STIEC45-24AS [STMICROELECTRONICS]
Transil™ for IEC 61000-4-5 compliance; TRANSIL ™为IEC 61000-4-5合规
| 型号： | STIEC45-24AS |
| 厂家： | 
ST |
| 描述： | Transil™ for IEC 61000-4-5 compliance |
| 文件： | 总9页 (文件大小：301K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STIEC45-XXAS
Transil™ for IEC 61000-4-5 compliance
Features
■ Peak pulse current: 500 A (8/20 μs, 1.2/50 µs)
■ Stand off voltage range: from 24 V to 33 V
■ Unidirectional types
A
■ Low leakage current
– 0.2 µA at 25 °C
– 1 µA at 85 °C
K
SMC
(JEDEC DO-214AB)
■ Operating T max: 150 °C
j
■ High peak current capability at T max :
j
410 A 8/20 µs
■ JEDEC registered package outline
Complies with the following standards
Description
■ IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
The STIEC45 Transil series has been designed to
protect DC power supply lines according to
IEC 61000-4-5. This device protects circuits
against electrical fast transients (EFT) according
to IEC 61000-4-4 and ETS EN 300 386.
Protection against electrostatic discharges is
provided according to IEC 61000-4-2 and
MIL STD 883 Method 3015.
■ MIL STD 883G - Method 3015-7 Class 3B
– 25 kV HBM (human body model)
■ IEC 61000-4-5
– Level 4 4 kV with R = 12 Ω (334 A)
common mode
Planar technology makes these devices suitable
for high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
– Level 2 1 kV with R = 2 Ω (500 A)
differential mode
■ MIL STD 883G, method 3015-7 Class 3B
-25 kV HBM (human body model)
■ Resin meets UL 94, V0
The STIEC45 device is packaged in SMC (SMC
footprint in accordance with IPC 7351 standard).
■ MIL-STD-750, method 2026 soldererabilty
■ EIA STD RS-481 and IEC 60286-3 packing
■ IPC 7531 footprint
TM: Transil is a trademark of STMicroelectronics
December 2009
Doc ID 16871 Rev 1
1/9
www.st.com
9
Characteristics
STIEC45-XXAS
1
Characteristics
Table 1.
Symbol
Absolute maximum ratings (T
= 25 °C)
amb
Parameter
Value
Unit
IPP
Tstg
Tj
Peak pulse current(1) (8/20 µs, 1.2/50 µs)
Storage temperature range
Tj initial = Tamb
500
A
-65 to +150
-55 to +150
260
°C
°C
°C
Operating junction temperature range
TL
Maximum lead temperature for soldering during 10 s.
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Symbol
Thermal resistances
Parameter
Value
Unit
Rth(j-l) Junction to leads
Rth(j-a) Junction to ambient on printed circuit on recommended pad layout
15
90
°C/W
°C/W
Figure 1.
Electrical characteristics - parameters
I
Symbol
VBR
VCL
IRM
VRM
IF
IPP
IR
VF
Rd
Parameter
IF
=
=
=
=
=
=
=
=
=
Breakdown voltage
Clamping voltage
Leakage current @ VRM
Stand-off voltage
Forward current
Peak pulse current
Breakdown current
Forward voltage drop
Dynamic impedance
VF
V
CL VBR VRM
V
IRM
IR
IPP
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STIEC45-XXAS
Characteristics
Table 3.
Electrical characteristics - parameter values (T
= 25 °C)
amb
(2)
VCL @IPP
RD
(1)
IRM @VRM
VBR @IR
αT (3)
8/20 µs, 1.2/50 µs 8/20 µs
Order code
25 °C 85 °C
µA
Min.
Typ.
V
Max.
Max.
V
Typ.
max
V
mA
A
Ω
10-4/ °C
STIEC45-24AS
STIEC45-26AS
STIEC45-27AS
STIEC45-28AS
STIEC45-30AS
STIEC45-33AS
0.2
0.2
0.2
0.2
0.2
0.2
1
1
1
1
1
1
24
26
27
28
30
33
26.7
28.9
30
28.2
30.3
31.6
32.6
35
29.5
31.9
33.2
34.3
36.8
40.6
1
1
1
1
1
1
42
45
47
49
55
59
500
500
500
500
500
500
0.025
0.026
0.028
0.029
0.036
0.036
9.6
9.7
9.7
9.8
9.9
10
31.1
33.3
36.7
38.6
1. Pulse test: tp < 50 ms
2. To calculate maximum clamping voltage at other surge levels: VCLmax = RD x IPP + VBRmax
3. To calculate VBR versus junction temperature: VBR @ Tj = VBR @ 25°C x (1 + αT x (Tj – 25))
Note:
Surge capability given for both directions for unidirectional and bidirectional types.
Figure 2. Pulse form
Figure 3. Peak pulse current versus initial
junction temperature
IPP(A)
600
500
400
300
200
100
0
% Ipp
8/20 µs, 1.2/50 µs
Repetitive pulse current
t = rise time (µs)
r
100
50
t
= pulse duration time (µs)
p
t
0
t
t
Tj(°C)
150 175
r
p
0
25
50
75
100
125
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Characteristics
STIEC45-XXAS
Figure 4. Clamping voltage at 500 A (1.2/50 µs - 8/20 µs)
100 A/div
Surge current
10 V/div
Remaining voltage - STIEC45-24AS
Remaining voltage - STIEC45-28AS
Remaining voltage- STIEC45-33AS
5 µs/div
10 V/div
5 µs/div
10 V/div
Remaining voltage - STIEC45-26AS
Remaining voltage - STIEC45-30AS
5 µs/div
10 V/div
5 µs/div
10 V/div
5 µs/div
5 µs/div
Figure 5. Junction capacitance versus
reverse applied voltage
Figure 6. Peak forward voltage drop
versus peak forward current
(typical values)
(typical values)
IFM(A)
C (pF)
1.E+03
10000
F=1 MHz
Vosc=30 mVRMS
Tj=25 °C
1.E+02
1.E+01
STIEC45-24AS
Tj = 25 °C
1000
STIEC45-33AS
1.E+00
Tj = 150 °C
1.E-01
VFM(V)
V (V)
R
100
1.E-02
1
10
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
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Doc ID 16871 Rev 1
STIEC45-XXAS
Characteristics
Figure 7. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead
Z
th(j a) / Rth(j a)
Rth(j-a)(°C/W)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100
90
80
70
60
50
40
30
20
10
0
Recommended pad layout
PCB FR4, copper thickness = 35 µm
PCB FR4, copper thickness = 35 µm
Single pulse
SCU(cm²)
4.5 5.0
tP(s)
1.E+03
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1.E-01
1.E+00
1.E+01
1.E+02
Figure 9. Leakage current versus junction temperature (typical values)
IR (nA)
1.E+03
VR=VRM
1.E+02
1.E+01
Tj(°C)
1.E+00
25
50
75
100
125
150
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Ordering information scheme
STIEC45-XXAS
2
Ordering information scheme
Figure 10. Ordering information scheme
STIEC45 - XX A S
IEC 61000-4-5
Stand off voltage
27 = 27 V
Current capability code
A = 500 A, 8/20 µs, 1.2/50 µs
Package
S = SMC package (JEDEC DO-214AB)
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STIEC45-XXAS
Package information
3
Package information
●
●
●
●
●
Case: JEDEC DO-214AB molded plastic over planar junction
Terminals: solder plated, solderable per MIL-STD-750, Method 2026
Polarity: for unidirectional types the band indicates cathode
Flammability: epoxy is rated UL94V-0
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 4.
SMC dimensions
Dimensions
Millimeters
Min. Max.
Ref.
Inches
Min. Max.
E1
A1
A2
b
1.90
0.05
2.90
0.15
7.75
6.60
4.40
5.55
0.75
2.45
0.20
3.2
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
D
c
0.41
8.15
7.15
4.70
6.25
1.60
E
E
A1
E1
E2
D
C
A2
E2
L
b
L
Figure 11. Footprint dimensions in mm Figure 12. Marking layout
(inches)
1.54
5.11
1.54
Cathode bar
(0.061)
(0.201)
(0.061)
E: ECOPACK environmental status
XXXX: Marking
Z: Manufacturing location
Y: Year
E
3.14
(0.124)
x x x x
WW: week
z y w w
8.19
(0.322)
Note:
Marking layout can vary according to assembly location.
Doc ID 16871 Rev 1
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Ordering information
STIEC45-XXAS
4
Ordering information
Table 5.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STIEC45-24AS
STIEC45-26AS
STIEC45-27AS
STIEC45-28AS
STIEC45-30AS
STIEC45-33AS
4524A
4526A
4527A
4528A
4530A
4533A
SMC
0.25 g
2500
Tape and reel
5
Revision history
Table 6.
Date
07-Dec-2009
Document revision history
Revision
Changes
1
First issue.
8/9
Doc ID 16871 Rev 1
STIEC45-XXAS
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