STB75NF75TRL [STMICROELECTRONICS]
75A, 75V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB, D2PAK-3;型号: | STB75NF75TRL |
厂家: | ST |
描述: | 75A, 75V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB, D2PAK-3 |
文件: | 总11页 (文件大小:474K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STB75NF75
STP75NF75 STP75NF75FP
N-CHANNEL 75V - 0.0095 Ω - 80A TO-220/TO-220FP/D²PAK
STripFET™ II POWER MOSFET
V
R
I
D
TYPE
DSS
DS(on)
STB75NF75
STP75NF75
STP75NF75FP
75 V
75 V
75 V
<0.011 Ω
<0.011 Ω
<0.011 Ω
80 A
80 A
80 A(*)
■
■
■
■
TYPICAL R (on) = 0.0095 Ω
DS
3
3
1
2
EXCEPTIONAL dv/dt CAPABILITY
1
100% AVALANCHE TESTED
2
D PAK
TO-263
TO-220FP
2
SURFACE-MOUNTING D PAK (TO-263)
POWER PACKAGE IN TAPE & REEL
(SUFFIX “T4”)
(Suffix “T4”)
3
2
1
DESCRIPTION
TO-220
This MOSFET series realized with STMicroelectronics
unique STripFET™ process has specifically been de-
signed to minimize input capacitance and gate charge. It
is therefore suitable as primary switch in advanced high-
efficiency, high-frequency isolated DC-DC converters for
Telecom and Computer applications. It is also intended for
any applications with low gate drive requirements.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
■
■
■
SOLENOID AND RELAY DRIVERS
DC MOTOR CONTROL
DC-DC CONVERTERS
AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
STB75NF75
STP75NF75FP
STP75NF75
V
Drain-source Voltage (V = 0)
75
75
V
V
DS
GS
V
Drain-gate Voltage (R = 20 kΩ)
DGR
GS
V
GS
Gate- source Voltage
± 20
V
I
Drain Current (continuous) at T = 25°C
80
70
80(*)
70(*)
320(*)
45
A
D
C
I
Drain Current (continuous) at T = 100°C
A
D
C
I
(•)
Drain Current (pulsed)
320
300
2.0
A
DM
P
Total Dissipation at T = 25°C
W
tot
C
Derating Factor
0.3
W/°C
V/ns
mJ
V
(1)
(2)
Peak Diode Recovery voltage slope
Single Pulse Avalanche Energy
Insulation Withstand Voltage (DC)
Storage Temperature
12
dv/dt
E
700
AS
V
ISO
------
2000
T
stg
-55 to 175
°C
T
Operating Junction Temperature
j
(•) Pulse width limited by safe operating area.
(*) Refer to SOA for the max allowable current values on FP-type
due to Rth value
(1) I ≤80A, di/dt ≤300A/µs, V ≤ V
, T ≤ T
SD
DD
(BR)DSS j JMAX
o
(2) Starting T = 25 C, I = 40A, V = 37.5V
j
D
DD
June 2003
1/11
NEW DATASHEET ACCORDING TO PCN DSG20023123 MARKING: P75NF75 @
STB75NF75 STP75NF75 STP75NF75FP
THERMAL DATA
2
D PAK
TO-220FP
TO-220
Rthj-case
Thermal Resistance Junction-case
Max
0.5
3.33
°C/W
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
( 1.6 mm from case, for 10 sec.)
62.5
300
°C/W
°C
Rthj-amb
Max
T
l
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol
Parameter
Drain-source
Test Conditions
Min.
Typ.
Max.
Unit
I
= 250 µA, V = 0
D
GS
V
75
V
(BR)DSS
Breakdown Voltage
V
= Max Rating
DS
Zero Gate Voltage
1
10
µA
µA
I
DSS
Drain Current (V = 0)
V
DS
= Max Rating T = 125°C
GS
C
Gate-body Leakage
V
GS
= ± 20 V
±100
nA
I
GSS
Current (V = 0)
DS
(*)
ON
Symbol
Parameter
Test Conditions
Min.
Typ.
3
Max.
4
Unit
V
V
GS(th)
V
V
= V
I
= 250 µA
D
Gate Threshold Voltage
2
DS
GS
GS
= 10 V
I
= 40 A
Static Drain-source On
Resistance
0.0095
0.011
Ω
R
D
DS(on)
DYNAMIC
Symbol
Parameter
Test Conditions
= 15 V = 40 A
Min.
Typ.
Max.
Unit
(*)
V
V
I
D
g
fs
Forward Transconductance
20
S
DS
DS
= 25V, f = 1 MHz, V = 0
C
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
3700
730
240
pF
pF
pF
iss
GS
C
oss
C
rss
2/11
STB75NF75 STP75NF75 STP75NF75FP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
R
= 37.5 V
= 4.7 Ω
I
= 45 A
= 10 V
Turn-on Delay Time
Rise Time
25
25
ns
ns
t
DD
D
d(on)
V
t
r
G
GS
(Resistive Load, Figure 3)
Q
V
= 60 V I = 80 A V = 10V
D GS
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
117
27
47
160
nC
nC
nC
g
DD
Q
gs
Q
gd
SWITCHING OFF
Symbol
Parameter
Test Conditions
Min.
Min.
Typ.
Max.
Unit
V
R
= 37.5 V
I
D
= 45 A
Turn-off Delay Time
Fall Time
66
30
ns
ns
t
DD
d(off)
= 4.7 Ω
V
GS
= 10 V
t
G
f
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
Typ.
Max.
Unit
I
Source-drain Current
Source-drain Current (pulsed)
80
320
A
A
SD
( )
•
I
SDM
(*)
I
I
= 80 A
V
= 0
GS
V
Forward On Voltage
1.5
V
SD
SD
SD
t
= 80 A
= 25 V
di/dt = 100A/µs
T = 150°C
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
132
660
10
ns
nC
A
rr
Q
V
rr
DD
j
I
(see test circuit, Figure 5)
RRM
(*)
(
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
•)Pulse width limited by safe operating area.
Safe Operating Area
Safe Operating Area for TO-220FP
3/11
STB75NF75 STP75NF75 STP75NF75FP
Thermal Impedance
Thermal Impedance for TO-220FP
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
4/11
STB75NF75 STP75NF75 STP75NF75FP
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage Temperature
5/11
STB75NF75 STP75NF75 STP75NF75FP
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Fig. 4: Gate Charge test Circuit
Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/11
STB75NF75 STP75NF75 STP75NF75FP
D PAK MECHANICAL DATA
mm.
2
inch.
TYP.
DIM.
MIN.
4.4
TYP.
MAX.
4.6
MIN.
0.173
0.098
0.001
0.028
0.045
0.018
0.048
0.352
TYP.
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
A
A1
A2
B
2.49
0.03
0.7
2.69
0.23
0.93
1.7
B2
C
1.14
0.45
1.21
8.95
0.6
C2
D
1.36
9.35
D1
E
8
0.315
0.334
10
8.5
4.88
15
10.4
0.394
0.409
E1
G
5.28
15.85
1.4
0.192
0.591
0.050
0.055
0.094
0.208
0.624
0.055
0.069
0.126
L
L2
L3
M
1.27
1.4
2.4
1.75
3.2
R
0.4
0.016
V2
0°
8°
0°
8°
7/11
STB75NF75 STP75NF75 STP75NF75FP
TO-220 MECHANICAL DATA
mm.
TYP.
inch.
TYP.
DIM.
MIN.
4.4
MAX.
4.6
MIN.
0.173
0.048
0.094
0.019
0.024
0.044
0.044
0.194
0.094
0.393
TYP.
0.181
0.051
0.107
0.027
0.034
0.067
0.067
0.203
0.106
0.409
A
C
1.23
2.40
0.49
0.61
1.14
1.14
4.95
2.40
10
1.32
2.72
0.70
0.88
1.70
1.70
5.15
2.70
10.40
D
E
F
F1
F2
G
G1
H2
L2
L3
L4
L5
L6
L7
L9
DIA
16.40
28.90
0.645
1.137
13
14
0.511
0.104
0.600
0.244
0.137
0.147
0.551
0.116
0.620
0.260
0.154
0.151
2.65
15.25
6.20
3.50
3.75
2.95
15.75
6.60
3.93
3.85
8/11
STB75NF75 STP75NF75 STP75NF75FP
TO-220FP MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
4.4
TYP.
MAX.
4.6
2.7
2.75
0.7
1
MIN.
0.173
0.098
0.098
0.017
0.030
0.045
0.045
0.195
0.094
0.393
MAX.
0.181
0.106
0.108
0.027
0.039
0.067
0.067
0.204
0.106
0.409
A
B
2.5
D
2.5
E
0.45
0.75
1.15
1.15
4.95
2.4
F
F1
F2
G
1.7
1.7
5.2
2.7
10.4
G1
H
10
L2
L3
L4
L6
L7
Ø
16
0.630
28.6
9.8
15.9
9
30.6
10.6
16.4
9.3
1.126
0.385
0.626
0.354
0.118
1.204
0.417
0.645
0.366
0.126
3
3.2
L3
L6
L7
¯
1 2 3
L4
L2
9/11
STB75NF75 STP75NF75 STP75NF75FP
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
mm
inch
MAX.
DIM.
MIN.
MAX.
MIN.
A
B
C
D
G
N
T
330
12.992
0.520
1.039
1.197
1.5
12.8
20.2
24.4
100
0.059
0.504
0.795
0.960
3.937
13.2
26.4
30.4
BASE QTY
BULK QTY
1000
1000
TAPE MECHANICAL DATA
mm
inch
DIM.
MIN.
10.5
15.7
1.5
MAX.
10.7
15.9
1.6
MIN.
0.413
0.618
0.059
0.062
0.065
0.449
0.189
0.153
0.468
0075
MAX.
0.421
0.626
0.063
0.063
0.073
0.456
0.197
0.161
0.476
0.082
A0
B0
D
D1
E
1.59
1.65
11.4
4.8
1.61
1.85
11.6
5.0
F
K0
P0
P1
P2
R
3.9
4.1
11.9
1.9
12.1
2.1
50
1.574
T
0.25
23.7
0.35
24.3
.0.0098 0.0137
0.933 0.956
W
* on sales type
10/11
STB75NF75 STP75NF75 STP75NF75FP
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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11/11
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