STPMIC1APQR [STMICROELECTRONICS]
Highly integrated power management IC for micro processor units;
| 型号： | STPMIC1APQR |
| 厂家： | 
ST |
| 描述： | Highly integrated power management IC for micro processor units |
| 文件： | 总140页 (文件大小：8810K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPMIC1
Datasheet
Highly integrated power management IC for micro processor units
Features
•
•
•
Input voltage range from 2.8 V to 5.5 V
4 adjustable general purpose LDOs
1 LDO for DDR3 termination (sink-source), bypass mode for low power DDR or
as general purpose LDO
•
•
•
•
•
•
•
1 LDO for USB PHY supply with automatic power source detection
1 reference voltage LDO for DDR memory
4 adjustable adaptive constant on-time (COT) buck SMPS converters
5.2 V / 1.1 A boost SMPS with bypass mode for 5 V input or battery input
1 power switch 500 mA USB OTG compliant
1 power switch 500 mA/1000 mA general purpose
User programmable non-volatile memory (NVM), enabling scalability to support
a wide range of applications
•
•
I²C and digital IO control interface
WFQFN 44L (5x6x0.8)
Applications
•
•
•
•
•
•
Power management for embedded micro processor units
Wearable and IoT
Portable devices
Man-machine interfaces
Product status link
Smart home
STPMIC1
Power management unit companion chip of the STM32MP1 MPU
Device summary
Description
STPMIC1APQR
The STPMIC1 is a fully integrated power management IC designed for products
based on high integrated application processor designs requiring low power and high
efficiency.
STPMIC1BPQR
STPMIC1CPQR
STPMIC1DPQR
STPMIC1EPQR
Order code
Packing
The device integrates advanced low power features controlled by a host processor
via I²C and IO interface.
The STPMIC1 regulators are designed to supply power to the application processor
as well as to the external system peripherals such as: DDR, Flash memories and
other system devices.
WFQFN 44L
(5x6x0.8)
The boost converter can power up to 3 USB ports (two 500 mA host USB and one
100 mA USB OTG). Its advanced bypass architecture allows the smooth regulation
of VBUS for USB ports from a battery as well as low-cost consumer 5 V AC-DC
adapters.
4 buck SMPS are optimized to provide an excellent transient response and an output
voltage precision for a wide range of operating conditions, high full range efficiency (η
up to 90%) by implementing a low power mode with a smooth transition from PFM to
PWM and also an advanced PWM synchronization technique with an integrated PLL
for a better noise (EMI performance).
DS12792 - Rev 7 - December 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
STPMIC1
Device configuration
1
Device configuration
The STPMIC1 has a non-volatile memory (NVM) that enables scalability to support a wide range of applications:
•
Default output voltage, POWER_UP/POWER_DOWN sequence, protection behavior, auto turn-on
functionality, I2C slave address
•
The STPMIC1A, STPMIC1B, STPMIC1D and STPMIC1E are pre-programmed devices to support the
STM32MP1 series application processor versions
•
•
The STPMIC1C is not a programmed device to support custom applications
Straightforward NVM (re)programming via I2C to facilitate mass production directly in target applications
Table 1. Default NVM configuration vs part number
Default configuration table
STPMIC1A
Default
STPMIC1B
STPMIC1C
STPMIC1D
STPMIC1E
Default
Default
Default
Default
output
Rank
output
Rank
output
Rank
output
Rank
output
Rank
voltage
voltage
voltage
voltage
voltage
LDO1
LDO2
1.8 V
1.8 V
1.8 V
3.3 V
2.9 V
1.0 V
0.55 V
5.2 V
1.2 V
1.1 V
3.3 V
3.3 V
0
0
1.8 V
2.9 V
1.8 V
3.3 V
2.9 V
1.0 V
0.55 V
5.2 V
1.2 V
1.1 V
1.8 V
3.3 V
0
2
1.8 V
1.8 V
1.8 V
3.3 V
1.8 V
1.0 V
0.55 V
5.2 V
1.1 V
1.1 V
1.2 V
1.15 V
0
0
1.8 V
1.8 V
1.8 V
3.3 V
3.3 V
1.0 V
0.55 V
5.2 V
1.2 V
1.1 V
3.3 V
1.2 V
0
0
1.8 V
1.8 V
1.8 V
3.3 V
2.9 V
1.0 V
0.55 V
5.2 V
1.2 V
1.1 V
1.8 V
1.2 V
0
0
LDO3
0
0
0
0
0
LDO4
3
3
0
3
3
LDO5
2
2
0
2
2
LDO6
0
0
0
0
0
REFDDR
BOOST
BUCK1
BUCK2
BUCK3
BUCK4
0
0
0
0
0
N/A
2
N/A
2
N/A
0
N/A
3
N/A
3
0
0
0
0
0
1
1
0
1
1
2
2
0
2
2
Default value
3.5 V
VINOK_Rise
3.5 V
3.3 V
4.0 V
3.3 V
The start-up sequence is split into four steps (Rank0 to Rank3).
Each BUCK converter or LDO regulator can be programmed to be automatically turned ON in one of these
phases:
•
•
•
•
Rank= 0: rail not turned ON automatically, no output voltage appears after POWER-UP
Rank= 1: rail automatically turned ON after 7 ms following a Turn_ON condition
Rank= 2: rail automatically turned ON after further 3 ms
Rank= 3: rail automatically turned ON after further 3 ms
Whatever the STPMIC1 version:
•
•
AUTO_TURN_ON option is set
Boost and switches cannot be turned ON automatically
DS12792 - Rev 7
page 2/140
STPMIC1
Typical application schematic
2
Typical application schematic
Figure 1. Typical application schematic
(VIN from 2.8V to 5.5V DC)
BUCK1IN
PGND1
LX1
LX2
LX3
LX4
VIN
VLX1
VDD_CORE
CVOUT1
BUCK1
(SMPS)
CBUCK1IN
VOUT1
BUCK2IN
PGND2
VLX2
VDD_DDR
(DDR3, DDR3L,
BUCK2
(SMPS)
CBUCK2IN
CBUCK3IN
VOUT2
CVOUT2 lpDDR2, lpDDR3,
DDR4)
BUCK3IN
PGND3
VLX3
VDD
(VIO: 1V8 or 3V3)
CVOUT3
BUCK3
(SMPS)
VOUT3
BUCK4IN
PGND4
VLX4
VDD_AUX
(to system devices
CVOUT4 or CPU voltage)
BUCK4
(SMPS)
CBUCK4IN
LXB
VOUT4
VLXBST
BOOST
BYPASS
BSTOUT
CVLXBST
VIN
PGND5
CBSTOUT
VBUSOTG
PWR_USB_SW
PWR_SW
VBUS_OTG
CVBUSOTG
(close to USB
connector)
SWIN
VIN
SWOUT
BSTOUT
VBUS_HOST
CSWOUT
close to USB
connector)
BSTOUT
VBUSOTG
LDO4OUT
SUPPLY
MUX
VDD_USB
(fixed 3.3V to
LDO4
CLDO4OUT AP USB PHY
)
CVIN
INTLDO
AGND
INTLDO
CINTLDO
LDO3IN
VIO
VDD_DDR
CLDO3IN
LDO3
(normal,
bypass,
LDO3OUT
VTT_DDR3
NVM
I2C
(to DDR3/3L
VDD
CLDO3OUTterminations or to
DDRVTT)
lpDDR2/3 VDD1)
SCL
SDA
BUCK2IN
DDR_REF
(VOUT2/2)
VREFDDR
LDO1OUT
VREF_DDR
CVREF
INTn
to / from
host AP
REGISTER
PWRCTRL
RSTn
STATE
MACHINE
VOUT_LDO1
(to system device)
LDO1
LDO6
LDO2
LDO5
CLDO1OUT
POWER
SUPPLIES
CONTROL
WAKEUP
LDO6OUT
LDO2OUT
user push button
VOUT_LDO6
PONKEYn
CLDO6OUT (to system device)
LOGIC
SYSTEM
CONTROL
LDO16IN
VOUT_LDO2
(to Flash Memory
VIN
CLDO16IN
CLDO2OUT or system device)
LDO5OUT
EPGND
LDO25IN
GNDLDO
VOUT_LDO5
(to SD-Card or
system device)
CLDO25IN
CLDO5OUT
Note: BUCK1IN and BUCK2IN must always be connected to VIN
DS12792 - Rev 7
page 3/140
STPMIC1
Recommended external components
2.1
Recommended external components
Table 2. Passive components
Component
Manufacturer
Part number
Value Size
CVIN, CLDO1OUT, CLDO2OUT, CLDO4OUT, CLDO5OUT,
CLDO6OUT, CINTLDO
GRM155R60J475ME47#(1)
4.7 µF 0402
CVLXBST, CBUCK1IN, CBUCK2IN, CBUCK3IN, CBUCK4IN,
CLDO3IN, CLDO3OUT(2)
GRM188R61A106KE69D 10 µF 0603
CLDO16IN, CLDO25IN, CVREF
CVBUSOTG
GRM155R61E105KA12
GRM188R61C475KE11# 4.7 µF 0603
GRM188R60J226MEA0 22 µF 0603
GRM31CR60J227ME11L 220 µF 1206
DFE252012P-1R0M=P2 1 µH 1008
1 µF 0402
Murata
CBSTOUT, CVOUT1, CVOUT2, CVOUT3, CVOUT4
CSWOUT
LX1, LX2, LX3, LX4, LXB
1. # is the last P/N digit; it indicates a package specification code.
2. 4.7 µF normal mode - 10 µF sink/source mode - no cap bypass mode.
Note:
All the components above refer to a typical application. Operation of the device is not limited to the choice of
these external components.
DS12792 - Rev 7
page 4/140
STPMIC1
Pinout and pin description
2.2
Pinout and pin description
Figure 2. Pin configuration WFQFN 44L top view
34 BOUT
RSTn
WAKEUP
SDA
1
2
3
4
5
6
7
8
9
33 VLXBST
32 PGBOOST
31 VOUT3
30 PGND3
29 VLX3
SCL
VOUT1
PGND1
VLX1
EPGND
28 BUCK3IN
27 VOUT4
26 PGND4
25 VLX4
BUCK1IN
VOUT2
PGND2 10
VLX2 11
24 BUCK4IN
23 LDO1OUT
BUCK2IN 12
Table 3. Pin description
A/D(1)
Pin name
RSTn
I/O Location
Description (default configuration)
Bi-directional reset (active low with internal pull-up)
D
D
D
I/O
I
1
2
3
WAKEUP
SDA
Power-ON from host processor (active high with internal pull-down)
2
I/O
I C serial data
2
SCL
D
A
A
A
A
A
A
A
A
A
A
A
A
D
I
I
4
5
I C serial clock
VOUT1
Input feedback signal buck converter 1
Power ground buck converter 1
PGND1
VLX1
-
6
O
I
7
LX node buck converter 1
BUCK1IN
VOUT2
8
Power input buck converter 1 must be connected to the same value of VIN pin
Input feedback signal buck converter 2
Power ground buck converter 2
I
9
PGND2
VLX2
-
10
11
12
13
14
15
16
17
O
I
LX node buck converter 2
BUCK2IN
LDO3IN
LDO3OUT
GNDLDO
VREFDDR
PONKEYn
Power input buck converter 2 must be connected to the same value of VIN pin
Power input LDO3
I
O
-
Output voltage LDO3
LDO GND
O
I
DDR VREF output voltage
User power ON key (active low with internal pullup)
DS12792 - Rev 7
page 5/140
STPMIC1
Pinout and pin description
A/D(1)
A
Pin name
LDO2OUT
LDO25IN
LDO5OUT
LDO6OUT
LDO16IN
LDO1OUT
BUCK4IN
VLX4
I/O Location
Description (default configuration)
O
I
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
ePad
Output voltage LDO2
A
Power input LDO2 and LDO5
Output voltage LDO5
A
O
O
I
A
Output voltage LDO6
A
Power input LDO1 and LDO6
Output voltage LDO1
A
O
I
A
Power input buck converter 4 must be connected to the same value of VIN pin
LX node buck converter 4
A
O
-
PGND4
VOUT4
A
Power ground buck converter 4
A
I
Input feedback signal buck converter 4
Power input buck converter 3 must be connected to the same value of VIN pin
LX node buck converter 3
BUCK3IN
VLX3
A
I
A
O
-
PGND3
VOUT3
A
Power ground buck converter 3
A
I
Input feedback signal buck converter 3
Power ground boost converter
PGND5
VLXBST
BSTOUT
VBUSOTG
VIN
A
-
A
I
LX Node boost converter
A
O
O
I
Output voltage boost converter
A
Power output switch powered by boost converter
Main power input - power input LDO4, VREF
Power input switch
A
SWIN
A
I
SWOUT
LDO4OUT
INTLDO
AGND
A
O
O
O
-
Power output switch
A
Output voltage LDO4
A
Internal LDO
A
Main analog ground
VIO
A
I
I/O voltage (for all digital signals except WAKEUP and PONKEYn)
Interrupt (active low with internal pull-up)
Power control mode (pull-up and pull-down inactive by default)
Exposed pad to be connected to ground
INTn
D
D
A
O
I
PWRCTRL
EPGND
-
1. A: analog; D: digital
DS12792 - Rev 7
page 6/140
STPMIC1
Electrical and timing characteristics
3
Electrical and timing characteristics
3.1
Absolute maximum ratings
Table 4. Absolute maximum ratings
Parameter
VIN, BUCKxIN, SWIN, LDO3IN, LDOxxIN, PONKEYn
VIO, SDA, SCL, RSTn, PWRCTRL, INTn, WAKEUP
INTLDO
Min.
Unit
V
-0.5 to 7
-0.5 to 4.2
-0.5 to 2
-0.5 to 7
-0.5 to 3
-0.5 to 5
-0.5 to 7
-0.5 to 5
-65 to 150
±1000
V
V
VLXx
V
VOUT1, VOUT2
V
VOUT3, VOUT4
V
BSTOUT, VBUSOTG, VLXBST, SWOUT
LDOxOUT, VREFDDR
V
V
T
storage temperature
°C
V
STO
ESD human body model
ESD charge device model
±500
V
Note:
Once the normal operating conditions are exceeded, the performance of the device may suffer. Stresses beyond
those listed under absolute maximum ratings may cause permanent damage to the device.
3.2
Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Operating junction temperature
Absolute maximum junction temperature
Operating ambient temperature
Min.
-40
-40
-40
Max.
125
160
105
Unit
°C
T
J
T
°C
JAMR
T
A
°C
Junction-case package thermal resistance JEDEC
reference (JESD51-12.01)
Ѳ
7
JC
°C/W
Junction-ambient package thermal resistance on
2s2p std JEDEC board (JESD51-7)
Ѳ
29
JA
DS12792 - Rev 7
page 7/140
STPMIC1
Consumption in typical application scenarios
3.3
Consumption in typical application scenarios
Table 6. Consumption in typical application scenarios
Application
mode
Application description
Conditions
Min. Typ. Max. Unit
), T =
STPMIC1 VIN input current consumption (all supply pins connected to VIN, V = 3.6 V, V = 1.8 V(from V
IN
IO
OUT3
A
+25 °C)
STPMIC1 in OFF-state
Turn-on from PONKEYn, WAKEUP and
VBUSOTG/SWOUT active
Application is OFF, waiting
for turn-on event to start
OFF
50
µA
2
No activity on I C
VIO=0 V (BUCK3 is OFF)
STPMIC1 in POWER_ON state
IRQ from PONKEYn, WAKEUP and VBUSOTG/
SWOUT
Application is in
STANDBY,AP always ON
power domain is present
BUCK3 active in LP mode, V
=1.8 V
OUT3
STANDBY
110
µA
All other regulators OFF
All outputs without load
2
No activity on I C
STPMIC1 in POWER_ON state
IRQ from PONKEYn WAKEUP and VBUSOTG/
SWOUT
BUCK1 active in LP mode, V
BUCK2 active in LP mode, V
BUCK3 active in LP mode, V
=1.2 V
=1.2 V
=1.8 V
OUT
OUT
OUT
Application is in STOP
mode, AP core voltages
are supplied, and DDR
memory in self refresh
STOP
370
µA
REF_DDR active
LDO3 active
All other regulators OFF
All outputs without load
2
No activity on I C
STPMIC1 in POWER_ON state
IRQ from PONKEYn WAKEUP and VBUSOTG/
SWOUT
BUCK1 active in HP mode, V
BUCK2 active in HP mode, V
BUCK3 active in HP mode, V
REF_DDR active
=1.2 V
=1.2 V
=1.8 V
OUT
OUT
OUT
RUN
Application is running
1.2
mA
LDO3 active, V
=1.8 V
OUT
All other regulators OFF
All outputs without load
2
No activity on I C
DS12792 - Rev 7
page 8/140
STPMIC1
Electrical and timing parameters
3.4
Electrical and timing parameters
Table 7. Electrical and timing parameters
Symbol
General section
= 3.6 V, V
Parameter
Test conditions
Min.
Typ.
Max.
Unit
=
V
= 1.2 V, V
= 1.2 V, V
= 1.8 V, V
= 3.3 V, V
/V
= 1.8 V, V /V /V
LDO2OUT LDO5OUT LDO6OUT
IN
OUT1
OUT2
OUT3
OUT4
LDO1OUT LDO3OUT
2.9 V, V = 1.8 V, recommended BOM, T = -40 °C to +125 °C, unless otherwise specified.
IO
j
Input voltage
range
V
2.8
2.2
2
3.6
2.3
2.1
5.5
2.4
2.2
V
V
V
IN
VIN POR rising
threshold
V
IN_POR_Rise
VIN POR falling
threshold
V
IN_POR_Fall
3
3.1
3.3
3.5
4
3.2
3.4
3.6
4.1
3.2
3.4
3.9
VINOK rising
threshold
Programmable value, defined in NVM register
Table 65. NVM_MAIN_CTRL_SHR
V
V
INOK_Rise
200
300
400
500
Programmable value, defined in NVM register
Table 65. NVM_MAIN_CTRL_SHR
V
VINOK hysteresis
mV
INOK_HYST
V
INOK_Rise
Defined indirectly by V
and V
INOK_HYST
VINOK falling
threshold
INOK_Rise
V
INOK_Fall
-
settings
V
INOK_HYST
V
+50
INOK_Fall
+30
+80
VINLOW rising
threshold
Programmable value, defined in register
Table 30. SW_VIN_CR
V
mV
mV
mV
INLOW_Rise
to
+300
+500
V
+400
INOK_Fall
90
100
110
220
330
440
180
270
360
200
VINLOW
hysteresis
Programmable value, defined in register
Table 30. SW_VIN_CR
V
INLOW_HYST
300
400
V
INLOW_Rise
Defined indirectly by V
and
VINLOW falling
threshold
INLOW_Rise
V
INLOW_Fall
+
V
settings
INLOW_HYST
V
INLOW_HYST
Warning
temperature
rising
T
115
95
125
140
120
160
135
°C
°C
°C
WRN_Rise
Warning
temperature
falling
T
105
150
WRN_Fall
Shutdown
temperature
rising
T
140
115
SHDN_Rise
Shutdown
temperature
falling
T
125
30
°C
SHDN_Fall
LDO OCP turn-off
delay
t
ms
OCPDB_LDO
DS12792 - Rev 7
page 9/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
BUCK OCP turn-
off delay
t
5
µs
OCPDB_BUCK
BOOST OVP
turn-off delay
t
1
2
ms
µs
OVPDB_BST
BOOST OCP
turn-off delay
t
OCPDB_BST
Switches OCP
turn-off delay
t
30
ms
OCPDB_SW
Programmable value, defined in register
Table 34. WDG_CR
1 to 256
1
t
Watchdog timer
s
WD
Timer programming step
NVM write cycles
endurance
NVM
1000
Cycle
END
LDO1, LDO2, LDO5
V
= 3.6 V, V = 3.6 V, V
= 3.6 V, V
= 1.8 V, recommended BOM, T = -40 °C to +125 °C, unless otherwise
LDOOUT j
LDOIN
IN
BUCK2IN
specified,V
and V
must always be connected to V
BUCK2IN
BUCK1IN
IN
Main input
voltage range
V
2.8
5.5
V
V
LDOIN
V
>V
+V
LDO1 LDO2
LDO5
1.7 to 3.3
1.7 to 3.9
100
LDOIN
LDOOUT
LDODROP
Programmable value. Refer to
Table 9. LDO output voltage
settings
V
Output voltage
V
LDOOUT
Voltage programming step
mV
%
V
>V
+V
1 mA<I
<350
LDOOUT
Output voltage
accuracy
LDOIN
LDOOUT
LDODROP
V
-2
2
LDOOUT-ACC
mA
Continuous
output current
I
V
= 2.8 V to 5.5 V
= 2.8 V to 5.5 V
350
360
mA
mA
µA
LDOOUT
LDOIN
LDOIN
Load current
limitation
I
V
450
4
800
20
LDOLIM
I
= 0 mA, T = +105 °C total current from
J
Total quiescent
current
LDOOUT
I
LDOQ
all LDO supply pins (VIN, LDOIN, BUCK2IN)
Input leakage
current
I
LDO OFF
0.5
180
45
2.5
300
µA
LDOIN_LKG
Dropout voltage
V
V
= 2.8 V, I = 350 mA
LDOOUT
mV
mV
mV
LDODROP
LDOOUT
(1)
Load transient
regulation
V
I
= 5 to 180 mA, ΔV
= 0, t = t ~1 µs
LDOOUT-LO
LDOOUT
LDOIN
R
F
V
= 3.6 V to 3.0 V, ΔI
= 0, t = t
LDO1OUT R
Line transient
regulation
LDOIN
F
V
10
LDOOUT-LI
~10 μs
ΔV
ΔV
= 300 mVPP, f=[0.1:20] kHz
= 300 mVPP, f=[20:100] kHz
43
37
LDOIN
Power supply
rejection ratio
PSRR
t
dB
LDO
LDOIN
2.8 V<V
<5.5 V, 0<I
<1 mA C =4.7
OUT
LDOIN
LDOOUT
Soft-start duration
160
µs
SSLDO
µF
Pull-down enabled, V
=1.8 V to
= no load
Shutdown
duration
LDOOUT
t
3
ms
SDLDO
V
=0.2 V, I
LDOOUT
LDOOUT
LDO3 normal mode
= 3.6 V, V = 3.6 V, V
V
= 3.6 V, V = 1.8 V, recommended BOM, T = -40 °C to +12 5 °C, unless otherwise
LDO3OUT j
LDO3IN
IN
BUCK2IN
specified
DS12792 - Rev 7
page 10/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Main input
voltage range
V
2.8
5.5
V
LDO3IN
V
>V
+V
programmable
LDO3DROP
LDO3IN
LDO3OUT
1.8 to 3.3
100
V
value. Refer to Table 9. LDO output voltage
settings
V
Output voltage
LDO3OUT
Voltage programming step
mV
%
V
>V
+V
1
LDO3DROP
Output voltage
accuracy
LDO3IN
LDO3OUT
V
-2
2
LDO3OUT-ACC
mA<I
<50 mA
LDO3OUT
Continuous
output current
I
V
= 2.8 V to 5.5 V
= 2.8 V to 5.5 V
100
120
mA
mA
µA
LDO3OUT
LDO3IN
LDO3IN
Load current
limitation
I
V
150
20
LDO3LIM
I
= 0 mA, T = +105 °C total current from
J
Total quiescent
current
LDO3OUT
I
QLDO3
all LDO supply pins (VIN, LDOIN, BUCK2IN)
Input leakage
current
I
LDO OFF
1
3
µA
mV
mV
LDO3IN_LKG
V
V
= 2.8 V, I
= 100 mA
Dropout voltage
120
30
200
LDO3DROP
LDO3OUT
LDO3OUT
ΔI
= 5 mA to 55 mA, ΔV
~10 µs
= 0, t = t
LDO3IN R F
Load transient
regulation
LDO3OUT
V
LDO3OUT-LO
V
= 3.6 V to 3.0 V, ΔI
= 0, t = t
LDO3OUT R F
Line transient
regulation
LDOIN
V
5
mV
LDO3OUT-LI
~10 µs
ΔV
ΔV
= 300 mVPP, f=[0.1:20] kHz
= 300 mVPP, f=[20:100] kHz
45
40
LDO3IN
Power supply
rejection ratio
PSRR
t
dB
µs
LDO3
LDO3IN
2.8 V<V
<5.5 V, 0<I
LDO3IN
<1 mA
LDO3OUT
Soft-start duration
200
SSLDO3
Pull-down enabled, V
=1.8 V to V
LDO3OUT
Shutdown
duration (all
modes)
LDO3OUT
t
= 0.2 V, I
= no load, V =3.6 V, C
=4.7
3
ms
SDLDO3
LDO3OUT
IN
OUT
µF
LDO3 sink-source mode
= V = 1.35 V, V = 5.0 V, V
V
= 5.0 V, V
= V
= V
, T = -40 °C to +125 °C, recommended BOM,
OUT2/2 j
LDO3IN
OUT2
IN
BUCK2IN
LDO3OUT
REFDDR
unless otherwise specified
Input voltage
range
V
1.1
1.35
1.6
V
LDO3IN-SS
Continuous
output current
I
mA
RMS
120
LDO3OUT-SS
I
Overcurrent limit
±200
mA
µA
LDO3LIM-SS
I
= 0 mA, T = +105 °C total current from
J
Total quiescent
current
LDO3OUT
I
2
20
QLDO3_SS
all LDO supply pins (VIN, LDOIN, BUCK2IN)
ΔI
= +/- [0:50] mA, ΔV
~250 ns
= 0, t = t
LDO3IN R F
Load transient
regulation
LDO3OUT
V
30
mV
LDO3OUT-LO-SS
V
= V
= 1.35 V, ΔI
~1 μs
= 0, t = t
Line transient
regulation
LDO3IN
OUT2
LDO3OUT
R
F
V
5
mV
µs
LDO3OUT-LI-SS
t
2.8 V <V
<5.5 V, 0< I < 1 mA
LDO3OUT
Soft-start duration
21
40
3
SSLDO3-SS
LDO3IN
Pull-down enabled, V
= V
to
OUT2/2
LDO3OUT
Shutdown
duration
t
V
< 0.2 V, I
= no load, V
=
IN
ms
SDLDO3-SS
LDO3OUT
LDO3OUT
V
, C
=4.7 µF
OUT2
OUT
LDO3 bypass mode
= 1.8 V, V
V
= ~1.8 V, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
j
LDO3IN
LDO3OUT
DS12792 - Rev 7
page 11/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Input voltage
range
V
1.7
2
V
LDO3IN-BP
1.7 V<V
<2 V no overcurrent protection in
bypass mode
Continuous
output current
LDO3IN
I
50
mA
LDO3OUT-BP
Bypass transistor
R
I
=40 mA,T = 25 °C
0.45
100
0.6
3
Ω
DSONLDO3-BP
LDO3OUT
j
R
DS(on)
t
1.7 V < V
< 2 V, 0 < I
< 1 mA
Soft-start duration
µs
SSLDO3-BP
LDO3IN
LDO3OUT
Pull-down enabled, V
=1.8 V to V
LDO3OUT
LDO3OUT
Shutdown
duration
t
= 0.2 V, I
= no load, V =3.6 V, C
=4.7
ms
SDLDO3-BP
LDO3OUT
IN
OUT
µF
LDO4
VLDO4OUT = 3.3 V, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
j
Input voltage
2.8(2)
3.23
50
V
V
= Max.(VIN; VBUSOTG; BSTOUT)
LDO4IN
5.5
V
V
LDO4IN
range
Output voltage
accuracy
V
3.6 V<V
<5.5 V, 1 mA<I
LDO4IN
<30 mA
LDO4OUT
3.3
3.34
LDO4OUT-ACC
Continuous
output current
I
V
= 3.6 V to 5.5 V
LDO4IN
mA
LDO4OUT
Load current
limitation
I
V
= 3.6 V to 5.5 V
LDO4IN
50
75
20
45
200
25
mA
µA
LDO4LIM
I
I
= 0 mA, T = +105 °C
Quiescent current
LDO4Q
LDO4OUT
J
Dropout voltage
from VIN
V
I
= 30 mA
LDO4OUT
90
mV
LDO4DROP
ΔI
= 1 to 30 mA, ΔV
µs
= 0, t = t ~1
LDO4IN R F
Load transient
regulation VIN
LDO4OUT
V
40
10
mV
mV
LDO4OUT-LO
Line transient
regulation VIN
V
ΔV
= 600 mV, ΔI
= 0, t = t ~10 μs
LDO4OUT R F
LDO4OUT-LI
LDO4IN
Power supply
rejection ratio
PSRR
ΔV
= 300 mVPP, f=[0.1:10] kHz
LDO4IN
40
dB
µs
LDO4
t
3.5 V<V
<5.5 V, 0<I
<1 mA
Soft-start duration
100
SSLDO4
LDO4IN
LDO4OUT
Pull-down enabled, V
<0.2 V, I = no load, V =3.6 V,
LDO4OUT IN
=3.3 V to
LDO4OUT
Shutdown
duration
t
V
3
ms
SDLDO4
LDO4OUT
C
OUT
=4.7 µF
LDO6
V
=3.6 V, V = 1.0 V, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
LDO6OUT j
LDO6IN
Main input
voltage range
V
V
LDO6IN
2.8
5.5
V
V
IN
V
>V
+V
Programmable
LDO6DROP
LDO6IN
LDO6OUT
0.9 to 3.3
100
value. Refer to Table 9. LDO output voltage
settings
V
Output voltage
LDO6OUT
Voltage programming step
mV
%
V
>V
0<I
+V
,
LDO6DROP
Output voltage
accuracy
LDO6IN
LDO6OUT
V
-2
2
LDO6OUT-ACC
<150 mA
<5.5 V
LDO6IN
LDO6OUT
Continuous
output current
I
2.8 V<V
2.8 V<V
150
160
mA
LDO6OUT
Load current
limitation
I
<5.5 V
LDO6IN
200
4
350
20
mA
µA
LDO6LIM
I
I
= 0 mA, T = +105 °C
LDO6OUT J
Quiescent current
LDO6Q
DS12792 - Rev 7
page 12/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
0.5
Max.
1
Unit
µA
Input leakage
current
I
LDO OFF
LDO6IN_LKG
V
V
= 2.9 V, I
=150 mA
Dropout voltage
160
30
300
mV
mV
LDO6DROP
LDO6OUT
LDO6OUT
Load transient
regulation
V
ΔI
= 75 mA, ΔV
= 0, t = t ~1 µs
LDO6IN R F
LDO6OUT-LO
LDO6OUT
Line transient
regulation
V
ΔV
= 600 mV, ΔI
= 0, t = t ~10 μs
LDO6OUT R F
5
mV
dB
LDO6OUT-LI
LDO6IN
ΔV
ΔV
= 300 mVPP, f=[0.1:20] kHz
= 300 mVPP, f=[20:100] kHz
55
40
LDO6IN
Power supply
rejection ratio
PSRR
t
LDO6
LDO6IN
2.8 V<V
<5.5 V, 0<I
LDO6IN LDO6OUT
<1 mA
<0.2 V,
Soft-start duration
100
µs
SSLDO6
PD on, V
=1.8 V to V
LDO6OUT
Shutdown
duration
LDO6OUT
t
3
ms
SDLDO6
I
<1 mA, V =3.6 V, C
=4.7 µF
LDO6OUT
IN
OUT
REFDDR
V
= V
= 0.675 V, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
OUT2/2 j
REFOUT
V
0.1 mA<I
<5 mA
V
/2
OUT2
Output voltage
V
REFOUT
REF-ACC
REFOUT
Output voltage
accuracy
V
I
= 0.1 mA
-1
5
1
%
REF
Output current
capability
I
mA
REFOUT
RMS
Load current
limitation
I
±10
±25
±50
mA
REFLIM
I
I
= 0 mA, T = +25 °C
REFOUT J
Quiescent current
Soft-start duration
30
µA
µs
REFQ
t
0.1 mA<I
<1 mA
REF
100
SSREF
PD on, V
=0.6 V to V
<0.2 V,
=1 µF
Shutdown
duration
REFOUT
REFOUT
t
3
ms
SDREF
I
<0.1 mA, V =3.6 V, C
IN OUT
REFOUT
Buck converter 1
V
= 3.6 V, V = 1.2 V, recommended BOM, T = -40 °C to +125 °C , unless otherwise specified
OUT1 j
BUCK1IN
Main input
voltage range
V
2.8
5.5
V
BUCK1IN
Programmable value, refer to Table 10. BUCK
output settings
0.725 to 1.5
25
V
V
Output voltage
OUT1
Voltage programming step
mV
V
= 2.8 V to 5.5 V, V = 0.725 V to 1.5
BUCK1IN OUT1
V
Output voltage
accuracy
V
V
%
OUT1-ACC
HP mode I
= 0 to 1.5 A
-2
-4
2
4
BK1OUT
LP mode I
= 0 to 50 mA
BK1OUT
I
= 0 mA, HP mode, T = +25 °C
10
5
BK1OUT
A
Output voltage
ripple
mV
OUT1-RIPP
I
= 1500 mA, HP mode, T = +25 °C
BK1OUT
A
2.8<V
<5.5 V, HP mode
<5.5 V, LP mode
1500
50
BUCK1IN
Continuous
output current
I
OUT1
2.8< V
BUCK1IN
mA
A
Peak output
current in LP
mode
I
2.8< V
<5.5 V, t
BUCK1IN
< 10 us
PEAK
200
OUT1_LP_PEAK
Inductor peak
current limit
I
2
BK1LIM
DS12792 - Rev 7
page 13/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Reference
switching
frequency
f
2
MHz
REFCLK
I
= 0 mA, HP mode
220
50
300
80
BUCK1OUT
Total quiescent
current
I
µA
µA
Q_BK1
I
= 0 mA, LP mode
BUCK1OUT
Input leakage
current
I
BUCK OFF
1
BUCK1IN_LKG
I
=150 mA, T = +25 °C
86
83
70
BK1OUT
A
EFF
I
=750 mA,T = +25 °C
Efficiency
%
BK1
BK1OUT
A
I
=1500 mA,T = +25 °C
A
BK1OUT
HP mode; 0<I
<1.5 A, ΔI
= 450 mA,
BK1OUT
BK1OUT
15
30
5
t
= t ~250 ns
F
R
Load transient
regulation
V
mV
OUT1-LO
LP mode; 0<I
<50 mA, ΔI
= 50 mA
BK1OUT
BK1OUT
t
R
= t ~250 ns
F
ΔV
= 600 mV, ΔI
= 0, t = t ~10 μs,
BK1OUT R F
Line transient
regulation
BK1IN
V
1.5
5
mV
mV
OUT1-LI
HP mode
2.8 V<V
<5.5 V, I ~1 mA, T = +25 °C,
Power-up
overshoot
BK1IN
BK1OUT
A
V
40
OUT1-OVR
0.725 V<V
<1.5 V
OUT1
Recovery time
from LP to HP
mode
t
V
20
1
µs
LP-HP-BK1
OUT1_LP = VOUT1_HP
Start-up delay
(delay before
voltage starts to
rise)
2.8 V<V
<5.5 V, refer toFigure 46. BUCKx
BUCK1IN
t
0.05
0.5
ms
SU_BK1
start-up/shutdown timings
2.8 V<V
<5.5 V, 1 mA<I <100 mA,
BK1OUT
BUCK1IN
t
Soft-start duration
V
=1.2 V, refer to Figure 16. Buck4 load
transient in LP mode.
235
400
µs
SS_BK1
OUT1
Slew rate during start-up
5.5
3.1
mV/µs
mV/µs
Output voltage
slew rate
S
RBK1
DVS slew rate of a voltage programmed change
low to high or high to low, from 0.8 V to 1.2 V
2.3
From V =1.2 V to V
OUT1
<0.2 V, V =3.6 V,
OUT1 IN
C
=22 µF
OUT
Shutdown
duration
t
ms
SD_BK1
Slow PD, I
<1 mA
1.5
BK1OUT
BK1OUT
Fast PD, I
<1 mA
0.15
Buck converter 2
V
= 3.6 V, V = 1.2 V, recommended BOM, T = -40 °C to +125 °C, unless otherwise specified
OUT2 j
BUCK2IN
Main input
voltage range
V
2.8
5.5
V
BUCK2IN
Programmable value, refer to Table 10. BUCK
output settings
1.0 to 1.5
50
V
V
Output voltage
OUT2
Voltage programming step
mV
V
= 2.8 V to 5.5 V, V
= 1.0 V to 1.5 V
BUCK2IN
OUT2
Output voltage
accuracy
V
V
HP mode I
= 0 to 1.0 A
BK2OUT
-2
-4
2
4
%
OUT2-ACC
LP mode I
= 0 to 50 mA
BK2OUT
Output voltage
ripple
I
= 0 mA, HP mode, T = +25 °C
A
10
BK2OUT
mV
OUT2-RIPP
DS12792 - Rev 7
page 14/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Output voltage
ripple
V
mV
I
= 1000 mA, HP mode, T = +25 °C
OUT2-RIPP
5
BK2OUT
A
2.8<V
<5.5 V, HP mode
<5.5 V, LP mode
1000
50
BUCK2IN
Continuous
output current
I
OUT2
2.8< V
BUCK2IN
mA
Peak output
current in LP
mode
I
2.8< V
<5.5 V, LP mode, t
BUCK2IN
< 10 us
PEAK
200
OUT2_LP_PEAK
Inductor peak
current limit
I
1.6
2
A
BK2LIM
Reference
switching
frequency
f
MHz
REFCLK
I
= 0 mA, HP mode
= 0 mA, LP mode
220
50
300
80
BUCK2OUT
Total quiescent
current
I
µA
µA
Q_BK2
I
BUCK2OUT
Input leakage
current
I
BUCK OFF
1
BUCK2IN_LKG
I
I
=150 mA, T = +25 °C
87
86
84
BK2OUT
A
EFF
=750 mA, T = +25 °C
Efficiency
%
BK2
BK2OUT
A
I
=1000 mA, T = +25 °C
A
BK2OUT
HP mode; 0<I
<1.0 A, ΔI
= 450 mA,
= 50 mA,
BK2OUT
BK2OUT
BK2OUT
15
30
5
t
= t ~250 ns
F
R
Load transient
regulation
V
mV
OUT2-LO
LP mode; 0<I
<50 mA ΔI
BK2OUT
t
= t ~250 ns
F
R
ΔV
= 600 mV, ΔI
= 0, t = t ~10 μs,
BK2OUT R F
Line transient
regulation
BK2IN
V
1.5
5
mV
mV
OUT2-LI
HP mode
2.8 V<V
<5.5 V, I ~1 mA, T = +25 °C,
Power-up
overshoot
BK2IN
BK2OUT
A
V
40
OUT2-OVR
0.725 V<V
<1.5 V
OUT2
Recovery time
from LP to HP
mode
t
V
= V
OUT2_LP OUT2_HP
20
1
µs
LP-HP-BK2
Start-up delay
(delay before
voltage starts to
rise)
2.8 V<V
2.8 V<V
<5.5 V, refer to Figure 46. BUCKx
BUCK2IN
t
0.05
0.5
ms
SU_BK2
start-up/shutdown timings.
<5.5 V, 1 mA<I
<100 mA,
BK2OUT
BUCK2IN
t
Soft-start duration
V
=1.2 V, refer to Figure 16. Buck4 load
transient in LP mode
235
400
µs
SS_BK2
OUT2
Slew rate during start-up
5.5
3.1
mV/µs
mV/µs
Output voltage
slew rate
S
RBK2
DVS slew rate of a voltage programmed change
low to high or high to low
From V
= 1.2 V to V <0.2 V, V =3.6 V,
OUT2 IN
OUT2
C
=22 µF
OUT
Shutdown
duration
t
ms
SD_BK2
Slow PD, I
Fast PD, I
<1 mA
1.5
BK2OUT
BK2OUT
<1 mA
0.15
Buck converter 3
V
= 3.6 V, V = 1.8 V, recommended BOM, T = -40 °C to +125 °C, unless otherwise specified
OUT3 j
BUCK3IN
Main input
voltage range
2.8(2)
V
5.5
V
BUCK3IN
DS12792 - Rev 7
page 15/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
1.0 to 3.4
100
Max.
Unit
V
Programmable value, refer to Table 10. BUCK
output settings
V
Output voltage
OUT3
Voltage programming step
mV
V
= 2.8 V to 5.5 V
BUCK3IN
HP mode I
HP mode I
= 0 to 500 mA, V
to 3.3 V
= 1.8 V
= 1.0 V
BK3OUT
OUT3
OUT3
-2.5
2.5
Output voltage
accuracy
V
%
OUT3-ACC
= 0 to 500 mA, V
to 3.4 V
BK3OUT
-3
-4
3
4
LP mode I
I
= 0 to 50 mA, V = 1.0 V to
OUT3
BK3OUT
3.4 V
= 0 mA, HP mode, T = +25 °C
10
5
BK3OUT
A
Output voltage
ripple
V
mV
mA
OUT3-RIPP
I
= 500 mA, HP mode, T = +25 °C
BK3OUT
A
2.8<V
<5.5 V, HP mode
<5.5 V, LP mode
500
50
BUCK3IN
Continuous
output current
I
OUT3
2.8< V
BUCK3IN
Peak output
current in LP
mode
I
2.8< V
<5.5 V, LP mode, t
< 10 µs
PEAK
200
OUT3_LP_PEAK
BUCK3IN
Inductor peak
current limit
I
1
2
A
BK3LIM
Reference
switching
frequency
f
MHz
REFCLK
I
= 0 mA, HP mode
= 0 mA, LP mode
220
50
300
80
BUCK3OUT
Total quiescent
current
I
µA
µA
Q_BK3
I
BUCK3OUT
Input leakage
current
I
BUCK OFF
1
BUCK3IN_LKG
I
=150 mA, T = +25 °C
90
88
91
BK3OUT
A
EFF
I
=350 mA,T = +25 °C
Efficiency
%
BK3
BK3OUT
BK3OUT
A
I
=500 mA,T = +2 5°C
A
HP mode; 0<I
<0.5 A, ΔI
= 100 mA,
= 50 mA,
IBK3OUT
BK3OUT
BK3OUT
15
30
5
t
= t ~250 ns
F
R
Load transient
regulation
V
mV
OUT3-LO
LP mode; 0<I
<50 mA Δ
BK3OUT
t
= t ~250 ns
F
R
Δ
= 600 mV, Δ
= 0, t = t ~10 μs,
Line transient
regulation
VBK3IN
IBK3OUT R F
V
1.5
5
mV
mV
OUT3-LI
HP mode
2.8 V<V
<5.5 V, I ~1 mA, T = +25 °C,
BK3IN
Power-up
overshoot
BK3OUT
A
V
40
OUT3-OVR
0.725 V<V
<1.5 V
OUT3
Recovery time
from LP to HP
mode
t
V
= V
OUT3_LP OUT3_HP
20
1
µs
LP-HP-BK3
Start-up delay
(delay before
voltage starts to
rise)
2.8 V<V
2.8 V<V
<5.5 V, refer to Figure 46. BUCKx
BUCK3IN
t
0.05
0.5
ms
SU_BK3
start-up/shutdown timings.
<5.5 V, 1 mA<I <100 mA,
BK3OUT
BUCK3IN
t
Soft-start duration
V
=1.2 V, refer to Figure 16. Buck4 load
transient in LP mode
235
400
µs
SS_BK3
OUT3
DS12792 - Rev 7
page 16/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Slew rate during start-up
5.5
mV/µs
Output voltage
slew rate
S
RBK3
DVS slew rate of a voltage programmed change
low to high or high to low
3.1
mV/µs
ms
From V
= 1.2 V to V <0.2 V, V =3.6 V,
OUT3 IN
OUT3
C
OUT
=22 µF
Shutdown
duration
t
SD_BK3
Slow PD, I
Fast PD, I
<1 mA
1.5
BK3OUT
BK3OUT
<1 mA
0.15
Buck converter 4
V
= 5.0 V, V = 3.3 V, recommended BOM, T = -40 °C to +125 °C, unless otherwise specified
OUT4 j
BUCK4IN
Main input
voltage range
2.8 (2)
V
5.5
V
V
BUCK4IN
Programmable value, refer to Table 10. BUCK
output settings
0.6 to 3.9
Voltage programming step
V
Output voltage
OUT4
0.6 V ≤ V
1.3 V≤ V
1.5 V ≤ V
<1.3 V
<1.5 V
<3.9 V
25
50
BK4OUT
BK4OUT
BK4OUT
mV
100
V
= 2.8 V to 5.5 V
BUCK4IN
HP mode I
HP mode I
= 0 to 2.0 A, V
1.4 V
= 0.8 V to
= 0.6 V to
= 0.6 V to
BK4OUT
OUT4
-2.5
-3.5
-4
2.5
3.5
4
Output voltage
accuracy
V
V
%
OUT4-ACC
= 0 to 2.0 A, V
3.9 V
BK4OUT
BK4OUT
OUT4
LP mode I
I
= 0 to 50 mA, V
3.9 V
OUT4
= 0 mA, HP mode, T = +25 °C
10
10
BK4OUT
A
Output voltage
ripple
mV
mA
OUT4-RIPP
I
= 2000 mA, HP mode, T = +25 °C
BK4OUT
A
2.8<V
<5.5 V, HP mode
<5.5V, LP Mode
2000
50
BUCK4IN
Continuous
output current
I
OUT4
2.8< V
BUCK4IN
Peak output
current in LP
mode
I
2.8< V
<5.5 V, LP mode, t
< 10 µs
PEAK
200
OUT4_LP_PEAK
BUCK4IN
Inductor peak
current limit
I
3
2
A
BK4LIM
Reference
switching
frequency
f
MHz
REFCLK
I
= 0 mA, HP mode
= 0mA, LP mode
220
50
300
80
BUCK4OUT
Total quiescent
current
I
µA
µA
Q_BK4
I
BUCK4OUT
Input leakage
current
I
BUCK OFF
1
BUCK4IN_LKG
I
=250 mA, T = +25 °C
90
85
79
BK4OUT
A
EFF
I
I
=1300 mA,T = +25 °C
Efficiency
%
BK4
BK4OUT
BK4OUT
A
=2000 mA,T = +25 °C
A
DS12792 - Rev 7
page 17/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
<2.0 A, ΔI
Min.
Typ.
Max.
Unit
HP mode; 0<I
LP mode; 0<I
= 500 mA,
= 50 mA,
BK4OUT
BK4OUT
BK4OUT
15
30
t
= t ~250 ns
F
R
Load transient
regulation
V
mV
OUT4-LO
<50 mA ΔI
BK4OUT
5
5
tR = tF ~250 ns
Δ
= 600 mV, Δ
= 0, t = t ~10 μs,
IBK4OUT R F
Line transient
regulation
VBK4IN
V
1.5
mV
mV
OUT4-LI
HP mode
2.8 V<V
<5.5 V, I
~1 mA, T = +25 °C,
BK4OUT A
Power-up
overshoot
BK4IN
V
40
OUT4-OVR
0.725 V<V
<1.5 V
OUT4
Recovery time
from LP to HP
mode
t
V
= V
OUT4_HP
20
1
µs
LP-HP-BK4
OUT4_LP
Startup delay
(delay before
voltage starts to
rise)
2.8 V<V
2.8 V<V
<5.5 V, refer to Figure 16. Buck4
BUCK4IN
t
0.05
0.5
ms
SU_BK4
load transient in LP mode.
<5.5 V, 1 mA<I
<100 mA,
BK4OUT
BUCK4IN
t
Soft-start duration
V
= 1.2 V, refer to Figure 46. BUCKx start-up/
shutdown timings
235
400
µs
SS_BK4
OUT4
Slew rate during start-up
5.5
3.1
mV/µs
mV/µs
Output voltage
slew rate
SR
BK4
DVS slew rate of a voltage programmed change
low to high or high to low, from 0.8 V to 1.2 V
1.9
From V
= 1.2 V to V <0.2 V, V =3.6 V,
OUT4 IN
OUT4
C
= 22 µF
OUT
Shutdown
duration
t
ms
SD_BK4
Slow PD, I
<1 mA
1.5
BK4OUT
BK4OUT
Fast PD, I
<1 mA
0.15
Boost converter
V
= 3.6 V, V
= 5.2 V, T = 25 °C, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
IN
BSTOUT
A
j
Main input
voltage range
V
2.8
5.5
V
V
IN
2.8 V<V
5.2 V<V
<5.2 V, boost mode
5.2
BSTOUT
Output voltage
range
V
OUT
<5.5 V, bypass mode
~VBOOSTIN
BSTOUT
2.8 V<V
<3.3 V, 0<I
<0.5 A or 3.3
Output voltage
accuracy
BSTIN
BSTOUT
V
-3.5
3.5
%
BST-ACC
V<V
<5.5 V, 0<I
BSTIN
<1.1 A
BSTOUT
Overvoltage
threshold
V
5.5
1.1
0.5
5.7
5.85
V
A
BSTOVP
Continuous
output current
I
3.3 V<V
<5.5 V
<3.3 V
BSTOUT_HI
BSTOUT_LO
BSTOUT_LKG
BSTIN
Continuous
output current
I
2.8 V<V
A
BSTIN
Output leakage
current
I
B
, boost OFF, pull-down disabled
STOUT
1
µA
A
Inductor peak
current limit LS
I
3.3
4
BSTLIM
Short-circuit
threshold HS
I
A
BSTSH
I
I
=0 mA
BSTOUT
Quiescent current
Efficiency
600
76
900
µA
%
Q
I
=2.5 mA, T = 25 °C
A
EFF
BSTOUT
BST
DS12792 - Rev 7
page 18/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
89
Max.
Unit
I
I
=100 mA, T = 25 °C
BSTOUT
A
EFF
Efficiency
%
=500 mA, T = 25 °C
BST
89
BSTOUT
A
I
=1100 mA, T = 25 °C
A
82
BSTOUT
I
= 0 A to 0.5 A, Δ
= 0, t = t ~5 µs
BSTOUT
VIN R F
300
200
V
={3.6 V;5 V}
IN
Load transient
regulation
V
mV
BST-LO
I
= 0.5 A to 1.0 A, ΔVIN = 0, t = t ~5 µs
R F
BSTOUT
130
40
VIN={3.6 V;5 V}
Δ
= 5 V+/-250 mV, I
= 500 mA, t = t
Line transient
regulation
VIN
BSTOUT
R
F
V
mV
mV
mA
BST-LI
~1 μs
<5.2 V, I =0 mA
BSTOUT
Power-up
overshoot
V
3.0 V<V
300
BST-OVR
BSTIN
Precharge
current
I
t
220
1
PRECH_BST
Maximum
precharge
duration
I
=0 mA
=0 mA
ms
PRECH_BST
BSTOUT
t
I
BSTOUT
Soft-start duration
500
115
µs
SS_BST
Bypass switch
ON-resistance
R
I
=300 mA, V = 5.3 V
BSTOUT IN
mΩ
DSON-BYP
PWR_USB_SW switch
VBSTOUT=5.2 V, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
j
Switch ON-
resistance
R
I
=300 mA
VBUSOTG
145
250
mΩ
DSON-VBUSOTG
Continuous
output current
I
0.5
mA
A
VBUSOTG
I
Overcurrent limit
0.55
VBUSOTGOCP
Short-circuit
threshold
I
1.1
3
A
VBUSOTG_SH
Soft-on/off
duration
t
ms
ms
V
SS_VBUSOTG
V
det.
BUSOTG
t
30
VBUSOTGDB
debounce time
V
rise
BUSOTG
V
3.6
2.0
3.8
2.2
4.0
2.4
VBUSOTG_Rise
threshold
V
fall
BUSOTG
V
V
VBUSOTG_Fall
threshold
PWR_SW switch
VSWIN = 5.2 V, T = -40 °C to +125 °C, recommended BOM, unless otherwise specified
j
Switch ON-
resistance
R
I
=300 mA
100
200
mΩ
A
DSON-SWOUT
SWOUT
Continuous
output current
I
1
SWOUT
OCP_SWOUT_LIM = 0
OCP_SWOUT_LIM = 1
0.6
1.1
A
A
I
Overcurrent limit
SWOUTOCP
Short-circuit
threshold
I
1.1
A
SWOUT_SH
DS12792 - Rev 7
page 19/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Soft-on/off
duration
t
3
ms
SS_SWOUT
SWOUT rise
threshold
V
40
30
50
40
60
50
% VIN
% VIN
ms
SWOUT_Rise
SWOUT fall
threshold
V
SWOUT_Fall
SWOUT det.
debounce time
t
30
SWOUTDB
SWIN rise
threshold
V
2.75
2.5
2.92
2.65
30
3.00
2.8
V
SWIN_Rise
SWIN fall
threshold
V
V
SWIN_Fall
SWIN det.
debounce time
t
ms
SWINDB
SWIN OCP
debounce time
t
2
µs
OCPDBSW
Digital interface
VIO input voltage
for IO signal
V
1.7
0
1.8
0.8
3.6
V
IO
PONKEYn input
low voltage
0.3x
VIN
internal VIN pull-up on pin
internal VIO pull-down on pin
internal VIO pull-up on pin
internal VIO pull-down on pin
internal VIO pull-up on pin
WAKEUP input
low voltage
0.3
0
0.3x
VIO
PWRCTRL input
low voltage
V
V
IL
0.3x
VIO
0
RSTn input low
voltage
0.3x
VIO
0
2
SDA, SCL input
low voltage
I C NXP UM10204 revision 5 compliant (October
2012)
PONKEYn input
high voltage
0.7 x
VIN
internal VIN pull-up on pin
Internal VIO pull-down on pin
Internal VIO pull-up pin
VIN
1.2
WAKEUP input
high voltage
1
0.7 x
VIO
VIO
VIO
VIO
PWRCTRL input
high voltage
V
V
IH
0.7 x
VIO
Internal VIO pull-down pin
Internal VIO pull-up on pin
RSTn input high
voltage
0.7 x
VIO
2
SDA, SCL input
high voltage
I C NXP UM10204 revision 5 compliant (October
2012)
INTn output low
voltage
0.3 x
VIO
80 kΩ internal VIO pull-up on pin
0
V
V
V
OL
2
SDA, SCL output
low voltage
I C NXP UM10204 revision 5 compliant (October
2012)
INTn output high
voltage
80 kΩ internal VIO pull-up on pin
VIO
V
OH
DS12792 - Rev 7
page 20/140
STPMIC1
Electrical and timing parameters
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
2
SDA, SCL output
high voltage
I C NXP UM10204 revision 5 compliant (October
2012)
V
V
OH
WAKEUP pin
pull-down resistor
Internally connected to GND
Internally connected to GND
45
60
90
50
50
50
60
90
120
80
80
80
30
2
80
R
PD
PWRCTRL pin
pull-down resistor
140
140
120
120
120
PONKEYn pin
pull-up resistor
Internally connected to V
IN
kΩ
PWRCTRL pin
pull-up resistor
Internally connected to V
io
R
PU
RSTn pin pull-up
resistor
Internally connected to V
io
INTn pin pull-up
resistor
Internally connected to V
io
PONKEYn
debounce time
PONKEYn
WAKEUP
ms
µs
µs
DB
WAKEUP
debounce time
DB
RSTn assertion
time
RSTn
20
DB
1. Dropout is the smallest difference between a regulator’s input and its output voltage, which is required to
maintain regulation and enable the regulator to provide rated voltage and current
2.
V
is intended to be higher than VOUT
IN
DS12792 - Rev 7
page 21/140
STPMIC1
Application board curves
3.5
Application board curves
Unless otherwise specified, all typical curves are given as design guidelines.
Figure 3. BUCK1 efficiency
Figure 4. BUCK2 efficiency
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
0.00001
0.0001
0.001
0.01
0.1
1
0.00001
0.0001
0.001
0.01
0.1
1
Load [A]
Load [A]
1.2Vout 5Vin LP
1.2Vout 3.6Vin LP
1.35Vout 5Vin LP
1.2Vout 3.6Vin HP
1.2Vout 5Vin HP
1.35Vout 5Vin HP
1.2Vout 5Vin LP
1.2Vout 3.6Vin LP
1.2Vout 3.6Vin HP
1.2Vout 5Vin HP
Figure 6. BUCK4 efficiency
Figure 5. BUCK3 efficiency
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.00001
0.0001
1.2Vout 3.6Vin LP
0.001
1.8Vout 3.6Vin LP
0.01
0.1
1
Load [A]
0.00001
0.0001
0.001
0.01
0.1
1
1.2Vout 5Vin LP
3.3Vout 5Vin LP
1.2Vout 3.6Vin HP
1.8Vout 3.6Vin HP
1.2Vout 5Vin HP
3.3V 5Vin HP
Load [A]
1.8Vout 5Vin LP
1.8Vout 3.6Vin LP
3.3Vout 5Vin LP
1.8Vout 5Vin HP
3.3Vout 5Vin HP
1.8Vout 3.6Vin HP
Figure 8. Boost powered by 5 V supply having poor
performance
Figure 7. Boost efficiency
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
VIN
VIN
VIN
VIN
=
=
=
=
3V
3.6V
5V
5.5V
1
10
Load [mA]
100
1000
DS12792 - Rev 7
page 22/140
STPMIC1
Application board curves
Figure 9. BUCK1 load transient in HP mode
Figure 11. BUCK2 load transient in HP mode
Figure 13. Buck3 load transient in HP mode
Figure 15. Buck4 load transient in HP mode
Figure 10. Buck1 load transient in LP mode
Figure 12. Buck2 load transient in LP mode
Figure 14. Buck3 load transient in LP mode
Figure 16. Buck4 load transient in LP mode
DS12792 - Rev 7
page 23/140
STPMIC1
Application board curves
Figure 17. LDO1 load transient
Figure 19. LDO3 load transient
Figure 21. LDO5 load transient
Figure 23. LDO4 line transient
Figure 18. LDO2 load transient
Figure 20. LDO4 load transient
Figure 22. LDO6 load transient
Figure 24. Boost output vs. input voltage
DS12792 - Rev 7
page 24/140
STPMIC1
Application board curves
Figure 25. Boost load regulation 5 VIN
Figure 27. LDO1 line transient, no load
Figure 29. LDO3 line transient, no load
Figure 26. Boost load regulation 3.6 VIN
Figure 28. LDO2 line transient, no load
Figure 30. LDO5 line transient, no load
Figure 32. LDO3 sink/source mode load transient
response
Figure 31. LDO6 line transient, no load
DS12792 - Rev 7
page 25/140
STPMIC1
Application board curves
Figure 34. STPMIC1A POWER_UP sequencing
Figure 33. Buck1 turn-ON waveform
Figure 36. STPMIC1A POWER_DOWN sequencing
Figure 35. STPMIC1A POWER_UP sequencing PONKEYn
Figure 37. STPMIC1A reset sequencing
DS12792 - Rev 7
page 26/140
STPMIC1
Power regulators and switch description
4
Power regulators and switch description
4.1
Overview
The STPMIC1 has a large input voltage range from 2.8 V to 5.5 V to supply applications from typically 5 V DC
wall-adaptor or from 1-cell 3.6 V Li-Ion / Li-PO battery or from USB port (bus-powered).
The STPMIC1 provides all regulators needed to power supply a complete application:
•
•
•
•
6 LDOs + 1 reference voltage LDO for DDR memories
4 step-down (buck) converters
1 step-up (boost) converter with a bypass to supply USB sub-system
2 power switches to supply USB sub-system
Table 8. General description
Rated output
current (mA)
Regulator
Output voltage (V) Programming step(mV)
Application use (example)
LDO1
LDO2
1.7 to 3.3
1.7 to 3.3
1.7 to 3.3
100
100
100
350
350
100
GP
SD-card or GP
lpDDR_1V8 or GP
LDO3 normal mode
+/-120
LDO3 sink/source mode VOUT2 / 2 (BUCK2)
-
DDR3 VTT (termination)
(+/-200 peak)
LDO3IN-V
LDO3 bypass mode
LDO4
-
50
50
lpDDR_1V8
USB PHY
DROP_LDO3
3.3 (fixed)
-
LDO5
1.7 to 3.9
0.9 to 3.3
100
100
-
350
150
+/-5
1500
1000
500
Application FlashMem or GP
GP
LDO6
REFDDR
BUCK1
VOUT2 / 2 (BUCK2)
0.725 to 1.5
1 to 1.5
Vref DDR
25
50
100
Application CORE
lpDDR2/3/4, DDR3/L, DDR4
Application VIO
BUCK2
BUCK3
1 to 3.4
25 (0.6 V to 1.3 V)
50 (1.3 V to 1.5 V)
100 (1.5 to 3.9 V)
BUCK4
0.6 to 3.9
2000
Application CPU or GP
BOOST
PWR_USB_SW
PWR_SW
5.2 V (fixed)
~BSTOUT
~SWIN
-
-
-
1100
500
USB ports
USB OTG/DRD
USB or GP
1000
LDO1, LDO2, LDO5, LDO6 are general purpose (GP) LDO (low-dropout) linear regulators and can be used to
supply application peripherals.
LDO3 is a multipurpose linear regulator that supports 3 modes:
•
•
Normal mode: operates as standard LDO with 1.7 to 3.3 V output voltage range (for general purpose use)
Sink/source mode: LDO3 operates in sink/source regulation mode to supply termination resistors of DDR3/
DDR3L memory interface (VTT voltage)
•
Bypass mode: LDO3 operates as a simple power switch to supply lpDDR2/3 VDD1 (1.8 V) power domain.
In that case, LDO3IN is supplied by 1.8 V. This is a preferred mode versus normal mode in term of power
efficiency to power supply lpDDR2/3 VDD1
DS12792 - Rev 7
page 27/140
STPMIC1
LDO regulators
LDO4 is a fixed output voltage (3.3 V) LDO and it is dedicated to power supply host processor USB PHY. It is able
to automatically switch among 3 power inputs (VIN, VBUSOTG and BSTOUT) to provide a valid output voltage in
all application use cases, for example to support a discharged battery for Li-Ion/Li-PO battery-powered device.
DDR REF is sink/source reference voltage LDO dedicated to power VREF of lpDDR/DDR.
BUCK1 to BUCK4 are 2 MHz synchronous step-down converters optimized for high efficiency. To improve
transient response, converters use an adaptive constant on-time (COT) controller with a nominal switching
frequency of 2 MHz.
In low power (LP) mode, converters operate in hysteretic mode to minimize quiescent current and improve
efficiency while an excellent transient response is being kept.
Buck controller also supports a dynamic voltage scaling (DVS) capability with an active discharge (voltage
tracking) and a switching phase shifting pi/2 mutual synchronization between converters to reduce switching EMI
radiations.
BOOST is a fixed output voltage 5.2 V synchronous step-up converter dedicated to power supply USB ports
(PWR_USB_SW and/or PWR_SW power switches). In addition to support a step-up conversion for battery
applications (to convert VBAT=3.6 V to VBUS= 5.2 V), this boost converter has been enhanced with a special
bypass circuitry with smooth output voltage transitions to comply USB VBUS tolerance when the application is
powered by a 5 V wall adaptors. This is to compensate voltage tolerance of the voltage source (wall adaptor) and
voltage drop through the PCB from input supply of device to USB port.
PWR_USB_SW is a 500 mA power switch suitable for USB OTG port or USB Type-C DRD. Input is internally
connected to BOOST output. It supports VBUS detection, OCP and the reverse current protection.
PWR_SW is a 1000 mA power switch, that can supply max. 2 USB STD HOST port.
4.2
LDO regulators
4.2.1
LDO regulators - common features
The STPMIC1 has 7 LDO regulators with the following meaning:
•
•
LDO1, LDO2, LDO5 and LDO6 are general purpose LDOs
LDO3 serves for DDR2, DDR3 memory termination (sink-source mode) or for lpDDR2 or lpDDR3 memory
(bypass mode) or for general purpose. For more details refer to Section 4.3 DDR memory sub-system
examples.
•
•
LDO4 is LDO dedicated to supply 3V3 USB PHY circuit of AP
REFDDR – sink/source LDO dedicated to provide a voltage reference for lpDDR/DDR memory
Enable/Disable - LDO can be enabled or disabled:
1.
Automatically during POWER_UP/POWER_DOWN state as described in Section 5.3 POWER_UP,
POWER_DOWN sequence
2.
Manually by setting ENA bit in corresponding Table 40. LDOx_MAIN_CR or Table 45. LDOx_ALT_CR
registers.
VOUT setting – LDO output voltage can be set:
1.
Automatically during POWER_UP/POWER_DOWN state as described in section Section 5.3 POWER_UP,
POWER_DOWN sequence. Default voltage is selected in LDOx_VOUT[1:0] bits of
Table 70. NVM_LDOS_VOUT_SHR1 and Table 71. NVM_LDOS_VOUT_SHR2 registers.
2.
3.
Automatically during MAIN/ALTERNATE mode change by toggling PWRCTRL pin as defined in VOUT[4:0]
field in corresponding Table 40. LDOx_MAIN_CR or Table 45. LDOx_ALT_CR registers.
Manually by setting VOUT[4:0] field of Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR registers.
Refer to Table 9. LDO output voltage settings
DS12792 - Rev 7
page 28/140
STPMIC1
LDO regulators
LDOs contain the following functions:
1.
Soft-start circuit is implemented to limit input inrush current when LDO starts. LDO soft-start duration is
defined by tSSLDO parameter. For more details, Figure 38. LDO start-up/shutdown timings
2.
Overcurrent limit circuit - When the load on the output of the LDO exceeds overcurrent limit threshold
ILDOLIM, LDO starts decreasing the output voltage limiting the output current. When the overcurrent condition
on LDO lasts for more than tOCPDB_LDO, LDOx_OCP interrupt is generated. For a detailed behavior of the
device on OCP event refer to Section 5.4.7 Overcurrent protection (OCP)
3.
Output discharge circuit (passive), to discharge LDO output decoupling capacitor energy. In power down
sequence, it allows LDO voltage to be down before disabling next regulators in next ranking slot.
Output discharge is by default active when LDO is disabled.
Different behavior can be programmed in Table 28. LDO14_PD_CR and Table 29. LDO56_VREF_PD_CR
registers.
Note:
To ensure the LDO functionality, BUCK2IN input must be always connected to VIN power supply.
Figure 38. LDO start-up/shutdown timings
4.2.2
LDO regulators - special features
LDO3
DS12792 - Rev 7
page 29/140
STPMIC1
LDO regulators
LDO3 is a multipurpose LDO with 3 operating modes:
1.
Normal mode – LDO works as general purpose LDOs to regulate VOUT only, such as the common
LDO1,2,5 and 6.
2.
Bypass mode – LDO operates as a power switch providing output without any regulation. Note, that in this
mode there is no overcurrent limitation available, and LDO is only protected by its input source capability;
that is typically BUCK3 powering application processor VIO domain at 1.8 V.
This mode can be set by writing to bit BYPASS in Table 41. LDO3_MAIN_CR or Table 46. LDO3_ALT_CR
register. Bypass mode can be activated by default at startup by setting LDO3_BYPASS bit in
Table 68. NVM_LDOS_RANK_SHR2.
Important : enabling BYPASS bit in Table 41. LDO3_MAIN_CR or Table 46. LDO3_ALT_CR overrides
normal and sink/source mode
3.
Sink/source mode – LDO is able to regulate voltage in source and sink mode allowing current to flow
to/from output; up to maximum rated current. This mode is dedicated to supply termination of DDR3/DDR3L
memories with fixed output voltage. If LDO3 is used in this mode, LDO3IN should be powered from the
output of BUCK2.
When LDO3 is enabled in this mode, output voltage is fixed and follows VOUT2/2; even during BUCK2
ramp-up and ramp-down phase. Overcurrent limitation works the same way as for the other LDOs, and it is
active for both load current polarities.
This mode can be enabled by setting VOUT[6:2] of Table 41. LDO3_MAIN_CR or Table 46. LDO3_ALT_CR
to 0x1F.
Note:
LDO requires the output capacitor with a low value of ESR and care must be taken during PCB design to
minimize parasitic inductance of the track between this capacitor and the device.
LDO4
It is primarily dedicated to supply 3.3 V circuit of USB analog PHY in AP.
VOUT setting – VOUT is fixed to 3.3 V
Automatic input switching - To guarantee the output voltage for various application scenarios (for example to
support discharged battery for Li-Ion/Li-PO battery powered device) LDO4 can be supplied from 3 power sources:
VIN, VBUSOTG and BSTOUT. The selection among these 3 power inputs is fully automatic, no user intervention
is needed. Internal circuit continuously monitors voltage levels on these pins and selects the input source having
the highest input voltage.
Active input source of LDO4 can be read out from LDO4_SRC[1:0] in Section 6.2.5 Restart status register
(RESTART_SR) status register.
REFDDR LDO (DDR reference voltage)
DDR_REF is sink/source LDO similar to LDO3 sink/source mode LDO but with lower current capability primarily
dedicated to supply VREF pin of lpDDR/DDR memories.
VOUT setting - Output voltage is fixed at VOUT2/2 at any time. Input of REFDDR is internally connected to
BUCK2IN.
In case BUCK2 is enabled/disabled when REFDDR is enabled, output of the REFDDR follows BUCK2 startup/
shutdown waveforms always keeping VOUT2/2.
Overcurrent limit circuit - When short-circuit event occurs, output of the LDO is current-limited and output
voltage decreases, however this LDO cannot trigger interrupt or shutdown the device.
4.2.3
LDO output voltage settings
Table 9. LDO output voltage settings
VOUT[4:0]
V
OUT
[V]
V
OUT
[V]
V
LDO3
[V]
V
LDO5
[V]
V
LDO6
[V]
OUT
OUT
OUT
LDOx_MAIN/
ALT_CR[6:2]
LDO1
LDO2
0
1
2
3
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
0.9
1
1.1
1.2
DS12792 - Rev 7
page 30/140
STPMIC1
LDO regulators
VOUT[4:0]
LDOx_MAIN/
ALT_CR[6:2]
V
LDO1
[V]
V
LDO2
[V]
V
LDO3
[V]
V
LDO5
[V]
V
LDO6
[V]
OUT
OUT
OUT
OUT
OUT
4
1.7
1.7
1.7
1.7
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.3
3.3
3.3
3.3
3.3
3.3
1.7
1.7
1.7
1.7
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.3
3.3
3.3
3.3
3.3
3.3
1.7
1.7
1.7
1.7
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.3
3.3
3.3
3.3
3.3
3.3
1.7
1.7
1.7
1.7
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.3
3.3
3.3
3.3
3.3
3.3
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
VOUT2/2
(sink/source)
31
3.3
3.3
3.9
3.3
DS12792 - Rev 7
page 31/140
STPMIC1
DDR memory sub-system examples
4.3
DDR memory sub-system examples
BUCK2, LDO3 and REFDDR regulators can be used in several possible configurations, to supply various types of
DDR memories.
4.3.1
Powering lpDDR2/lpDDR3 memory
Figure 39. Powering lpDDR2/lpDDR3 memory (LDO3 in bypass mode)
The example in Figure 39. Powering lpDDR2/lpDDR3 memory (LDO3 in bypass mode) shows how to use LDO3
in bypass mode to power supply lpDDR2/3 VDD1 (1.8 V) power domain. LDO3IN is supplied by 1.8 V power
source that is usually from BUCK3 output when BUCK3 is set at 1.8 V to power supply the application processor
VIO power domain. This topology reaches better power efficiency than next example in Figure 40. Powering
lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN).
Figure 40. Powering lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN)
The example in Figure 40. Powering lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN) shows
how to use LDO3 in normal mode to power supply lpDDR2/3 VDD1 (1.8V) power domain. LDO3IN is supplied by
a power source having higher voltage than LDO3OUT (VIN in this example). This topology is suitable for those
applications which do not have 1.8 V power source available from a buck converter.
DS12792 - Rev 7
page 32/140
STPMIC1
Buck converters
4.3.2
Powering DDR3/DDR3L memory
Figure 41. Powering DDR3/DDR3L memory (LDO3 in sink/source mode)
The example in Figure 41. Powering DDR3/DDR3L memory (LDO3 in sink/source mode) shows how to use LDO3
in sink/source mode to power supply termination resistor network of DDR3/DDR3L memory (aka VTT). LDO3IN is
a power supply from BUCK2 output (VOUT2) and LDO3 output regulate at Vout2/2 voltage.
4.4
Buck converters
4.4.1
BUCK general description
There are 4 buck converters in the STPMIC1 optimised to supply circuits with high current consumption and fast
transient response requirement.
BUCK1 is primarily dedicated to power supply CORE power domain of application processors.
BUCK2 is primarily dedicated to power supply DDR memory.
BUCK3 is primarily dedicated to VIO domain and analog subsystem.
BUCK4 is for general purpose, it can be used to supply CPU power domain of application processors having
CORE and CPU power domain splitted.
All converters are based on an adaptive constant-on-time controller (COT), that guarantees an excellent transient
response and high efficiency across a wide range of operating conditions.
Each converter can work in 2 power modes – HP mode, and LP mode. These modes differ both in performance
and quiescent current consumption. In HP mode the highest performance can be reached, while in LP mode the
performance is lower with a much lower consumption.
Switching frequency of converter is 2 MHz in steady-state CCM condition. During load transient, switching
frequency can be temporarily increased/decreased to provide accurate amount of energy needed and minimize
voltage error. Refer to the figure below.
DS12792 - Rev 7
page 33/140
STPMIC1
Buck converters
Figure 42. PWM clock generation
Clock synchronization (HP mode)– buck controller integrates phase locked loop (PLL) circuit, that maintains
steady-state frequency in CCM phase-locked to reference 2 MHz clock generated by internal oscillator. Each
buck has its own reference clock that is shifted from master clock by 90 degree, which minimizes the chance of
multiple controllers switching at the same time, and improving EMI performance. Refer to Figure 43. PWM clock
synchronisation .
Figure 43. PWM clock synchronisation
Voltage accuracy (HP mode)- COT controllers are well-known for their excellent transient response but standard
implementations usually suffer from a high output load regulation error. To cope with this problem, the STPMIC1
adaptive COT controller also integrates an ACCU loop circuit that fixes the parameters of controller in order to
reach the maximum possible accuracy of output voltage for all operating conditions. Refer to Figure 44. Buck
block diagram.
DS12792 - Rev 7
page 34/140
STPMIC1
Buck converters
Figure 44. Buck block diagram
Light low power consumption (HP mode)– To minimize power consumption in low load conditions PFM mode
is implemented. Switching between PFM and PWM mode is smooth, fully automatic, and requires no user
intervention.
Low power mode (LP mode) – If the application remains in low load conditions for longer time, the converter can
be switched to LP mode and minimize quiescent consumption to IQ_ BK_LP. In LP mode, the controller works in
hysteretic PFM mode, and has the following features:
1.
Maximum DC current capability is lower, specified by IOUT. However, also in LP mode, converter is able to
handle peak current load of up to IOUT_LP_PEAK but transient response and accuracy are not guaranteed.
2.
3.
ACCU loop is disabled, which results in a lower VOUT accuracy specified by VOUT1-ACC
PLL is disabled. Converter is in PFM mode, which means pulses are not synced to reference clock
To guarantee the best performance, it is recommended LP mode to be entered only when output load is
below IOUTMAX_LP, LP mode can be entered by setting PREG_MODE bit Table 38. BUCKx_MAIN_CR or
Table 43. BUCKx_ALT_CR registers.
Exit from LP mode - It is recommended that application processor switches from LP mode to HP mode before
it applies full rated load exceeding maximum LP current IOUT_LP. This time is defined as minimum LP to HP
recovery time tLP-HP-BKIf load is increased before this time, buck converter stays in regulation but transient or
accuracy specification may not be guaranteed. Refer to Figure 45. BUCKx LP to HP mode recovery time.
Note:
During POWER_UP sequence, buck is always started in HP mode, with default VOUT configuration defined in
NVM_BUCKx_VOUT[1:0] bits of Table 69. NVM_BUCKS_VOUT_SHR register.
Enable/disable - BUCK can be enabled or disabled:
1.
Automatically during POWER_UP/POWER_DOWN state as described in Section 5.3 POWER_UP,
POWER_DOWN sequence
2.
Manually by setting ENA bit in corresponding Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR
registers
VOUT setting – BUCK output voltage can be set:
1.
Automatically during POWER_UP/POWER_DOWN state as described in Section 5.3 POWER_UP,
POWER_DOWN sequence
Default voltage is selected in BUCKx_VOUT[1:0] bits of Table 69. NVM_BUCKS_VOUT_SHR register.
2.
3.
Automatically during MAIN/ALTERNATE mode change by toggling PWRCTRL pin as defined in VOUT[5:0]
field in corresponding Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR registers.
Manually by setting VOUT[5:0] field of Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR registers.
DS12792 - Rev 7
page 35/140
STPMIC1
Buck converters
Refer to Section 4.2.3 LDO output voltage settings.
Dynamic voltage scaling (DVS) – When Buck voltage is changed by writing to VOUT[5:0] bits in POWER_ON
state, Buck reference is digitally stepped up/down in order to keep VOUT slew rate defined by parameter SRBK.
When a lower VOUT is requested, Buck operates in “boost reverse” mode to discharge the output capacitor with
the same slew rate SRBK, providing current back to the input supply capacitor. This improves efficiency because
energy stored in the output capacitor is not lost but “recycled” into input capacitor. For more details refer to
Figure 47. BUCKx dynamic voltage scaling (DVS) .
Bypass capability – BUCK3 and BUCK4 switch to bypass mode with 100% duty cycle when VIN voltage is below
target VOUT setting. Transition to bypass mode is fully automatic and requires no user intervention.
Overcurrent protection – When inductor current exceeds peak current limit threshold IBK1_LIM, PWM pulse is
immediately stopped, and buck starts to decrease output voltage limiting the output current. When this condition
lasts for more than tOCPDB_BUCK, BUCKx_OCP interrupt is generated.
For a detailed behavior of the device on OCP event refer to Section 5.4.7 Overcurrent protection (OCP).
VOUT Protection – BUCK4 VOUT value digital setting can be limited to 1.3 V by writing BUCK4_CLAMP bit in
Table 68. NVM_LDOS_RANK_SHR2 register.
This feature can be used to prevent destruction of low-voltage circuit connected to VOUT4, in case of erroneous/
unwanted software access to Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR.
Start-up sequence – After the Buck is enabled, variable calibration delay is present before the output voltage
starts rising. This delay is specified as start-up delay tSU_BUCKx. For details about start-up/shutdown timings refer
to Figure 46. BUCKx start-up/shutdown timings.
Output discharge – Buck has configurable passive output discharge circuit to guarantee that shutdown time is
shorter than single ranking slot in POWER_DOWN sequence.
Discharge circuit can be configured to Slow PD (pull-down) for longer discharge time or Fast PD for faster
discharge time. Discharge duration is defined accordingly by tSD_BKx
.
Slow output discharge circuit is active by default when buck is disabled.
Different behavior can be programmed in BUCKx_PD[1:0] bits of BUCKS_PD_CR register.
Figure 45. BUCKx LP to HP mode recovery time
DS12792 - Rev 7
page 36/140
STPMIC1
Buck converters
Figure 46. BUCKx start-up/shutdown timings
Figure 47. BUCKx dynamic voltage scaling (DVS)
DS12792 - Rev 7
page 37/140
STPMIC1
Buck converters
4.4.2
BUCK output voltage settings
Table 10. BUCK output settings
V
[V]
V
[V]
V
[V]
V
OUT
[V]
VOUT[5:0]
OUT
OUT
OUT
BUCKx_MAIN/ALT_CR[7:2]
BUCK1
0.725
BUCK2
1
BUCK3
1
BUCK4
0.6(1)
0
0.625(1)
0.65(1)
0.675(1)
0.7(1)
1
0.725
1
1
2
0.725
1
1
3
0.725
1
1
4
0.725
1
1
0.725(1)
0.75(1)
0.775(1)
0.8(1)
0.725(1)
0.75(1)
0.775(1)
0.8(1)
5
1
1
6
1
1
7
1
1
8
1
1
0.825(1)
0.85(1)
0.875(1)
0.9(1)
0.825(1)
0.85(1)
0.875(1)
0.9(1)
9
1
1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
1
1
1
1
1
1
0.925(1)
0.95(1)
0.975(1)
1(1)
0.925(1)
0.95(1)
0.975(1)
1(1)
1
1
1
1
1
1
1
1
1.025(1)
1.05(1)
1.075(1)
1.1(1)
1 (2)
1.05(2)
1.05(2)
1.1(2)
1.1(2)
1.15(2)
1.15(2)
1.2(2)
1.2(2)
1.25(2)
1.25(2)
1.3(2)
1.3(2)
1.35(2)
1.35(2)
1.4(2)
1.4(2)
1.45(2)
1.025(1)
1.05(1)
1.075(1)
1.1(1)
1
1
1 (3)
1.1(3)
1.1(3)
1.1(3)
1.1(3)
1.2(3)
1.2(3)
1.2(3)
1.2(3)
1.3(3)
1.3(3)
1.3(3)
1.3(3)
1.4(3)
1.4(3)
1.4(3)
1.125(1)
1.15(1)
1.175(1)
1.2(1)
1.125(1)
1.15(1)
1.175(1)
1.2(1)
1.225(1)
1.25(1)
1.275(1)
1.3(1)
1.225(1)
1.25(1)
1.275(1)
1.3(1)
1.325(1)
1.35(1)
1.375(1)
1.4(1)
1.3(2)
1.35(2)
1.35(2)
1.4(2)
1.425(1)
1.45(1)
1.4(2)
1.45(2)
DS12792 - Rev 7
page 38/140
STPMIC1
Buck converters
V
[V]
V
[V]
V
[V]
V
OUT
[V]
VOUT[5:0]
OUT
OUT
OUT
BUCKx_MAIN/ALT_CR[7:2]
BUCK1
1.475(1)
1.5(1)
1.5
BUCK2
1.45(2)
1.5(2)
1.5
BUCK3
1.4(3)
1.5(3)
1.6(3)
1.7(3)
1.8(3)
1.9(3)
2(3)
BUCK4
1.45(2)
1.5(2)
1.6(3)
1.7(3)
1.8(3)
1.9(3)
2(3)
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
2.1(3)
2.2(3)
2.3(3)
2.4(3)
2.5(3)
2.6(3)
2.7(3)
2.8(3)
2.9(3)
3(3)
2.1(3)
2.2(3)
2.3(3)
2.4(3)
2.5(3)
2.6(3)
2.7(3)
2.8(3)
2.9(3)
3(3)
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
3.1(3)
3.2(3)
3.3(3)
3.4(3)
3.4
3.1(3)
3.2(3)
3.3(3)
3.4(3)
3.5(3)
3.6(3)
3.7(3)
3.8(3)
3.9(3)
3.9
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
3.4
1.5
1.5
3.4
1.5
1.5
3.4
1.5
1.5
3.4
1.5
1.5
3.4
1.5
1.5
3.4
3.9
1.5
1.5
3.4
3.9
1. Step 25 mV
2. Step 50 mV
3. Step 100 mV
DS12792 - Rev 7
page 39/140
STPMIC1
Boost converter and power switches
4.5
Boost converter and power switches
The STPMIC1 integrates boost converter and two power switches, primarily dedicated to supply USB sub-system:
PWR_USB_SW with 500 mA capability PWR_SW with 1 A capability.
For application examples refer to USB sub-system examples.
Figure 48. Boost and switch block diagram
4.5.1
Boost converter
Boost is a synchronous constant on-time step-up converter with fixed 5.2 V output. It is dedicated to power supply
USB sub-system (VBUS) with 1.1 A rated output current to supply up to 3 USB ports: x2 USB host port @500 mA
+ 1 USB OTG port @100 mA.
Boost requires 3 small external components only to operate (1 coil LXB, 2 capacitors CVLXBST and CBSTOUT) –
there is no external diode required. Refer to: Table 2. Passive components.
Input voltage range Converter is capable to supply 0.5 A starting from as low as 2.8 V input, and full rated
current from 3.3 V input. This allows a wide range of applications to be supported embedding USB host port like
Li-Ion/Li-Po battery powered applications or 5 V DC wall adaptor applications.
Bypass feature Boost integrates an advanced bypass circuitry that allows fast and smooth transition to be
performed from boost to bypass operation and reciprocally to keep VBUS in USB compliant tolerance [4.75 V;5.5
V]. This allows USB subsystems to be supplied with standard 5 V DC wall adaptors.
•
When the wall adaptor voltage is below ~5.2 V (due to its nominal tolerance, load regulation or voltage loss
between adaptor and device), the converter works in boost mode
•
When the wall adaptor voltage is between ~5.2 V to 5.5 V (due to its nominal tolerance or light device load),
the converter works in bypass mode
Switching frequency of converter is 2 MHz in steady-state CCM condition for VIN below ~5 V. During load
transient, switching frequency can be temporarily increased/decreased to provide accurate amount of energy
needed and minimize the voltage error. For VIN above ~5.2 V or for low load conditions, 2 MHz frequency
decreases to optimum.
Clock synchronization - The controller integrates PLL circuit, that maintains steady-state frequency in CCM
locked in phase to reference 2 MHz clock generated by the internal oscillator. Boost clock is shifted in phase
to Buck reference clocks, which minimizes the chance of multiple controllers switching at the same time, and
improving EMI performance.
DS12792 - Rev 7
page 40/140
STPMIC1
Boost converter and power switches
Enable/disable – Boost can be enabled in POWER_ON state only by I2C setting of BST_ON bit in BST_SW_CR
register.
Boost can be disabled by I2C clearing BST_ON bit.
Boost is also disabled during POWER_DOWN sequence in RANK0 slot and when overcurrent or overvoltage
condition is present for defined time.
Output discharge – When boost is switched off (BST_ON bit = ‘0’), switching stops immediately and a passive
discharge, enabled on BSTOUT by default, occurs.
Output discharge can be disabled by setting BST_PDbit in Table 29. LDO56_VREF_PD_CR register.
Overvoltage protection – Boost converter has an overvoltage protection. If voltage on BSTOUT pin exceeds
VBSTOVP threshold, LXB pin stops switching immediately, and remains in high impedance state. If the overvoltage
condition lasts for more than tOVPDB_BST, boost is disabled, and BST_OVP interrupt is generated.
OVP event on BSTOUT also disables switches PWR_USB_SW and PWR_SW (if NVM_SWOUT_BOOST_OVP
is set in Table 70. NVM_LDOS_VOUT_SHR1).
Overcurrent protection – Boost implements low-side current sensor with peak current detector (IBSTLIM), and
high-side current sensor with short-circuit detector, (IBSTSH). If the overcurrent condition during HS phase lasts for
more than tOCPDB_BST, boost is disabled, and BST_OCP interrupt is generated.
Start-up sequence Boost start-up sequence consists of 2 phases:
•
Precharge phase - in this phase, bypass switch operates in “constant current source” mode and charges
boost output capacitor with constant IPRECH_BST current for tPRECH_BST duration. After this time, boost
output voltage is checked. If VBSTOUT > VPRECH =~ (VIN – 0.7 V), boost starts switching and proceeds to
soft-start phase, besides boost is immediately turned off and BST_OCP interrupt is generated
Note:
Boost load during precharge phase must be minimized, from this reason it is necessary to enable
PWR_USB_SW and PWR_SW after the boost soft-start is finished.
•
Soft-start phase – in this phase boost switches, the inrush current minimizes. Soft-start duration is tSS_BST
Figure 49. Boost start-up sequence
4.5.2
PWR_USB_SW and PWR_SW power switches
PWR_USB_SW is a 500 mA power switch dedicated to supply a USB port (VBUS voltage) and it is compatible
with USB OTG specifications. PWR_USB_SW input is internally connected to boost converter output (BSTOUT).
See Figure 48. Boost and switch block diagram.
Reverse current protection - VBUSOTG pin is a switch with a reverse current protection to prevent leakage
from VBUSOTG pin to BSTOUT or VIN when switch is OFF.
DS12792 - Rev 7
page 41/140
STPMIC1
Boost converter and power switches
Enable/disable – PWR_USB_SW can be enabled in POWER_ON state by I2C setting of VBUSOTG_ON bit
in Table 48. BST_SW_CR register. PWR_USB_SW switch cannot be enabled automatically during power-up
sequence. During power-down sequence, switch is turned OFF in RANK0 phase.
It is recommended that PWR_USB_SW is enabled only after boost converter works in steady-state (after boost
start-up sequence). This is typically ~2 ms after boost is enabled. Nevertheless, if PWR_USB_SW is enabled
earlier than Boost, it turns ON only when both boost is enabled by BST_ON bit and BSTOUT voltage is higher
than ~VIN.
Boost OVP – When boost OVP is detected PWR_USB_SW is disabled automatically.
VBUSOTG pin monitoring – When PWR_USB_SW is OFF, VBUSOTG voltage is monitored by VBUSOTG det.
to detect VBUS voltage rising/falling from USB OTG connector due to USB cable insertion/removal.
When voltage on VVBUSOTG pin goes higher than VVBUSOTG_Rise threshold, the interrupt and/or turn-ON condition
is generated. When voltage on VBUSOTG pin goes below than VVBUSOTG_Fall threshold, the interrupt is
generated. VBUSOTG pin monitoring is filtered by tVBUSOTGDB debounce timer for both rising and falling
voltage. VBUSOTG detector is enabled by default and can be disabled by setting VBUSOTG_DET_DIS bit
Table 48. BST_SW_CR register.
Soft-on/off –Switch implements soft-on, soft-off circuit. After the switch is enabled, switch starts operating in
“current limiting” mode, gradually increasing the output current limit until the switch is fully turned ON. This soft-on
phase has a duration defined by tSS_VBUSOTG
.
The same mechanism is also applied during switch soft-off phase during turn-off to prevent quick unloading of
BSTOUT and excessive voltage overshoot.
Overcurrent limitation – Switch implements 2 levels of overcurrent protection:
1.
When load on the output exceeds overcurrent limit threshold IVBUSOTGOCP, switch starts limiting the output
voltage to decrease output current. If the switch stays in this condition for more than tOCPDBSW, switch is
automatically turned OFF, and VBUSOTG_OCP interrupt generated.
2.
In case the output load exceeds IVBUSOTG_SH threshold, switch turns OFF immediately to prevent
boost overload, and VBUSOTG_SH interrupt is generated. Shortly after this action, switch is re-enabled
automatically with standard soft-on current limiting procedure. In case the overload condition is still present,
the switch continues operation in current limiting mode, and is finally switched OFF after tOCPDBSW. In case
overload condition is removed before tOCPDBSW, switch continues its normal operation.
For detailed behavior of the device on OCP event refer to Section 5.4.7 Overcurrent protection (OCP).
Output discharge – Switch implements passive discharge circuit (by default disabled) that can be enabled by
setting VBUSOTG_PD bit in Table 48. BST_SW_CR.
PWR_SW is a configurable 500 mA/1000 mA power switch that can be used to power supply one or two USB
host ports or for general purpose.
It has dedicated the input SWIN and the output SWOUT pin.
Minimum SWIN voltage to enable the switch is VSWIN_Rise
.
PWR_SW pin is a switch without reverse current protection. If voltage on SWOUT is higher than SWIN-0.7 V, a
leakage from SWOUT to SWIN occurs even if the switch is OFF.
Enable/disable – PWR_SW can be enabled in POWER_ON state by I2C setting of SWOUT_ON bit in
Table 48. BST_SW_CR. PWR_SW switch cannot be enabled automatically during power-up sequence. During
power-down sequence, switch is automatically turned OFF in RANK0 phase.
PWR_SW turns ON only when SWIN voltage is higher than VSWIN_Rise threshold.
If the switch is supplied by boost, it is recommended to enable the switch after boost is already in steady-state
with 5.2 V output. This is typically ~2 ms after boost is enabled.
Boost OVP – When boost OVP is detected, switch is ON by default. It is disabled automatically only if
NVM_SWOUT_BOOST_OVP bit is set.
SWOUT pin monitoring – When PWR_SW is OFF, SWOUT voltage is monitored by SWOUT detector.
When VSWOUT > VSWOUT_Rise, interrupt and turn-ON condition is generated. SWOUT detector is enabled by
default and can be disabled by setting SWOUT_DET_DIS bit in Table 30. SW_VIN_CR.
tSWOUTDB debounce timer is on SWOUT detector output.
SWIN pin monitoring – SWIN detector is disabled by default and can be enabled to monitor the voltage on SWIN
pin by setting SWIN_DET_EN bit in Table 48. BST_SW_CR.
When VSWIN > VSWIN_Rise, interrupt is generated.
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STPMIC1
Boost converter and power switches
tSWINDB debounce timer is on SWIN detector output.
Regardless SWIN detector is enabled or not, PWR_SW is enabled only if VSWIN > VSWIN_Rise
Note:
.
Soft-on/off – Switch implements soft-on, soft-off circuit. After the switch is enabled, switch starts operating in
“current limiting” mode, gradually increasing the output current limit until the switch is fully turned ON. This soft-on
phase has a duration defined by tSS_SWOUT
.
The same mechanism is also applied during switch soft-off phase during turn-off to prevent quick unloading of
SWIN and excessive voltage overshoot.
Overcurrent limitation – Switch implements 2 levelsof overcurrent protection:
1.
When load on the output exceeds overcurrent limit threshold ISWOUTOCP, switch starts limiting the output
voltage to decrease the output current. If the switch is in this condition for more than tOCPDBSW, switch is
automatically turned OFF, and SWOUT_OCP interrupt is generated.
2.
In case output load exceeds ISWOUT_SH threshold, switch turns OFF immediately to prevent boost overload,
and SWOUT_SH interrupt is generated. Shortly after this action switch is re-enabled automatically with
standard soft-on current limiting procedure. In case overload condition is still present, switch continues the
operation in current limiting mode, and is finally switched OFF after tOCPDBSW. In case overload condition is
removed before tOCPDBSW switch continues its normal operation.
For a detailed behavior of the device on OCP event refer to Section 5.4.7 Overcurrent protection (OCP).
Output discharge – Switch implements a passive discharge circuit (by default disabled) that can be enabled by
setting SWOUT_PD bit in Table 48. BST_SW_CR register.
SWOUT pin is bidirectional but does not support reverse current protection:
•
Output: PWR_SW is turned ON (using SW_ON bit = ‘1’) only if SWIN voltage is higher than SWIN_Rise
threshold; else, PWR_SW keeps OFF. The SWIN rising and falling edge voltage (respectively VSWIN_Rise
VSWIN_Fall thresholds) can be monitored by sending interrupt to host processor.
/
•
Input:
–
When PWR_SW is turned OFF (SW_ON bit = ‘0’), SWOUT pin monitors output voltage rising/falling by
sending interrupts to host processor. See VSWOUT_Rise / VSWOUT_Fall thresholds
–
When the STPMIC1 is in OFF (PWR_SW is implicitely turned OFF), SWOUT pin monitors a rising
voltage (SWOUT_Rise threshold) to generate power-up event. Refer to Section 5.4.2 Turn-ON
conditions.
•
PWR_SW has no reverse current protection voltage: SWIN should always be higher or equal to SWOUT
voltage to avoid reverse current flowing from SWOUT to SWIN
If PWR_SW switch is used to supply USB port from Boost converter (SWIN pin connected to BSTOUT
pin), then SWOUT_BOOST_OVP bit should be set in Table 70. NVM_LDOS_VOUT_SHR1 in order to
automatically turn OFF PWR_SW and clear SW_ON bit in case of boost OVP event occur. Reciprocally,
if PWR_SW is used as general-purpose power switch, SWOUT_BOOST_OVP bit should be clear in
Table 70. NVM_LDOS_VOUT_SHR1 in order to ignore boost OVP event. Reference to Section 5.4.8 BOOST
overvoltage protection.
Both of switches are controlled by VBUSOTG_ON / SWOUT_ON bit in Table 48. BST_SW_CR only. They
are always turned OFF when the STPMIC1 goes to POWER_ON (no NVM bit option to turn ON switches at
power-up) and are automatically turned OFF if the STPMIC1 POWER_DOWN.
Both of switches have a Pull_Down (PD) discharge resistor that is automatically enabled when switches are
turned OFF. PD discharge resistor can be disabled on PWR_USB_SW and PWR_SW by setting respectively
VBUSOTG_PD and SWOUT_PD bit in Table 48. BST_SW_CR register.
Both switches have overcurrent protection:
•
•
Safety features, see Section 5.4.7 Overcurrent protection (OCP).
An overcurrent detection can also be set as a turn-off condition – Section 5.4.7 Overcurrent protection
(OCP).
•
PWR_SW is selectable 500 mA/1000 mA power switch: overcurrent protection threshold is set by SW_OCP
bit in Table 48. BST_SW_CR.
PWR_USB_SW and PWR_SW switches (if SW_BOOST_OVP bit in Table 70. NVM_LDOS_VOUT_SHR1 is set)
are also disabled and their enable bits are cleared in case of boost OVP event.
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STPMIC1
USB sub-system examples
4.6
USB sub-system examples
The following Figure 50. Battery powered application with a USB OTG port and a USB host port,
Figure 51. Battery powered application with a single USB OTG port , and Figure 52. 5 V DC powered application
with a USB OTG port and two USB host ports show some typical USB sub-system configuration examples:
Figure 50. Battery powered application with a USB OTG port and a USB host port
On this example, a battery supplies the boost converter. When enabled, the boost converter generates a 5.2 V on
BSTOUT.
PWR_USB_SW output (VBUSOTG) is connected, in this example, to a USB Type-μAB connector (OTG). It can
alternatively be connected to a USB Type-C connector.
PWR_SW output (SWOUT) is connected, in this example, to a USB Type-A connector (USB host only). PWR_SW
input (SWIN) is connected to the output of boost converter (BSTOUT).
DS12792 - Rev 7
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STPMIC1
USB sub-system examples
Figure 51. Battery powered application with a single USB OTG port
On this example, a battery supplies a boost converter. When enabled, the boost converter generates a 5.2 V on
BSTOUT.
PWR_USB_SW output (VBUSOTG) is connected, in this example, to a USB Type-μAB connector (OTG). It can
alternatively be connected to a USB Type-C connector.
PWR_SW can be used as general purpose power switch in the application. Note that PWR_SW is functional
when SWIN is powered by VSWIN_Rise to 5.5 V.
DS12792 - Rev 7
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STPMIC1
USB sub-system examples
Figure 52. 5 V DC powered application with a USB OTG port and two USB host ports
In this example, the application is powered by a 5 V DC power source (eg: from 5 V AC/DC wall adaptor) and it
supplies a boost converter. When enabled, the boost converter generates a 5.2 V on BSTOUT.
PWR_USB_SW output (VBUSOTG) is connected, in this example, to a USB Type-μAB connector (OTG). It can
alternatively be connected to a USB Type-C connector.
PWR_SW output (SWOUT) is connected, in this example, to one or two USB Type-A connectors (USB host only).
PWR_SW input (SWIN) is connected to the output of the boost converter (BSTOUT).
In this example, the boost is used to regulate VBUS voltage at 5.2 V (to be compatible with USB specification
voltage range [4.75 V;5.5 V]) to compensate the power supply voltage losses (power supply voltage tolerance and
load regulation lose on the printed circuit board).
DS12792 - Rev 7
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STPMIC1
Functional description
5
Functional description
5.1
Overview
The STPMIC1 integrates advanced low power features controlled by the application processor through I²C, 4
digital control pins (PONKEYn, WAKEUP, PWRCTRL and RSTn) and one interrupt output line (INTn).
The main parameter settings can be programmed in a non-volatile memory (NVM) as default values at start-up
time.
See Section 5.5.2 Non-volatile memory (NVM)
The STPMIC1 offers 2 independent POWER_ON modes called MAIN and ALTERNATE. Switching between these
modes is driven by the application processor through PWRCTRL pin.
This allow a flexible configuration and fast transition between two different power strategies at application level,
typically RUN and STANDBY (LowPower).
Other features are provided to fulfill high-end application processors and advanced operating system needs:
•
•
•
•
•
•
Multiple turn-on/turn-off conditions
mask_default and restart_request options
Overcurrent and overvoltage protection
Thermal protection
Watchdog
Interrupt controller
5.2
Functional state machine
The behavior of the STPMIC1 circuit is controlled by a state machine described in this section.
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STPMIC1
Functional state machine
5.2.1
Main state machine diagram
Figure 53. STPMIC1 state machine
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STPMIC1
Functional state machine
5.2.2
State explanations
NO_SUPPLY
VIN is below VIN_POR_Fall - see Section 5.4.1 VIN conditions and monitoring. No output state can be guaranteed
in this state.
PRELOAD_NVM
State is immediately reached after VIN transition above VIN_POR_Rise
.
NVM download is performed in this state. (see Section 5.5.2 Non-volatile memory (NVM))
If automatic turn-on condition is set in NVM, AUTO_TURN_ON bit in Table 65. NVM_MAIN_CTRL_SHR,
transition is made to CHECK&LOAD, else to OFF-state. Refer to Section 5.4.2 Turn-ON conditions.
RSTn is asserted by the STPMIC1 and all regulators are off.
OFF
State is entered after PRELOAD_NVM from POR_VIN, or when a turn-OFF condition occurs from POWER_ON.
Transition to CHECK&LOAD state is made of any turn-ON condition. Refer to Section 5.4.3 Turn-OFF conditions
and restart_request.
RSTn is asserted by the STPMIC1 and all regulators are OFF.
LOCK_OCP
This state is an alternative to OFF-state in the context of overcurrent protection safety feature.
This state occurs if an overcurrent has been detected and LOCK_OCP bit has been set in
Table 65. NVM_MAIN_CTRL_SHR register.
As soon as an overcurrent is detected from any regulator, the STPMIC1 immediately performs a POWER_DOWN
sequence and goes permanently to LOCK_OCP state (passing through OFF-state). LOCK_OCP_FLAG internal
bit is set to prevent state machine from leaving LOCK_OCP state.
LOCK_OCP_FLAG bit can only been reset by VIN_POR_Fall (removing application power supply source)
and optionally by a PONKEYn long key press if PKEY_CLEAR_OCP_FLAG bit has been set in
Table 31. PKEY_TURNOFF_CR.
Refer to Section 5.4.7 Overcurrent protection (OCP) for further details.
RSTn is assert by the STPMIC1 and all regulators are off.
CHECK&LOAD
This state is a combination of three initialization steps in this order:
•
CHECK_TEMP: The STPMIC1 starts a thermal monitoring and control that junction temperature (Tj) is in
functional range before going to next state. Refer to Section 5.4.6 Thermal protection.
•
•
LOAD_NVM: The STPMIC1 performs a load of the NVM, initializing related registers to their default state.
CHECK_VIN: The STPMIC1 starts VIN monitoring and control that the applied VIN is in functional range
before going to next state. Refer to Section 5.4.1 VIN conditions and monitoring for details. RSTn is
asserted by the STPMIC1 and all regulators are off.
POWER_UP
The STPMIC1 sequentially starts regulators following a rank procedure. Refer to Section 5.3 POWER_UP,
POWER_DOWN sequence for detailed description. RSTn is asserted by the STPMIC1.
POWER_ON
RSTn is released and monitored (digital input) by the STPMIC1. RSTn signal can be driven externally by the
application processor or a reset push-button.
The STPMIC1 delivers by default the power as per configuration in main mode, through Section 6.3.1 Main
control register (MAIN_CR) registers of each regulator.
The STPMIC1 can optionally switch to ALTERNATE mode, controlled by the application processor through
PWRCTRL pin. As described in Section 5.4.5 Power control modes (MAIN / ALTERNATE) for details.
The STPMIC1 exits POWER_ON state if:
•
•
A turn-OFF condition occurs. See Section 5.4.3 Turn-OFF conditions and restart_request
RSTn is asserted by the application processor. See Section 5.4.4 Reset and mask_reset option
POWER_DOWN
The STPMIC1 sequentially stops regulators following the rank procedure in reverse order than POWER_UP.
Refer to Section 5.3 POWER_UP, POWER_DOWN sequence for a more detailed description.
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STPMIC1
POWER_UP, POWER_DOWN sequence
5.3
POWER_UP, POWER_DOWN sequence
The STPMIC1 starts and stops regulators following sequential rank procedures called respectively POWER_UP
and POWER_DOWN.
During POWER_UP each regulator is started at one of the 4-rank phase programmed in NVM.
RANK0 means that the regulator is not started.
Default rank is defined:
For BUCKs: Section 6.7.2 NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR)
For LDO1, 2, 3, 4: Section 6.7.3 NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1)
For LDO5, 6, REFDDR: Section 6.7.4 NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2)
Default voltage is defined:
For BUCKs: Section 6.7.5 NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR)
For LDO1, 2, 3, 4: Section 6.7.6 NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1
For LDO5, 6, REFDDR: Section 6.7.7 NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2)
During POWER_DOWN regulators are shutdown in reverse order than POWER_UP.
Figure 54. STPMIC1 POWER_UP and POWER_DOWN sequence example shows an example of power cycle.
Figure 54. STPMIC1 POWER_UP and POWER_DOWN sequence example
Enable Buck2
Turn_ON condition
Turn_OFF condition
by I²C
CHECK&
LOAD
POWER_UP
RANK1 RANK2 RANK3
POWER_DOWN
rst RANK0 RANK3 RANK2 RANK1
STPMIC1 State OFF
POWER_ON
OFF
100 µs
6.7ms
3 ms
3 ms
3 ms
3 ms
3 ms
3 ms
3 ms
RSTn
BUCK3 (Rank1)
ENA bit
BUCK1 (Rank2)
ENA bit
LDO4 (Rank3)
ENA bit
BUCK2 (Rank0)
ENA bit
POWER_UP
The STPMIC1 enables regulators sequentially by 3 ms slots:
RANK1 (BUCK3) -> RANK2 (BUCK1) -> RANK3 (LDO4) regulators, this sequence example is related to the
STPMIC1.
RANK0 regulators (eg BUCK2) are not started.
RSTn is asserted by the STPMIC1 until all regulators on. Then it deasserts RSTn and switches to POWER_ON
as soon as RSTn is deasserted by the application processor (RSTn signal goes high).
POWER_ON:
Regulator state and output voltage are driven by settings to registers MAIN or ALTERNATE control registers.
Those registers are by default initialized with values programmed in NVM and can then be changed through I²C.
In the example, BUCK2 (RANK0) is enabled by I²C.
POWER_DOWN:
The STPMIC1 asserts RSTn and immediately shutdowns RANK0 regulators which may have been started by
software. (BUCK2 in upon example).
Then it disables regulators sequentially in rank reverse order by 3 ms slots:
RANK3 (LDO4) -> RANK2 (BUCK1) -> RANK1 (BUCK3)
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STPMIC1
Feature description
The example above shows POWER_UP and POWER_DOWN procedure from digital point of view (ENA bit of
each regulators); but not their respective output voltage (analog).
Regarding to analog behavior of each regulator, please refer to Section 4 Power regulators and switch
description.
5.4
Feature description
5.4.1
VIN conditions and monitoring
Main input supply named VIN is monitored permanently by the STPMIC1 state machine. There are different
threshold triggers on VIN. The lowest to the highest thresholds are: POR_VIN, VINOK, VINLOW as presented in
the Figure 55. VIN monitoring thresholds.
Figure 55. VIN monitoring thresholds
VINLOW_Fall
VINLOW_HYST
VINLOW_Rise
VINOK_Rise
NVM
(
)
VINOK_HYST(NVM)
VINLOW_TRESH
VINOK_Fall
VIN_POR_Rise
200mv
VIN_POR_Fall
VIN
VINLOW_RI Interrupt
VINLOW_FA Interrupt
POR_VIN
POR_VIN is the minimum voltage required to supply the STPMIC1 internal circuitry. It is specified by two
hardcoded thresholds with 200 mv hysteresis:
•
•
Below VIN_POR_Fall STPMIC1 is considered as not supplied
Above VIN_POR_Rise STPMIC1 internal circuitry is functional
Refer to Section 3.4 Electrical and timing parameters for threshold value.
VIN_OK
VIN_OK is the minimal voltage required to allow the STPMIC1 to work in POWER_ON state.
It is specified by VINOK_Rise threshold and VINOK_HYST hysteresis values that can be adjusted in NVM,
respectively by VINOK_TRESH[1:0] and VINOK_HYS[1:0] bits in Table 65. NVM_MAIN_CTRL_SHR.
•
If VIN falls below VINOK_Fall (VINOK_Fall = VINOK_Rise – VINOK_HYST) then it is considered as a turn-OFF
condition and the STPMIC1 immediately starts POWER_DOWN sequence. Refer to Section 5.4.3 Turn-
OFF conditions and restart_request.
•
If VIN rises above VINOK_Rise then the STPMIC1 is allowed to go to POWER_ON state after a turn-ON
condition has occurred. Refer to Section 5.4.2 Turn-ON conditions
VINLOW
VINLOW is an optional and configurable software threshold that can be setup to notify the application processor
through interrupt, that a power shutdown, due to VIN going low, is a possible risk.
VINLOW can be enabled and configured by programming register Section 6.3.6 PWR_SWOUT and VIN control
register (SW_VIN_CR).
VINLOW rising and falling thresholds are defined by a logical signal point of view. VINLOW signal goes to ‘1’
(rising edge) when VIN decreases VINLOW_Rise threshold. VINLOW falling edge occurs when VIN goes above
VINLOW_Fall threshold.
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STPMIC1
Feature description
VINLOW_Rise and VINLOW_Fall detection generate respectively VINLOW_RI and VINLOW_FA interrupt in
INT_PENDING_R4, allowing application processor to take relevant actions. They can be unmasked
independently.
Refer to Section 6.5 Interrupt registers.
5.4.2
Turn-ON conditions
Turn-ON means the STPMIC1 reaches POWER_ON state from NO_SUPPLY or OFF-state.
The STPMIC1 is turned ON on four conditions.
Three conditions are triggered by an external stimulation:
•
•
•
PONKEYn pin detection
VBUS detection (voltage rising on VBUSOTG or SWOUT pins)
WAKEUP pin detection
Last condition is triggered by AUTO turn-ON feature (see below).
When in POWER_ON, the last turn-ON condition is stored and can be read in Section 6.2.1 Turn-ON status
register (TURN_ON_SR) register.
AUTO turn-ON
AUTO turn-ON feature allows the STPMIC1 to be turned ON automatically as soon as VIN rises above a valid
voltage. See Section 5.4.1 VIN conditions and monitoring .
After VIN rises above VINOK_Rise, the STPMIC1 goes to PRELOAD_NVM state and load AUTO_TURN_ON bit
from NVM. If AUTO_TURN_ON is set, the STPMIC1 goes directly into CHECK&LOAD then goes to POWER_UP
and to POWER_ON.
AUTO turn-ON event is triggered only by NO_SUPPLY state transition.
AUTO turn-ON is enabled by default in NVM and can be disabled by resetting AUTO_TURN_ON bit in
Table 65. NVM_MAIN_CTRL_SHR register.
Details of the sequence are described in the Figure 56. Auto turn-on condition sequence.
Figure 56. Auto turn-on condition sequence
VINOK_Rise
VIN_POR_Rise
PRE CHECK&
LOAD LOAD
NO_SUPPLY
POWER_UP
POWER_ON
ms
>7
RSTn
AUTO_TURN_ON=1
PONKEY/VBUS/WAKEUP detection
Those 3 conditions depend on stimulation on the specific STPMIC1 pins. The source and electrical characteristics
of each condition are described in Table 11. Turn-on description.
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STPMIC1
Feature description
Table 11. Turn-on description
Turn-ON
condition
source
Active condition
description
Name
Configuration
Debounce
30 ms
Interrupt
PONKEYn
pin
PKEY_RI/PKEY_FA in
INT_PENDING_R1
PONKEY
N/A
Active low
Can be disable by
settingVBUSOTG_DET_DIS bit
in Table 48. BST_SW_CR
VBUSOTG_RI/
VBUSOTG_FA in
INT_PENDING_R1
VBUS
(VBUSOTG)
VBUSOTG
pin
VBUSOTG >
VBUSOTG_Rise
30 ms
Can be disable by setting
SWOUT_RI/
SWOUT_FA in
INT_PENDING_R1
VBUS
(SWOUT)
SWOUT >
SWOUT_Rise
SWOUT pin
30 ms
SWOUT_DET_DIS bit in
Table 30. SW_VIN_CR
WKP_RI/WKP_FA
in
No
debounce
WAKEUP
WAKEUP pin
N/A
Active high
INT_PENDING_R1
The STPMIC1 manages 2 different scenarios depending if the turn-ON condition is active before or after VIN rises
above VIN_POR_Rise
.
Active Turn-ON condition after VIN rises above VIN_POR_Rise sequence is presented in Figure 57. Turn-on
condition after VIN_POR_RISE
.
Figure 57. Turn-on condition after VIN_POR_RISE
t1: VIN rises above VIN_POR_Rise while no turn-ON condition is detected active. The STPMIC1 performs the
PRELOAD_NVM and swiches to OFF-state.
t2: the STPMIC1 starts detecting the activity on turn-ON condition but the detection threshold above is not stable.
t3: turn-ON signal has been detected stable longer than debounce time. Turn-ON event triggered. Switch to
CHECK&LOAD then POWER_UP as VIN > VINOK_Rise
.
t3 to t4: turn-ON conditions are ignored from CHECK&LOAD to POWER_ON.
t4: turn-ON condition is ignored and does not affect the usual STPMIC1 behavior in POWER_ON. (Except
PONKEY long key press. See Section 5.4.3 Turn-OFF conditions and restart_request). Active turn-ON signal
does not prevent from POWER_DOWN.
t5: active turn-OFF condition event occurs from a valid source. Switch to POWER_DOWN.
t5 to t6: active turn-ON during POWER_DOWN is ignored.
t7: New turn-ON signal rising edge has been detected after debounce time. A valid turn-ON condition is detected.
The STPMIC1 switches to POWER_UP.
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STPMIC1
Feature description
Active turn-ON condition before VIN rises above VIN_POR_Rise sequence is presented in Figure 58. Turn-on
condition before VIN_POR_Rise
.
Figure 58. Turn-on condition before VIN_POR_Rise
t1: VIN rises above VIN_POR_RISE while a turn-ON condition is detected active. The STPMIC1 performs the
PRELOAD_NVM and swiches to OFF-state.
t2: the STPMIC1 starts debounce as soon as it is entered OFF-state.
t3: turn-ON condition is confirmed after debounce time. Switch to CHECK&LOAD then POWER_UP as VIN >
VINOK_Rise
.
t3 to t4: turn-ON conditions are ignored from CHECK&LOAD to POWER_ON.
t4: turn-ON condition is ignored and does not affect usual STPMIC1 behavior in POWER_ON. (Except PONKEY
long key press. See Section 5.4.3 Turn-OFF conditions and restart_request)
Active turn-ON signal does not prevent from POWER_DOWN.
t5: active turn-OFF condition event occurs from a valid source. Switch to POWER_DOWN.
t5 to t6: Active turn-ON during POWER_DOWN is ignored.
t7: New turn-ON signal rising edge has been detected after debounce time. Valid turn-ON condition detected. The
STPMIC1 switches to POWER_UP.
5.4.3
Turn-OFF conditions and restart_request
Turn-OFF conditions are events or stimulus leading the STPMIC1 to go to OFF-state from a POWER_ON state,
by switching through a POWER_DOWN sequence.
The STPMIC1 is turned OFF by six conditions presented in Table 12. Turn-off conditions.
Some turn-OFF conditions support restart_request option that allows the STPMIC1 to perform a power cycle back
to POWER_ON instead of going to off-state (POWER_DOWN/CHECK&LOAD/POWER_UP) without waiting for a
valid turn-ON condition restarts.
Turn-OFF condition with restart_request option has a similar behavior as a reset power cycle except that
mask_reset option is ignored. Refer to Section 5.4.4 Reset and mask_reset option
restart_request option can be enabled by setting RREQ_EN bit in Table 25. MAIN_CR register, prior to turn-OFF
condition occurrence.
Table 12. Turn-off conditions
Power cycle if
Name
Conditions
RREQ_EN=1
Software switch-
OFF
Writing 1 to SWOFF bit in Table 25. MAIN_CR register
PKEYLKP bit set in Table 31. PKEY_TURNOFF_CR
YES
PONKEYn long
key press
YES
DS12792 - Rev 7
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STPMIC1
Feature description
Power cycle if
RREQ_EN=1
Name
Conditions
Default value loaded by PKEYLKP_OFF bit in
Table 65. NVM_MAIN_CTRL_SHR
Request duration for the long key press defined in PKEY_LKP_TMR[3:0] in
Table 31. PKEY_TURNOFF_CR
PONKEYn signal is asserted for a duration > PKEY_LKP_TMR[3:0]
STPMIC1 always restart
automatically whatever
restart_request option.
STPMIC1 functional temperature is exceeded. Refer to
Section 5.4.6 Thermal protection
Thermal shutdown
Overcurrent
protection
STPMIC1 detects overcurrent on a regulator. Refer to
Section 5.4.7 Overcurrent protection (OCP)
NO
Watchdog feature active and downcounter reach 0. Refer to
Section 5.4.9 Watchdog feature
Watchdog
YES
VIN falls down under VIN_OK_Fall threshold.
YES only if VIN remains
above POR_VIN_Fall
VIN_OK_Fall
Depending on VIN decrease speed, proper execution of POWER_DOWN
operation is not guaranteed
Last turn-OFF condition is stored in Table 20. TURN_OFF_SR.
If restart_request is set, power cycle source is stored in Table 23. RESTART_SR register.
5.4.4
Reset and mask_reset option
RSTn is bidirectional reset pin both for the STPMIC1 and the application processor. It is digital input / open drain
output topology with internal pull-up resistor.
•
When the STPMIC1 asserts RSTn, it drives RSTn signal low (open drain internal transistor). Application
processor is forced in reset state
•
When the STPMIC1 does not assert RSTn, RSTn pin is in high impedance and RSTn signal goes high
(thanks to pull-up resistor) if RSTn signal is not asserted low externally (eg: by a reset push button or from
application processor asserting the reset signal low). In that case, the STPMIC1 RSTn pin becomes digital
input and it monitors RSTn signal
In POWER_ON state, RSTn pin can be driven by the application processor or a reset push-button.
If the application processor asserts RSTn low more than RSTnDB duration, it triggers immediately a reset
sequence of the STPMIC1 by performing a non-interruptible power cycle:
1.
2.
3.
4.
5.
6.
The STPMIC1 asserts RSTn low (forcing AP to keep it in case reset is deasserted by AP)
POWER_DOWN sequence
LOAD&CHECK
POWER_UP sequence
STPMIC1 deasserts RSTn and monitor RSTn
STPMIC1 waits for RSTn signal going high before entering POWER_ON. (To prevent infinite loop of reset
sequence)
LDOs and Bucks follow POWER_DOWN / POWER_UP power cycle from leave state to default one, except if
mask_reset option is specified.
mask_reset option can be defined for each regulator by setting the corresponding MRST bit in corresponding
MRST_CR register.
Eg for BUCK3 : MRST_BUCK3 in Table 32. BUCKS_MRST_CR.
When mask_reset option is set by a regulator, it means that MAIN and ALTERNATE related register do not
change during and after the reset power cycle:
•
•
POWER_DOWN is not performed
MAIN and ALTERNATE register values are not reloaded by NVM and are not reset
The STPMIC1 always ends the power cycle in POWER_ON MAIN mode. (PWRCTRL pin configuration reset).
If reset happens in MAIN mode, the regulator is not impacted at all, keeping VOUT, ENA and PREG_MODE
unchanged.
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STPMIC1
Feature description
In case reset happens in ALTERNATE mode, VOUT, ENA and PREG_MODE switch to content of the
[regulator]_MAIN_CR register values.
Figure 59. Reset power-cycle sequence below shows an example of a reset power-cycle on the STPMIC1.
Figure 59. Reset power-cycle sequence
Enable Buck2
RSTn Low by AP
by I²C
CHECK&
LOAD
POWER_DOWN
rst RANK0 RANK3 RANK2 RANK1
POWER_UP
RANK1 RANK2 RANK3
POWER_ON
POWER_ON
STPMIC1 State
RSTn
BUCK3 (Rank1)
mask_reset
BUCK1 (Rank2)
LDO4 (Rank3)
BUCK2 (Rank0)
27,8ms
mask_reset is a single shot option, cleared by Turn-OFF, POR_VIN and reset.
BUCK3 with mask_reset option set, is not impacted by reset power-cycle.
BUCK1 and LDO4 are powered down and up at their respective rank defined in NVM.
BUCK2, enabled by I2C is power down but not restarted.
5.4.5
Power control modes (MAIN / ALTERNATE)
In order to address implementation of low power platform, the STPMIC1 supports two independent and
configurable modes for POWER_ON state. For all regulators, settings enable (ENA), output voltage (VOUT)
and regulation mode (PREG_MODE) can be defined for each mode. With the following exceptions due to some
regulator specificities:
•
•
•
REFDDR provides ENA only
LDO3 also provides BYPASS mode bit
LDO4 also provides input source selector bits
Default MAIN mode has to be applied to full load applications, typically RUN mode of application processor.
ALTERNATE mode has to be used when the application processor enters low power mode, typically STANDBY
mode. Switch between MAIN and ALTERNATE, can be controlled by the application processor through
PWRCTRL pin.
•
•
MAIN mode corresponds to “inactive state” of PWRCTRL pin
ALTERNATE mode corresponds to “active state” of PWRCTRL pin
PWRCTRL pin detection can be enabled and its polarity configured through respectively PWRCTRL_EN and
PWRCTRL_POL bits in Table 25. MAIN_CR register.
PWRCTRL pin detection is always disabled by default (PWRCTRL_EN bit clear by turn-OFF and reset), as a
consequence POWER_ON mode is always MAIN by default.
In each mode, MAIN or ALTERNATE, the STPMIC1 applies the settings indicated in the regulator (Rx) related
register, [Rx]_MAIN_CR for MAIN and [Rx]_ALT_CR, for ALTERNATE.
If Buck converter has different output voltage settings between MAIN and ALTERNATE register, a smooth voltage
transition is applied during MAIN to ALTERNATE (and reciprocally) as described in Figure 47. BUCKx dynamic
voltage scaling (DVS).
Please refer to Section 4 Power regulators and switch description for details on voltage scale up and down
procedure for each regulator and switche.
Figure 60. Power mode switch sequence example is an example of the STPMIC1 transition with settings available
in Table 13. MAIN/ALTERNATE switch example configuration and where PWRCTRL is set as active low.
DS12792 - Rev 7
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STPMIC1
Feature description
Table 13. MAIN/ALTERNATE switch example configuration
Regulator
MAIN setting
ALTERNATE setting
Register value
ENA=1
ENA=1
BUCKx_MAIN_CR=0x61
BUCKx_ALT_CR=0x33
BUCKz(z=1..4)
VOUT=1.2 V,
VOUT=0.9 V
PREG_MODE=HP
PREG_MODE=LP
ENA=1
ENA=0,
BUCKy_MAIN_CR=0xD9
BUCKy(y=1..4)
LDOx(x=1,2,5,6)
VOUT=3.3 V
VOUT=3.3 V
BUCKy_ALT_CR=0xD8(or 0x00)
PREG_MODE=HP
PREG_MODE=HP
ENA=1
ENA=0
LDOx_MAIN_CR=0x27
VOUT=1.8
VOUT=1.8
LDOx_ALT_CR=0x26 (or 0x00)
Figure 60. Power mode switch sequence example
POWER_ON
MAIN MODE
ALTERNATE MODE
MAIN MODE
PWRCTRL
ΔVOUTz x SR(BUCK
ΔVOUTz x SR(BUCK
Z)
Z)
1.2 V
0.9 V
VOUTz (Buck z)
VOUTy (Buck y)
tSD (BUCK
tSS = ΔVOUTy x SR(BUCK
Y)
y)
3.3 V
tSU (BUCK
y)
0.2 V
0 V
tSD (LDO x)
tSS = ΔVLDOxOUT x SR(LDO
X)
1.8 V
VLDOxOUT (LDO x)
0.2 V
0 V
5.4.6
Thermal protection
The STPMIC1 implements a thermal protection to prevent over heating damage.
Junction temperature is permanently monitored thanks to an embed cell.
Protection consists of 2 thresholds :
•
•
Thermal shutdown threshold (TSHDN), which turns off the STPMIC1
Thermal warning threshold (TWRN), which generates an interrupt to be handled by the application processor
Figure 61. Thermal protection thresholds represents the distribution of those thresholds along the temperature
curve.
When the temperature rises above TSHDN_Rise, the STPMIC1 starts a rank down and goes to CHECK&LOAD
state.
If temperature decreases and comes back lower than TSHDN_Fall, the STPMIC1 restarts automatically with
POWER_UP sequence.
In order to allow the application processor to anticipate TSHDN_Rise shutdown and take relevant actions, interrupts
THW_RI and THW_FA are generated when the temperature rises above TWRN_Rise and falls down TWRN_Fall.
Refer to Section 6.5 Interrupt registers about the interruption management.
DS12792 - Rev 7
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STPMIC1
Feature description
Figure 61. Thermal protection thresholds
TSHDN_Rise
TSHDN_Fall
TWRN_Rise
TWRN_Fall
T°
THW_RI Interrupt
THW_FA Interrupt
5.4.7
Overcurrent protection (OCP)
The STPMIC1 implements protection against short-circuit (SC) or overcurrent (OC) on all regulators output.
The STPMIC1 supports 3 levels of protection described in Table 14. OCP levels below.
Table 14. OCP levels
LOCK_OCP OCPOFF
Protection
STPMIC1 behavior
level
(NVM)
[Rx] bit
This is the default mode.
When SC/OC occurs on regulator Rx :
•
For LDOs and bucks: if current rises above defined tresholds, an automatic
current limitation is activated. Refer to Section 4.2 LDO regulators and
Section 4.4.1 BUCK general description for details
•
•
For BOOST refer to Section 4.5.1 Boost converter
Level 0
0
0
For switches: Refer to PWR_USB_SW and PWR_SW power switches
Note: In case of a sharp increase of the current, the boost overcurrent protection may
react earlier than switch.
•
For all: all interrupts are generated by setting corresponding [Rx]_OCP bit of
INT_PENDING_R2 or INT_PENDING_R3.
(see Section 6.5 Interrupt registers)
The STPMIC1 is in POWER_ON state.
By setting OCPOFF[Rx] bit Section 6.3.12 Bucks OCP turn-OFF control register
(BUCKS_OCPOFF_CR) or Section 6.3.13 LDO OCP turn-OFF control register
(LDOS_OCPOFF_CR) registers, an OC on related Rx becomes a turn-OFF condition.
(see Section 5.4.3 Turn-OFF conditions and restart_request
The STPMIC1 starts a POWER_DOWN sequence.
RREQ_EN bit is ignored in case OCP turn-OFF.
Level 1
0
1
The STPMIC1 is in OFF-state until a valid turn-ON condition.
Regulator that caused the OCP turn-OFF can be identified with a
corresponding bit set in overcurrent protection LDO turn-OFF status register
(Section 6.2.3 Overcurrent protection LDO turn-OFF status register
(OCP_LDOS_SR)) or Section 6.2.4 Overcurrent protection buck turn-OFF status
register (OCP_BUCKS_BSW_SR)
NVM_LOCK_OCP (Section 6.7.1 NVM main control shadow register
(NVM_MAIN_CTRL_SHR) bit 0) is set.
Level 2
1
x
This level 2 concerns all regulators. OCPOFF[Rx] bits are ignored.
If SC/OC occurs on any regulators, the STPMIC1 enters POWER_DOWN to finally
goes into LOCK_OCP state
DS12792 - Rev 7
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STPMIC1
Programming
LOCK_OCP OCPOFF
(NVM) [Rx] bit
Protection
level
STPMIC1 behavior
The STPMIC1 is kept forced in LOCK_OCP state (see Figure 53. STPMIC1 state
machine) until internal LOCK_OCP_FLAG is released by V or optionally
IN_POR_Fall
by PONKEYn long key press, if enabled by setting PKEY_CLEAR_OCP_FLAG bit in
Table 31. PKEY_TURNOFF_CR register
5.4.8
5.4.9
BOOST overvoltage protection
See Section 4.5.1 Boost converter.
Watchdog feature
The STPMIC1 offers a watchdog mechanism that triggers a turn-OFF condition when the watchdog down counter
elapses.
Watchdog is disabled by default and it is enabled if WDG_ENA bit is set in Section 6.3.10 Watchdog control
register (WDG_CR).
The watchdog timer downcounter can be set in a range from 1 s to 256 s by 1 s step in Section 6.3.11 Watchdog
timer control register (WDG_TMR_CR).
Watchdog counter is reset by setting WDG_RST bit in Section 6.3.10 Watchdog control register (WDG_CR) and
when setting WDG_ENA from 0 to 1.
When enabled the watchdog timer remains active regardless MAIN or ALTERNATE mode. Watchdog is disabled
by reset, VIN_POR_Fall and turn-OFF.
5.5
Programming
2
5.5.1
I C interface
I2C interface works in slave mode. It supports both standard and fast mode with data rate up to 400Kb/s. It
supports also fast mode plus (FM+) with data rate up to 1Mb/s that is suitable frequency for DVS operations.
Please refer to NXP UM10204 revision 5 for specifications.
SCL pin is the input clock used to shift data. SDA pin is the input/output bi-directional data.
Device ID
There is a device ID system to address the STPMIC1.
The address is stored into NVM_I2C_ADDR[6:0] bits in Section 6.7.8 NVM device address shadow register
(I2C_ADDR_SHR). Default address is 0x33.
Table 15. Device ID format
b7
b6
b5
b4
b3
b2
b1
b0
AdrID6
AdrID5
AdrID4
AdrID3
AdrID2
AdrID1
AdrID0
R/W
Read/write operation
Each transaction is composed of a start condition followed by a number of packet number (8-bit long)
representing either a device ID plus R/W command or register address or register data coming to/from slave
Table 15. Device ID format. An acknowledgment is needed after each packet. This acknowledgment is given
by the receiver of the packet. Transaction examples are given in Table 16. Register address format and
Table 17. Register data format. Multi read and multi write operations are supported.
Table 16. Register address format
b7
b6
b5
b4
b3
b2
b1
b0
RegADR7
RegADR6
RegADR5
RegADR4
RegADR3
RegADR2
RegADR1
RegADR0
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STPMIC1
Programming
Table 17. Register data format
b7
b6
b5
b4
b3
b2
b1
b0
DATA7
DATA6
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
Figure 62. I2C read operation
Figure 63. I2C write operation
5.5.2
Non-volatile memory (NVM)
General description
The STPMIC1 built-in non-volatile memory provides a high flexibility to support a wide range of applications:
Its straightforward write management through I2C allows customizing the STPMIC1 directly in final applications
during the product development and mass production.
The NVM is composed of 64 bits customizable parameters (accessible from shadow registers):
•
BUCKs and LDOs regulators:
–
–
Output voltage: to set the default output voltage at POWER-UP
POWER-UP sequence order: RANK regulator starts
•
General:
–
–
–
–
AUTO_TURN_ON: to power up the STPMIC1 automatically when the input voltage rises
VINOK_RISE threshold voltage: to select right power-up voltage
VINOK_HYST hysteresis voltage: to trigger power-down in case of VIN drop
LOCK_OCP: overcurrent protection bit that blocks the STPMIC1 in LOCK_OCP state in case of
short-circuit or overload detection
–
–
PONKEY long key press functionality – can be configured to reset device
I²C slave address
NVM read operation is performed automatically before each POWER_UP sequence to set control registers with
default values and configure POWER_UP and POWER_DOWN sequence.
NVM write operation can be performed several times at product level to:
1.
Customize a pre-programmed device directly from application host processor via I²C interface
(STPMIC1A,STPMIC1B, STPMIC1D and STPMIC1E)
2.
To program a non-programmed device (STPMIC1C) into a final application by connecting a I2C host
programmer to the product via JIG tester
NVM macrocell is designed to provide high reliability: it is composed of complementary memory approach with
two cells per bit (one direct cell and one complementary cell) and during each read operation, NVM controller
check NVM content integrity. If integrity check fails, the STPMIC1 does not start up.
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STPMIC1
Programming
NVM read operation
NVM read operation is fully managed by the STPMIC1.
For each read operation, the STPMIC1 automatically loads the 64-bit NVM content into NVM shadow registers
(see Table 64. NVM shadow register map ). It means that shadow register content is a copy of NVM content.
When the STPMIC1 power supply is connected (VIN > VPOR_VIN_Rise), the STPMIC1 state machine goes to
PRELOAD_NVM state (see Section 5.2 Functional state machine). In this state, a NVM read operation is
performed to check if the STPMIC1 should start up automatically depending on AUTO_TURN_ON NVM bit value.
If AUTO_TURN_ON bit is not set, the STPMIC1 goes to OFF-state; else the STPMIC1 continues automatically by
power-up procedure.
Before each POWER_UP procedure, NVM read operation is performed in CHECK&LOAD state. NVM content is
loaded into shadow registers. Additionally, the STPMIC1 initializes BUCK and LDO control registers with values
pre-defined in NVM (see Table 64. NVM shadow register map ) and configure POWER_UP and POWER_DOWN
sequence of regulators.
NVM write operation (STPMIC1 customization)
NVM write operation can be performed multiple times (see NVMEND) by I2C interface.
NVM write operation generic sequence:
1.
2.
3.
Apply VIN to the application: STPMIC1 goes to POWER_ON state(1)
Write NVM shadow registers with expected customization values
Initiate a “NVM program operation” command - write NVM_CMD[1:0] = ‘01’ in Section 6.6.2 NVM control
register (NVM_CR)
4.
5.
Wait for NVM write operation to be completed: wait for NVM_BUSY becomes 0 in Table 62. NVM_SR
(Optional): check new NVM content by initiating a NVM read operation: write NVM_CMD[1:0] = ‘10’ and wait
for NVM_BUSY becomes 0
1. The STPMIC1 has AUTO_TURN_ON bit set by default to power up automatically. This is to allow NVM write operation
without generating turn-ON conditions.
The following conditions should be fulfilled to allow NVM write operation:
•
•
VIN must be minimum 3.8 V
The STPMIC1 must be in POWER_ON state (NVM write operation is ignored in OFF-state)
Writing into NVM shadow registers does not affect NVM content until NVM write operation is executed.
WARNING: If VIN goes below 3.8 V during write operation, NVM content integrity may be corrupted and the
STPMIC1 may not start up anymore.
Change of I2C address
Special attention must be given when new I2C address needs to be programmed.
When different I2C address is written in Section 6.7.8 NVM device address shadow register (I2C_ADDR_SHR),
this new address becomes effective immediately and next I2C transaction must already use this new device
address.
If a “NVM write operation” is not performed following I2C address change in shadow register, previously
programmed I2C address is loaded from NVM during next POWER_UP sequence.
DS12792 - Rev 7
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STPMIC1
Register description
6
Register description
6.1
User register map
Registers are all default down to 0 at VIN_POR_Fall
.
Default value in the table below represents values at POWER_ON when application processor can access I2C
registers.
Value ‘x’ represents:
•
•
Read/write bits loaded by NVM
Read bit status depending on previous operation or event
It is important to highlight that all bits marked "reserved" (-) must be written 0 (reset value). So a read / modify /
write operation into a register is allowed if "reserved" bits are not modified.
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STPMIC1
User register map
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STPMIC1
User register map
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STPMIC1
User register map
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STPMIC1
User register map
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STPMIC1
User register map
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STPMIC1
User register map
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STPMIC1
Status registers
6.2
Status registers
6.2.1
Turn-ON status register (TURN_ON_SR)
Table 19. TURN_ON_SR
7
reserved
R
6
reserved
R
5
reserved
R
4
AUTO
R
3
SWOUT
R
2
VBUS
R
1
WKUP
R
0
PKEY
R
Address: 0x01
Type: read register only
Default: b000x_xxxx where x depends on turn-ON condition
Description: turn-ON status register. This register stores last condition, which has turned ON the STPMIC1.
Register is set during CHECK&LOAD state following the turn-ON condition.
It is not refreshed or default by restart and default power cycle.
[7 :5]
[4]
Reserved
AUTO: STPMIC1 has automatically turned ON on VIN rising.
0: False
1: True
SWOUT: last Turn-ON condition was VBUS detection on SWOUT pin.
[3]
[2]
[1]
[0]
0: False
1: True
VBUS: last Turn-ON condition was VBUS detection on VBUSOTG pin
0: False
1: True
WKUP: last Turn-ON condition was WAKEUP pin detection
0: False
1: True
PKEY: last Turn-ON condition was PONKEYn detection
0: False
1: True
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STPMIC1
Status registers
6.2.2
Turn-OFF status register (TURN_OFF_SR)
Table 20. TURN_OFF_SR
7
reserved
R
6
reserved
R
5
PKEYLKP
R
4
WDG
R
3
OCP
R
2
THSD
R
1
VINOK_FA
R
0
SWOFF
R
Address: 0x02
Type: read register only
Default : b000x_xxxx where x depends on previous turn-OFF condition
Description: Turn-OFF status register. This register stores the last condition, which turns OFF the STPMIC1.
It is set during POWER_DOWN state following turn-OFF condition.
[7 :6]
[5]
Reserved
PKEYLKP: Last turn-OFF condition was due to PONKEYn long key
0: False
1: True
WDG: Last turn-OFF condition was due to watchdog
[4]
[3]
[2]
0: False
1: True
OCP: Last turn-ON condition was due to overcurrent protection
0: False
1: True
THSD: Last turn-OFF condition was due to thermal shutdown
0: False
1: True
VINOK_FA: Last turn-OFF condition was due to VIN below V
INOK_Fall
(when VIN is crossing VIN_POR_Rise threshold, this bit value is not valid)
[1]
[0]
0: False
1: True
SWOFF: Last turn-OFF condition was due to software switch OFF
0: False
1: True
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STPMIC1
Status registers
6.2.3
Overcurrent protection LDO turn-OFF status register (OCP_LDOS_SR)
Table 21. OCP_LDOS_SR
7
reserved
R
6
reserved
R
5
OCP_LDO6
R
4
OCP_LDO5
R
3
OCP_LDO4
R
2
OCP_LDO3
R
1
OCP_LDO2
R
0
OCP_LDO1
R
Address: 0x03
Type: read register only
Default: b00xx_xxxx where x depends on possible OCP event during previous POWER_ON
Description: OCP LDO turn-OFF status register. This register stores the identification of the LDO source of the
last OCP turn-OFF.
It is set during POWER_DOWN state.
[7 :6]
[5]
Reserved
OCP_LDO6: Last turn-OFF was due to overcurrent protection on LDO6
0: False
1: True
OCP_LDO5: Last turn-OFF was due to overcurrent protection on LDO5
[4]
[3]
[2]
[1]
[0]
0: False
1: True
OCP_LDO4: Last turn-OFF was due to overcurrent protection on LDO4
0: False
1: True
OCP_LDO3: Last turn-OFF was due to overcurrent protection on LDO3
0: False
1: True
OCP_LDO2: Last turn-OFF was due to overcurrent protection on LDO2
0: False
1: True
OCP_LDO1: Last turn-OFF was due to overcurrent protection on LDO1
0: False
1: True
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STPMIC1
Status registers
6.2.4
Overcurrent protection buck turn-OFF status register (OCP_BUCKS_BSW_SR)
Table 22. OCP_BUCKS_BSW_SR
7
6
5
4
3
2
1
0
reserved OCP_BOOST OCP_SWOUT OCP_VBUSOTG OCP_BUCK4 OCP_BUCK3 OCP_BUCK2 OCP_BUCK1
R
R
R
R
R
R
R
R
Address: 0x04
Type: read register only
Default: b00xx_xxxx where x depends on possible OCP event during previous POWER_ON
Description: OCP buck turn-OFF status register. This register stores the identification of the BUCK, BOOST or
power switch source of the last OCP turn-OFF.
It is set during POWER_DOWN state.
[7]
Reserved
OCP_BOOST: Last turn-OFF was due to overcurrent protection on BOOST
[6] 0: False
1: True
OCP_SWOUT: Last turn-OFF was due to overcurrent protection on SWOUT pin (PWR_SW out)
[5] 0: False
1: True
OCP_VBUSOTG: Last turn-OFF was due to overcurrent protection on VBUSTOTG pin (PWR_USB_SW out)
[4] 0: False
1: True
OCP_BUCK4: Last turn-OFF was due to overcurrent protection on BUCK4
[3] 0: False
1: True
OCP_BUCK3: Last turn-OFF was due to overcurrent protection on BUCK3
[2] 0: False
1: True
OCP_BUCK2: Last turn-OFF was due to overcurrent protection on BUCK2
[1] 0: False
1: True
OCP_BUCK1: Last turn-OFF was due to overcurrent protection on BUCK1
[0] 0: False
1: True
DS12792 - Rev 7
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STPMIC1
Status registers
6.2.5
Restart status register (RESTART_SR)
Table 23. RESTART_SR
7
OP_MODE
R
6
5
4
3
R_PKEYLKP
R
2
R_WDG
R
1
0
LDO4_SRC[1:0]
R_VINOK_FA
R
R_SWOFF
R
R_RST
R
R
R
Address: 0x05
Type: read register only
Default: b000x_xxxx where x depends on last restart condition
Description: Restart status register. This register mainly contains identification of the last restart condition. Either
turn-OFF condition with restart_request option set, or from RSTn assertion from application processor. (Refer to
Section 5.4.3 Turn-OFF conditions and restart_request) and Section 5.4.4 Reset and mask_reset option.
Bits prefixed with R_ are set during transition from POWER_DOWN to CHECK&LOAD.
This register also contains active operating mode (MAIN or ALTERNATE) and current LDO4 input source. (Refer
to Section 4.2.2 LDO regulators - special features).
OP_MODE: Operating mode. Signal if the STPMIC1 is in MAIN mode or ALTERNATE mode.
[7]
0: STPMIC1 is in MAIN mode
1: STPMIC1 is in ALTERNATE mode
LDO4_SRC[1:0]: LDO4 input source. Provides status of LDO4 input switch selection.
00: LDO4 is OFF
[6 :5] 01: VIN supply selected
10: VBUSOTG supply selected
11: BSTOUT supply selected
R_VINOK_FA: Restart is due to VINOK_Fall turn-OFF condition while RREQ_EN bit is set
[4]
[3]
[2]
[1]
[0]
0: False
1: True
R_PKEYLKP: Restart is due to PONKEYn long key press turn- OFF condition while RREQ_EN bit is set
0: False
1: True
R_WDG: Restart is due to watchdog turn-OFF condition while RREQ_EN bit is set
0: False
1: True
R_SWOFF: Restart is due to SWOFF turn-OFF condition while RREQ_EN bit is set
0: False
1: True
R_RST: Restart is due to RSTn signal asserted by application processor
0: False
1: True
DS12792 - Rev 7
page 73/140
STPMIC1
Status registers
6.2.6
Version status register (VERSION_SR)
Table 24. VERSION_SR
7
6
5
4
3
2
1
0
MAJOR_VERSION[3:0]
MINOR_VERSION[3:0]
R
R
R
R
R
R
R
R
Address: 0x06
Type: read register only
Default: 0x21
Description: version status register. Chip ID version.
[7 :4]
[3 :0]
MAJOR_VERSION[3:0]
MINOR_VERSION[3:0]
Reading x21 means that the STPMIC1 has a silicon version 2.1; regardless the STPMIC1A, STPMIC1B,
STPMIC1C, STPMIC1D and STPMIC1E.
DS12792 - Rev 7
page 74/140
STPMIC1
Control registers
6.3
Control registers
6.3.1
Main control register (MAIN_CR)
Table 25. MAIN_CR
3
7
6
5
4
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
OCP_OFF_DBG
R/W
PWRCTRL_POL
R/W
PWRCTRL_EN
R/W
RREQ_EN
R/W
SWOFF
R/W
Address: 0x10
Type: read/write register
Default: 0x00
Description: main control register. This register is initialized to default values during CHECK&LOAD state.
[7 :5]
[4]
Reserved
OCP_OFF_DBG: Used as software debug bit to emulate OCP turn-OFF event generation. OCP flags coming from any
regulators are bypassed when this bit is set.
0: OCP event is generated based on flags from regulators.
1: OCP turn-OFF event is generated.
PWRCTRL_POL: specifies PWRCTRL pin polarity
[3] 0: PWRCTRL active low
1: PWRCTRL active high
PWRCTRL_EN: enable PWRCTRL functionality
[2] 0: PWRCTRL enable
1: PWRCTRL disable
RREQ_EN: allows power cycling on turn-OFF condition
[1] 0: power cycling is performed only on RSTn assertion by the application processor
1: Power cycling is performed on turn-OFF condition and on RSTn assertion by the application processor
SWOFF: Software switch OFF bit
[0] 0: no effect
1: switch-OFF requested (POWER_DOWN starts immediately)
DS12792 - Rev 7
page 75/140
STPMIC1
Control registers
6.3.2
Pads pull control register (PADS_PULL_CR)
Table 26. PADS_PULL_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
WKUP_EN
R/W
PWRCTRL_PD
R/W
PWRCTRL_PU
R/W
WKUP_PD
R/W
PKEY_PU
R/W
Address: 0x11
Type: read/write register
Default: 0x00
Description: pads pull control register. This register is initialized to default values upon entering CHECK&LOAD
state.
[7 :5]
[4]
Reserved
WKUP_EN: Enable WAKEUP detector
0: WAKEUP detector is enabled
1: WAKEUP detector is disabled
PWRCTRL_PD: PWRCTRL pull-down control
0: PD inactive
[3]
1: PD active
Note: this bit has higher priority than PWRCTRL_PU.
PWRCTRL_PU: PWRCTRL pull-up control
0: PU inactive
[2]
[1]
[0]
1: PU active
WKUP_PD: WAKEUP pull-down control (reverse logic)
0: PD active
1: PD not active
PKEY_PU: PONKEY pull-up control (reverse logic)
0: PU active
1: PU not active
DS12792 - Rev 7
page 76/140
STPMIC1
Control registers
6.3.3
Bucks pull-down control register (BUCKS_PD_CR)
Table 27. BUCKS_PD_CR
7
6
5
4
3
2
1
0
BUCK4_PD[1:0]
BUCK3_PD[1:0]
BUCK2_PD[1:0]
BUCK1_PD[1:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x12
Type: read/write register
Default: 0x00
Description: Bucks pull-down control register. This register is initialized to default values upon entering to
CHECK&LOAD state
BUCK4_PD[1:0]:
00: light PD active when ENA of Buck4 = 0
[7:6]
[5:4]
[3:2]
[1:0]
01: high PD active when ENA of Buck4 = 0
10: light and high PD forced inactive
11: light PD forced active
BUCK3_PD[1:0]:
00: light PD active when ENA of Buck3 = 0
01: high PD active when ENA of Buck3 = 0
10: light and high PD forced inactive
11: light PD forced active
BUCK2_PD[1:0]:
00: light PD active when ENA of Buck2 = 0
01: high PD active when ENA of Buck2 = 0
10: light and high PD forced inactive
11: light PD forced active
BUCK1_PD[1:0]:
00: light PD active when ENA of Buck1 = 0
01: high PD active when ENA of Buck1 = 0
10: light and high PD forced inactive
11: light PD forced active
DS12792 - Rev 7
page 77/140
STPMIC1
Control registers
6.3.4
LDO1-4 pull-down control register (LDO14_PD_CR)
Table 28. LDO14_PD_CR
7
6
5
4
3
2
1
0
LDO4_PD[1:0]
LDO3_PD[1:0]
LDO2_PD[1:0]
LDO1_PD[1:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x13
Type: read/write register
Default: 0x00
Description: LDO1-4 pull-down control register. This register is initialized to default values upon entering to
CHECK&LOAD state.
LDO4_PD[1:0]:
00: PD active when ENA of LDO4 = 0
[7:6]
[5:4]
[3:2]
[1:0]
01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO3_PD[1:0]:
00: PD active when ENA of LDO3 = 0
01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO2_PD[1:0]:
00: PD active when ENA of LDO2 = 0
01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO1_PD[1:0]:
00: PD active when ENA of LDO1 = 0
01: PD forced inactive
10: PD forced inactive
11: PD forced active
DS12792 - Rev 7
page 78/140
STPMIC1
Control registers
6.3.5
LDO5/6 pull-down control register (LDO56_VREF_PD_CR)
Table 29. LDO56_VREF_PD_CR
7
6
5
4
3
2
1
0
reserved
R/W
BST_PD
R/W
REFDDR_PD[1:0]
R/W R/W
LDO6_PD[1:0]
LDO5_PD[1:0]
R/W R/W
R/W
R/W
Address: 0x14
Type: read/write register
Default: 0x00
Description: LDO5 and LDO6 pull-down control register. This register is initialized to default values upon entering
to CHECK&LOAD state.
[7]
[6]
Reserved
BST_PD: Boost pull-down activation (reverse logic)
0: PD active when BST_ON = 0
1: PD inactive when BST_ON = 0
REFDDR_PD[1:0]:
00: PD active only when REFDDR disabled
01: PD forced inactive
[5:4]
[3:2]
[1:0]
10: PD forced inactive
11: PD forced active
LDO6_PD[1:0]:
00: PD active only when LDO6 disabled
01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO5_PD[1:0]:
00: PD active only when LDO5 disabled
01: PD forced inactive
10: PD forced inactive
11: PD forced active
DS12792 - Rev 7
page 79/140
STPMIC1
Control registers
6.3.6
PWR_SWOUT and VIN control register (SW_VIN_CR)
Table 30. SW_VIN_CR
7
6
5
4
3
2
1
0
SWIN_DET_EN
R/W
SWOUT_DET_DIS
R/W
VINLOW_HYST[1:0]
R/W R/W
VINLOW_TRESH[2:0]
R/W R/W R/W
VINLOW_MON
R/W
Address: 0x15
Type: read/write register
Default: 0x00
Description: switch and VIN control register. This register is initialized to default values upon entering to
CHECK&LOAD state.
SWIN_DET_EN: SWIN detection enable control bit
[7]
[6]
0: SW_IN detector is enabled only when SW_OUT switch is enabled else SW_IN detector is off
1: SW_IN detector is enabled
SWOUT_DET_DIS: SWOUT detection disable control bit
0: SWOUT detector is enabled
1 : SWOUT detector is disabled
VINLOW_HYST[1:0]: VINLOW threshold hysteresis
00: 100 mV
[5 :4] 01 : 200 mV
10 : 300 mV
11: 400 mV
VINLOW_TRESH[2:0]: VINLOW threshold offset
000 : VINOK_Fall + 50 mV
001 : VINOK_Fall + 100 mV
010 : VINOK_Fall + 150 mV
[3 :1] 011 : VINOK_Fall + 200 mV
100 : VINOK_Fall + 250 mV
101 : VINOK_Fall + 300 mV
110 : VINOK_Fall + 350 mV
111 : VINOK_Fall + 400 mV
VINLOW_MON: VINLOW monitoring enable bit
[0]
0: VINLOW monitoring is disabled
1: VINLOW monitoring is enabled
DS12792 - Rev 7
page 80/140
STPMIC1
Control registers
6.3.7
PONKEYn turn-OFF control register (PKEY_TURNOFF_CR)
Table 31. PKEY_TURNOFF_CR
7
6
PKEY_CLEAR_OCP_FLAG
R/W
5
4
3
2
1
0
PKEY_LKP_OFF
R/W
reserved
R/W
reserved
R/W
PKEY_LKP_TMR[3:0]
R/W R/W R/W R/W
Address: 0x16
Type: read/write register
Default: 0bX0000000 where X depends on the value programmed in NVM
Description: PONKEYn turn-OFF control register. This register is initialized to default values during
CHECK&LOAD state.
PKEY_LKP_OFF:
0: Turn OFF on long key press inactive
[7]
1: Turn OFF on long key press active
Default value is defined by PKEYLKP_OFF bit in Table 65. NVM_MAIN_CTRL_SHR
PKEY_CLEAR_OCP_FLAG:
0: only VIN_POR_Fall can reset LOCK_OCP_FLAG internal signal
[6]
1: if PONKEYn pin is pressed for more than PKEY_LKP_TMR[3:0] then LOCK_OCP_FLAG is cleared. This also results
as turn-ON condition for the STPMIC1
[5 :4] reserved
PKEY_LKP_TMR[3:0]: PONKEYn long key press duration
0000 : 16 s
0001 : 15 s
0010 : 14 s
0011 : 13 s
0100 : 12 s
0101 : 11 s
0110 : 10 s
[3 :0] 0111 : 9 s
1000 : 8 s
1001 : 7 s
1010: 6 s
1011 : 5 s
1100 : 4 s
1101 : 3 s
1110 : 2 s
1111 : 1 s
DS12792 - Rev 7
page 81/140
STPMIC1
Control registers
6.3.8
Mask reset Buck control register (BUCKS_MRST_CR)
Table 32. BUCKS_MRST_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
MRST_BUCK4
R/W
MRST_BUCK3
R/W
MRST_BUCK2
R/W
MRST_BUCK1
R/W
Address: 0x18
Type: read/write register
Default: 0x00
Description: mask reset Buck control register. Set bit to 1 active Mask reset option for selected Bucks for the next
NRST power cycle. It is a single shot option. Register is reset to default in CHECK&LOAD state.
Refer to Section 5.4.4 Reset and mask_reset option.
[7 :4]
[3]
Reserved
MRST_BUCK4: Buck 4 mask reset option
0: inactive
1: Mask default active for Buck4
MRST_BUCK3: Buck3 mask reset option
0: inactive
[2]
[1]
[0]
1: Mask default active for Buck3
MRST_BUCK2: Buck2 mask reset option
0: inactive
1: Mask default active for Buck2
MRST_BUCK1: Buck1 mask reset option
0: inactive
1: Mask default active for Buck1
DS12792 - Rev 7
page 82/140
STPMIC1
Control registers
6.3.9
Mask reset LDO control register (LDOS_MRST_CR)
Table 33. LDOS_MRST_CR
7
6
5
4
3
2
1
0
reserved MRST_REFDDR MRST_LDO6 MRST_LDO5 MRST_LDO4 MRST_LDO3 MRST_LDO2 MRST_LDO1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x1A
Type: read/write register
Default: 0x00
Description: mask reset LDO control register. Set bit to 1 active mask reset option for selected LDO for next
reset power-cycle. It is a single shot option. Register is reset to default in CHECK&LOAD state. Refer to
Section 5.4.4 Reset and mask_reset option.
[7]
[6]
Reserved
MRST_REFDDR: REFDDR LDO mask reset option
0: inactive
1: Mask reset active for REFDDR
MRST_LDO6: LDO6 mask default option
0: inactive
[5]
[4]
[3]
[2]
[1]
[0]
1: mask reset active for LDO6
MRST_LDO5: LDO5 mask default option
0: inactive
1: mask reset active for LDO5
MRST_LDO4: LDO4 mask default option
0: inactive
1: mask reset active for LDO4
MRST_LDO3: LDO3 mask default option
0: inactive
1: mask reset active for LDO3
MRST_LDO2: LDO2 mask default option
0: inactive
1: mask default active for LDO2
MRST_LDO1: LDO1 mask default option
0: inactive
1: mask default active for LDO1
DS12792 - Rev 7
page 83/140
STPMIC1
Control registers
6.3.10
Watchdog control register (WDG_CR)
Table 34. WDG_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
WDG_RST
R/W
WDG_ENA
R/W
Address: 0x1B
Type: read/write register
Default: 0x00
Description: watchdog control register
[7 :2] Reserved
WDG_RST: watchdog counter reset
[1]
[0]
0: NA
1: Watchdog downcounter is reloaded with a value in WDG_TIMER_CR (self-cleared bit)
WDG_ENA: watchdog enable bit
0: watchdog is disabled
1: watchdog is enabled
DS12792 - Rev 7
page 84/140
STPMIC1
Control registers
6.3.11
Watchdog timer control register (WDG_TMR_CR)
Table 35. WDG_TMR_CR
7
6
5
4
3
2
1
0
WDG_TMR [7:0]
R/W R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x1C
Type: read/write register
Default: 0x00
Description: watchdog timer control register. This register is initialized to default value upon entering
CHECK&LOAD state.
WDG_TMR[7:0]: watchdog downcounter period value
Value in second.
[7 :0]
0x00 = 1 s
…
0xFF=256 s
DS12792 - Rev 7
page 85/140
STPMIC1
Control registers
6.3.12
Bucks OCP turn-OFF control register (BUCKS_OCPOFF_CR)
Table 36. BUCKS_OCPOFF_CR
7
6
5
4
3
2
1
0
OCPOFF
BOOST
OCPOFF
SWOUT
OCPOFF
OCPOFF
BUCK4
OCPOFF
BUCK3
OCPOFF
BUCK2
OCPOFF
BUCK1
reserved
R/W
VBUSOTG
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x1D
Type: read/write register
Default: 0x00
Description: Buck OCP turn-OFF control register. This register is initialized to default value during CHECK&LOAD
state.
[7] reserved
OCPOFFBOOST: STPMIC1 turn-OFF in case OCP on BOOST
[6] 0: False
1: True
OCPOFFSWOUT: STPMIC1 turn-OFF in case OCP on SWOUT
[5] 0: False
1: True
OCPOFFVBUSOTG: STPMIC1 turn-OFF in case OCP on VBUSOTG
[4] 0: False
1: True
OCPOFFBUCK4: STPMIC1 turn-OFF in case OCP on BUCK4
[3] 0: False
1: True
OCPOFFBUCK3: STPMIC1 turn-OFF in case OCP on BUCK3
[2] 0: False
1: True
OCPOFFBUCK2: STPMIC1 turn-OFF in case OCP on BUCK2
[1] 0: False
1: True
OCPOFFBUCK1: STPMIC1 turn-OFF in case OCP on BUCK1
[0] 0: False
1: True
DS12792 - Rev 7
page 86/140
STPMIC1
Control registers
6.3.13
LDO OCP turn-OFF control register (LDOS_OCPOFF_CR)
Table 37. LDOS_OCPOFF_CR
7
6
5
4
3
2
1
0
reserved reserved OCPOFFLDO6 OCPOFFLDO5 OCPOFFLDO4 OCPOFFLDO3 OCPOFFLDO2 OCPOFFLDO1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x1E
Type: read/write register
Default: 0x00
Description: LDO OCP turn-OFF control register. This register is initialized to default value upon entering
CHECK&LOAD state.
[7 :6]
[5]
Reserved
OCPOFFLDO6: STPMIC1 Turn-OFF in case OCP on LDO6
0: False
1: True
OCPOFFLDO5: STPMIC1 Turn-OFF in case OCP on LDO5
[4]
[3]
[2]
[1]
[0]
0: False
1: True
OCPOFFLDO4: STPMIC1 Turn OFF in case OCP on LDO4
0: False
1: True
OCPOFFLDO3: STPMIC1 Turn-OFF in case OCP on LDO3
0: False
1: True
OCPOFFLDO2: STPMIC1 Turn-OFF in case OCP on LDO2
0: False
1: True
OCPOFFLDO1: STPMIC1 Turn-OFF in case OCP on LDO1
0: False
1: True
DS12792 - Rev 7
page 87/140
STPMIC1
Power supplies control registers
6.4
Power supplies control registers
6.4.1
BUCKx MAIN mode control registers (BUCKx_MAIN_CR) (x=1…4)
Table 38. BUCKx_MAIN_CR
7
6
5
4
3
2
1
0
VOUT[5:0]
PREG_MODE
R/W
ENA
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x20 to 0x23
Type: Read/write register
Default: 0bXXXXXX0X where X depends on the value programmed in NVM
Description: BUCKx MAIN mode control registers. Registers are initialized in CHECK&LOAD state. User can write
to these registers to control enable, regulation mode and voltage setting of BUCKx that are applied to MAIN
mode.
[7:2] VOUT[5:0]: Buck output voltage setting. Refer to Table 10. BUCK output settings
PREG_MODE: select high power or low power regulation mode
[1]
0: High power mode (HP)
1: Low power mode (LP)
ENA: Buck enable bit
0: Buck is disabled
1: Buck is enabled
[0]
DS12792 - Rev 7
page 88/140
STPMIC1
Power supplies control registers
6.4.2
REFDDR MAIN mode control register (REFDDR_MAIN_CR)
Table 39. REFDDR_MAIN_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
ENA
R/W
Address: 0x24
Type: read/write register
Default: 0x0000000X where X depends on NVM settings
Description: REFDDR, MAIN mode control register. Register is initialized in CHECK&LOAD mode.
User can write to this register to control the enable of REFDDR applied to MAIN mode.
[7 :1]
[0]
Reserved
ENA: VREF_DDR enable bit
0: VREF_DDR is disabled
1: VREF_DDR is enabled
DS12792 - Rev 7
page 89/140
STPMIC1
Power supplies control registers
6.4.3
LDOx MAIN mode control registers (LDOx_MAIN_CR) (x=1, 2, 5, 6)
Table 40. LDOx_MAIN_CR
7
6
5
4
3
2
1
0
reserved
R/W
VOUT[4:0]
R/W
Reserved
R/W
ENA
R/W
R/W
R/W
R/W
R/W
Address: 0x25, 0x26, 0x29, 0x2A
Type: read/write register
Default: 0b0XXXXX00 where X depends on the value programmed in NVM
Description: LDOx (x=1,2,5,6) MAIN mode control register. The register is set to default value in CHECK&LOAD.
User can write to this register to control both enable and voltage settings of LDOx that are applied to MAIN mode.
[7]
[6:2]
[1]
Reserved
VOUT[4:0]: refer to Table 9. LDO output voltage settings
reserved
ENA: LDOx enable bit
0: LDOx is disabled
1: LDOx is enabled
[0]
DS12792 - Rev 7
page 90/140
STPMIC1
Power supplies control registers
6.4.4
LDO3 MAIN mode control register (LDO3_MAIN_CR)
Table 41. LDO3_MAIN_CR
7
6
5
4
3
2
1
0
BYPASS
R/W
VOUT[4:0]
R/W
reserved
R/W
ENA
R/W
R/W
R/W
R/W
R/W
Address: 0x27
Type: read/write register
Default: 0bXXXXXX00 where X depends on the value programmed in NVM
Description: LDO3 MAIN mode control register. The register is set to a default value in CHECK&LOAD.
User can write to this register to control bypass, enable and voltage settings of LDO3 that is applied to MAIN
mode.
BYPASS: force bypass mode of LDO3
0: LDO3 is in normal mode
[7]
1: LDO3 is in bypass mode. VOUT[4:0] bits have no effect
[6:2]
[1]
VOUT[4:0]: refer to Table 9. LDO output voltage settings
reserved
ENA: LDO3 enable bit
0: LDO3 is disabled
1: LDO3 is enabled
[0]
DS12792 - Rev 7
page 91/140
STPMIC1
Power supplies control registers
6.4.5
LDO4 MAIN mode control register (LDO4_MAIN_CR)
Table 42. LDO4_MAIN_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
SRC_VBUSOTG
R/W
SRC_BOOST
R/W
SRC_VIN
R/W
reserved
R/W
ENA
R/W
Address: 0x28
Type: read/write register
Default: 0x0000000X
Description: LDO4 MAIN mode control register. Register is set to a default value in CHECK&LOAD. User can
write to this register to enable and force the input source of LDO4 that is applied to MAIN mode. If more than one
SRC_ bit is set, it is taken into account following this priority order: VIN, VBUSOTG, BSTOUT.
[7 :5]
[4]
reserved
SRC_VBUSOTG: Force VBUSOTG as input source.
0: automatic
1: supply switch is set to VBUSOTG
SRC_BSTOUT: Force BSTOUT has input source.
0: automatic
[3]
1: supply switch is set to BSTOUT
SRC_VIN: Force VIN has an input source.
0: automatic
[2]
[1]
[0]
1: supply switch is set to VIN
reserved
ENA: LDO4 enable bit
0: LDO4 is disabled
1: LDO4 is enabled
DS12792 - Rev 7
page 92/140
STPMIC1
Power supplies control registers
6.4.6
BUCKx ALTERNATE mode control registers (BUCKx_ALT_CR)(x=1..4)
Table 43. BUCKx_ALT_CR
7
6
5
4
3
2
1
0
VOUT[5:0]
PREG_MODE
R/W
ENA
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x30 to 0x33
Type: read/write register
Default: 0bXXXXXX00 where X depends on the value programmed in NVM
Description: BUCKx ALTERNATE mode control registers. The register is set to a default value in CHECK&LOAD.
User can write to these registers to control enable, regulation mode and voltage settings of BUCKx that is applied
to ALTERNATE mode.
[7:2]
[1]
VOUT[5:0]: refer to Table 10. BUCK output settings
PREG_MODE: Force high power - low power mode of buck
0: high power mode (HP)
1: low power mode (LP)
ENA: buck enable bit
0: buck is disabled
1: buck is enabled
[0]
DS12792 - Rev 7
page 93/140
STPMIC1
Power supplies control registers
6.4.7
REFDDR ALTERNATE mode control register (REFDDR_ALT_CR)
Table 44. REFDDR_ALT_CR
7
reserved
R/W
6
reserved
R/W
5
reserved
R/W
4
reserved
R/W
3
reserved
R/W
2
reserved
R/W
1
reserved
R/W
0
ENA
R/W
Address: 0x34
Type: read/write register
Default: 0x00
Description: REFDDR ALTERNATE mode control register. The register is initialized in CHECK&LOAD mode. User
can write to this register to control enable of REFDDR that is applied to ALTERNATE mode.
[7 :1]
[0]
Reserved
ENA: REFDDR enable bit
0: REFDDR is disabled
1: REFDDR is enabled
DS12792 - Rev 7
page 94/140
STPMIC1
Power supplies control registers
6.4.8
LDOx ALTERNATE mode control registers (LDOx_ALT_CR) (x=1, 2, 5, 6)
Table 45. LDOx_ALT_CR
7
6
5
4
3
2
1
0
reserved
R/W
VOUT[4:0]
R/W
reserved
R/W
ENA
R/W
R/W
R/W
R/W
R/W
Address: 0x35, 0x36, 0x39, 0x3A
Type: read/write register
Default: 0b0XXXXX0X where X depends on the value programmed in NVM
Description: LDOx ALTERNATE mode control registers. Register is set to a default value in CHECK&LOAD.
User can write to these registers to control enable and voltage settings of LDOx that are applied to ALTERNATE
mode.
[7]
[6 :2]
[1]
Reserved
VOUT[4:0]: refer to Table 9. LDO output voltage settings
reserved
ENA: LDOx enable bit
0: LDOx is disabled
1: LDOx is enabled
[0]
DS12792 - Rev 7
page 95/140
STPMIC1
Power supplies control registers
6.4.9
LDO3 ALTERNATE mode control register (LDO3_ALT_CR)
Table 46. LDO3_ALT_CR
7
6
5
4
3
2
1
0
BYPASS
R/W
VOUT[4:0]
R/W
reserved
R/W
ENA
R/W
R/W
R/W
R/W
R/W
Address: 0x37
Type: read/write register
Default: 0bXXXXXX00 where X depends on the value programmed in NVM
Description: LDO3 ALTERNATE mode control register. Register is set to a default value in CHECK&LOAD.
User can write to this register to control bypass, enable and voltage settings of LDO3 that is applied to
ALTERNATE mode.
BYPASS: force bypass mode of LDO3
0: LDO3 is in normal mode
[7]
1: LDO3 is in bypass mode. VOUT[4:0] bits have no effect.
Default value of BYPASS is NVM_LDO3_BYPASS.
[6:2]
[1]
VOUT[4:0]: refer to Table 9. LDO output voltage settings
reserved
ENA: LDO3 enable bit
0: LDO3 is disabled
1: LDO3 is enabled
[0]
DS12792 - Rev 7
page 96/140
STPMIC1
Power supplies control registers
6.4.10
LDO4 ALTERNATE mode control register (LDO4_ALT_CR)
Table 47. LDO4_ALT_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
ENA
R/W
Address: 0x38
Type: read/write register
Default: 0x00
Description: LDO4 ALTERNATE mode control register. Register is set to a default value in CHECK&LOAD.
User can write to this register to control enable LDO4 that is applied to ALTERNATE mode.
[7 :1]
[0]
Reserved
ENA: LDO4 enable bit
0: LDO4 is disabled
1: LDO4 is enabled
DS12792 - Rev 7
page 97/140
STPMIC1
Power supplies control registers
6.4.11
Boost/switch control register (BST_SW_CR)
Table 48. BST_SW_CR
7
6
5
4
3
2
1
0
RESERVED VBUSOTG_DET_DIS SWOUT_PD VBUSOTG_PD OCP_SWOUT_LIM SWOUT_ON VBUSOTG_ON BST_ON
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0x40
Type: read/write register
Default: 0x00
Description: boost and power switch control register. Register is set to a default value in CHECK&LOAD.
[7] RESERVED
VBUSOTG_DET_DIS: PWR_USB_SW detection circuit disable
[6] 0: detection circuit is enabled
1: detection circuit is disabled
SWOUT_PD: SWOUT (PWR_SW) pull-down activation
[5] 0: PD inactive
1: PD active when PWR_SW is disabled (SW_ON bit = 0)
VBUSOTG_PD: PWR_USB_SW pull-down activation
[4] 0: PD inactive
1: PD active when PWR_USB_SW is disabled (VBUSOTG_ON bit = 0)
OCP_SWOUT_LIM: Overcurrent limit protection of PWR_SW switch
[3] 0: limit max. output current to 600 mA
1: limit max. output current to 1.1 A
SWOUT_ON: PWR_SW switch enable bit
[2] 0: PWR_SW disabled
1: PWR_SW enabled
VBUSOTG_ON: PWR_USB_SW switch enable
[1] 0: PWR_USB_SW disabled
1: PWR_USB_SW enabled
BST_ON: BOOST enable bit
[0] 0: BOOST disabled
1: BOOST enabled
DS12792 - Rev 7
page 98/140
STPMIC1
Interrupt registers
6.5
Interrupt registers
6.5.1
Overall interrupt register behavior
No interrupts are stored before RSTn is released. Interrupt registers are all cleared and masked on default and
turn-OFF conditions.
Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt pending
register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) store information about masked and not masked
events.
Section 6.5.10 Interrupt clear mask registers (INT_CLEAR_MASK_Rx) or Section 6.5.6 Interrupt debug latch
registers (INT_DBG_LATCH_Rx) is a write register. Any read on this address provides x00 as data. Writing ‘1’ in a
bit forces INT_PENDING corresponding bit to ‘1’. Writing ‘0’ has no effect.
Section 6.5.8 Interrupt mask registers (INT_MASK_Rx) is a read/write register.
INTn pin is forced low as long as a bit is set in INT_PENDING_Rx and no mask in its corresponding
Section 6.5.8 Interrupt mask registers (INT_MASK_Rx). Section 6.5.11 Interrupt source register 1
(INT_SRC_R1), Section 6.5.12 Interrupt source register 2 (INT_SRC_R2), Section 6.5.13 Interrupt source
register 3 ( INT_SRC_R3) and Section 6.5.14 Interrupt source register 4 ( INT_SRC_R4) reflects a ‘real time’
status of the event while INT_PENDING_Rx stores events and not levels.
DS12792 - Rev 7
page 99/140
STPMIC1
Interrupt registers
6.5.2
Interrupt pending register 1 (INT_PENDING_R1)
Table 49. INT_PENDING_R1
7
SWOUT_RI
R
6
SWOUT_FA
R
5
4
3
WKP_RI
R
2
WKP_FA
R
1
0
VBUSOTG_RI
R
VBUSOTG_FA
R
PKEY_RI
R
PKEY_FA
R
Address: 0x50
Type: read register only
Default: 0x00
Description: interrupt pending register 1. Register is set to default on RSTn assertion.
For all bits:
0: IT not pending
1: IT pending
[7] SWOUT_RI: VBUS on SWOUT pin (PWR_SW out) rises above SWOUT_Rise treshold
[6] SWOUT_FA: VBUS on SWOUT pin (PWR_SW out) falls below above SWOUT_Fall treshold
[5] VBUSOTG_RI: VBUS on VBUSOTG pin (PWR_USB_SW out) rises above VBUSOTG_Rise threshold
[4] VBUSOTG_FA: VBUS on VBUSOTG pin (PWR_USB_SW out) falls below VBUSOTG_Fall threshold
[3] WKP_RI: WAKEUP rising edge
[2] WKP_FA: WAKEUP falling edge
[1] PKEY_RI: PONKEYn rising edge
[0] PKEY_FA: PONKEYn falling edge detected
DS12792 - Rev 7
page 100/140
STPMIC1
Interrupt registers
6.5.3
Interrupt pending register 2 (INT_PENDING_R2)
Table 50. INT_PENDING_R2
7
BST_OVP
R
6
BST_OCP
R
5
4
3
BUCK4_OCP
R
2
BUCK3_OCP
R
1
0
SWOUT_O VBUSOTG_OC
BUCK2_
OCP
BUCK1_OCP
R
CP
P
R
R
R
Address: 0x51
Type: read register only
Default: 0x00
Description: interrupt pending register 2. Register is set to default on RSTn assertion
For all bits:
0: IT not pending
1: IT pending
[7]
[6]
[5]
[4]
[3]
[2]
[1]
[0]
BST_OVP: Overvoltage detected on Boost BSTOUT pin
BST_OCP: Overcurrent detected on Boost BSTOUT pin
SWOUT_OCP: Current limitation detected on SWOUT pin
VBUSOTG_OCP: Overcurrent detected on VBUSOTG pin
BUCK4_OCP: Overcurrent detected on Buck4
BUCK3_OCP: Overcurrent detected on Buck3
BUCK2_OCP: Overcurrent detected on Buck2
BUCK1_OCP: Overcurrent detected on Buck1
DS12792 - Rev 7
page 101/140
STPMIC1
Interrupt registers
6.5.4
Interrupt pending register 3 (INT_PENDING_R3)
Table 51. INT_PENDING_R3
7
SWOUT_SH
R
6
5
4
3
2
1
0
VBUSOTG_SH
R
LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
R
R
R
R
R
R
Address: 0x52
Type: read register only
Default: 0x00
Description: interrupt pending register 3. Register is set to default on RSTn assertion
For all bits:
0: IT not pending
1: IT pending
SWOUT_SH: A short event has been detected on SWOUT pin.
[7]
Refer to Section 4.5.2 PWR_USB_SW and PWR_SW power switches
VBUSOTG_SH: A short event has been detected on VBUSOTG pin. Refer to Section 4.5.2 PWR_USB_SW and
PWR_SW power switches
[6]
[5] LDO6_OCP: Current limitation detected on LDO6
[4] LDO5_OCP: Current limitation detected on LDO5
[3] LDO4_OCP: Current limitation detected on LDO4
[2] LDO3_OCP: Current limitation detected on LDO3
[1] LDO2_OCP: Current limitation detected on LDO2
[0] LDO1_OCP: Current limitation detected on LDO1
DS12792 - Rev 7
page 102/140
STPMIC1
Interrupt registers
6.5.5
Interrupt pending register 4 (INT_PENDING_R4)
Table 52. INT_PENDING_R4
7
SWIN_RI
R
6
SWIN_FA
R
5
reserved
R
4
reserved
R
3
VINLOW_RI
R
2
VINLOW_FA
R
1
0
THW_RI
R
THW_FA
R
Address: 0x53
Type: read register only
Default: 0x00
Description: interrupt pending register 4. Register is set to default on RSTn assertion
For all bits:
0: IT not pending
1: IT pending
[7]
[6]
SWIN_RI: Voltage on SWIN pin (PWR_SW input) rises above SWIN_Rise threshold
SWIN_FA: Voltage on SWIN pin (PWR_SW input) falls below SWIN_Fall threshold
[5 :4] reserved
[3]
[2]
[1]
[0]
VINLOW_RI: VIN drops below VINLOW_Rise threshold
VINLOW_FA: VIN rises above VINLOW_Fall threshold
THW_RI: Temperature rises above Twrn_Rise threshold
THW_FA: Temperature drops below Twrn_Fall threshold
DS12792 - Rev 7
page 103/140
STPMIC1
Interrupt registers
6.5.6
Interrupt debug latch registers (INT_DBG_LATCH_Rx)
Table 53. INT_DBG_LATCH_Rx
Name
Address
7
6
5
4
3
2
1
0
INT_DBG_
LATCH_R1
SWOUT
_RI
SWOUT
_FA
VBUS
VBUS
WKP
WKP
PKEY
_RI
PKEY
_FA
0x60
OTG_RI
OTG_FA
_RI
_FA
INT_DBG_
LATCH_R2
BST
BST
SWOUT
_OCP
VBUSOTG
_OCP
BUCK4_
OCP
BUCK3_
OCP
BUCK2_ BUCK1_
0x61
0x62
0x63
_OVP
_OCP
OCP
OCP
INT_DBG_
LATCH_R3
SWOUT_ VBUS
LDO6_
LDO5_
OCP
LDO4_
OCP
LDO3_
OCP
LDO2_
OCP
LDO1_
OCP
SH
OTG_SH OCP
INT_DBG_
LATCH_R4
SWIN
_RI
SWIN
_FA
VINLOW VINLOW
_RI _FA
THW
_FA
reserved reserved
THW_RI
Address: 0x60-0x63
Type: write register - read x00
Default: 0x00
Description: interrupt debug latch registers. Write registers only. Read always return 0x00.
Writing 1 in the bit forces the corresponding interrupt event in INT_PENDING_Rx
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
DS12792 - Rev 7
page 104/140
STPMIC1
Interrupt registers
6.5.7
Interrupt clear registers (INT_CLEAR_Rx)
Table 54. INT_CLEAR_Rx
Name
Address
7
6
5
4
3
2
1
0
INT
SWOUT SWOUT
VBUSOTG VBUSOTG WKP
WKP
PKEY
_RI
PKEY
_FA
0x70
_CLEAR_R1
_RI
_FA
_RI
_FA
_RI
_FA
INT
BST
BST
SWOUT
_OCP
VBUSOTG BUCK4
BUCK3
_OCP
BUCK2 BUCK1
0x71
0x72
0x73
_CLEAR_R2
_OVP
_OCP
_OCP
_OCP
_OCP
_OCP
INT
SWOUT VBUSOTG LDO6_
LDO5
_OCP
LDO4
_OCP
LDO3
_OCP
LDO2
_OCP
LDO1
_OCP
_CLEAR_R3
_SH
_SH
OCP
INT
SWIN
_RI
SWIN
_FA
VINLOW VINLOW THW
_RI _FA _RI
THW
_FA
reserved
reserved
_CLEAR_R4
Address: 0x70-0x73
Type: write register - read x00
Default: 0x00
Description: Interrupt clear registers. Write registers only. Read always return 0x00.
Writing 1 clears the corresponding interrupt event in INT_PENDING_Rx
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
DS12792 - Rev 7
page 105/140
STPMIC1
Interrupt registers
6.5.8
Interrupt mask registers (INT_MASK_Rx)
Table 55. INT_MASK_Rx
Name
Address
7
6
5
4
3
2
1
0
INT
_MASK
_R1
SWOUT
_RI
SWOUT_
FA
VBUS
VBUS
WKP
_RI
WKP
_FA
PKEY
_RI
PKEY
_FA
0x80
OTG_RI
OTG_FA
INT
_MASK
_R2
BST
SWOUT_
OCP
VBUS
BUCK4_
OCP
BUCK3_
OCP
BUCK2_
OCP
BUCK1_
OCP
0x81
0x82
0x83
BST_OCP
_OVP
OTG_OCP
INT
_MASK
_R3
SWOUT
_SH
VBUS
LDO6_
OCP
LDO5
_OCP
LDO4_
OCP
LDO3_
OCP
LDO2_
OCP
LDO1_
OCP
OTG_SH
INT
_MASK
_R4
SWIN
_RI
SWIN
_FA
VINLOW_
RI
VINLOW_
FA
THW
_RI
THW
_FA
reserved
reserved
Address: 0x80 – 0x83
Type: read/write register
Default: 0xFF
0x83
Description: interrupt mask registers. Registers are default on RSTn assertion.
Reading 1 from the bit means the corresponding interrupt event is masked
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
DS12792 - Rev 7
page 106/140
STPMIC1
Interrupt registers
6.5.9
Interrupt set mask registers (INT_SET_MASK_Rx)
Table 56. INT_SET_MASK_Rx
Name
Address
7
6
5
4
3
2
1
0
INT_SET
SWOUT
_RI
SWOUT
_FA
VBUS
VBUSOTG
_FA
WKP
_RI
WKP
_FA
PKEY
_RI
PKEY
_FA
0x90
_MASK_R1
OTG_RI
INT_SET
BST
BST
SWOUT
_OCP
VBUS
BUCK4_
OCP
BUCK3_
OCP
BUCK2_
OCP
BUCK1_
OCP
0x91
0x92
0x93
_MASK_R2
_OVP
_OCP
OTG_OCP
INT_SET
SWOUT
_SH
VBUS
LDO6_
OCP
LDO5_
OCP
LDO4_
OCP
LDO3_
OCP
LDO2_
OCP
LDO1_
OCP
_MASK_R3
OTG_SH
INT_SET
SWIN
_RI
SWIN
_FA
VINLOW
_RI
VINLOW
_FA
THW
_RI
THW
_FA
reserved
reserved
_MASK_R4
Address: 0x90 – 0x93
Type: write registers - read x00
Default: 0x00
Description: interrupt set mask registers. Registers are default on RSTn assertion
Writing 1 in the bit forces the mask of the corresponding interrupt event in INT_MASK_Rx
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
DS12792 - Rev 7
page 107/140
STPMIC1
Interrupt registers
6.5.10
Interrupt clear mask registers (INT_CLEAR_MASK_Rx)
Table 57. INT_CLEAR_MASK_Rx
Name
Address
7
6
5
4
3
2
1
0
INT_CLEAR
_MASK_R1
SWOUT
_RI
SWOUT
_FA
VBUS
VBUS
WKP
_RI
WKP
_FA
PKEY
_RI
PKEY
_FA
0xA0
OTG_RI
OTG_FA
INT_CLEAR
_MASK_R2
BST
BST
SWOUT
_OCP
VBUS
BUCK4_
OCP
BUCK3_
OCP
BUCK2_
OCP
BUCK1_
OCP
0xA1
0xA2
0xA3
_OVP
_OCP
OTG_OCP
INT_CLEAR
_MASK_R3
SWOUT
_SH
VBUS
LDO6_
OCP
LDO5_
OCP
LDO4_
OCP
LDO3_
OCP
LDO2_
OCP
LDO1_
OCP
OTG_SH
INT_CLEAR
_MASK_R4
SWIN
_RI
SWIN
_FA
VINLOW
_RI
VINLOW
_FA
THW
_RI
THW
_FA
reserved
reserved
Address: 0xA0 – 0xA3
Type: write register - read x00
Default: 0x00
Description: interrupt clear registers. Registers are default on RSTn assertion.
Writing 1 in the bit clears the mask of the corresponding interrupt in INT_MASK_Rx.
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
DS12792 - Rev 7
page 108/140
STPMIC1
Interrupt registers
6.5.11
Interrupt source register 1 (INT_SRC_R1)
Table 58. INT_SRC_R1
7
SWOUT
R
6
reserved
R
5
VBUSOTG
R
4
reserved
R
3
WKP
R
2
reserved
R
1
PKEY
R
0
reserved
R
Address: 0xB0
Type: read register
Default: 0x00
Description: interrupt source register 1. Register is reset on RSTn assertion.
State bit is 1 as long as event source is active.
SWOUT: SWOUT event source state
[7]
[6]
[5]
[4]
[3]
[2]
[1]
[0]
0: inactive
1: active
reserved
VBUSOTG: VBUSOTG event source state
0: inactive
1: active
reserved
WKP: WAKEUP event source state
0: inactive
1: active
reserved
PKEY: PONKEYn event source state
0: inactive
1: active
reserved
DS12792 - Rev 7
page 109/140
STPMIC1
Interrupt registers
6.5.12
Interrupt source register 2 (INT_SRC_R2)
Table 59. INT_SRC_R2
7
6
5
4
3
2
1
0
BST_OVP BST_OCP SWOUT_OCP VBUSOTG_OCP BUCK4_OCP BUCK3_OCP BUCK2_OCP BUCK1_OCP
R
R
R
R
R
R
R
R
Address: 0xB1
Type: read register
Default: 0x00
Description: interrupt source register 2. Register is set to default on RSTn assertion. State bit is 1 as long as
event source is active.
BST_OVP: overvoltage detection on Boost output
[7]
[6]
[5]
[4]
[3]
[2]
[1]
[0]
0: inactive
1: active
BST_OCP: Current limitation detection on Boost output
0: inactive
1: active
SWOUT_OCP: Current limitation detection on SWOUT
0: inactive
1: active
VBUSOTG_OCP: Current limitation detection on VBUSOTG
0: inactive
1: active
BUCK4_OCP: Current limitation detection on Buck4
0: inactive
1: active
BUCK3_OCP: Current limitation detection on Buck3
0: inactive
1: active
BUCK2_OCP: Current limitation detection on Buck2
0: inactive
1: active
BUCK1_OCP: Current limitation detection on Buck1
0: inactive
1: active
DS12792 - Rev 7
page 110/140
STPMIC1
Interrupt registers
6.5.13
Interrupt source register 3 ( INT_SRC_R3)
Table 60. INT_SRC_R3
7
SWOUT_SH
R
6
5
4
3
2
1
0
VBUSOTG_SH
R
LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
R
R
R
R
R
R
Address: 0xB2
Type: read register
Default: 0x00
Description: interrupt source register 3. Register is default on RSTn assertion. State bit is 1 as long as event
source is active.
SWOUT_SH: Current limitation detection on SWOUT
[7]
[6]
[5]
[4]
[3]
[2]
[1]
[0]
0: inactive
1: active
VBUSOTG_SH: Current limitation detection on VBUSOTG
0: inactive
1: active
LDO6_OCP: Current limitation detection on LDO6
0: inactive
1: active
LDO5_OCP: Current limitation detection on LDO5
0: inactive
1: active
LDO4_OCP: Current limitation detection on LDO4
0: inactive
1: active
LDO3_OCP: Current limitation detection on LDO3
0: inactive
1: active
LDO2_OCP: Current limitation detection on LDO2
0: inactive
1: active
LDO1_OCP: Current Limitation detection on LDO1
0: inactive
1: active
DS12792 - Rev 7
page 111/140
STPMIC1
Interrupt registers
6.5.14
Interrupt source register 4 ( INT_SRC_R4)
Table 61. INT_SRC_R4
7
SWIN
R
6
reserved
R
5
reserved
R
4
reserved
R
3
VINLOW
R
2
reserved
R
1
THW
R
0
reserved
R
Address: 0xB3
Type: read register
Default: 0x00
Description: interrupt source register 4. Register is default on RSTn assertion. State bit is 1 as long as event
source is active.
SWIN: SWIN event source state
[7]
[6 :4]
[3]
0: inactive
1: active
reserved
VINLOW: VINLOW event source state
0: inactive
1: active
[2]
reserved
THW: Temperature event source state
[1]
0: inactive
1: active
[0]
reserved
DS12792 - Rev 7
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STPMIC1
NVM registers
6.6
NVM registers
6.6.1
NVM status register (NVM_SR)
Table 62. NVM_SR
7
reserved
R
6
reserved
R
5
reserved
R
4
reserved
R
3
reserved
R
2
reserved
R
1
reserved
R
0
NVM_BUSY
R
Address: 0xB8
Type: read only register
Default: 0x00
Description: NVM status register.
[7 :1]
[0]
reserved
NVM_BUSY: NVM controller status
0: NVM controller is in idle state
1: NVM controller is in busy state
Self-cleared when the operation is completed
DS12792 - Rev 7
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STPMIC1
NVM registers
6.6.2
NVM control register (NVM_CR)
Table 63. NVM_CR
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
NVM_CMD[1:0]
R/W
R/W
Address: 0xB9
Type: read/write register
Default: 0x00
Description: NVM control register
[7 :2] reserved
NVM_CMD[1:0]: NVM controller command bits to control NVM operation on NVM shadow register bits.
00: No operation
[1:0] 01: Program (write shadow register to NVM)
10: Read (load NVM content into shadow registers)
11: No operation
DS12792 - Rev 7
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STPMIC1
NVM shadow registers
6.7
NVM shadow registers
DS12792 - Rev 7
page 115/140
STPMIC1
NVM shadow registers
DS12792 - Rev 7
page 116/140
STPMIC1
NVM shadow registers
DS12792 - Rev 7
page 117/140
STPMIC1
NVM shadow registers
6.7.1
NVM main control shadow register (NVM_MAIN_CTRL_SHR)
Table 65. NVM_MAIN_CTRL_SHR
7
6
5
4
3
2
1
0
VINOK_HYS[1:0]
R/W R/W
VINOK_THRES[1:0]
R/W R/W
FORCE_LDO4
R/W
PEKYLKP_OFF
R/W
AUTO_TURN_ON
R/W
LOCK_OCP
R/W
Address: 0xF8
Type: read write register
Default: depends on the part number, refer to Table 64. NVM shadow register map
Description: NVM main control shadow register.
VINOK_HYS[1:0]: VINOK threshold hysteresis
00 : 200 mV
[7:6] 01 : 300 mV
10: 400 mV
11: 500 mV
VINOK_THRES[1:0]: VINOK_Rise threshold voltage
00 : 3.1 V
[5:4] 01 : 3.3 V
10: 3.5 V
11: 4.0 V
FORCE_LDO4:
[3] 0: LDO4 starts with rank LDO4_RANK[1:0] only if VBUS_det turn-ON condition occurs
1: LDO4 starts with rank LDO4_RANK[1:0] every turn-ON condition
PKEYLKP_OFF:
[2] 0: Turn-OFF on long key press inactive
1: Turn-OFF on long key press active
AUTO_TURN_ON:
[1] 0: STPMIC1 does not start automatically on VIN rising
1: STPMIC1 starts automatically on VIN rising
LOCK_OCP:
0: STPMIC1 is turned OFF only if regulator related OCPOFF bit is set in Section 6.3.12 Bucks OCP turn-OFF control
register (BUCKS_OCPOFF_CR) or Section 6.3.13 LDO OCP turn-OFF control register (LDOS_OCPOFF_CR) .
[0]
1: short-circuit turn-OFF STPMIC1 and keep it in LOCK_OCP state until LOCK_OCP_FLAG is reset
Refer to Section 5.4.7 Overcurrent protection (OCP)
DS12792 - Rev 7
page 118/140
STPMIC1
NVM shadow registers
6.7.2
NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR)
Table 66. NVM_BUCKS_RANK_SHR
7
6
5
4
3
2
1
0
BUCK4_RANK[1:0]
BUCK3_RANK[1:0]
R/W R/W
BUCK2_RANK[1:0]
R/W R/W
BUCK1_RANK [1:0]
R/W
R/W
R/W
R/W
Address: 0xF9
Type: read write register
Default: Depends on part number refer to Table 64. NVM shadow register map
Description: NVM buck rank shadow register.
BUCK4_RANK[1:0]:
00: rank0
[7:6]
[5:4]
[3:2]
[1:0]
01: rank1
10: rank2
11: rank3
BUCK3_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
BUCK2_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
BUCK1_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
DS12792 - Rev 7
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STPMIC1
NVM shadow registers
6.7.3
NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1)
Table 67. NVM_LDOS_RANK_SHR1
7
6
5
4
3
2
1
0
LDO4_RANK[1:0]
R/W R/W
LDO3_RANK[1:0]
R/W R/W
LDO2_RANK[1:0]
R/W R/W
LDO1_RANK[1:0]
R/W
R/W
Address: 0xFA
Type: read write register
Default: Depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDOs rank shadow register 1.
LDO4_RANK[1:0]:
00: rank0
[7:6]
[5:4]
[3:2]
[1:0]
01: rank1
10: rank2
11: rank3
LDO3_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
LDO2_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
LDO1_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
DS12792 - Rev 7
page 120/140
STPMIC1
NVM shadow registers
6.7.4
NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2)
Table 68. NVM_LDOS_RANK_SHR2
7
6
5
4
3
2
1
0
BUCK4_CLAMP
R/W
LDO3_BYPASS
R/W
REFDDR_RANK[1:0]
R/W R/W
LDO6_RANK[1:0]
R/W R/W
LDO5_RANK[1:0]
R/W
R/W
Address: 0xFB
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDOs rank shadow register 2
BUCK4_CLAMP: Clamp Buck4 output value to 1.3 V max.
[7]
[6]
0: VOUT[5:0] of Buck4 is not clamped
1: VOUT[5:0] of Buck4 is clamped to b011100 (1.3 V)
LDO3_BYPASS: LDO3 forced bypass mode
0: LDO3 not in bypass mode
1: LDO3 in bypass mode
REFDDR_RANK[1:0]:
00: rank0
[5:4]
[3:2]
[1:0]
01: rank1
10: rank2
11: rank3
LDO6_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
LDO5_RANK[1:0]:
00: rank0
01: rank1
10: rank2
11: rank3
DS12792 - Rev 7
page 121/140
STPMIC1
NVM shadow registers
6.7.5
NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR)
Table 69. NVM_BUCKS_VOUT_SHR
7
6
5
4
3
2
1
0
BUCK4_VOUT[1:0]
BUCK3_VOUT[1:0]
R/W R/W
BUCK2_VOUT[1:0]
R/W R/W
BUCK1_VOUT[1:0]
R/W
R/W
R/W
R/W
Address: 0xFC
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM Bucks VOUT register.
BUCK4_VOUT[1:0]: Buck4 default output selection
00: 1.15 V
[7:6]
[5:4]
[3:2]
[1:0]
01: 1.2 V
10: 1.8 V
11: 3.3 V
BUCK3_VOUT[1:0]: Buck3 default output selection
00: 1.2 V
01: 1.8 V
10: 3.0 V
11: 3.3 V
BUCK2_VOUT[1:0]: Buck2 default output selection
00: 1.1 V
01: 1.2 V
10: 1.35 V
11: 1.5 V
BUCK1_VOUT[1:0]: Buck1 default output selection
00: 1.1 V
01: 1.15 V
10: 1.2 V
11: 1.5 V
DS12792 - Rev 7
page 122/140
STPMIC1
NVM shadow registers
6.7.6
NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1
Table 70. NVM_LDOS_VOUT_SHR1
7
SWOUT_BOOST_OVP
R/W
6
5
4
3
2
1
0
reserved
R/W
LDO3_VOUT[1:0]
R/W R/W
LDO2_VOUT[1:0]
R/W R/W
LDO1_VOUT[1:0]
R/W
R/W
Address: 0xFD
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDO1 to LDO3 default voltage output setting shadow register.
SWOUT_BOOST_OVP:
[7]
[6]
0: PWR_SW does not turn OFF if boost OVP occurs
1: PWR_SW is turned OFF automatically if Boost OVP occurs
reserved
LDO3_VOUT[1:0]: LDO3 default output selection
00: 1.8 V
[5:4]
[3:2]
[1:0]
01: 2.5 V
10: 3.3 V
11: VOUT[5:0] of Buck2 divided by 2
LDO2_VOUT[1:0]: LDO2 default output selection
00: 1.8 V
01: 2.5 V
10: 2.9 V
11: 3.3 V
LDO1_VOUT[1:0]: LDO1 default output selection
00: 1.8 V
01: 2.5 V
10: 2.9 V
11: 3.3 V
DS12792 - Rev 7
page 123/140
STPMIC1
NVM shadow registers
6.7.7
NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2)
Table 71. NVM_LDOS_VOUT_SHR2
7
6
5
4
3
2
1
0
reserved
R/W
reserved
R/W
reserved
R/W
reserved
R/W
LDO6_VOUT[1:0]
R/W R/W
LDO5_VOUT[1:0]
R/W
R/W
Address: 0xFE
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDO5-6 voltage output shadow register.
[7:4]
[3:2]
reserved
LDO6_VOUT[1:0]: LDO6 default output selection
00: 1.0 V
01: 1.2 V
10: 1.8 V
11: 3.3 V
LDO5_VOUT[1:0]: LDO5 default output selection
00: 1.8 V
01: 2.5 V
10: 2.9 V
11 : 3.3 V
[1:0]
DS12792 - Rev 7
page 124/140
STPMIC1
NVM shadow registers
6.7.8
NVM device address shadow register (I2C_ADDR_SHR)
Table 72. NVM_I2C_ADDR_AHR
7
6
5
4
3
2
1
0
reserved
R/W
I2C_ADDR[6:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Address: 0xFF
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM device address shadow register.
[7]
Reserved
2
I2C_ADDR[6:0]: I C device address.
[6:0]
Warning: applied immediately, next access should use new address
DS12792 - Rev 7
page 125/140
STPMIC1
Package information
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
7.1
WFQFN 44L (5X6X0.8) package information
Figure 64. WFQFN 44L (5X6X0.8) package outline
DS12792 - Rev 7
page 126/140
STPMIC1
WFQFN 44L (5X6X0.8) package information
Table 73. WFQFN 44L (5X6X0.8) mechanical data
mm
Typ.
Symbol
Min.
0.65
0.00
Max.
0.80
0.05
A
A1
A3
b
0.75
0.02
0.2 REF
0.21
0.16
3.40
0.26
3.60
D
5.00 BSC
3.50
D2
e
0.40 BSC
6.00 BSC
4.50
E
E2
L
4.40
0.30
0.20
4.60
0.50
0.40
k
N
44
Figure 65. WFQFN 44L (5X6X0.8) recommended footprint
DS12792 - Rev 7
page 127/140
STPMIC1
Packing information
7.2
Packing information
Figure 66. Tape outline
Figure 67. Reeel outline
DS12792 - Rev 7
page 128/140
STPMIC1
Marking composition
8
Marking composition
Figure 68. Marking composition
MARKING COMPOSITION :
PACKAGE FACE: TOP
VFQFPN 5.0 X 6.0 X 1 44L PITCH 0.4
LEGEND
Unmarkable surface
A
B
Marking composition field
A - 85256 - DOT
B - 85264 - MARKING AREA
C
F
D
E
K
C - 85263 - Assy Plant
(PP)
D - 85262 - BE Sequence
G
H
(LLL)
E - 85261 - Diffusion
Traceability Plant
(WX)
J
I
F - 85260 - COUNTRY OF ORIGIN
(MAX CHAR ALLOWED = 3)
G - 85259 - Assy Year
(Y)
H - 85258 - Assy Week
(WW)
I - 85265 - Second_lvl_intct
J - 85255 - MARKING AREA
K - 85257 - ADDITIONAL
INFORMATION
(MAX CHAR ALLOWED = 2)
DS12792 - Rev 7
page 129/140
STPMIC1
Ordering information
9
Ordering information
Table 74. Ordering information
Order code
Part number
STPMIC1A
STPMIC1B
STPMIC1C
STPMIC1D
STPMIC1E
Marking
VIO (BUCK3) programming
Packing
STPMIC1APQR(1)
STPMIC1BPQR(1)
STPMIC1CPQR(1)
STPMIC1DPQR(1)
STPMIC1EPQR(1)
3.3 V(2)
1.8 V(2)
STPMIC1A
STPMIC1B
STPMIC1C
STPMIC1D
STPMIC1E
Not programmed
3.3 V(2)
WFQFN 44L (5x6x0.8)
1.8 V(2)
1. xR= tape and reel packing
2. Refer to Table 1. Default NVM configuration vs part number for all default output voltages in NVM configuration.
DS12792 - Rev 7
page 130/140
STPMIC1
Revision history
Table 75. Document revision history
Date
Version
Changes
26-Jun-2019
1
Initial release.
Updated Table 4. Absolute maximum ratings, Table 7. Electrical and timing
parameters and Table 11. Turn-on description.
17-Oct-2019
2
Updated Figure 68. Marking composition.
Updated Section 4.5 Boost converter and power switches and
Section 5.4.2 Turn-ON conditions.
Updated Section 1 Device configuration, Section 5.5.2 Non-volatile
memory (NVM) and Section 6.7.8 NVM device address shadow register
(I2C_ADDR_SHR).
30-Jan-2020
22-Jun-2020
3
4
Updated Table 3. Pin description, Table 4. Absolute maximum ratings,
Table 7. Electrical and timing parameters and Table 18. Register map.
Updated , Table 1. Default NVM configuration vs part number and
Table 74. Ordering information.
23-Sep-2020
5
Updated Section 5.5.2 Non-volatile memory (NVM) and
Section 6.2.6 Version status register (VERSION_SR).
27-Nov-2020
15-Dec-2020
6
7
Updated Table 2. Passive components.
Added the Section 7.2 Packing information.
DS12792 - Rev 7
page 131/140
STPMIC1
Contents
Contents
1
2
Device configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Typical application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2.1
2.2
Recommended external components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Electrical and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
3.1
3.2
3.3
3.4
3.5
Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Consumption in typical application scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical and timing parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application board curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
4
Power regulators and switch description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
4.1
4.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
LDO regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
4.2.1
4.2.2
4.2.3
LDO regulators - common features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
LDO regulators - special features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
LDO output voltage settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.3
4.4
4.5
4.6
DDR memory sub-system examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
4.3.1
4.3.2
Powering lpDDR2/lpDDR3 memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Powering DDR3/DDR3L memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Buck converters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
4.4.1
4.4.2
BUCK general description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
BUCK output voltage settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Boost converter and power switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
4.5.1
4.5.2
Boost converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PWR_USB_SW and PWR_SW power switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
USB sub-system examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
5
Functional description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
5.1
5.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Functional state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
5.2.1
Main state machine diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
DS12792 - Rev 7
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STPMIC1
Contents
5.2.2
State explanations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
5.3
5.4
POWER_UP, POWER_DOWN sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Feature description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
5.4.7
5.4.8
5.4.9
VIN conditions and monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Turn-ON conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Turn-OFF conditions and restart_request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Reset and mask_reset option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Power control modes (MAIN / ALTERNATE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Overcurrent protection (OCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
BOOST overvoltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Watchdog feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
5.5
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2
5.5.1
5.5.2
I C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Non-volatile memory (NVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
6
Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
6.1
6.2
User register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
Status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
Turn-ON status register (TURN_ON_SR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Turn-OFF status register (TURN_OFF_SR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Overcurrent protection LDO turn-OFF status register (OCP_LDOS_SR) . . . . . . . . . . . . . 71
Overcurrent protection buck turn-OFF status register (OCP_BUCKS_BSW_SR) . . . . . . . 72
Restart status register (RESTART_SR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Version status register (VERSION_SR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
6.3
Control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
Main control register (MAIN_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Pads pull control register (PADS_PULL_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Bucks pull-down control register (BUCKS_PD_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
LDO1-4 pull-down control register (LDO14_PD_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
LDO5/6 pull-down control register (LDO56_VREF_PD_CR) . . . . . . . . . . . . . . . . . . . . . . . 79
PWR_SWOUT and VIN control register (SW_VIN_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . 80
PONKEYn turn-OFF control register (PKEY_TURNOFF_CR). . . . . . . . . . . . . . . . . . . . . . 81
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Contents
6.3.8
6.3.9
Mask reset Buck control register (BUCKS_MRST_CR). . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Mask reset LDO control register (LDOS_MRST_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.10 Watchdog control register (WDG_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
6.3.11 Watchdog timer control register (WDG_TMR_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
6.3.12 Bucks OCP turn-OFF control register (BUCKS_OCPOFF_CR) . . . . . . . . . . . . . . . . . . . . 86
6.3.13 LDO OCP turn-OFF control register (LDOS_OCPOFF_CR) . . . . . . . . . . . . . . . . . . . . . . . 87
Power supplies control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
6.4
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
6.4.6
6.4.7
6.4.8
6.4.9
BUCKx MAIN mode control registers (BUCKx_MAIN_CR) (x=1…4). . . . . . . . . . . . . . . . . 88
REFDDR MAIN mode control register (REFDDR_MAIN_CR). . . . . . . . . . . . . . . . . . . . . . 89
LDOx MAIN mode control registers (LDOx_MAIN_CR) (x=1, 2, 5, 6) . . . . . . . . . . . . . . . . 90
LDO3 MAIN mode control register (LDO3_MAIN_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
LDO4 MAIN mode control register (LDO4_MAIN_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
BUCKx ALTERNATE mode control registers (BUCKx_ALT_CR)(x=1..4). . . . . . . . . . . . . . 93
REFDDR ALTERNATE mode control register (REFDDR_ALT_CR) . . . . . . . . . . . . . . . . . 94
LDOx ALTERNATE mode control registers (LDOx_ALT_CR) (x=1, 2, 5, 6). . . . . . . . . . . . 95
LDO3 ALTERNATE mode control register (LDO3_ALT_CR) . . . . . . . . . . . . . . . . . . . . . . . 96
6.4.10 LDO4 ALTERNATE mode control register (LDO4_ALT_CR) . . . . . . . . . . . . . . . . . . . . . . . 97
6.4.11 Boost/switch control register (BST_SW_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
6.5
Interrupt registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
6.5.1
6.5.2
6.5.3
6.5.4
6.5.5
6.5.6
6.5.7
6.5.8
6.5.9
Overall interrupt register behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Interrupt pending register 1 (INT_PENDING_R1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Interrupt pending register 2 (INT_PENDING_R2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Interrupt pending register 3 (INT_PENDING_R3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Interrupt pending register 4 (INT_PENDING_R4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Interrupt debug latch registers (INT_DBG_LATCH_Rx) . . . . . . . . . . . . . . . . . . . . . . . . . 104
Interrupt clear registers (INT_CLEAR_Rx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Interrupt mask registers (INT_MASK_Rx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Interrupt set mask registers (INT_SET_MASK_Rx). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
6.5.10 Interrupt clear mask registers (INT_CLEAR_MASK_Rx). . . . . . . . . . . . . . . . . . . . . . . . . 108
6.5.11 Interrupt source register 1 (INT_SRC_R1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
6.5.12 Interrupt source register 2 (INT_SRC_R2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
6.5.13 Interrupt source register 3 ( INT_SRC_R3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
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Contents
6.5.14 Interrupt source register 4 ( INT_SRC_R4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
6.6
6.7
NVM registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
6.6.1
6.6.2
NVM status register (NVM_SR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
NVM control register (NVM_CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
NVM shadow registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
6.7.1
6.7.2
6.7.3
6.7.4
6.7.5
6.7.6
6.7.7
6.7.8
NVM main control shadow register (NVM_MAIN_CTRL_SHR). . . . . . . . . . . . . . . . . . . . 118
NVM BUCK rank shadow register (NVM_BUCKS_RANK_SHR). . . . . . . . . . . . . . . . . . . 119
NVM LDOs rank shadow register 1 (NVM_LDOS_RANK_SHR1) . . . . . . . . . . . . . . . . . . 120
NVM LDOs rank shadow register 2 (NVM_LDOS_RANK_SHR2) . . . . . . . . . . . . . . . . . . 121
NVM BUCKs voltage output shadow register (NVM_BUCKS_VOUT_SHR) . . . . . . . . . . 122
NVM LDOs voltage output shadow register 1 (NVM_LDOS_VOUT_SHR1. . . . . . . . . . . 123
NVM LDOs voltage output shadow register 2 (NVM_LDOS_VOUT_SHR2) . . . . . . . . . . 124
NVM device address shadow register (I2C_ADDR_SHR). . . . . . . . . . . . . . . . . . . . . . . . 125
7
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
7.1
7.2
WFQFN 44L (5x6x0.8) package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .128
8
9
Marking composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
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STPMIC1
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Default NVM configuration vs part number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Passive components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Consumption in typical application scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical and timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
LDO output voltage settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 10. BUCK output settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 11. Turn-on description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 12. Turn-off conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 13. MAIN/ALTERNATE switch example configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table 14. OCP levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 15. Device ID format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 16. Register address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 17. Register data format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 18. Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 19. TURN_ON_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 20. TURN_OFF_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 21. OCP_LDOS_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 22. OCP_BUCKS_BSW_SR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table 23. RESTART_SR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 24. VERSION_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 25. MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Table 26. PADS_PULL_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Table 27. BUCKS_PD_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 28. LDO14_PD_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Table 29. LDO56_VREF_PD_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Table 30. SW_VIN_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 31. PKEY_TURNOFF_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 32. BUCKS_MRST_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 33. LDOS_MRST_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 34. WDG_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 35. WDG_TMR_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 36. BUCKS_OCPOFF_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 37. LDOS_OCPOFF_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Table 38. BUCKx_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 39. REFDDR_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 40. LDOx_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 41. LDO3_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 42. LDO4_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Table 43. BUCKx_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Table 44. REFDDR_ALT_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table 45. LDOx_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 46. LDO3_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 47. LDO4_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 48. BST_SW_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 49. INT_PENDING_R1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Table 50. INT_PENDING_R2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Table 51. INT_PENDING_R3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Table 52. INT_PENDING_R4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
DS12792 - Rev 7
page 136/140
STPMIC1
List of tables
Table 53. INT_DBG_LATCH_Rx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Table 54. INT_CLEAR_Rx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Table 55. INT_MASK_Rx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Table 56. INT_SET_MASK_Rx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Table 57. INT_CLEAR_MASK_Rx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Table 58. INT_SRC_R1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Table 59. INT_SRC_R2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Table 60. INT_SRC_R3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
Table 61. INT_SRC_R4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
Table 62. NVM_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Table 63. NVM_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114
Table 64. NVM shadow register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
Table 65. NVM_MAIN_CTRL_SHR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
Table 66. NVM_BUCKS_RANK_SHR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
Table 67. NVM_LDOS_RANK_SHR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Table 68. NVM_LDOS_RANK_SHR2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Table 69. NVM_BUCKS_VOUT_SHR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Table 70. NVM_LDOS_VOUT_SHR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Table 71. NVM_LDOS_VOUT_SHR2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Table 72. NVM_I2C_ADDR_AHR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Table 73. WFQFN 44L (5X6X0.8) mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Table 74. Ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Table 75. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
DS12792 - Rev 7
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STPMIC1
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin configuration WFQFN 44L top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
BUCK1 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
BUCK2 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
BUCK3 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
BUCK4 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Boost efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Boost powered by 5 V supply having poor performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
BUCK1 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Buck1 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
BUCK2 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Buck2 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Buck3 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Buck3 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Buck4 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Buck4 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
LDO1 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LDO2 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LDO3 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LDO4 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LDO5 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LDO6 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
LDO4 line transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Boost output vs. input voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Boost load regulation 5 VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Boost load regulation 3.6 VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LDO1 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LDO2 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LDO3 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LDO5 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LDO6 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LDO3 sink/source mode load transient response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Buck1 turn-ON waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STPMIC1A POWER_UP sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STPMIC1A POWER_UP sequencing PONKEYn. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STPMIC1A POWER_DOWN sequencing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STPMIC1A reset sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
LDO start-up/shutdown timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Powering lpDDR2/lpDDR3 memory (LDO3 in bypass mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Powering lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN) . . . . . . . . . . . . . . . . . . . . . . . . 32
Powering DDR3/DDR3L memory (LDO3 in sink/source mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PWM clock generation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
PWM clock synchronisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Buck block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
BUCKx LP to HP mode recovery time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
BUCKx start-up/shutdown timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
BUCKx dynamic voltage scaling (DVS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Boost and switch block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Boost start-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Battery powered application with a USB OTG port and a USB host port . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Battery powered application with a single USB OTG port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
5 V DC powered application with a USB OTG port and two USB host ports . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
DS12792 - Rev 7
page 138/140
STPMIC1
List of figures
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
STPMIC1 state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
STPMIC1 POWER_UP and POWER_DOWN sequence example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
VIN monitoring thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Auto turn-on condition sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Turn-on condition after VIN_POR_RISE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Turn-on condition before VIN_POR_Rise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Reset power-cycle sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Power mode switch sequence example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Thermal protection thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 62.
I2C read operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Figure 63.
Figure 64.
Figure 65.
Figure 66.
Figure 67.
Figure 68.
I2C write operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
WFQFN 44L (5X6X0.8) package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
WFQFN 44L (5X6X0.8) recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Tape outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Reeel outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Marking composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
DS12792 - Rev 7
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STPMIC1
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DS12792 - Rev 7
page 140/140
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STPMS2H-PUR
Smart sensor II dual-channel 1-bit, 4 MHz, second-order sigma-delta modulator with embedded PGLNA
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Smart sensor II dual-channel 1-bit, 4 MHz, second-order sigma-delta modulator with embedded PGLNA
STMICROELECTR
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