in terms of emission. This  
emission test is in line with the norm SAE J 1752/  
3 which specifies the board and the loading of  
each pin.  
Max vs. [f  
/f  
]
Monitored  
Frequency Band  
OSC CPU  
Symbol  
Parameter  
Conditions  
Device/ Package  
Unit  
8/4MHz 16/8MHz  
0.1MHz to 30MHz  
30MHz to 130MHz  
130MHz to 1GHz  
SAE EMI Level  
25  
30  
18  
3.0  
25  
30  
18  
3.0  
12  
19  
15  
3
27  
36  
23  
3.5  
27  
36  
23  
3.5  
18  
25  
22  
3.5  
15  
26  
20  
3.5  
dBµV  
Flash/TQFP32  
-
0.1MHz to 30MHz  
30MHz to 130MHz  
130MHz to 1GHz  
SAE EMI Level  
dBµV  
3)  
ROM/TQFP32  
V
=5V,  
DD  
-
T =+25°C  
conforming to  
1)  
A
S
Peak level  
EMI  
0.1MHz to 30MHz  
30MHz to 130MHz  
130MHz to 1GHz  
SAE EMI Level  
SAE J 1752/3  
dBµV  
8K Flash/TQFP44  
8K ROM/TQFP44  
-
dBµV  
-
0.1MHz to 30MHz  
30MHz to 130MHz  
130MHz to 1GHz  
SAE EMI Level  
12  
23  
15  
3.0  
Notes:  
1. Data based on characterization results, not tested in production.  
2. Refer to Application Note AN1709 for data on other package types.  
3. Under completion  
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ST7232A  
EMC CHARACTERISTICS (Cont’d)  
12.7.3 Absolute Maximum Ratings (Electrical  
Sensitivity)  
12.7.3.1 Electro-Static Discharge (ESD)  
Electro-Static Discharges (a positive then a nega-  
tive pulse separated by 1 second) are applied to  
the pins of each sample according to each pin  
combination. The sample size depends on the  
number of supply pins in the device (3 parts*(n+1)  
supply pin). Two models can be simulated: Human  
Body Model and Machine Model. This test con-  
forms to the JESD22-A114A/A115A standard.  
Based on three different tests (ESD, LU and DLU)  
using specific measurement methods, the product  
is stressed in order to determine its performance in  
terms of electrical sensitivity. For more details, re-  
fer to the application note AN1181.  
Absolute Maximum Ratings  
1)  
Symbol  
Ratings  
Conditions  
Maximum value  
Unit  
Electro-static discharge voltage  
(Human Body Model)  
T =+25°C  
V
2000  
A
ESD(HBM)  
Electro-static discharge voltage  
(Machine Model)  
T =+25°C  
V
200  
250  
V
A
ESD(MM)  
Electro-static discharge voltage  
(Charged Device Model)  
T =+25°C  
V
A
ESD(CD)  
Notes:  
1. Data based on characterization results, not tested in production.  
12.7.3.2 Static and Dynamic Latch-Up  
DLU: Electro-Static Discharges (one positive  
then one negative test) are applied to each pin  
of 3 samples when the micro is running to  
assess the latch-up performance in dynamic  
mode. Power supplies are set to the typical  
values, the oscillator is connected as near as  
possible to the pins of the micro and the  
component is put in reset mode. This test  
conforms to the IEC1000-4-2 and SAEJ1752/3  
standards. For more details, refer to the  
application note AN1181.  
LU: 3 complementary static tests are required  
on 10 parts to assess the latch-up performance.  
A supply overvoltage (applied to each power  
supply pin) and a current injection (applied to  
each input, output and configurable I/O pin) are  
performed on each sample. This test conforms  
to the EIA/JESD 78 IC latch-up standard. For  
more details, refer to the application note  
AN1181.  
Electrical Sensitivities  
1)  
Symbol  
Parameter  
Conditions  
Class  
T =+25°C  
A
A
A
A
A
T =+85°C  
A
LU  
Static latch-up class  
T =+105°C  
A
T =+125°C  
A
V
=5.5V, f  
=4MHz, T =+25°C  
OSC A  
DLU  
Dynamic latch-up class  
A
DD  
Notes:  
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC spec-  
ifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the  
JEDEC criteria (international standard).  
127/157  
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ST7232A  
12.8 I/O PORT PIN CHARACTERISTICS  
12.8.1 General Characteristics  
Subject to general operating conditions for V , f  
, and T unless otherwise specified.  
A
DD OSC  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Input low level voltage (standard voltage  
V
0.3xVDD  
V
1)  
IL  
devices)  
1)  
V
Input high level voltage  
0.7xVDD  
0
IH  
V
2)  
V
Schmitt trigger voltage hysteresis  
0.7  
hys  
Injected Current on Flash device pin PB0  
Injected Current on other I/O pins  
+4  
3)  
I
INJ(PIN)  
±4  
V
V
=5V  
mA  
DD  
Total injected current (sum of all I/O and  
control pins)  
3)  
ΣI  
±25  
INJ(PIN)  
I
Input leakage current  
SS VIN V  
1
lkg  
DD  
µA  
Static current consumption induced by each  
floating input pin  
4)  
I
Floating input mode  
V =V =5V  
200  
S
5)  
R
Weak pull-up equivalent resistor  
V
DD  
50  
1
120  
5
250  
kΩ  
PU  
IN  
SS  
C
I/O pin capacitance  
pF  
IO  
1)  
t
Output high to low level fall time  
C =50pF  
25  
f(IO)out  
L
Between 10% and  
90%  
ns  
1)  
t
Output low to high level rise time  
25  
r(IO)out  
6)  
t
External interrupt pulse time  
t
CPU  
w(IT)in  
Notes:  
1. Data based on characterization results, not tested in production.  
2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.  
3. When the current limitation is not possible, the V maximum must be respected, otherwise refer to I  
specifica-  
INJ(PIN)  
IN  
tion. A positive injection is induced by V >V while a negative injection is induced by V <V . Refer to Section 12.2.2  
IN  
DD  
IN  
SS  
on page 114 for more details.  
4. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for  
example and leaving the I/O unconnected on the board or an external pull-up or pull-down resistor (see Figure 66). Static  
peak current value taken at a fixed V value, based on design simulation and technology characteristics, not tested in  
IN  
production. This value depends on V and temperature values.  
DD  
5. The R pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics de-  
PU  
scribed in Figure 67).  
6. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external  
interrupt source.  
Figure 66. Unused I/O Pins configured as input  
Figure 67. Typical I vs. V with V =V  
PU DD IN SS  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
DD  
Ta=140°C  
ST7XXX  
Ta=95°C  
Ta=25°C  
Ta=-45°C  
10kΩ  
UNUSED I/O PORT  
UNUSED I/O PORT  
10kΩ  
ST7XXX  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Vdd(V)  
Note: I/O can be left unconnected if it is configured as output  
(0 or 1) by the software. This has the advantage of  
greater EMC robustness and lower cost.  
128/157  
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ST7232A  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
12.8.2 Output Driving Current  
Subject to general operating conditions for V , f  
, and T unless otherwise specified.  
A
DD CPU  
Symbol  
Parameter  
Conditions  
I =+5mA  
Min  
Max  
Unit  
Output low level voltage for a standard I/O pin  
when 8 pins are sunk at same time  
(see Figure 68)  
1.2  
IO  
I =+2mA  
0.5  
IO  
1)  
V
OL  
I =+20mA,T 85°C  
1.3  
1.5  
IO  
A
Output low level voltage for a high sink I/O pin  
when 4 pins are sunk at same time  
(see Figure 69 and Figure 71)  
T >85°C  
A
V
I =+8mA  
0.6  
IO  
I =-5mA, T 85°C  
V
V
-1.4  
IO  
A
Output high level voltage for an I/O pin  
when 4 pins are sourced at same time  
(see Figure 70 and Figure 73)  
DD  
DD  
2)  
-1.6  
T >85°C  
V
A
OH  
I =-2mA  
V
-0.7  
IO  
DD  
Figure 68. Typical V at V =5V (std. ports)  
Figure 70. Typical V at V =5V  
OH DD  
OL  
DD  
5.5  
1.2  
5
1
4.5  
4
0.8  
0.6  
0.4  
0.2  
0
3.5  
3
Ta=140°C "  
Vdd=5V 140°C min  
Vdd=5v 95°C min  
Vdd=5v 25°C min  
Vdd=5v -45°C min  
Ta=95°C  
Ta=25°C  
Ta=-45°C  
2.5  
2
5
10  
15  
IIO (mA)  
-10  
-8  
-6  
-4  
-2  
0
I
(mA)  
IO
Figure 69. Typ. V at V =5V (high-sink ports)  
OL  
DD  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
Ta= 140°C  
Ta= 95°C  
Ta= 25°C  
Ta=-45°C  
10  
20  
30  
IIO (mA)  
Notes:  
1. The I current sunk must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of I  
IO  
IO  
(I/O ports and control pins) must not exceed I  
.
VSS  
2. The I current sourced must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of  
IO  
I
(I/O ports and control pins) must not exceed I  
. True open drain I/O pins do not have V  
.
IO  
VDD  
OH  
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ST7232A  
I/O PORT PIN CHARACTERISTICS (Cont’d)  
Figure 71. Typical V vs. V (std. ports)  
OL  
DD  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.45  
0.4  
Ta= -45°C  
Ta= 25°C  
Ta=-45°C  
Ta=25°C  
Ta=95°C  
Ta=140°C  
Ta= 95°C  
0.35  
0.3  
Ta= 140°C  
0.25  
0.2  
0.15  
0.1  
0.05  
0
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Vdd(V)  
Vdd(V)  
Figure 72. Typical V vs. V (high-sink ports)  
OL  
DD  
1.6  
1.4  
1.2  
1
0.6  
Ta= 140°C  
Ta=95°C  
Ta=25°C  
Ta=-45°C  
0.5  
0.4  
0.3  
0.2  
0.8  
0.6  
0.4  
0.2  
0
Ta= 140°C  
Ta=95°C  
Ta=25°C  
Ta=-45°C  
0.1  
0
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
V dd(V )  
Vdd(V )  
Figure 73. Typical V vs. V  
OH  
DD  
5.5  
6
5
4
3
2
1
0
Ta=-45°C  
Ta=25°C  
Ta=95°C  
Ta=140°C  
5
4.5  
4
3.5  
3
Ta=-45°C  
Ta=25°C  
Ta=95°C  
Ta=140°C  
2.5  
2
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Vdd(V)  
Vdd(V)  
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1
ST7232A  
12.9 CONTROL PIN CHARACTERISTICS  
12.9.1 Asynchronous RESET Pin  
Subject to general operating conditions for V , f  
, and T unless otherwise specified.  
A
DD CPU  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
2)  
V
Schmitt trigger voltage hysteresis  
2.5  
hys  
1)  
V
Input low level voltage  
0.16xVDD  
0.5  
IL  
V
1)  
V
Input high level voltage  
0.85xVDD  
IH  
3)  
V
Output low level voltage  
V
V
=5V  
=5V  
I =+2mA  
IO  
0.2  
2
V
mA  
kΩ  
µs  
µs  
ns  
OL  
IO  
DD  
DD  
I
Driving current on RESET pin  
Weak pull-up equivalent resistor  
Generated reset pulse duration  
R
20  
20  
30  
30  
120  
ON  
w(RSTL)out  
6)  
t
Internal reset sources  
42  
4)  
t
t
External reset pulse hold time  
2.5  
h(RSTL)in  
5)  
Filtered glitch duration  
200  
g(RSTL)in  
Notes:  
1. Data based on characterization results, not tested in production.  
2. Hysteresis voltage between Schmitt trigger switching levels.  
3. The I current sunk must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of I  
IO  
IO  
(I/O ports and control pins) must not exceed I  
.
VSS  
4. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on  
the RESET pin with a duration below t can be ignored.  
h(RSTL)in  
5. The reset network (the resistor and two capacitors) protects the device against parasitic resets, especially in noisy en-  
vironments.  
6. Data guaranteed by design, not tested in production.  
131/157  
1
ST7232A  
CONTROL PIN CHARACTERISTICS (Cont’d)  
1)2)3)4)  
Figure 74. RESET pin protection  
Recommended for EMC  
V
ST72XXX  
DD  
V
V
DD  
DD  
R
ON  
Filter  
0.01µF  
0.01µF  
4.7kΩ  
INTERNAL  
RESET  
USER  
EXTERNAL  
RESET  
CIRCUIT  
PULSE  
GENERATOR  
WATCHDOG  
Required  
1. The reset network protects the device against parasitic resets.  
2. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device  
can be damaged when the ST7 generates an internal reset (watchdog).  
3. Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go below  
the V max. level specified in Section 12.9.1 . Otherwise the reset will not be taken into account internally.  
IL  
4. Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure  
that the current sunk on the RESET pin (by an external pull-up for example) is less than the absolute maximum value  
specified for I  
in Section 12.2.2 on page 114.  
INJ(RESET)  
132/157  
1
ST7232A  
CONTROL PIN CHARACTERISTICS (Cont’d)  
12.9.2 ICCSEL/V Pin  
PP  
Subject to general operating conditions for V , f  
, and T unless otherwise specified.  
A
DD CPU  
Symbol  
Parameter  
Conditions  
FLASH versions  
Min  
Max  
Unit  
V
V
0.2  
SS  
SS  
1)  
V
Input low level voltage  
IL  
ROM versions  
FLASH versions  
ROM versions  
0.3xV  
DD  
V
V
-0.1 12.6  
DD  
1)  
V
I
Input high level voltage  
Input leakage current  
IH  
0.7xV  
V
DD  
DD  
V =V  
1
µA  
L
IN  
SS  
2)  
Figure 75. Two typical Applications with ICCSEL/V Pin  
PP  
ICCSEL/V  
V
PP  
PP  
PROGRAMMING  
TOOL  
10kΩ  
ST72XXX  
ST72XXX  
Notes:  
1. Data based on design simulation and/or technology characteristics, not tested in production.  
2. When ICC mode is not required by the application ICCSEL/V pin must be tied to V  
.
SS  
PP  
133/157  
1
ST7232A  
12.10 TIMER PERIPHERAL CHARACTERISTICS  
Subject to general operating conditions for V , f  
, and T unless otherwise specified.  
A
DD OSC  
Refer to I/O port characteristics for more details on the input/output alternate function characteristics (out-  
put compare, input capture, external clock, PWM output...).  
Data based on design simulation and/or characterisation results, not tested in production.  
12.10.1 16-Bit Timer  
Symbol  
Parameter  
Conditions  
Min  
1
Typ  
Max  
Unit  
t
Input capture pulse time  
t
t
w(ICAP)in  
CPU  
2
CPU  
t
PWM resolution time  
res(PWM)  
f
=8MHz  
250  
0
ns  
CPU  
f
Timer external clock frequency  
PWM repetition rate  
f
f
/4  
MHz  
MHz  
bit  
EXT  
CPU  
f
0
/4  
CPU  
PWM  
Res  
PWM resolution  
16  
PWM  
134/157  
1
ST7232A  
12.11 COMMUNICATION INTERFACE CHARACTERISTICS  
12.11.1 SPI - Serial Peripheral Interface  
Subject to general operating conditions for V , f  
, and T unless otherwise specified. Data based on  
A
DD CPU  
design simulation and/or characterisation results, not tested in production.  
When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave  
mode) has its alternate function capability released. In this case, the pin status depends on the I/O port  
configuration. Refer to I/O port characteristics for more details on the input/output alternate function char-  
acteristics (SS, SCK, MOSI, MISO).  
Symbol  
Parameter  
Conditions  
Min  
/128  
0.0625  
Max  
Unit  
Master  
Slave  
f
f
f
/4  
CPU  
2
CPU  
f
=8MHz  
=8MHz  
f
CPU  
SCK  
MHz  
SPI clock frequency  
1/t  
/2  
c(SCK)  
CPU  
0
f
4
CPU  
t
t
r(SCK)  
SPI clock rise and fall time  
see I/O port pin description  
f(SCK)  
t
SS setup time  
SS hold time  
Slave  
Slave  
120  
120  
su(SS)  
t
h(SS)  
t
t
Master  
Slave  
100  
90  
w(SCKH)  
SCK high and low time  
Data input setup time  
Data input hold time  
w(SCKL)  
t
Master  
Slave  
100  
100  
su(MI)  
t
su(SI)  
ns  
t
Master  
Slave  
100  
100  
h(MI)  
t
h(SI)  
t
Data output access time  
Data output disable time  
Data output valid time  
Data output hold time  
Data output valid time  
Data output hold time  
Slave  
Slave  
0
120  
240  
90  
a(SO)  
t
dis(SO)  
t
v(SO)  
h(SO)  
v(MO)  
h(MO)  
Slave (after enable edge)  
t
0
t
0.25  
0.25  
Master (before capture edge)  
t
CPU  
t
Figure 76. SPI Slave Timing Diagram with CPHA=0 1)  
SS  
INPUT  
t
t
su(SS)  
c(SCK)  
t
h(SS)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
t
t
w(SCKH)  
w(SCKL)  
t
t
t
t
dis(SO)  
a(SO)  
v(SO)  
h(SO)  
t
t
r(SCK)  
f(SCK)  
see  
note 2  
MISO  
OUTPUT  
MSB OUT  
see note 2  
BIT6 OUT  
LSB OUT  
t
t
h(SI)  
su(SI)  
MSB IN  
LSB IN  
BIT1 IN  
MOSI  
INPUT  
Notes:  
1. Measurement points are done at CMOS levels: 0.3xV and 0.7xV  
.
DD  
DD  
135/157  
1
ST7232A  
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)  
Figure 77. SPI Slave Timing Diagram with CPHA=11)  
SS  
INPUT  
t
t
su(SS)  
c(SCK)  
t
h(SS)  
CPHA=1  
CPOL=0  
CPHA=1  
CPOL=1  
t
t
w(SCKH)  
w(SCKL)  
t
t
dis(SO)  
a(SO)  
t
t
h(SO)  
v(SO)  
t
t
r(SCK)  
f(SCK)  
see  
note 2  
see  
note 2  
MISO  
OUTPUT  
MSB OUT  
BIT6 OUT  
HZ  
LSB OUT  
t
t
h(SI)  
su(SI)  
MSB IN  
LSB IN  
BIT1 IN  
MOSI  
INPUT  
Figure 78. SPI Master Timing Diagram 1)  
SS  
INPUT  
t
c(SCK)  
CPHA=0  
CPOL=0  
CPHA=0  
CPOL=1  
CPHA=1  
CPOL=0  
CPHA=1  
CPOL=1  
t
t
w(SCKH)  
w(SCKL)  
t
t
r(SCK)  
f(SCK)  
t
t
h(MI)  
su(MI)  
MISO  
MOSI  
INPUT  
MSB IN  
h(MO)  
BIT6 IN  
LSB IN  
t
t
v(MO)  
MSB OUT  
LSB OUT  
see note 2  
BIT6 OUT  
see note 2  
OUTPUT  
Notes:  
1. Measurement points are done at CMOS levels: 0.3xV and 0.7xV  
.
DD  
DD  
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has  
its alternate function capability released. In this case, the pin status depends of the I/O port configuration.  
136/157  
1
ST7232A  
12.12 10-BIT ADC CHARACTERISTICS  
Subject to general operating conditions for V , f  
, and T unless otherwise specified.  
DD CPU  
A
Symbol  
Parameter  
ADC clock frequency  
Conditions  
Min  
0.4  
3.8  
Typ  
Max  
Unit  
f
2
MHz  
ADC  
V
Analog reference voltage  
Conversion voltage range  
0.7*V V  
V  
V
DD  
AREF  
DD  
AREF  
DD  
V
1)  
V
V
V
AREF  
AIN  
SSA  
-40°CT ≤+85°C  
250  
nA  
µA  
kΩ  
pF  
Positive input leakage current for analog  
input  
A
I
2)  
lkg  
+85°C<T ≤+125°C  
1
A
R
C
External input impedance  
see  
Figure 79  
and  
AIN  
AIN  
External capacitor on analog input  
f
Variation freq. of analog input signal  
Hz  
pF  
Figure 80  
AIN  
C
Internal sample and hold capacitor  
Conversion time (Sample+Hold)  
12  
ADC  
t
t
7.5  
µs  
ADC  
f
=8MHz, SPEED=0 f  
=2MHz  
CPU  
ADC  
- No of sample capacitor loading cycles  
- No. of Hold conversion cycles  
4
11  
1/f  
ADC  
ADC  
Notes:  
1. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10k). Data  
based on characterization results, not tested in production.  
2.injecting negative current on any of the analog input pins significantly reduces the accuracy of any conversion being  
performed on any analog input. Analog pins can be protected against negative injection by adding a Schottky diode (pin  
to ground). Injecting negative current on digital input pins degrades ADC accuracy especially if performed on a pin close  
to the analog input pins. Any positive injection current within the limits specified for I  
does not affect the ADC accuracy.  
and ΣI  
in Section 12.8  
INJ(PIN)  
INJ(PIN)  
137/157  
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ST7232A  
ADC CHARACTERISTICS (Cont’d)  
1)  
2)  
Figure 79. R  
max. vs f  
with C =0pF  
Figure 80. Recommended C  
& R  
AIN AIN values.  
AIN  
ADC  
AIN  
45  
40  
35  
30  
25  
20  
15  
10  
5
1000  
Cain 10 nF  
Cain 22 nF  
Cain 47 nF  
2 MHz  
1 MHz  
100  
10  
1
0
0.1  
0
10  
30  
70  
0.01  
0.1  
1
10  
CPARASITIC (pF)  
fAIN(KHz)  
Figure 81. Typical A/D Converter Application  
V
DD  
ST72XXX  
V
T
0.6V  
R
2kΩ(max)  
AIN  
AINx  
10-Bit A/D  
V
AIN  
Conversion  
C
V
0.6V  
AIN  
T
I
C
ADC  
12pF  
L
1µA  
Notes:  
1. C  
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad ca-  
PARASITIC  
pacitance (3pF). A high C  
value will downgrade conversion accuracy. To remedy this, f  
should be reduced.  
PARASITIC  
ADC  
2. This graph shows that depending on the input signal variation (f ), C  
can be increased for stabilization time and  
AIN  
AIN  
decreased to allow the use of a larger serial resistor (R  
.
AIN)  
138/157  
1
ST7232A  
ADC CHARACTERISTICS (Cont’d)  
12.12.1 Analog Power Supply and Reference  
Pins  
digital ground plane via a single point on the  
PCB.  
Depending on the MCU pin count, the package  
– Filter power to the analog power planes. It is rec-  
ommended to connect capacitors, with good high  
frequency characteristics, between the power  
and ground lines, placing 0.1µF and optionally, if  
needed 10pF capacitors as close as possible to  
the ST7 power supply pins and a 1 to 10µF ca-  
pacitor close to the power source (see Figure  
82).  
may feature separate V  
and V  
analog  
AREF  
SSA  
power supply pins. These pins supply power to the  
A/D converter cell and function as the high and low  
reference voltages for the conversion. In some  
packages, V  
and V  
pins are not available  
AREF  
SSA  
(refer to Section 2 on page 8). In this case the an-  
alog supply and reference pads are internally  
bonded to the V and V pins.  
DD  
SS  
– The analog and digital power supplies should be  
connected in a star nework. Do not use a resis-  
Separation of the digital and analog power pins al-  
low board designers to improve A/D performance.  
Conversion accuracy can be impacted by voltage  
drops and noise in the event of heavily loaded or  
badly decoupled power supply lines (see Section  
12.12.2 General PCB Design Guidelines).  
tor, as V  
is used as a reference voltage by  
AREF  
the A/D converter and any resistance would  
cause a voltage drop and a loss of accuracy.  
– Properly place components and route the signal  
traces on the PCB to shield the analog inputs.  
Analog signals paths should run over the analog  
ground plane and be as short as possible. Isolate  
analog signals from digital signals that may  
switch while the analog inputs are being sampled  
by the A/D converter. Do not toggle digital out-  
puts on the same I/O port as the A/D input being  
converted.  
12.12.2 General PCB Design Guidelines  
To obtain best results, some general design and  
layout rules should be followed when designing  
the application PCB to shield the noise-sensitive,  
analog physical interface from noise-generating  
CMOS logic signals.  
– Use separate digital and analog planes. The an-  
alog ground plane should be connected to the  
Figure 82. Power Supply Filtering  
ST72XXX  
1 to 10µF  
0.1µF  
V
V
SS  
DD  
ST7  
DIGITAL NOISE  
FILTERING  
V
DD  
POWER  
SUPPLY  
SOURCE  
0.1µF  
V
V
AREF  
SSA  
EXTERNAL  
NOISE  
FILTERING  
139/157  
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ST7232A  
10-BIT ADC CHARACTERISTICS (Cont’d)  
12.12.3 ADC Accuracy  
Conditions: V =5V 1)  
DD  
2)  
Max  
6
Symbol  
|E |  
Parameter  
Conditions  
Typ  
4
Unit  
1)  
Total unadjusted error  
T
1)  
3
5
|E |  
Offset error  
O
1)  
0.5  
1.5  
1.5  
4.5  
4.5  
4.5  
LSB  
|E |  
Gain Error  
G
1)  
|E |  
Differential linearity error  
CPU in run mode @ f  
CPU in run mode @ f  
= 2 MHz.  
= 2 MHz.  
D
ADC  
1)  
|E |  
Integral linearity error  
L
ADC  
Notes:  
1. ADC Accuracy vs. Negative Injection Current: Injecting negative current may reduce the accuracy of the conversion  
being performed on another analog input. The effect of negative injection current on robust pins is specified in Section  
12.12.  
Any positive injection current within the limits specified for I  
accuracy.  
and ΣI  
in Section 12.8 does not affect the ADC  
INJ(PIN)  
INJ(PIN)  
2. Data based on characterization results, monitored in production to guarantee 99.73% within max value from -40°C  
to 125°C ( 3σ distribution limits).  
Figure 83. ADC Accuracy Characteristics  
Digital Result ADCDR  
E
G
(1) Example of an actual transfer curve  
(2) The ideal transfer curve  
(3) End point correlation line  
1023  
1022  
1021  
V
V  
AREF  
SSA  
1LSB  
= --------------------------------------------  
IDEAL  
1024  
(2)  
E =Total Unadjusted Error: maximum deviation  
T
E
between the actual and the ideal transfer curves.  
T
(3)  
7
6
5
4
3
2
1
E =Offset Error: deviation between the first actual  
O
transition and the first ideal one.  
(1)  
E =Gain Error: deviation between the last ideal  
G
transition and the last actual one.  
E
E
O
L
E =Differential Linearity Error: maximum deviation  
D
between actual steps and the ideal one.  
E =Integral Linearity Error: maximum deviation  
L
E
between any actual transition and the end point  
correlation line.  
D
1 LSB  
IDEAL  
V
(LSB  
)
in  
IDEAL  
0
1
2
3
4
5
6
7
1021 1022 1023 1024  
V
V
SSA  
AREF  
140/157  
1
ST7232A  
13 PACKAGE CHARACTERISTICS  
13.1 PACKAGE MECHANICAL DATA  
Figure 84. 32-Pin Thin Quad Flat Package  
mm  
inches  
Dim.  
Min Typ Max Min Typ Max  
D
A
1.60  
0.063  
0.006  
A
D1  
A2  
A1 0.05  
0.15 0.002  
A2 1.35 1.40 1.45 0.053 0.055 0.057  
A1  
b
C
0.30 0.37 0.45 0.012 0.015 0.018  
0.09 0.20 0.004 0.008  
e
b
D
9.00  
7.00  
9.00  
7.00  
0.80  
3.5°  
0.354  
0.276  
0.354  
0.276  
0.031  
3.5°  
D1  
E
E1  
E
E1  
e
θ
0°  
7°  
0°  
7°  
c
L1  
L
0.45 0.60 0.75 0.018 0.024 0.030  
1.00 0.039  
Number of Pins  
32  
L
L1  
h
N
Figure 85. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width  
mm  
inches  
Dim.  
Min Typ Max Min Typ Max  
E
eC  
A
3.56 3.76 5.08 0.140 0.148 0.200  
A1 0.51  
A2 3.05 3.56 4.57 0.120 0.140 0.180  
0.36 0.46 0.58 0.014 0.018 0.023  
b1 0.76 1.02 1.40 0.030 0.040 0.055  
0.020  
A2  
A
L
b
A1  
E1  
C
eA  
eB  
C
D
E
0.20 0.25 0.36 0.008 0.010 0.014  
27.43 28.45 1.080 1.100 1.120  
9.91 10.41 11.05 0.390 0.410 0.435  
b
b2  
e
D
E1 7.62 8.89 9.40 0.300 0.350 0.370  
e
1.78  
0.070  
0.400  
eA  
eB  
eC  
L
10.16  
12.70  
1.40  
0.500  
0.055  
2.54 3.05 3.81 0.100 0.120 0.150  
Number of Pins  
N
32  
141/157  
1
ST7232A  
Figure 86. 42-Pin Plastic Dual In-Line Package, Shrink 600-mil Width  
mm  
Min Typ Max Min Typ Max  
5.08 0.200  
inches  
Dim.  
E
A
A2  
A
L
A1 0.51  
A2 3.05 3.81 4.57 0.120 0.150 0.180  
0.38 0.46 0.56 0.015 0.018 0.022  
b2 0.89 1.02 1.14 0.035 0.040 0.045  
0.020  
A1  
c
E1  
b
b2  
b
e
eA  
eB  
E
D
c
D
E
0.23 0.25 0.38 0.009 0.010 0.015  
36.58 36.83 37.08 1.440 1.450 1.460  
0.015  
15.24  
16.00 0.600  
0.630  
GAGE PLANE  
E1 12.70 13.72 14.48 0.500 0.540 0.570  
e
1.78  
0.070  
0.600  
eA  
eB  
eC  
L
15.24  
eC  
18.54  
0.730  
0.060  
eB  
1.52 0.000  
2.54 3.30 3.56 0.100 0.130 0.140  
Number of Pins  
N
42  
Figure 87. 44-Pin Thin Quad Flat Package  
mm  
inches  
Dim.  
A
D
D1  
Min Typ Max Min Typ Max  
A2  
A
1.60  
0.063  
0.006  
A1 0.05  
0.15 0.002  
A1  
A2 1.35 1.40 1.45 0.053 0.055 0.057  
b
C
0.30 0.37 0.45 0.012 0.015 0.018  
b
e
0.09  
0.20 0.004 0.000 0.008  
D
12.00  
10.00  
12.00  
10.00  
0.80  
0.472  
0.394  
0.472  
0.394  
0.031  
D1  
E
E1  
E
E1  
e
θ
0°  
3.5°  
7°  
0°  
3.5°  
7°  
L
0.45 0.60 0.75 0.018 0.024 0.030  
1.00 0.039  
Number of Pins  
44  
c
L1  
L1  
L
h
N
Figure 88.  
142/157  
1
ST7232A  
13.2 THERMAL CHARACTERISTICS  
Symbol  
Ratings  
Value  
Unit  
Package thermal resistance (junction to ambient)  
TQFP32 7x7  
SDIP32 400mil  
R
70  
TBD  
°C/W  
thJA  
1)  
P
Power dissipation  
Maximum junction temperature  
500  
150  
mW  
°C  
D
2)  
T
Jmax  
Notes:  
1. The power dissipation is obtained from the formula P =P +P  
where P  
is the chip internal power (I xV  
)
D
INT  
PORT  
INT  
DD DD  
and P  
is the port power dissipation determined by the user.  
PORT  
2. The average chip-junction temperature can be obtained from the formula T = T + P x RthJA.  
J
A
D
143/157  
1
ST7232A  
13.3 SOLDERING INFORMATION  
In accordance with the RoHS European directive,  
all STMicroelectronics packages will be converted  
Backward and forward compatibility:  
The main difference between Pb and Pb-free sol-  
dering process is the temperature range.  
in 2005 to lead-free technology, named ECO-  
TM  
PACK  
(for a detailed roadmap, please refer to  
TM  
– ECOPACK TQFP, SDIP and SO packages  
PCN CRP/04/744 "Lead-free Conversion Program  
- Compliance with RoHS", issued November 18th,  
2004).  
are fully compatible with Lead (Pb) containing  
soldering process (see application note AN2034)  
TM  
– TQFP, SDIP and SO Pb-packages are compati-  
ble with Lead-free soldering process, neverthe-  
less it's the customer's duty to verify that the Pb-  
packages maximum temperature (mentioned on  
the Inner box label) is compatible with their Lead-  
free soldering temperature.  
ECOPACK packages are qualified according  
to the JEDEC STD-020B compliant soldering  
profile.  
Detailed information on the STMicroelectronic  
TM  
ECOPACK transition program is available on  
www.st.com/stonline/leadfree/, with specific  
technical Application notes covering the main  
technical aspects related to lead-free  
conversion (AN2033, AN2034, AN2035,  
AN2036).  
Table 26. Soldering Compatibility (wave and reflow soldering process)  
Package  
SDIP & PDIP  
TQFP and SO  
Plating material devices  
Sn (pure Tin)  
NiPdAu (Nickel-palladium-Gold)  
Pb solder paste  
Pb-free solder paste  
Yes  
Yes  
Yes *  
Yes *  
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)  
is compatible with their Lead-free soldering process.  
144/157  
1
ST7232A  
14 ST7232A DEVICE CONFIGURATION AND ORDERING INFORMATION  
Each device is available for production in user pro-  
grammable versions (FLASH) as well as in factory  
coded versions (ROM). ST7232A devices are  
ROM versions. ST72P32A devices are Factory  
Advanced Service Technique ROM (FASTROM)  
versions: they are factory-programmed HDFlash  
devices. FLASH devices are shipped to customers  
with a default content (FFh), while ROM factory  
coded parts contain the code supplied by the cus-  
tomer. This implies that FLASH devices have to be  
configured by the customer using the Option Bytes  
while the ROM devices are factory-configured.  
14.1 FLASH OPTION BYTES  
STATIC OPTION BYTE 0  
STATIC OPTION BYTE 1  
7
0
7
0
WDG  
OSCTYPE  
OSCRANGE  
1
1
0
0
1
1
0
1
2
1
Default  
1
1
1
0
0
1
1
1
0
1
1
The option bytes allows the hardware configura-  
tion of the microcontroller to be selected. They  
have no address in the memory map and can be  
accessed only in programming mode (for example  
using a standard ST7 programming tool). The de-  
fault content of the FLASH is fixed to FFh. To pro-  
gram directly the FLASH devices using ICP,  
FLASH devices are shipped to customers with an  
internal clock source. In masked ROM devices,  
the option bytes are fixed in hardware by the ROM  
code (see option list).  
OPT6= WDG SW Hardware or software watchdog  
This option bit selects the watchdog type.  
0: Hardware (watchdog always enabled)  
1: Software (watchdog to be enabled by software)  
OPT5:1 = Reserved, must be kept at default value.  
OPT0= FMP_R Flash memory read-out protection  
Read-out protection, when selected, provides a  
protection against Program Memory content ex-  
traction and against write access to Flash memo-  
ry.  
OPTION BYTE 0  
OPT7= WDG HALT Watchdog reset on HALT  
This option bit determines if a RESET is generated  
when entering HALT mode while the Watchdog is  
active.  
0: No Reset generation when entering Halt mode  
1: Reset generation when entering Halt mode  
Erasing the option bytes when the FMP_R option  
is selected causes the whole user memory to be  
erased first, and the device can be reprogrammed.  
Refer to Section 7.3.1 on page 37 and the ST7  
Flash Programming Reference Manual for more  
details.  
0: Read-out protection enabled  
1: Read-out protection disabled  
145/157  
1
ST7232A  
ST7232A DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)  
OPTION BYTE 1  
these option bits select the resonator oscillator  
current source corresponding to the frequency  
range of the used resonator. Otherwise, these bits  
are used to select the normal operating frequency  
range.  
OPT7= PKG1 Pin package selection bit  
This option bit selects the package.  
Version  
Selected Package  
TQFP32 / SDIP32  
TQFP44 / SDIP42  
PKG1  
K
J
0
1
OSCRANGE  
Typ. Freq. Range  
2
0
0
0
0
1
0
0
1
1
0
0
1
0
1
LP  
1~2MHz  
2~4MHz  
4~8MHz  
8~16MHz  
Note: On the chip, each I/O port has 8 pads. Pads  
that are not bonded to external pins are in input  
pull-up configuration after reset. The configuration  
of these pads must be kept at reset state to avoid  
added current consumption.  
MP  
MS  
HS  
OPT6 = RSTC RESET clock cycle selection  
This option bit selects the number of CPU cycles  
applied during the RESET phase and when exiting  
HALT mode. For resonator oscillators, it is advised  
to select 4096 due to the long crystal stabilization  
time.  
OPT0 = PLL OFF PLL activation  
This option bit activates the PLL which allows mul-  
tiplication by two of the main input clock frequency.  
The PLL is guaranteed only with an input frequen-  
cy between 2 and 4MHz.  
0: PLL x2 enabled  
1: PLL x2 disabled  
CAUTION: the PLL can be enabled only if the  
“OSC RANGE” (OPT3:1) bits are configured to  
“MP - 2~4MHz”. Otherwise, the device functionali-  
ty is not guaranteed.  
0: Reset phase with 4096 CPU cycles  
1: Reset phase with 256 CPU cycles  
OPT5:4 = OSCTYPE[1:0] Oscillator Type  
These option bits select the ST7 main clock  
source type.  
OSCTYPE  
Clock Source  
1
0
0
1
1
0
0
1
0
1
Resonator Oscillator  
Reserved  
Reserved  
External Source  
OPT3:1 = OSCRANGE[2:0] Oscillator range  
When the resonator oscillator type is selected,  
146/157  
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ST7232A  
ST7232A DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)  
14.2 ROM DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE  
ROM devices can be ordered in any combination  
of memory size and temperature range with the  
types given in Figure 89 and by completing the op-  
tion list on the next page.  
hexadecimal file generated by the development  
tool. All unused bytes must be set to FFh.  
Refer to application note AN1635 for information  
on the counter listing returned by ST after code  
has been transferred.  
ROM customer code is made up of the ROM con-  
tents and the list of the selected options (if any).  
The ROM contents are to be sent with the S19  
The STMicroelectronics Sales Organization will be  
pleased to provide detailed information on con-  
tractual points.  
Figure 89. ROM Factory Coded Device Types  
/
XXX  
PACKAGE VERSION  
DEVICE  
Code name (defined by STMicroelectronics)  
1= Standard 0 to +70 °C  
5= Standard -10 to +85 °C  
6= Standard -40 to +85 °C  
A = Automotive -40 to +85 °C  
B = Automotive -40 to +105 °C  
C = Automotive -40 to +125 °C  
T= Plastic Thin Quad Flat Pack  
B= Plastic Dual in Line  
ST7232AK1, ST7232AK2, ST7232AJ1, ST7232AJ2  
147/157  
1
ST7232A  
ST7232A DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)  
ST7232A MICROCONTROLLER OPTION LIST  
(Last update: 16 December 2005)  
Customer:  
Address:  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Contact:  
Phone No:  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Reference/ROM Code* : . . . . . . . . . . . . . . . . . . . . . . . . . . .  
*The ROM code name is assigned by STMicroelectronics.  
ROM code must be sent in .S19 format. .Hex extension cannot be processed.  
Device Type/Memory Size/Package (check only one option):  
-----------------------------------  
----------------------------------------- ---------------------------------------  
|
|
|
ROM DEVICE:  
4K  
8K  
|
----------------------------------------- ---------------------------------------  
------------------------------------  
TQFP32 7x7:  
|
|
|
|
[ ] ST7232AK1T  
[ ] ST7232AK1B  
[ ] ST7232AJ1T  
[ ] ST7232AJ1B  
|
|
|
|
[ ] ST7232AK2T  
[ ] ST7232AK2B  
[ ] ST7232AJ2T  
[ ] ST7232AJ2B  
SDIP32 (3)  
:
TQFP44 10x10:  
SDIP42 (3)  
:
------------------------------------ --------------------------------------  
---------------------------------------  
8K  
|
|
|
DIE FORM:  
4K  
|
------------------------------------ --------------------------------------- ----------------------------------------  
32-pin:  
44-pin:  
|
|
[ ]  
[ ]  
|
|
[ ]  
[ ]  
Conditioning (check only one option):  
------------------------------------------------------------------------ --------------------------------------------------------  
|
Packaged Product  
Die Product (dice tested at 25°C only)  
|
------------------------------------------------------------------------ --------------------------------------------------------  
TQFP:  
SDIP  
[ ] Tape & Reel [ ] Tray  
[ ] Tube  
|
|
|
[ ] Tape & Reel  
[ ] Inked wafer  
[ ] Sawn wafer on sticky foil  
Power Supply Range: [ ] 3.8 to 5.5V  
Version/Temp. Range (do not check for die product). Please refer to datasheet for specific sales conditions:  
----------------------- -------------------- --------------------------------------  
|
|
Temp. Range  
Standard  
Automotive  
----------------------- --------------------- --------------------------------------  
[ ]  
[ ]  
[ ]  
|
|
|
|
|
| 0°C to +70°C  
| -10°C to +85°C  
| -40°C to +85°C  
| -40°C to +105°C  
| -40°C to +125°C  
[ ]  
[ ]  
[ ]  
Special Marking:  
[ ] No  
[ ] Yes "_ _ _ _ _ _ _ _ _ _ " (TQFP32 7 char., other pkg. 10 char. max)  
Authorized characters are letters, digits, '.', '-', '/' and spaces only.  
Clock Source Selection:  
[ ] Resonator:  
[ ] LP: Low power resonator (1 to 2 MHz)  
[ ] MP: Medium power resonator (2 to 4 MHz)  
[ ] MS: Medium speed resonator (4 to 8 MHz)  
[ ] HS: High speed resonator (8 to 16 MHz)  
[ ] External Clock (1)  
PLL (1)  
Reset Delay  
[ ] Disabled  
[ ] 256 Cycles  
[ ] Enabled  
[ ] 4096 Cycles  
Watchdog Selection:  
Watchdog Reset on Halt:  
[ ] Software Activation  
[ ] Reset  
[ ] Hardware Activation  
[ ] No Reset  
Readout Protection (2)  
Date  
(1) PLL not supported with external clock source  
:
[ ] Disabled  
[ ] Enabled  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
(2) The Readout Protection binary value is inverted between ROM and FLASH products. The option byte checksum  
will differ between ROM and FLASH.  
(3) Not available for Automotive.  
Please download the latest version of this option list from:  
http://www.st.com/mcu > downloads > ST7 microcontrollers > Option list  
148/157  
1
ST7232A  
DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)  
14.3 VERSION-SPECIFIC SALES CONDITIONS  
To satisfy the different customer requirements and  
to ensure that ST Standard Microcontrollers will  
consistently meet or exceed the expectations of  
each Market Segment, the Codification System for  
Standard Microcontrollers clearly distinguishes  
products intended for use in automotive environ-  
ments, from products intended for use in non-auto-  
motive environments.  
It is the responsibility of the Customer to select the  
appropriate product for his application.  
14.4 FLASH DEVICE ORDERING INFORMATiON  
Table 27. ST72F32A Flash Order Codes  
Flash  
Part Number  
Version  
Package  
Memory  
(KBytes)  
Temp. Range  
ST72F32AK2TA  
ST72F32AJ2TA  
ST72F32AK2TB  
ST72F32AJ2TB  
ST72F32AK2TC  
ST72F32AJ2TC  
ST72F32AK1B5  
ST72F32AK2B5  
ST72F32AK1B6  
ST72F32AK2B6  
ST72F32AJ1B5  
ST72F32AJ2B5  
ST72F32AJ1B6  
ST72F32AJ2B6  
ST72F32AK1T5  
ST72F32AK2T5  
ST72F32AK1T6  
ST72F32AK2T6  
ST72F32AJ1T5  
ST72F32AJ2T5  
ST72F32AJ1T6  
ST72F32AJ2T6  
TQFP32  
TQFP44  
TQFP32  
TQFP44  
TQFP32  
TQFP44  
-40°C +85°C  
-40°C +105°C  
-40°C +125°C  
-10°C +85°C  
-40°C +85°C  
-10°C +85°C  
-40°C +85°C  
-10°C +85°C  
-40°C +85°C  
-10°C +85°C  
-40°C +85°C  
Automotive  
8
4
8
4
8
4
8
4
8
4
8
4
8
4
8
4
8
SDIP32  
SDIP42  
TQFP32  
TQFP44  
Standard/  
Industrial  
149/157  
1
ST7232A  
14.5 DEVELOPMENT TOOLS  
In-circuit Debugging Kit  
Two configurations are available from ST:  
STMicroelectronics offers a range of hardware  
and software development tools for the ST7 micro-  
controller family. Full details of tools available for  
the ST7 from third party manufacturers can be ob-  
tain from the STMicroelectronics Internet site:  
http//:mcu.st.com.  
STXF521-IND/USB:  
Low-cost  
In-Circuit  
Debugging kit from Softec Microsystems.  
Includes STX-InDART/USB board (USB port)  
and a specific demo board for ST72521  
(TQFP64)  
STxF-INDART  
Tools from these manufacturers include C compli-  
ers, emulators and gang programmers.  
Flash Programming tools  
Emulators  
ST7-STICK ST7 In-circuit Communication Kit, a  
complete software/hardware package for  
programming ST7 Flash devices. It connects to  
a host PC parallel port and to the target board or  
socket board via ST7 ICC connector.  
ICC Socket Boards provide an easy to use and  
flexible means of programming ST7 Flash  
devices. They can be connected to any tool that  
supports the ST7 ICC interface, such as ST7  
EMU3, ST7-DVP3, inDART, ST7-STICK, or  
many third-party development tools.  
Two types of emulators are available from ST for  
the ST7232A family:  
ST7 DVP3 entry-level emulator offers a flexible  
and modular debugging and programming  
solution. SDIP42 & SDIP32 probes/adapters  
are included, other packages need a specific  
connection kit (refer to Table 28)  
ST7 EMU3 high-end emulator is delivered with  
everything (probes, TEB, adapters etc.) needed  
to start emulating the ST7232x family. To  
configure it to emulate other ST7 subfamily  
devices, the active probe for the ST7EMU3 can  
be changed and the ST7EMU3 probe is  
designed for easy interchange of TEBs (Target  
Emulation Board). See Table 28.  
Evaluation board  
ST7232x-EVAL with ICC connector for  
programming capability. Provides direct  
connection to ST7-DVP3 emulator. Supplied  
with daughter boards (core module) for  
ST72F32A chips.  
Table 28. STMicroelectronics Development Tools  
Emulation  
Programming  
Supported  
Products  
ST7 DVP3 Series  
ST7 EMU3 series  
ICC Socket Board  
Active Probe &  
Emulator  
Connection kit  
Emulator  
T.E.B.  
ST7MDT20-T44/  
DVP  
ST72F32AJ,  
ST72F324AJ  
ST7MDT20-DVP3  
ST7MDT20-DVP3  
ST7MDT20J-  
EMU3  
1
ST7MDT20J-TEB  
ST7SB20J/xx  
ST7MDT20-T32/  
DVP  
ST7232AK,  
ST72F32AK  
Note 1: Add suffix /EU, /UK, /US for the power supply of your region.  
150/157  
1
ST7232A  
14.5.1  
Socket  
and  
Emulator  
Adapter  
Information  
For information on the type of socket that is sup-  
plied with the emulator, refer to the suggested list  
of sockets in Table 29.  
Note: Before designing the board layout, it is rec-  
ommended to check the overall dimensions of the  
socket as they may be greater than the dimen-  
sions of the device.  
For footprint and other mechanical information  
about these sockets and adapters, refer to the  
manufacturer’s datasheet (www.ironwoodelec-  
tronics.com for TQFP32 7 x 7).  
Table 29. Suggested List of Socket Types  
Socket (supplied with  
ST7MDT20J-EMU3)  
Emulator Adapter (supplied with  
ST7MDT20J-EMU3)  
Device  
TQFP32 7 X 7  
IRONWOOD SF-QFE32SA-L-01  
YAMAICHI IC149-044-*52-*5  
IRONWOOD SK-UGA06/32A-01  
YAMAICHI ICP-044-5  
TQFP44 10 X10  
151/157  
1
ST7232A  
14.6 ST7 APPLICATION NOTES  
Table 30. ST7 Application Notes  
IDENTIFICATION DESCRIPTION  
APPLICATION EXAMPLES  
AN1658  
AN1720  
AN1755  
SERIAL NUMBERING IMPLEMENTATION  
MANAGING THE READ-OUT PROTECTION IN FLASH MICROCONTROLLERS  
A HIGH RESOLUTION/PRECISION THERMOMETER USING ST7 AND NE555  
EXAMPLE DRIVERS  
AN 969  
AN 970  
AN 972  
AN 973  
AN 974  
AN 976  
AN 979  
AN 980  
AN1041  
AN1044  
AN1046  
AN1047  
AN1048  
AN1078  
AN1445  
AN1504  
SCI COMMUNICATION BETWEEN ST7 AND PC  
SPI COMMUNICATION BETWEEN ST7 AND EEPROM  
ST7 SOFTWARE SPI MASTER COMMUNICATION  
SCI SOFTWARE COMMUNICATION WITH A PC USING ST72251 16-BIT TIMER  
REAL TIME CLOCK WITH ST7 TIMER OUTPUT COMPARE  
DRIVING A BUZZER THROUGH ST7 TIMER PWM FUNCTION  
DRIVING AN ANALOG KEYBOARD WITH THE ST7 ADC  
ST7 KEYPAD DECODING TECHNIQUES, IMPLEMENTING WAKE-UP ON KEYSTROKE  
USING ST7 PWM SIGNAL TO GENERATE ANALOG OUTPUT (SINUSOÏD)  
MULTIPLE INTERRUPT SOURCES MANAGEMENT FOR ST7 MCUS  
UART EMULATION SOFTWARE  
MANAGING RECEPTION ERRORS WITH THE ST7 SCI PERIPHERALS  
ST7 SOFTWARE LCD DRIVER  
PWM DUTY CYCLE SWITCH IMPLEMENTING TRUE 0% & 100% DUTY CYCLE  
EMULATED 16 BIT SLAVE SPI  
STARTING A PWM SIGNAL DIRECTLY AT HIGH LEVEL USING THE ST7 16-BIT TIMER  
GENERAL PURPOSE  
AN1476  
AN1709  
AN1752  
LOW COST POWER SUPPLY FOR HOME APPLIANCES  
EMC DESIGN FOR ST MICROCONTROLLERS  
ST72324 QUICK REFERENCE NOTE  
PRODUCT EVALUATION  
AN 910  
AN 990  
AN1150  
AN1151  
AN1278  
PERFORMANCE BENCHMARKING  
ST7 BENEFITS VERSUS INDUSTRY STANDARD  
BENCHMARK ST72 VS PC16  
PERFORMANCE COMPARISON BETWEEN ST72254 & PC16F876  
LIN (LOCAL INTERCONNECT NETWORK) SOLUTIONS  
PRODUCT MIGRATION  
AN1131  
MIGRATING APPLICATIONS FROM ST72511/311/214/124 TO ST72521/321/324  
PRODUCT OPTIMIZATION  
AN 982  
AN1014  
AN1015  
AN1070  
AN1181  
AN1502  
USING ST7 WITH CERAMIC RESONATOR  
HOW TO MINIMIZE THE ST7 POWER CONSUMPTION  
SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE  
ST7 CHECKSUM SELF-CHECKING CAPABILITY  
ELECTROSTATIC DISCHARGE SENSITIVE MEASUREMENT  
EMULATED DATA EEPROM WITH ST7 HDFLASH MEMORY  
ACCURATE TIMEBASE FOR LOW-COST ST7 APPLICATIONS WITH INTERNAL RC OSCILLA-  
TOR  
AN1530  
AN1636  
UNDERSTANDING AND MINIMIZING ADC CONVERSION ERRORS  
PROGRAMMING AND TOOLS  
AN 978  
ST7 VISUAL DEVELOP SOFTWARE KEY DEBUGGING FEATURES  
152/157  
1
ST7232A  
Table 30. ST7 Application Notes  
IDENTIFICATION DESCRIPTION  
AN 983  
AN 985  
AN 986  
AN 987  
AN 988  
AN 989  
AN1039  
AN1064  
AN1106  
AN1446  
AN1478  
AN1575  
AN1576  
AN1635  
AN1754  
AN1796  
KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE  
EXECUTING CODE IN ST7 RAM  
USING THE INDIRECT ADDRESSING MODE WITH ST7  
ST7 SERIAL TEST CONTROLLER PROGRAMMING  
STARTING WITH ST7 ASSEMBLY TOOL CHAIN  
GETTING STARTED WITH THE ST7 HIWARE C TOOLCHAIN  
ST7 MATH UTILITY ROUTINES  
WRITING OPTIMIZED HIWARE C LANGUAGE FOR ST7  
TRANSLATING ASSEMBLY CODE FROM HC05 TO ST7  
USING THE ST72521 EMULATOR TO DEBUG A ST72324 TARGET APPLICATION  
PORTING AN ST7 PANTA PROJECT TO CODEWARRIOR IDE  
ON-BOARD PROGRAMMING METHODS FOR XFLASH AND HDFLASH ST7 MCUS  
IN-APPLICATION PROGRAMMING (IAP) DRIVERS FOR ST7 HDFLASH OR XFLASH MCUS  
ST7 CUSTOMER ROM CODE RELEASE INFORMATION  
DATA LOGGING PROGRAM FOR TESTING ST7 APPLICATIONS VIA ICC  
FIELD UPDATES FOR FLASH BASED ST7 APPLICATIONS USING A PC COMM PORT  
SYSTEM OPTIMIZATION  
AN1711 SOFTWARE TECHNIQUES FOR COMPENSATING ST7 ADC ERRORS  
153/157  
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ST7232A  
15 KNOWN LIMITATIONS  
15.1 ALL FLASH AND ROM DEVICES  
Nested interrupt context:  
The symptom does not occur when the interrupts  
are handled normally, i.e.  
15.1.1 Safe Connection of OSC1/OSC2 Pins  
The OSC1 and/or OSC2 pins must not be left un-  
connected otherwise the ST7 main oscillator may  
start and, in this configuration, could generate an  
when:  
– The interrupt flag is cleared within its own inter-  
rupt routine  
f
clock frequency in excess of the allowed  
OSC  
maximum (>16MHz.), putting the ST7 in an un-  
safe/undefined state. Refer to Section 6.2 on page  
24.  
– The interrupt flag is cleared within any interrupt  
routine with higher or identical priority level  
– The interrupt flag is cleared in any part of the  
code while this interrupt is disabled  
15.1.2 Unexpected Reset Fetch  
If an interrupt request occurs while a "POP CC" in-  
struction is executed, the interrupt controller does  
not recognise the source of the interrupt and, by  
default, passes the RESET vector address to the  
CPU.  
If these conditions are not met, the symptom can  
be avoided by implementing the following se-  
quence:  
PUSH CC  
SIM  
Workaround  
reset interrupt flag  
POP CC  
To solve this issue, a "POP CC" instruction must  
always be preceded by a "SIM" instruction.  
15.1.3 Clearing active interrupts outside  
interrupt routine  
15.1.4 16-bit Timer PWM Mode  
In PWM mode, the first PWM pulse is missed after  
writing the value FFFCh in the OC1R register  
(OC1HR, OC1LR). It leads to either full or no PWM  
during a period, depending on the OLVL1 and  
OLVL2 settings.  
When an active interrupt request occurs at the  
same time as the related flag is being cleared, an  
unwanted reset may occur.  
Note: clearing the related interrupt mask will not  
generate an unwanted reset  
15.1.5 SCI Wrong Break duration  
Description  
Concurrent interrupt context  
The symptom does not occur when the interrupts  
are handled normally, i.e.  
A single break character is sent by setting and re-  
setting the SBK bit in the SCICR2 register. In  
some cases, the break character may have a long-  
er duration than expected:  
when:  
– The interrupt flag is cleared within its own inter-  
rupt routine  
- 20 bits instead of 10 bits if M=0  
- 22 bits instead of 11 bits if M=1.  
– The interrupt flag is cleared within any interrupt  
routine  
In the same way, as long as the SBK bit is set,  
break characters are sent to the TDO pin. This  
may lead to generate one break more than expect-  
ed.  
– The interrupt flag is cleared in any part of the  
code while this interrupt is disabled  
If these conditions are not met, the symptom can  
be avoided by implementing the following se-  
quence:  
Occurrence  
The occurrence of the problem is random and pro-  
portional to the baudrate. With a transmit frequen-  
cy of 19200 baud (fCPU=8MHz and SCI-  
BRR=0xC9), the wrong break duration occurrence  
is around 1%.  
Perform SIM and RIM operation before and after  
resetting an active interrupt request.  
Example:  
SIM  
Workaround  
reset interrupt flag  
RIM  
If this wrong duration is not compliant with the  
communication protocol in the application, soft-  
ware can request that an Idle line be generated  
before the break character. In this case, the break  
duration is always correct assuming the applica-  
154/157  
1
ST7232A  
DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)  
tion is not doing anything between the idle and the  
break. This can be ensured by temporarily disa-  
bling interrupts.  
15.1.6 39-Pulse ICC Entry Mode  
For Flash devices, ICC mode entry using ST7 ap-  
plication clock (39 pulses) is not supported. Exter-  
nal clock mode must be used (36 pulses). Refer to  
the ST7 Flash Programming Reference Manual.  
The exact sequence is:  
- Disable interrupts  
- Reset and Set TE (IDLE request)  
- Set and Reset SBK (Break Request)  
- Re-enable interrupts  
15.2 ROM DEVICES ONLY  
15.2.1 I/O Port A and F Configuration  
As a consequence, for cycle-accurate operations,  
these configurations are prohibited in either input  
or output mode.  
When using an external quartz crystal or ceramic  
resonator, a few f  
clock periods may be lost  
OSC2  
when the signal pattern in Table 31 occurs . This is  
because this pattern causes the device to enter  
test mode and return to user mode after a few  
clock periods. User program execution and I/O  
status are not changed, only a few clock cycles are  
lost.  
Workaround:  
To avoid this occurring, it is recommended to con-  
nect one of these pins to GND (PF4 or PF0) or  
V
(PA3 or PF1).  
DD  
15.2.2 External clock source with PLL  
This happens with either one of the following con-  
figurations:  
PLL is not supported with external clock source.  
PA3=0, PF4=1, PF1=0 while PLL option is disa-  
bled and PF0 is toggling  
PA3=0, PF4=1, PF1=0, PF0=1 while PLL option is  
enabled  
This is detailed in the following table  
Table 31. Port A and F Configuration:  
Clock  
PLL PA3 PF4 PF1  
PF0  
Disturbance  
Max. 2 clock cy-  
cles lost at each  
rising or falling  
edge of PF0  
Max. 1 clock cy-  
cle lost out of  
every 16  
OFF  
ON  
0
0
1
1
0
0
Toggling  
1
155/157  
ST7232A  
16 REVISION HISTORY  
Table 32. Revision History  
Date  
Revision  
Description of Changes  
Apr-2005  
1
First Release.  
Added TQFP44 and SDIP42 sales types  
Added -40°C to 105°C and -40°C to 125°C sales types: changes in device summa-  
ry on 1st page, Section 12.3.1 on page 115, Section 12.4.1 on page 116, Section  
12.7.3.2 on page 127, Section 12.12 on page 137, Figure 85 on page 141 and in  
option list on page 148  
Added Figure 4 on page 9  
Modified Table 1 on page 10  
Updated Figure 5 on page 13 and Figure 7 on page 18  
Changed reset duration in Section 10.1.3 on page 48  
In Section 10.5.4.2 on page 90, changed text in Transmitter / Character Transmis-  
sion / Procedure section (when a frame transmission is complete, etc.)  
Changed Section 12.7.2 on page 126  
Dec-2005  
2
Changed data retention on 1st page and in Section 12.6.2 on page 124  
Changed note 4 in Section 12.8.1 on page 128  
Changed OPT 7 in Section 14.1 on page 145  
Modified Section 14.2 on page 147, Section 14.4 on page 149 and Section 14.5 on  
page 150  
Modified option list  
156/157  
ST7232A  
Notes:  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics.  
All other names are the property of their respective owners  
© 2005 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
Australia – Belgium - Brazil - Canada - China – Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
www.st.com  
157/157  

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STMICROELECTR

ST7232AJ2TA/XXX

8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44
STMICROELECTR

ST7232AJ2TA/XXXRE

MICROCONTROLLER
STMICROELECTR

ST7232AJ2TB

8-BIT MICROCONTROLLER WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR

ST7232AJ2TC

8-BIT MICROCONTROLLER WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR

ST7232AK1

8-BIT MCU WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR

ST7232AK1B1

8-BIT MCU WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR

ST7232AK1B5

8-BIT MCU WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR

ST7232AK1B6

8-BIT MCU WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR

ST7232AK1B6A

8-BIT MICROCONTROLLER WITH 8K FLASH/ROM, ADC, 4 TIMERS, SPI, SCI INTERFACE
STMICROELECTR