STPS20L25C [STMICROELECTRONICS]

LOW DROP POWER SCHOTTKY RECTIFIER; 电力低压降肖特基整流器


型号：	STPS20L25C
厂家：	ST
描述：	LOW DROP POWER SCHOTTKY RECTIFIER 电力低压降肖特基整流器
文件：	总5页 (文件大小：97K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

STPS20L25CT/CG

LOW DROP POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I_F(AV)

V_RRM

2 x 10 A

25 V

Tj (max)

V_F(max)

150 °C

0.35 V

FEATURES AND BENEFITS

VERY LOW FORWARD VOLTAGE DROP FOR

LESS POWER DISSIPATION AND REDUCED

HEATSINK

OPTIMIZED CONDUCTION/REVERSE LOSSES

TRADE-OFF WHICH MEANS THE HIGHEST

EFFICIENCY IN THE APPLICATIONS

TO-220AB

D²PAK

STPS20L25CG

STPS20L25CT

DESCRIPTION

Dual center tap Schottky rectifier suited to

Switched Mode Power Supplies and high

frequency DC to DC converters.

Packaged in TO-220AB and D²PAK, this device is

especially intended for use as a rectifier at the

secondary of 3.3V SMPS units.

ABSOLUTE RATINGS

Symbol

(limiting values, per diode)

Parameter

Value

Unit

V_RRM

Repetitive peak reverse voltage

I_F(RMS)RMS forward current

I_F(AV)

Average forward current

Tc = 145°C Per diode

= 0.5

Per device

I_FSM

I_RRM

I_RSM

T_stg

Surge non repetitive forward current

Repetitive peak reverse current

Non repetitive peak reverse current

Storage temperature range

tp = 10 ms Sinusoidal

tp=2 µs square F=1kHz

tp = 100 µs square

220

°C

- 65 to + 150

150

Maximum operating junction temperature *

Critical rate of rise of reverse voltage

V/ s

dV/dt

10000

dPtot

dTj

* :

thermal runaway condition for a diode on its own heatsink

Rth(j−a)

June 1999 - Ed : 3A

1/5

STPS20L25CT/CG

THERMAL RESISTANCES

Symbol

Parameter

Value

1.5

Unit

R_{th (j-c)}Junction to case

Per diode

Total

C/W

0.8

R_{th (c)}

0.1

Coupling

When the diodes 1 and 2 are used simultaneously :

∆

Tj(diode 1) = P(diode1) x R_th(j-c)(Per diode) + P(diode 2) x R_th(c)

STATIC ELECTRICAL CHARACTERISTICS (per diode)

Symbol

Tests conditions

Tj = 25°C V_R= V_RRM

Min. Typ. Max.

Unit

µA

I_R*

Reverse leakage current

800

Tj = 125 C

125

0.30

0.41

250

0.46

0.35

0.56

0.48

V_F*

Forward voltage drop

Tj = 25°C

I_F= 10 A

I_F= 20 A

Tj = 125 C

Tj = 25 C

Tj = 125 C

Pulse test : * tp = 380 µs, δ < 2%

To evaluate the maximum₂conduction losses use the following equation :

P = 0.22 x I_F(AV)+ 0.013 I_{F (RMS)}

Fig.1 :

average forward current.

Fig.2 :

Average forward current versus ambient

Average forward power dissipation versus

temperature ( = 0.5).

PF(av)(W)

IF(av)(A)

δ = 0.1

δ = 0.2

δ = 0.5

Rth(j-a)=Rth(j-c)

δ = 0.05

δ = 1

Rth(j-a)=50°C/W

Tamb(°C)

=tp/T

IF(av) (A)

=tp/T

100

125

150

10 11

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STPS20L25CT/CG

Fig.3 :

Fig.4 :

Relative variation of thermal impedance

junction to case versus pulse duration.

Non repetitive surge peak forward current

versus overload duration (maximum values).

IM(A)

Zth(j-c)/Rth(j-c)

200

1.0

180

160

140

120

0.8

Tc=25°C

δ = 0.5

0.6

100

Tc=75°C

0.4

δ = 0.2

Tc=100°C

δ = 0.1

0.2

=0.5

t(s)

Single pulse

tp(s)

=tp/T

0.0

1E-3

1E-2

1E-1

1E+0

1.0E-4

1.0E-3

1.0E-2

1.0E-1

1.0E+0

Fig.5 :

Fig.6 :

voltage applied (typical values).

Reverse leakage current versus reverse

Junction capacitance versus reverse

voltage applied (typical values).

C(nF)

IR(mA)

5E+2

5.0

Tj=150°C

F=1MHz

Tj=25°C

1E+2

Tj=125°C

1E+1

1.0

1E+0

Tj=25°C

1E-1

VR(V)

1E-2

0.1

Fig.7 :

current (maximum values).

Forward voltage drop versus forward

Fig.8 :

Thermal resistance junction to ambient

versus copper surface under tab (Epoxy printed

circuit board FR4, copper thickness : 35 m).

(STPS20L25G only)

Rth(j-a) (°C/W)

IFM(A)

100.0

Typical values

Tj=150°C

10.0

Tj=25°C

1.0

Tj=125°C

VFM(V)

S(Cu) (cm²)

0.1

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

12 16 20 24 28 32 36 40

3/5

STPS20L25CT/CG

PACKAGE MECHANICAL DATA

D²PAK

DIMENSIONS

Millimeters Inches

Min. Min.

REF.

Max.

4.60

2.69

0.23

0.93

1.70

0.60

1.36

9.35

10.40

5.28

15.85

1.40

1.75

3.20

Max.

0.181

0.106

0.009

0.037

0.067

0.024

0.054

0.368

0.409

0.208

0.624

0.055

0.069

0.126

4.40

2.49

0.03

0.70

1.14

0.45

1.23

8.95

10.00

4.88

15.00

1.27

1.40

2.40

0.173

0.098

0.001

0.027

0.045

0.017

0.048

0.352

0.393

0.192

0.590

0.050

0.055

0.094

0.40 typ.

0.016 typ.

0°

8°

0°

8°

* FLAT ZONE NO LESS THAN 2mm

FOOTPRINT DIMENSIONS

(in millimeters)

Cooling method: by conduction (method C)

16.90

10.30

5.08

1.30

3.70

8.90

4/5

STPS20L25CT/CG

PACKAGE MECHANICAL DATA

TO-220AB

DIMENSIONS

Millimeters Inches

Min. Min.

REF.

Max.

4.60

1.32

2.72

0.70

0.88

1.70

5.15

2.70

10.40

Max.

0.181

0.051

0.107

0.027

0.034

0.066

0.202

0.106

0.409

4.40

1.23

2.40

0.49

0.61

1.14

4.95

2.40

0.173

0.048

0.094

0.019

0.024

0.044

0.194

0.094

0.393

Dia

16.4 typ.

0.645 typ.

0.511

0.104

0.600

0.244

0.137

0.551

0.116

0.620

0.259

0.154

2.65

15.25

6.20

3.50

2.95

15.75

6.60

3.93

2.6 typ.

0.102 typ.

Diam.

3.75

3.85

0.147

0.151

Cooling method : C

Recommended torque value : 0.55 m.N

Maximum torque value : 0.70 m.N

Delivery

mode

Ordering type

Marking

Package

Weight

Base qty

STPS20L25CT

STPS20L25CG

STPS20L25CT

STPS20L25CG

TO-220AB

D²PAK

2.23g

1.48g

Tube

STPS20L25CG-TR

D²PAK

1000

Tape & reel

Epoxy meets UL94,V0

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-

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5/5

STPS20L25C [STMICROELECTRONICS]

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