STM1645-10 [STMICROELECTRONICS]
RF POWER MODULES SATELLITE COMMUNICATIONS APPLICATIONS; RF功率模块卫星通信应用
| 型号： | STM1645-10 |
| 厂家： | 
ST |
| 描述： | RF POWER MODULES SATELLITE COMMUNICATIONS APPLICATIONS |
| 文件： | 总5页 (文件大小：53K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STM1645-10
RF POWER MODULES
SATELLITE COMMUNICATIONS APPLICATIONS
PRELIMINARY DATA
.
SATELLITE COMMUNICATIONS
AMPLIFIER
.
.
.
.
.
1625 - 1665 MHz
18/28 VOLTS
INPUT/OUTPUT 50 OHMS
POUT = 10 W MIN.
GAIN = 30 dB MIN.
CASE STYLE H150
BRANDING
ORDER CODE
STM1645-10
STM1645-10
PIN CONNECTION
DESCRIPTION
The STM1645-10 module is designed for high
power satellite communication applications in
the 1.6 GHz frequency range operating at 28
Volts.
1. RF Input
3. VC2, 28V
2. VC1, 18V
4. RF Output
°
25 C)
ABSOLUTE MAXIMUM RATINGS (T
=
case
Symbol
VC1
Parameter
Value
Unit
DC Supply Voltage
DC Supply Voltage
RF Input Power
20
Vdc
Vdc
mW
W
VC2
32
20
PIN
POUT
TSTG
TC
RF Output Power
16
°
Storage Temperature
Operating Case Temperature
− 40 to +100
− 35 to +70
C
°
C
April 4, 1996
1/5
STM1645-10
ELECTRICAL SPECIFICATIONS (T
= 25 °C, V
= 18 V, V = 28 V)
C2
case
C1*
Value
Typ.
Symbol
Parameter
Test Conditions
Unit
Min.
Max.
BW Frequency Range
1625
—
—
1665
MHz
dBm
dB
PIN
GP
η
Input Power
Power Gain
Efficiency
—
30
30
—
10.0
—
POUT 10 W
=
—
POUT = 10 W
POUT = 10 W
35
−45
—
%
H
ZIN
—
Harmonics
dBc
POUT 10 W reference
−40
=
Input Impedance
Load Mismatch
POUT = 10 W
ZG, ZL = 50Ω
V = 28 Vdc
—
1.5:1 2.0:1 VSWR
No Degradation in Output
Power
VSWR = 10:1
POUT = 10 W
*Note: V
= 18V Regulated ± 1%
C1
D.C. TEST FIXTURE BYPASSING
C1
C2
C3
C4
:
:
:
:
100pf Chip Capacitor
1000pf Chip Capacitor
.01µf Chip Capacitor
10µf Chip Capacitor
2/5
STM1645-10
TYPICAL PERFORMANCE
VC2 vs FLANGE TEMPERATURE
POWER OUTPUT vs FREQUENCY
20
30
28
26
24
22
20
Pin = 10mW
Vc1 = 18V
Vc1 = 18V
Pin = 10mW
Pout = 10W
Vc2 = 28V
18
-35 deg C
16
1662 MHz
1626 MHz
+25 deg C
14
+70 deg C
12
10
1620 1625 1630 1635 1640 1645 1650 1655 1660 1665 1670
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80
Frequency (MHz)
Temperature(Deg C)
3/5
STM1645-10
APPLICATIONS RECOMMENDATIONS
MODULE MOUNTING
OPERATION LIMITS
The STM1645-10 power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum rat-
ings. If the module is to be subjected to one or
more of the maximum rating conditions, care must
be taken to monitor other parameters which may
be affected.
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within ± 0.05mm (± 0.002 inch).
The module should be mounted to the heatsink
using 3 mm (or 4-40) or equivalent screws tor-
qued to 5-6 kg-cm (4-6 in-lb).
DECOUPLING
Failure to properly decouple any of the voltage
supply pins mayl result in oscillations at certain
operating frequencies. Therefore, it is recom-
mended that these pins be bypassed as indicated
in the Module DC and Test Fixture Configuration
drawing of this data sheet.
The module leads should be attached to equip-
ment PC board using 180°C solder applied to the
leads with a properly grounded soldering iron tip,
not to exceed 195°C, applied a minimum of 2mm
(0.080 inch) from the body of the module for a
duration not to exceed 15 seconds per lead. It is
imperative that no other portion of the module,
other than the leads, be subjected to tempera-
tures in excess of 100°C (maximum storage tem-
perature), for any period of time, as the plastic
moulded cover, internal components and sealing
adhesives may be adversely affected by such
conditions.
POWER CONTROL
The recommeded method of power control for the
STM1645-10 is to set PIN = 10mW, VC1 = 18V
and VC2 = 28 volts nominal at a flange tempera-
ture of 25°C to achieve an output power of 10
watts. Varing VC2 will allow stable power control
over a wide range of flange temperature. The cur-
rent consumption of VC2 is typically 850mA to
900mA for 10 watts power ouput.
Due to the construction techniques and materials
used within the module, reflow soldering of the
flange heatsink or leads, is not recommended.
4/5
STM1645-10
PACKAGE MECHANICAL DATA
Ref.: Dwg. No. 1018019 rev. D
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1996 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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5/5
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