STM1066C35F38F [STMICROELECTRONICS]

Smart voltage supervisor; 智能电压监控器
STM1066C35F38F
型号: STM1066C35F38F
厂家: ST    ST
描述:

Smart voltage supervisor
智能电压监控器

电源电路 电源管理电路 监控
文件: 总20页 (文件大小:219K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STM1066  
Smart voltage supervisor  
Features  
Operating voltage 2.7 V to 5.5 V  
Supply current of 1.5 µA (typ)  
Factory-trimmed voltage threshold from 3.2 V  
to 3.5 V in 50 mV increments  
3% voltage threshold accuracy across  
temperature  
Enable and inhibit inputs (EN, INH)  
Power supply transient immunity  
Flip chip  
(6-bump)  
Current limited output of 15 mA (max)  
Available in flip chip 6-bump package  
Operating temperature –30°C to +85°C  
Applications  
Portable devices  
Cell phones/smart phones  
PDA  
Palmtops  
Organizers  
Portable audio/video players  
Portable terminals  
April 2008  
Rev 4  
1/20  
www.st.com  
1
Contents  
STM1066  
Contents  
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.1  
2.2  
2.3  
Output, OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Enable input, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Inhibit input, INH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3
4
5
6
7
8
9
Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2/20  
STM1066  
List of tables  
List of tables  
Table 1.  
Table 2.  
Table 3.  
Table 4.  
Table 5.  
Table 6.  
Table 7.  
Table 8.  
Table 9.  
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Flip chip 6-bump, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Factory-trimmed thresholds with marking description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
3/20  
List of figures  
STM1066  
List of figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Figure 9.  
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
6-bump flip chip connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Application hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Supply current vs. supply voltage, V = 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
EN  
Supply current vs. temperature, V = 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
EN  
Supply current vs. supply voltage, V = 0 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
EN  
Supply current vs. temperature, V = 0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
EN  
Rising voltage detector threshold vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Figure 10. Threshold hysteresis vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Figure 11. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 12. Flip chip 6-bump, package mechanical outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Figure 13. Flip chip tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4/20  
STM1066  
Description  
1
Description  
The STM1066 device monitors V , and connects OUT to V or GND, based on the V  
CC  
CC  
IN  
level (above V  
or below V  
) and the state of EN and INH inputs.  
TH+  
TH-  
The device offers several voltage thresholds, V  
miniature flip chip 6-bump package.  
(see Table 8) and it is available in  
TH+  
Figure 1.  
Logic diagram  
V
V
IN  
CC  
EN  
STM1066  
GND  
OUT  
INH  
ai 13963  
5/20  
Description  
Table 1.  
STM1066  
Pin descriptions  
Pin  
Symbol  
Function  
Supply for output pin (OUT)  
1A  
1B  
1C  
2A  
2B  
2C  
VIN  
EN  
Enable from USB VBUS  
Ground  
GND  
OUT  
INH  
VCC  
Output  
Active high. Inhibits device  
Chip supply  
Figure 2.  
6-bump flip chip connections  
B
A
C
B
C
A
V
INH  
EN  
OUT  
2
CC  
V
EN  
GND  
1
2
IN  
V
GND  
OUT  
INH  
V
1
CC  
IN  
bottom view, bumps up  
top view, bumps down  
ai 13915  
6/20  
STM1066  
Figure 3.  
Description  
Block diagram  
V
IN  
V
CC  
Current  
source  
Band  
gap  
+
-
GND  
OUT  
Level  
shifter  
LOGIC  
Delay  
2µs  
EN  
V
CC  
INH  
ai13916  
Figure 4.  
Application hookup  
USB charging and  
transceiver circuits  
VBUS  
V
USB connector  
DC-DC step-up  
BAT  
R
converter  
1
V
CC  
V
EN  
OUT  
BOOST  
C
3
GND  
R
2
ASIC  
V
BAT  
C
1
V
V
IN  
CC  
EN  
V
OUT  
CHARGER  
Inhibit  
INH  
C
2
control  
GND  
STM1066  
ai13917  
7/20  
Operation  
STM1066  
2
Operation  
The STM1066 connects or disconnects the output OUT, from the V pin based on the  
IN  
logical combination of the enable input (EN), the inhibit input (INH), and the supply voltage  
level, V (see Table 2 or Figure 11 for more details).  
CC  
2.1  
Output, OUT  
If the enable input is in a logic high state and inhibit input is in a logic low state, the output  
will be connected to V input as V rises above the V voltage threshold. Otherwise, the  
IN  
CC  
TH+  
output is connected to ground GND. The output is current limited (see Table 5).  
2.2  
2.3  
Enable input, EN  
A Logic low on the enable input disconnects the output from V and disables the device,  
which enters a standby mode with very low current consumption (see Table 5).  
IN  
Inhibit input, INH  
A logic high on the inhibit input disconnects the output from V .  
IN  
Table 2.  
Truth table  
VCC  
EN(1)  
INH  
OUT  
<VTH+ (rising edge)  
<VTH- (falling edge)  
x
x
connected to GND  
x
x
L
x
x
connected to GND  
connected to GND  
H
>VTH+ (rising edge)  
>VTH- (falling edge)  
H
L
connected to VIN  
1. Once the device is disabled by EN input, the VCC must be above VTH+ to reconnect output to VIN  
.
8/20  
STM1066  
Typical operating characteristics  
3
Typical operating characteristics  
Figure 5.  
Supply current vs. supply voltage, V = 4 V  
EN  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
T = -30 ˚C  
A
T = 25 ˚C  
A
T = 0˚C  
A
T = 85˚C  
A
2.5  
3.0  
3.5  
4.0  
4.5  
CC  
5.0  
5.5  
Supply Voltage, V (V)  
ai13942  
Figure 6.  
Supply current vs. temperature, V = 4 V  
EN  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
= 2.70 V  
= 3.50 V  
= 4.25 V  
= 5.00 V  
= 5.50 V  
CC  
V
V
V
V
CC  
CC  
CC  
CC  
-30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
Temperature, T (˚C)  
A
ai13943  
9/20  
Typical operating characteristics  
Figure 7. Supply current vs. supply voltage, V = 0 V  
STM1066  
EN  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
T = -30 ˚C  
A
T = 85 ˚C  
A
T = 25 ˚C  
A
T = 0 ˚C  
A
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
Supply Voltage, V (V)  
CC  
ai13944  
Figure 8.  
Supply current vs. temperature, V = 0 V  
EN  
0.65  
0.60  
0.55  
0.50  
0.45  
V
V
V
V
V
= 2.70 V  
= 3.50 V  
= 4.25 V  
= 5.00 V  
= 5.50 V  
CC  
CC  
CC  
CC  
CC  
-30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
Temperature, T (˚C)  
A
ai13945  
10/20  
STM1066  
Typical operating characteristics  
Rising voltage detector threshold vs. temperature  
Figure 9.  
3.50  
3.45  
3.40  
3.35  
3.30  
3.25  
3.20  
maximum value  
typical value  
minimum value  
-30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
Temperature, T (˚C)  
A
ai13946  
Figure 10. Threshold hysteresis vs. temperature  
550  
500  
450  
400  
350  
300  
250  
maximum value  
minimum value  
-30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
Temperature, T (˚C)  
A
ai13947  
11/20  
Maximum ratings  
STM1066  
4
Maximum ratings  
Stressing the device above the rating listed in the “Absolute maximum ratings” table may  
cause permanent damage to the device. These are stress ratings only and operation of the  
device at these or any other conditions above those indicated in the Operating sections of  
this specification is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE  
Program and other relevant quality documents.  
Table 3.  
Symbol  
Absolute maximum ratings  
Parameter  
Min Typ  
Max  
Unit  
Remarks  
VCC  
VIN  
Input supply voltage  
Output source voltage  
–0.2  
–0.2  
+7.0  
+7.0  
V
V
Independent of VCC  
Series 1M external resistor for  
protection  
VEN  
VBUS input  
–0.2  
VCC + 0.3  
V
VOUT  
VINH  
TA  
Output pin  
Inhibit pin  
–0.3  
–0.3  
VIN + 0.3  
VCC + 0.3  
+85  
V
V
Operating ambient temperature –30  
°C  
°C  
V
Storage temperature  
Electrostatic protection  
Electrostatic protection  
–45  
–100  
–2000  
–500  
+150  
+100  
Machine model  
+2000  
+500  
V
Human body model  
Charged device model  
V
12/20  
STM1066  
DC and AC characteristics  
5
DC and AC characteristics  
This section summarizes the operating measurement conditions and the DC and AC  
characteristics of the device. The parameters in the DC and AC characteristics tables that  
follow are derived from tests performed under the measurement conditions summarized in  
Table 4: Operating and AC measurement conditions. Designers should check that the  
operating conditions in their circuit match the operating conditions when relying on the  
quoted parameters.  
Table 4.  
Operating and AC measurement conditions  
Parameter Condition  
Unit  
VCC supply voltage  
2.7 to 5.5  
–30 to 85  
5  
V
Ambient operating temperature (TA)  
Input rise and fall times  
°C  
ns  
Figure 11. Waveforms  
V
CC  
(V  
V
TH+  
)
BAT  
V
TH-  
~2.1V  
~2.3V  
EN VIH  
EN (VBUS )  
EN VIL  
INHIBIT  
V
input  
(5V  
IN  
option)  
Output  
follows  
in  
OUT  
V
ai 13919  
Note:  
V
V
assumed to be from 1.6 V to 5.5 V. No V means no signal on OUT pin. If there is no  
IN  
IN  
then there will be no V .  
CC  
IN  
13/20  
DC and AC characteristics  
STM1066  
Table 5.  
Sym  
DC and AC characteristics  
Parameter  
Supply voltage  
Test condition(1)  
Min  
Typ  
Max  
Unit  
VCC  
ICC  
2.7  
5.5  
1
V
V
EN = 0 V  
EN = 4 V  
EN = 0 V  
0.6  
1.5  
µA  
µA  
µA  
µA  
Supply current into VCC pin  
V
V
15  
5
I
CC +IIN Current into VCC + VIN pins  
Rising voltage detector threshold (see  
VEN = 4 V  
15  
VTH+  
–3%  
0.3  
VTH+  
+3%  
0.5  
V
Table 7 on page 17 for detailed listing)  
VHYST  
VTH-  
Threshold hysteresis  
V
V
Falling voltage detector threshold  
VTH+ - VHYST  
VCC falling from  
(VTH- + 100 mV) to  
(VTH- – 100 mV) at  
10 mV/µs  
(2)  
tPD-FALL  
VCC falling to OUT delay  
VCC rising to OUT delay  
30  
µs  
VCC rising from  
(VTH+ – 100 mV) to  
(VTH+ + 100 mV) at  
10m V/µs  
(2)  
tPD-RISE  
70  
µs  
V
Voltage on VIN pin  
Allows 2.5 V rail,  
VBAT or +5 V  
VIN  
2.4  
5.5  
Supply for output pin  
Output pin, OUT(3)  
VOUT-OH Output high voltage, see Figure 11  
ISOURCE = 5 mA  
ISINK = 10 mA  
VIN - 0.2  
VIN  
0.3  
15  
V
V
VOUT-OL Output low voltage  
IOUT  
Output current  
5
mA  
Enable input, EN  
VEN-IH When VBUS is valid  
1.2  
1.2  
V
V
VEN-IL  
IEN-IN  
When VBUS is not valid  
Enable input current  
EN glitch immunity  
0.4  
0.1  
µA  
µs  
1
1
Inhibit input, INH  
VINH-IH Inhibit logic high  
VINH-IL Inhibit logic low  
VINH-IN Inhibit input current  
INH glitch immunity  
V
V
0.4  
0.1  
µA  
µs  
1. Valid for ambient operating temperature: TA = –30°C to +85°C; VCC = 2.7 V to 5.5 V (except where noted).  
2. Guaranteed by design.  
3. For VCC below VTH-, the output remains low down to VCC = 1 V. Below VCC = 1 V the voltage VIN must be less than  
OUT-OL (max.) to guarantee output low voltage less than 0.3 V.  
V
14/20  
STM1066  
Package mechanical data  
6
Package mechanical data  
®
In order to meet environmental requirements, ST offers these devices in ECOPACK  
packages. These packages have a lead-free second level interconnect. The category of  
second Level Interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
Figure 12. Flip chip 6-bump, package mechanical outline  
Flip chip (6-bump)  
15/20  
Package mechanical data  
STM1066  
Table 6.  
Symbol  
Flip chip 6-bump, package mechanical data  
mm  
Typ  
inches  
Typ  
Min  
Max  
Min  
Max  
A
A1  
A2  
b
0.54  
0.60  
0.205  
0.395  
0.255  
1.20  
0.80  
0.66  
0.021  
0.007  
0.024  
0.008  
0.015  
0.010  
0.047  
0.031  
0.016  
0.031  
0.016  
0.008  
0.008  
0.002  
0.002  
0.026  
0.009  
0.170  
0.240  
0.215  
1.17  
0.295  
1.23  
0.008  
0.046  
0.012  
0.048  
D
D1  
e
0.36  
0.77  
0.36  
0.18  
0.40  
0.80  
0.40  
0.44  
0.83  
0.44  
0.22  
0.014  
0.030  
0.014  
0.007  
0.017  
0.033  
0.017  
0.009  
E
E1  
SE  
f
0.20  
0.20  
0.05  
0.045  
ccc  
$
0.035  
0.050  
0.001  
0.002  
Figure 13. Flip chip tape and reel specifications  
Dot identifying pin A1 location  
4.00 0.10  
0.71 0.05  
2.00 0.05  
0.200 0.015  
TxS  
yww  
TxS  
yww  
TxS  
yww  
TxS  
yww  
TxS  
yww  
0.90  
0.05  
4.00 0.10  
User direction of unreeling  
All dimensions in mm  
16/20  
STM1066  
Part numbering  
7
Part numbering  
Table 7.  
Ordering information scheme  
STM1066  
Example:  
C35  
F3  
8
F
Device type  
STM1066  
Threshold voltage (3.2 V to 3.5 V in 50 mV increments)  
C20: 3.20 V(1)  
C25: 3.25 V(1)  
C30: 3.30 V(1)  
C35: 3.35 V  
C40: 3.40 V(1)  
C45: 3.45 V(1)  
C50: 3.50 V(1)  
Package  
F3: Flip chip, lead-free, pitch = 400 µm, bump = 250 µm  
Temperature  
8: –30°C to 85°C  
Shipping method  
F = ECOPACK® package, tape & reel  
1. Contact local ST sales office for availability.  
17/20  
Package marking information  
STM1066  
8
Package marking information  
Table 8.  
Factory-trimmed thresholds with marking description  
Rising voltage detector threshold VTH+ at ambient temperature  
TA from –30 to +85°C  
Topside  
Part number  
marking(1)  
Min (–3%)  
Typ  
Max (+3%)  
TAS  
yww  
STM1066C20F38F  
STM1066C25F38F  
STM1066C30F38F  
STM1066C35F38F  
STM1066C40F38F  
STM1066C45F38F  
STM1066C50F38F  
3.104  
3.20  
3.296  
TBS  
yww  
3.152  
3.201  
3.249  
3.298  
3.346  
3.395  
3.25  
3.30  
3.35  
3.40  
3.45  
3.50  
3.348  
3.399  
3.451  
3.502  
3.554  
3.605  
TCS  
yww  
TDS  
yww  
TES  
yww  
TFS  
yww  
TGS  
yww  
1. Where “y” = assembly year (0 to 9) and “ww” = assembly work week (01 to 52).  
18/20  
STM1066  
Revision history  
9
Revision history  
Table 9.  
Date  
Document revision history  
Revision  
Changes  
06-Sep-2007  
03-Jan-2008  
1
Initial release.  
Updated cover page, Section 1, Figure 2, 11, 13, and Table 4; added  
Figure 1: Logic diagram; minor text and presentation changes.  
2
26-Mar-2008  
09-Apr-2008  
3
4
Updated Table 5, 6.  
Document status upgraded to full datasheet; updated Figure 12.  
19/20  
STM1066  
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