STP16DP05B1R [STMICROELECTRONICS]

Low-voltage 16-bit constant current LED sink driver with outputs error detection;
STP16DP05B1R
型号: STP16DP05B1R
厂家: ST    ST
描述:

Low-voltage 16-bit constant current LED sink driver with outputs error detection

驱动 光电二极管 接口集成电路
文件: 总33页 (文件大小:567K)
中文:  中文翻译
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STP16DP05  
Low voltage 16-bit constant current LED sink driver with outputs  
error detection  
Datasheet  
-
production data  
Description  
The STP16DP05 is a monolithic, low voltage, low  
current power 16-bit shift register designed for  
LED panel displays. The device contains a 16-bit  
serial-in, parallel-out shift register that feeds a 16-  
bit D-type storage register. In the output stage,  
sixteen regulated current sources were designed  
to provide 5-100 mA constant current to drive the  
LEDs. The STP16DP05 features open and short  
LED detections on the outputs.The STP16DP05  
is backward compatible with STP16C/L596.The  
detection circuit checks 3 different conditions that  
can occur on the output line: short to GND, short  
to VO or open line. The data detection results are  
loaded in the shift register and shifted out via the  
serial line output. The detection functionality is  
implemented without increasing the pin count  
number, through a secondary function of the  
output enable and latch pin (DM1 and DM2  
respectively), a dedicated logic sequence allows  
the device to enter or leave from detection mode.  
Through an external resistor, users can adjust the  
STP16DP05 output current, controlling in this way  
the light intensity of LEDs, in addition, user can  
adjust LED’s brightness intensity from 0% to  
100% via OE/DM2 pin. The STP16DP05  
SO-24  
QSOP-24  
TSSOP24  
TSSOP24  
(exposed pad)  
Features  
Low voltage power supply down to 3 V  
16 constant current output channels  
Adjustable output current through external  
resistor  
Short and open output error detection  
Serial data IN/Parallel data OUT  
3.3 V micro driver-able  
Output current: 5-100 mA  
30 MHz clock frequency  
guarantees a 20 V output driving capability,  
allowing users to connect more LEDs in series.  
The high clock frequency, 30 MHz, makes the  
device suitable for high data rate transmission.  
The 3.3 V voltage supply is well useful for  
Available in high thermal efficiency TSSOP  
exposed pad  
ESD protection 2.5 kV HBM, 200 V MM  
applications that interface any 3.3 V micro  
Compared with a standard TSSOP package, the  
TSSOP exposed pad increases heat dissipation  
capability by a 2.5 factor.  
Table 1. Device summary  
Order codes  
Package  
Packaging  
STP16DP05MTR  
STP16DP05TTR  
SO-24 (tape and reel)  
1000 parts per reel  
2500 parts per reel  
TSSOP24 (tape and reel)  
TSSOP24 exposed pad  
(tape and reel)  
STP16DP05XTTR  
STP16DP05PTR  
2500 parts per reel  
2500 parts per reel  
QSOP-24  
June 2014  
DocID13093 Rev 7  
1/33  
This is information on a product in full production.  
www.st.com  
Contents  
STP16DP05  
Contents  
1
2
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1  
Pin connection and description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.1  
2.2  
2.3  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
6
7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Equivalent circuit and outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Detection mode functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
7.1  
7.2  
7.3  
7.4  
Phase one: “entering in detection mode“ . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Phase two: “error detection” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Phase three: “resuming to normal mode” . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Error detection conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
9
10  
2/33  
DocID13093 Rev 7  
STP16DP05  
Summary description  
1
Summary description  
Table 2. Typical current accuracy  
Current accuracy  
Output voltage  
Output current  
VDD  
Temperature  
Between bits Between ICs  
1.3 V  
±1.5%  
±5%  
20 to 100 mA  
3.3 V to 5 V  
25 °C  
1.1  
Pin connection and description  
Figure 1. Pin connection  
Note:  
The exposed pad should be electrically connected to a metal land electrically isolated or  
connected to ground  
Table 3. Pin description  
Pin n°  
Symbol  
Name and function  
1
2
GND  
SDI  
Ground terminal  
Serial data input terminal  
Clock input terminal  
3
CLK  
4
LE-DM1  
OUT 0-15  
Latch input terminal - detect mode 1 (see operation principle)  
Output terminal  
5-20  
Input terminal of output enable (active low) - detect mode 1  
(see operation principle)  
21  
22  
OE-DM2  
SDO  
Serial data out terminal  
DocID13093 Rev 7  
3/33  
33  
Summary description  
Pin n°  
STP16DP05  
Table 3. Pin description (continued)  
Name and function  
Symbol  
23  
24  
R-EXT  
VDD  
Input terminal of an external resistor for constant current programing  
Supply voltage terminal  
4/33  
DocID13093 Rev 7  
STP16DP05  
Electrical ratings  
2
Electrical ratings  
2.1  
Absolute maximum ratings  
Stressing the device above the rating listed in the “absolute maximum ratings” table may  
cause permanent damage to the device. These are stress ratings only and operation of the  
device at these or any other conditions above those indicated in the operating sections of  
this specification is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
Table 4. Absolute maximum ratings  
Symbol  
Parameter  
Value  
Unit  
VDD  
VO  
Supply voltage  
Output voltage  
Output current  
Input voltage  
0 to 7  
-0.5 to 20  
100  
V
V
IO  
mA  
V
VI  
-0.4 to VDD  
1600  
IGND  
fCLK  
GND terminal current  
Clock frequency  
mA  
MHz  
50  
2.2  
Thermal data  
Table 5. Thermal data  
Parameter  
Symbol  
Value  
Unit  
TOPR  
TSTG  
Operating temperature range  
Storage temperature range  
-40 to +125  
-55 to +150  
42.7  
°C  
°C  
SO-24  
°C/W  
°C/W  
TSSOP24  
55  
TSSOP24(1)  
exposed pad  
RthJC  
Thermal resistance junction-case  
37.5  
55  
°C/W  
°C/W  
QSOP-24  
1. The exposed pad should be soldered directly to the PCB to realize the thermal benefits.  
DocID13093 Rev 7  
5/33  
33  
 
Electrical ratings  
STP16DP05  
2.3  
Recommended operating conditions  
Table 6. Recommended operating conditions  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
VDD  
VO  
Supply voltage  
Output voltage  
Output current  
Output current  
Output current  
Input voltage  
3.0  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
5.5  
20  
V
V
IO  
OUTn  
5
100  
mA  
mA  
mA  
V
IOH  
SERIAL-OUT  
SERIAL-OUT  
+1  
IOL  
-1  
VIH  
0.7VDD  
-0.3  
6
VDD+0.3  
0.3VDD  
VIL  
Input voltage  
V
twLAT  
twCLK  
twEN  
LE\DM1 pulse width  
CLK pulse width  
OE\DM2 pulse width  
ns  
ns  
ns  
ns  
ns  
ns  
MHz  
8
100  
10  
VDD = 3.0 V to 5.0 V  
Cascade operation (1)  
tSETUP(D) Setup time for DATA  
tHOLD(D) Hold time for DATA  
tSETUP(L) Setup time for LATCH  
5
10  
fCLK  
Clock frequency  
30  
1. If the device is connected in cascade, it may not be possible achieve the maximum data transfer.  
Please consider the timings carefully.  
6/33  
DocID13093 Rev 7  
STP16DP05  
Electrical characteristics  
3
Electrical characteristics  
VDD = 3.3 V to 5 V, T = 25 °C, unless otherwise specified  
Table 7. Electrical characteristics  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
VIH  
VIL  
IOH  
Input voltage high level  
Input voltage low level  
Output leakage current  
0.7VDD  
GND  
VDD  
0.3VDD  
1
V
V
VOH = 20 V  
μA  
Output voltage  
(Serial-OUT)  
VOL  
VOH  
IOL = 1 mA  
IOH = -1 mA  
0.4  
V
V
Output voltage  
(Serial-OUT)  
VOH -VDD = -0.4 V  
IOL1  
IOL2  
VO = 0.3 V, Rext = 3.9 kΩ  
VO = 0.3 V, Rext = 970 Ω  
VO = 1.3 V, Rext = 190 Ω  
4.25  
19  
5
5.75  
21  
Output current  
20  
mA  
%
IOL3  
96  
100  
± 5  
104  
± 8  
ΔIOL1  
ΔIOL2  
ΔIOL3  
VO = 0.3 VREXT = 3.9 kΩ  
Output current error  
between bit  
(all output ON)  
VO = 0.3 VREXT = 970 Ω  
VO = 1.3 VREXT =190 Ω  
± 1.5  
± 1.2  
300  
200  
± 3  
± 3  
RSIN(up) Pull-up resistor  
150  
100  
600  
400  
KΩ  
KΩ  
RSIN(down) Pull-down resistor  
REXT = 970  
OUT 0 to 15 = OFF  
IDD(OFF1)  
5
13  
6
6
14  
7
Supply current (OFF)  
IDD(OFF2)  
REXT = 240  
OUT 0 to 15 = OFF  
mA  
°C  
REXT = 970  
OUT 0 to 15 = ON  
IDD(ON1)  
Supply current (ON)  
IDD(ON2)  
REXT = 240  
OUT 0 to 15 = ON  
13.5  
170  
14.5  
Thermal Thermal protection (1)  
1. Guaranteed by design (not tested)  
The thermal protection switches OFF only the outputs current  
DocID13093 Rev 7  
7/33  
33  
 
 
Electrical characteristics  
STP16DP05  
VDD = 5 V, T = 25 °C, unless otherwise specified  
Table 8. Switching characteristics  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Propagation delay time,  
tPLH1 CLK-OUTn, LE\DM1 = H,  
OE\DM2 = L  
VDD = 3.3 V  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
-
-
-
-
-
-
40  
20  
51  
32  
49  
27  
65  
30  
77  
47  
77  
41  
ns  
ns  
Propagation delay time,  
tPLH2 LE\DM1 -OUTn,  
OE\DM2 = L  
Propagation delay time,  
tPLH3 OE\DM2-OUTn,  
LE\DM1 = H  
VDD = 3.3 V  
ns  
ns  
ns  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
-
-
-
21.5  
14.5  
15  
32  
21.5  
25  
Propagation delay time,  
CLK-SDO  
tPLH  
Propagation delay time,  
tPHL1 CLK-OUTn, LE\DM1 = H,  
OE\DM2 = L  
VDD = 3.3 V  
VIH = VDD  
VIL = GND  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
-
-
-
-
-
11  
13  
14.5  
20  
CL = 10 pF  
VL = 3.0 V  
RL = 60 Ω  
IO = 20 mA  
Propagation delay time,  
tPHL2 LE\DM1 -OUTn,  
OE\DM2 = L  
REXT = 1 KΩ  
ns  
9
12.5  
18  
Propagation delay time,  
tPHL3 OE\DM2-OUTn,  
LE\DM1 = H  
11.5  
8.5  
ns  
ns  
ns  
12  
VDD = 3.3 V  
VDD = 5 V  
-
-
-
25.5  
17.5  
34  
38  
25  
Propagation delay time,  
CLK-SDO  
tPHL  
Output rise time  
10~90% of voltage  
waveform  
VDD = 3.3 V  
53.5  
tON  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
-
-
-
12.5  
5.5  
18.5  
8.5  
Output fall time  
90~10% of voltage  
waveform  
tOFF  
ns  
4.5  
6.5  
tr  
tf  
CLK rise time (1)  
CLK fall time (1)  
-
-
5000  
5000  
ns  
ns  
1. In order to achieve high cascade data transfer, please consider tr/tf timings carefully.  
8/33  
DocID13093 Rev 7  
STP16DP05  
Equivalent circuit and outputs  
4
Equivalent circuit and outputs  
Figure 2. OE\DM2 terminal  
Figure 3. LE\DM1 terminal  
Figure 4. CLK, SDI terminal  
DocID13093 Rev 7  
9/33  
33  
Equivalent circuit and outputs  
STP16DP05  
Figure 5. SDO terminal  
Figure 6. Block diagram  
10/33  
DocID13093 Rev 7  
STP16DP05  
Timing diagrams  
5
Timing diagrams  
Table 9. Truth table  
CLOCK LE\DM1 OE\DM2 SERIAL-IN OUT0 ............. OUT7 ................ OUT15  
SDO  
H
L
L
L
L
L
H
Dn  
Dn ..... Dn - 7 ..... Dn -15  
No change  
Dn - 15  
Dn - 14  
Dn - 13  
Dn - 13  
Dn - 13  
Dn + 1  
Dn + 2  
Dn + 3  
Dn + 3  
H
X
X
Dn + 2 ..... Dn - 5 ..... Dn -13  
Dn + 2 ..... Dn - 5 ..... Dn -13  
OFF  
Note:  
OUTn = ON when Dn = H OUTn = OFF when Dn = L  
Figure 7. Timing diagram  
Note:  
1
Latch and output enable are level sensitive and ARE NOT synchronized with rising-or-falling  
edge of CALK signal.  
2
3
4
When LE terminal is low level, the latch circuits hold previous set of data  
When LE terminal is at high level, the latch circuits refresh new set of data from SDI chain.  
When OE terminal is at low level, the output terminals - Out0 to Out15 respond to data in the  
latch circuits, either '1' for ON or '0' for OFF  
5
When OE terminal is at high level, all output terminals will be switched OFF.  
DocID13093 Rev 7  
11/33  
33  
 
 
Timing diagrams  
STP16DP05  
Figure 8. Clock, serial-in, serial-out  
12/33  
DocID13093 Rev 7  
STP16DP05  
Timing diagrams  
Figure 9. Clock, serial-in, latch, enable, outputs  
LE\DM1  
OE\DM2  
Figure 10. Outputs  
DocID13093 Rev 7  
13/33  
33  
Typical characteristics  
STP16DP05  
6
Typical characteristics  
Figure 11. Output current-REXT resistor  
Table 10. Output current-REXT resistor  
Rext (Ω)  
Output current (mA)  
976  
780  
652  
560  
488  
433  
389  
354  
325  
300  
278  
259  
241  
229  
215  
20  
25  
30  
35  
40  
45  
50  
55  
60  
65  
70  
75  
80  
85  
90  
14/33  
DocID13093 Rev 7  
STP16DP05  
Typical characteristics  
Conditions:  
Temperature = 25 °C, VDD = 3.3 V; 5.0 V, ISET = 3 mA; 5 mA; 10 mA; 20 mA; 50 mA; 80 mA.  
Figure 12. ISET vs drop out voltage (Vdrop  
)
800  
700  
600  
500  
400  
300  
200  
100  
0
Avg @ 3.0V  
Avg @ 5.0V  
0
20  
40  
60  
80  
Iset mA)  
Table 11. ISET vs drop out voltage (Vdrop  
Avg @ 3.0 V  
)
Iout (mA)  
Avg @ 5.0 V  
3
19.33  
36.67  
77.33  
158.67  
406  
22.66  
40.33  
80  
5
10  
20  
50  
80  
157.33  
406  
692  
668  
DocID13093 Rev 7  
15/33  
33  
Typical characteristics  
STP16DP05  
Figure 13. IDD ON\OFF  
14  
12  
10  
8
IddON Avg @ 5.5V  
IddON Avg @ 3.6V  
IddOFF Avg @ 5.5V  
IddOFF Avg @ 3.6V  
6
4
2
0
0
10 20 30 40 50 60 70 80 90  
Iset (mA)  
Figure 14. Power dissipation vs temperature package  
Note:  
The exposed pad should be soldered to the PBC to realize the thermal benefits.  
16/33  
DocID13093 Rev 7  
STP16DP05  
Detection mode functionality  
7
Detection mode functionality  
7.1  
Phase one: “entering in detection mode“  
From the “normal mode” condition the device can switch to the “error mode” by a logic  
sequence on the OE\DM2 and LE/DM1 pins as showed in the following table and diagram:  
Table 12. Entering in detection truth table  
CLK  
1°  
H
L
2°  
L
3°  
H
L
4°  
H
5°  
H
L
OE/DM2  
LE/DM1  
L
H
Figure 15. Entering in detection timing diagram  
After these five CLK cycles the device goes into the “error detection mode” and at the 6th  
rise front of CLK the SDI data are ready for the sampling.  
DocID13093 Rev 7  
17/33  
33  
Detection mode functionality  
STP16DP05  
7.2  
Phase two: “error detection”  
The 16 data bits must be set “1” in order to set ON all the outputs during the detection. The  
data are latched by LE/DM1 and after that the outputs are ready for the detection process.  
When the micro controller switches the OE\DM2 to LOW, the device drives the LEDs in  
order to analyze if an OPEN or SHORT condition has occurred.  
Figure 16. Detection diagram  
The LEDs status will be detected at least in 1 microsecond and after this time the  
microcontroller sets OE\DM2 in HIGH state and the output data detection result will go to the  
microprocessor via SDO.  
Detection mode and normal mode use both the same format data. As soon as all the  
detection data bits are available on the serial line, the device may go back to normal mode  
of operation. To re-detect the status the device must go back in normal mode and re-  
entering in error detection mode.  
18/33  
DocID13093 Rev 7  
STP16DP05  
Detection mode functionality  
Figure 17. Timing example for open and/or short detection  
DocID13093 Rev 7  
19/33  
33  
Detection mode functionality  
STP16DP05  
7.3  
Phase three: “resuming to normal mode”  
The sequence for re-entering in normal mode is showed in the following table and diagram:  
Figure 18. Resuming to normal mode timing diagram  
CLK  
1°  
H
L
2°  
L
3°  
H
L
4°  
H
L
5°  
H
L
OE/DM2  
LE/DM1  
L
Note:  
For proper device operation the “Entering in detection” sequence must be follow by a  
“resume mode” sequence, it is not possible to insert consecutive equal sequence.  
7.4  
Error detection conditions  
VDD = 3.3 to 5 V temperature range -40 to 125 °C  
Table 13. Detection conditions  
SW-1 or Open line or output  
==> IODEC 0.5 x IO No error detected ==> IODEC 0.5 x IO  
SW-3b short to GND detected  
SW-2 or Short on LED or short  
SW-3a to V-LED detected  
==> VO 2.4 V  
No error detected ==> VO 2.2 V  
Note:  
Where: IO = the output current programmed by the REXT, IODEC = the detected output  
current in detection mode  
20/33  
DocID13093 Rev 7  
STP16DP05  
Detection mode functionality  
Figure 19. Detection circuit  
STP16DP05  
DocID13093 Rev 7  
21/33  
33  
Detection mode functionality  
STP16DP05  
Figure 20. Error detection sequence  
During the error  
detection are  
necessary at least  
2 CLK signal plus  
oneat the end  
16 CLK pulse are required to  
load the data setting 1 into  
shift register  
Every CLK pulse shows the results of  
single Output results:Out15;14; 13 etc. etc  
The OE Pulse put  
the device from  
EDM to Normal  
Mode  
The LE pulse  
latch the data  
loaded during the  
previous state  
LE and OE Key  
Sequence  
necessary to Enter  
in EDM  
After OE signal turn High the  
SDO pin show the results of  
Error Detection (Open or  
Short in this case)  
22/33  
DocID13093 Rev 7  
STP16DP05  
Package mechanical data  
8
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®  
specifications, grade definitions and product status are available at: www.st.com.  
ECOPACK® is an ST trademark.  
DocID13093 Rev 7  
23/33  
33  
 
Package mechanical data  
STP16DP05  
Figure 21. QSOP-24 package dimensions  
24/33  
DocID13093 Rev 7  
 
STP16DP05  
Package mechanical data  
Table 14. QSOP-24 mechanical data  
mm.  
Dim.  
Min  
Typ  
Max  
A
A1  
A2  
b
1.54  
0.1  
1.62  
0.15  
1.47  
0.2  
1.73  
0.25  
0.31  
0.254  
8.56  
5.8  
c
0.17  
8.66  
6
D
E
8.76  
6.2  
E1  
e
3.8  
3.91  
0.635  
0.635  
0.33  
0°  
4.01  
L
0.4  
0.25  
8°  
0.89  
0.41  
h
<
DocID13093 Rev 7  
25/33  
33  
 
Package mechanical data  
STP16DP05  
Figure 22. TSSOP24 package dimensions  
Table 15. TSSOP24 mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
1.1  
0.05  
0.15  
0.9  
0.19  
0.09  
7.7  
0.30  
0.20  
7.9  
c
D
E
4.3  
4.5  
e
0.65 BSC  
H
K
6.25  
0°  
6.5  
8°  
L
0.50  
0.70  
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STP16DP05  
Package mechanical data  
Figure 23. SO-24 package dimensions  
Table 16. SO-24 mechanical data  
mm.  
Dim.  
Min  
Typ  
Max  
A
a1  
a2  
b
2.65  
0.2  
0.1  
2.45  
0.49  
0.32  
0.35  
0.23  
b1  
C
0.5  
c1  
45°(typ.)  
D
E
15.20  
10.00  
15.60  
10.65  
e
1.27  
e3  
F
13.97  
7.40  
0.50  
7.60  
1.27  
L
S
°(max.) 8  
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33  
Package mechanical data  
STP16DP05  
Figure 24. TSSOP24 exposed pad dimensions  
7100778_D  
28/33  
DocID13093 Rev 7  
STP16DP05  
Package mechanical data  
Table 17. TSSOP24 exposed pad mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
1.20  
0.15  
1.05  
0.30  
0.20  
7.90  
5.2  
0.80  
0.19  
0.09  
7.70  
4.80  
6.20  
4.30  
3.00  
1.00  
c
D
7.80  
5.00  
6.40  
4.40  
3.20  
0.65  
0.60  
1.00  
D1  
E
6.60  
4.50  
3.40  
E1  
E2  
e
L
0.45  
0
0.75  
L1  
k
8
aaa  
0.10  
DocID13093 Rev 7  
29/33  
33  
Packaging mechanical data  
STP16DP05  
9
Packaging mechanical data  
Figure 25. TSSOP24, TSSOP24 exposed pad and SO-24 reel dimensions  
30/33  
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STP16DP05  
Packaging mechanical data  
Table 18. TSSOP24 and TSSOP24 exposed pad tape and reel mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
C
-
-
-
-
-
-
-
-
-
-
330  
12.8  
20.2  
60  
13.2  
D
N
T
22.4  
7
Ao  
Bo  
Ko  
Po  
P
6.8  
8.2  
8.4  
1.9  
4.1  
12.1  
1.7  
3.9  
11.9  
Table 19. SO-24 tape and reel mechanical data  
mm.  
Dim.  
Min  
Typ  
Max  
A
C
-
-
-
-
-
-
-
-
-
-
330  
12.8  
20.2  
60  
13.2  
D
N
T
30.4  
11.0  
15.9  
3.1  
Ao  
Bo  
Ko  
Po  
P
10.8  
15.7  
2.9  
3.9  
4.1  
11.9  
12.1  
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33  
Revision history  
STP16DP05  
10  
Revision history  
Table 20. Document revision history  
Revision Changes  
Date  
9-Jan-2007  
21-May-2007  
10-Jul-2007  
1
2
3
First release  
Updated Table 7 on page 7  
Updated Table 9: Truth table on page 11  
Updated Table 15: TSSOP24 exposed-pad on page 23  
28-Feb-2008  
4
Added QSOP-24 package information Table 14 and Figure 21  
on page 24  
23-Oct-2009  
20-Jan-2010  
5
6
Updated Figure 7 on page 11, Chapter 3 on page 7  
Updated Table 5 on page 5  
Updated Section 8: Package mechanical data.  
Added Section 9: Packaging mechanical data.  
Minor text changes.  
17-Jun-2014  
7
32/33  
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STP16DP05  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
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any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
© 2014 STMicroelectronics - All rights reserved  
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