STPS1150M [STMICROELECTRONICS]
1A 150 V power Schottky rectifier;
| 型号： | STPS1150M |
| 厂家： | 
ST |
| 描述： | 1A 150 V power Schottky rectifier 整流二极管 PC |
| 文件： | 总7页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS1150
Power Schottky rectifier
Main product characteristics
IF(AV)
VRRM
1 A
150 V
175° C
0.67 V
Tj (max)
VF(max)
Description
SMA
DO-41
(JEDEC DO-214AC)
STPS1150A
150 V Power Schottky rectifier are suited for
switch mode power supplies on up to 24 V rails
and high frequency converters.
STPS1150
Packaged in SMA and Axial, this device is
intended for use in consumer and computer
applications like TV, STB, PC and DVD where low
drop forward voltage is required to reduce power
dissipation.
Features and benefits
■ Negligible switching losses
■ Low forward voltage drop for higher efficiency
Order Codes
and extented battery life
■ Low thermal resistance
Part Number
Marking
■ Surface mount miniature package
■ Avalanche capability specified
STPS1150A
STPS1150
1150
STPS1150
STPS1150
STPS1150RL
Table 1.
Symbol
VRRM
Absolute Ratings (limiting values)
Parameter
Value
Unit
Repetitive peak reverse voltage
150
15
V
A
IF(RMS) RMS forward voltage
SMA
TL = 160° C δ = 0.5
TL = 150° C δ = 0.5
A
A
IF(AV)
Average forward current
1
DO-41
SMA
50
75
Surge non repetitive forward
current
IFSM
tp = 10 ms sinusoidal
tp = 1µs Tj = 25° C
DO-41
PARM
Tstg
Repetitive peak avalanche power
Storage temperature range
1500
W
-65 to + 150
175
° C
° C
Tj
Maximum operating junction temperature(1)
dPtot
dTj
1
1. --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink
Rth(j – a)
May 2006
Rev 4
1/7
www.st.com
7
Characteristics
STPS1150
1
Characteristics
Table 2.
Symbol
Thermal resistance
Parameter
Value
Unit
SMA
20
30
Rth(j-l)
Junction to lead
° C/W
Lead length = 10 mm
DO-41
Table 3.
Symbol
Static electrical characteristics
Parameter
Tests conditions
Min.
Typ
Max.
Unit
Tj = 25° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
0.2
0.2
1.0
1.0
µA
(1)
IR
Reverse leakage current
VR = VRRM
mA
0.78
0.62
0.85
0.69
0.82
0.67
0.89
0.75
IF = 1 A
(2)
VF
Forward voltage drop
V
IF = 2 A
1. t = 5 ms, δ < 2%
p
2. t = 380 µs, δ < 2%
p
To evaluate the conduction losses use the following equation:
2
P = 0.59 x IF(AV) + 0.08 IF (RMS)
Figure 1.
Average forward power
dissipation versus average
forward current
Figure 2.
Average forward current versus
ambient temperature (δ = 0.5)
P (W)
F(AV)
I
(A)
F(AV)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
δ = 0.2
δ = 0.1
δ = 0.5
Rth(j-a)=Rth(j-I)
SMA
δ = 0.05
DO-41
δ = 1
Rth(j-a)=120°C/W
T
T
T (°C)
amb
I
(A)
F(AV)
tp
=tp/T
δ
tp
=tp/T
δ
0
25
50
75
100
125
150
175
0.0
0.2
0.4
0.6
0.8
1.0
1.2
2/7
STPS1150
Figure 3.
Characteristics
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
P
(t )
p
(1µs)
ARM
P
ARM
(t )
p
(25°C)
ARM
P
ARM
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0.01
T (°C)
j
t (µs)
p
0
0.001
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
Figure 5.
Non repetitive surge peak
forward current versus overload
duration - maximum values (SMA)
Figure 6.
Non repetitive surge peak forward
current versus overload duration
- maximum values (DO-41)
I
(A)
I (A)
M
M
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
SMA
DO-41
Ta=25°C
Ta=75°C
Ta=25°C
Ta=75°C
Ta=125°C
Ta=125°C
IM
IM
t
t
t(s)
t(s)
δ
=0.5
δ=0.5
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
Figure 7.
Relative variation of thermal
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy
printed circuit board, eCu = 35 µm,
recommended pad layout (SMA)
impedance junction to ambient
versus pulse duration (DO-41)
Z
/R
Z
/R
th(j-a) th(j-a)
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMA
DO-41
δ = 0.5
δ = 0.5
δ = 0.2
δ = 0.1
δ = 0.2
δ = 0.1
T
T
Single pulse
tp
1.E+03
tp
1.E+03
=tp/T
=tp/T
t (s)
p
δ
t (s)
p
δ
Single pulse
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
3/7
Characteristics
STPS1150
Figure 9.
Reverse leakage current versus
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values)
reverse voltage applied (typical
values)
I (µA)
R
C(pF)
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
100
10
1
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
V (V)
R
V (V)
R
1
10
100
1000
0
25
50
75
100
125
150
Figure 11. Forward voltage drop versus
Figure 12. Forward voltage drop versus
forward current - maximum values,
high level (SMA)
forward current - maximum values,
low level (DO-41)
I (A)
FM
I (A)
FM
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
10
1
Tj=125°C
(maximum values)
Tj=125°C
(maximum values)
Tj=125°C
(typical values)
Tj=25°C
Tj=125°C
(maximum values)
(typical values)
Tj=25°C
(maximum values)
V
(V)
FM
V (V)
FM
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Figure 13. Thermal resistance junction to
ambient versus copper surface
under each lead - Epoxy printed
circuit board FR4, eCu = 35 µm
(SMA)
Figure 14. Thermal resistance versus lead
length (DO-41)
R
(°C/W)
th(j-a)
R
(°C/W)
th
130
120
110
100
90
120
100
80
60
40
20
0
Rth(j-a)
80
70
60
Rth(j-I)
50
40
30
20
10
L (mm)
leads
SCu(cm²)
0
5
10
15
20
25
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
4/7
STPS1150
Package information
2
Package information
Band shows cathode. Epoxy meets UL94, V0.
Table 4.
SMA Package dimensions
DIMENSIONS
Millimeters Inches
E1
REF.
Min.
Max.
Min.
Max.
D
A1
A2
b
1.90
0.05
1.25
0.15
4.80
3.95
2.25
0.75
2.03
0.20
1.65
0.41
5.60
4.60
2.95
1.60
0.075
0.002
0.049
0.006
0.189
0.156
0.089
0.030
0.080
0.008
0.065
0.016
0.220
0.181
0.116
0.063
E
c
A1
E
E1
D
A2
C
L
b
L
Figure 15. SMA Foot Print Dimensions (in mm)
1.87
1.75
1.87
1.67
5.49
Table 5.
DO-41 Package dimensions
DIMENSIONS
REF. Millimeters Inches
C
A
C
O/ B
Min. Max. Min. Max.
A
B
C
D
4.07 5.20 0.160 0.205
2.04 2.71 0.080 0.107
O
/
D
O
/
D
28
1.102
0.712 0.863 0.028 0.035
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5/7
Ordering information
STPS1150
3
Ordering information
Ordering type
Marking
Package
Weight
Base qty Delivery mode
STPS1150A
STPS1150
1150
SMA
0.068 g
0.34 g
0.34 g
5000
2000
5000
Tape and reel
Ammopack
STPS1150
STPS1150
DO-41
DO-41
STPS1150RL
Tape and reel
4
Revision history
Date
Revision
Description of Changes
Jul-2003
2A
Last update.
SMA package dimensions update. Reference A1 max. changed
from 2.70mm (0.106inc.) to 2.03mm (0.080).
Aug-2004
3
4
Reformatted to current standard. Added ECOPACK statement.
Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10.
31-May-2006
6/7
STPS1150
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