STPS30M100SR [STMICROELECTRONICS]

100 V, 30 A power Schottky rectifier; 100 V, 30 A功率肖特基整流器
STPS30M100SR
型号: STPS30M100SR
厂家: ST    ST
描述:

100 V, 30 A power Schottky rectifier
100 V, 30 A功率肖特基整流器

整流二极管 功效
文件: 总10页 (文件大小:140K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STPS30M100S  
100 V, 30 A power Schottky rectifier  
Features  
A
Avalanche rated  
Low V  
F
K
Good trade off between leakage current and  
forward voltage drop  
A
High frequency operation  
Avalanche capability specified  
K
Description  
The STPS30M100S device is a single Schottky  
rectifier, suited for high frequency switch mode  
power supply.  
A
A
K
A
K
A
2
Packaged in TO-220AB, TO-220FPAB, and I PAK  
TO-220AB  
TO-220FPAB  
this device is intended to be used in notebook and  
game station adaptors, providing in these  
applications a good efficiency at both low and  
high load.  
STPS30M100ST  
STPS30M100SFP  
(a)  
Figure 1.  
Electrical characteristics  
I
A
V
I
"Forward"  
K
A
2 x I  
X
O
2
I PAK  
STPS30M100SR  
I
F
I
O
X
V
AR  
RRM  
Table 1.  
Device summary  
V
R
V
V
IF(AV)  
30 A  
100 V  
I
R
VRRM  
Tj (max)  
VF(typ)  
V
V
V
V
F F(2xI  
F(I  
)
)
o
To  
o
150 °C  
0.385 V  
"Reverse"  
I
AR  
a. VARM and IARM must respect the reverse safe  
operating area defined in Figure 14. VAR and IAR are  
pulse measurements (tp < 1 µs). VR, IR, VRRM and VF,  
are static characteristics  
January 2011  
Doc ID 15523 Rev 3  
1/10  
www.st.com  
10  
Characteristics  
STPS30M100S  
1
Characteristics  
Table 2.  
Symbol  
VRRM  
Absolute ratings (limiting values)  
Parameter  
Value  
Unit  
Repetitive peak reverse voltage  
100  
60  
V
A
IF(RMS) Forward rms current  
IF(AV)  
IFSM  
Average forward current δ = 0.5  
Surge non repetitive forward current  
Repetitive peak avalanche power  
Tc = 125 °C  
30  
A
tp = 10 ms sinusoidal  
tp = 1 µs Tj = 25 °C  
300  
26400  
A
PARM  
W
Maximum repetitive peak avalanche  
voltage  
tp < 1 µs Tj < 150 °C  
IAR < 66 A  
(1)  
VARM  
120  
120  
V
V
Maximum single pulse peak avalanche tp < 1 µs Tj < 150 °C  
voltage  
(1)  
VASM  
IAR < 66 A  
Tstg  
Tj  
Storage temperature range  
Maximum operating junction temperature (2)  
-65 to + 175  
150  
°C  
°C  
1. Refer to Figure 14.  
dPtot  
dTj  
1
---------------  
-------------------------  
2.  
<
condition to avoid thermal runaway for a diode on its own heatsink  
Rth(j a)  
Table 3.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
TO-220AB, I2PAK  
TO-220FPAB  
1
4
Rth(j-c) Junction to case  
°C/W  
Table 4.  
Symbol  
Static electrical characteristics with all leads connected on board  
Parameter  
Test conditions  
Tj = 25 °C  
Min. Typ. Max. Unit  
-
-
-
-
-
-
-
-
-
-
-
-
-
175  
50  
60  
20  
-
µA  
mA  
µA  
VR = VRRM  
VR = 70 V  
IF = 5 A  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
20  
(1)  
IR  
Reverse leakage current  
-
10  
mA  
0.475  
0.385  
0.555  
0.475  
-
-
IF = 10 A  
IF = 15 A  
IF = 30 A  
--  
(2)  
VF  
Forward voltage drop  
V
0.620 0.660  
0.525 0.565  
0.740 0.800  
0.605 0.655  
1. Pulse test: tp = 5 ms, δ < 2%  
2. Pulse test: tp = 380 µs, δ < 2%  
2/10  
Doc ID 15523 Rev 3  
STPS30M100S  
To evaluate the conduction losses use the following equation:  
Characteristics  
2
P = 0.475 x I  
+ 0.006 x I  
F(AV)  
F (RMS)  
Figure 2.  
Conduction losses versus average Figure 3.  
current  
Average forward current versus  
ambient temperature (δ = 0.5)  
P
(av)(W)  
I
(av)(A)  
F
F
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
35  
30  
25  
20  
15  
10  
5
δ=0.05  
δ=0.1  
δ=0.2  
δ=0.5  
δ=1  
R
=R  
th(j-a) th(j-c)  
Rth(j-a)=15°C/W  
T
T
6
4
t
=t /T  
2
δ
p
t
p
p
=t /T  
p
T
(°C)  
amb  
δ
I
(av)(A)  
20  
F
0
0
0
25  
50  
75  
100  
125  
150  
0
4
8
12  
16  
24  
28  
32  
36  
Figure 4.  
Normalized avalanche power  
derating versus pulse duration  
Figure 5.  
Normalized avalanche power  
derating versus junction  
temperature  
P
(t )  
p
ARM  
P
ARM  
(T )  
j
ARM  
(25 °C)  
P
ARM  
(1 µs)  
P
1
1.2  
1
0.1  
0.8  
0.6  
0.4  
0.2  
0.01  
T (°C)  
j
t (µs)  
p
0.001  
0
25  
50  
75  
100  
125  
150  
0.01  
0.1  
1
10  
100  
1000  
Figure 6.  
Non repetitive surge peak forward Figure 7.  
current versus overload duration  
(maximum values)  
Relative variation of thermal  
impedance junction to case versus  
pulse duration  
I
(A)  
Z
/R  
th(j-c) th(j-c)  
M
350  
300  
250  
200  
150  
100  
50  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
2
2
T0-220AB / I PAK  
T0-220AB / I PAK  
Tc=25°C  
Tc=75°C  
Tc=125°C  
IM  
Single pulse  
t
tp(s)  
t(s)  
δ
=0.5  
0
1.E-03  
1.E-02  
1.E-01  
1.E+00  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
Doc ID 15523 Rev 3  
3/10  
Characteristics  
STPS30M100S  
Figure 8.  
Non repetitive surge peak forward Figure 9.  
Relative variation of thermal  
current versus overload duration  
(maximum values) (TO-220FPAB)  
impedance junction to case versus  
pulse duration (TO-220FPAB)  
I
(A)  
Z
/R  
th(j-c) th(j-c)  
M
200  
150  
100  
50  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Tc=25°C  
Tc=75°C  
I
M
Tc=125°C  
t
t(s)  
tp(s)  
δ
=0.5  
Single pulse  
0
1.E-03  
1.E-02  
1.E-01  
1.E+00  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
1.E+01  
Figure 10. Reverse leakage current versus  
reverse voltage applied (typical  
values)  
Figure 11. Junction capacitance versus  
reverse voltage applied (typical  
values)  
I
(mA)  
R
C(pF)  
1.E+03  
1.E+02  
1.E+01  
1.E+00  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
10000  
1000  
100  
F=1M Hz  
Vosc=30m V  
Tj=25°C  
Tj=150°C  
Tj=125°C  
Tj=100°C  
Tj=75°C  
Tj=50°C  
Tj=25°C  
V
(V)  
V
(V)  
R
R
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
1
10  
100  
Figure 12. Forward voltage drop versus  
forward current (high level)  
Figure 13. Forward voltage drop versus  
forward current (low level)  
I
(A)  
I
(A)  
FM  
FM  
200  
180  
160  
140  
120  
100  
80  
30  
25  
20  
15  
10  
5
Tj=125°C  
(Maximum values)  
Tj=125°C  
(Maximum values)  
Tj=125°C  
(Typical values)  
Tj=125°C  
(Typical values)  
60  
Tj=25°C  
(Maximum values)  
Tj=25°C  
(Maximum values)  
40  
20  
V
(V)  
FM  
VFM(V)  
0
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
4/10  
Doc ID 15523 Rev 3  
STPS30M100S  
Characteristics  
Figure 14. Reverse safe operating area (t < 1 µs and T < 150 °C)  
p
j
I
(A)  
AR  
80  
75  
70  
65  
60  
55  
50  
Forbiddenarea  
Operating Area  
V
AR  
(V)  
100  
110  
120  
130  
140  
150  
Doc ID 15523 Rev 3  
5/10  
Package Information  
STPS30M100S  
2
Package Information  
Epoxy meets UL94,V0  
Recommended torque: 0.4 to 0.6 N·m  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
®
ECOPACK is an ST trademark.  
Table 5.  
TO-220AB dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min. Max.  
Min.  
Max.  
A
C
4.40  
1.23  
2.40  
0.49  
0.61  
1.14  
1.14  
4.95  
2.40  
10  
4.60  
1.32  
2.72  
0.70  
0.88  
1.70  
1.70  
5.15  
2.70  
10.40  
0.173  
0.048  
0.094  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.181  
0.051  
0.107  
0.027  
0.034  
0.066  
0.066  
0.202  
0.106  
0.409  
A
H2  
D
Dia  
C
E
L5  
L7  
F
F1  
F2  
G
L6  
L2  
F2  
F1  
D
L9  
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
M
L4  
16.4 typ.  
0.645 typ.  
F
M
13  
14  
0.511  
0.104  
0.600  
0.244  
0.137  
0.551  
0.116  
0.620  
0.259  
0.154  
G1  
E
2.65  
15.25  
6.20  
3.50  
2.95  
15.75  
6.60  
3.93  
G
2.6 typ.  
0.102 typ.  
Diam.  
3.75  
3.85  
0.147  
0.151  
6/10  
Doc ID 15523 Rev 3  
STPS30M100S  
Package Information  
Dimensions  
Table 6.  
TO-220FPAB dimensions  
Ref.  
Millimeters  
Inches  
Min.  
Max.  
Min.  
Max.  
A
B
4.4  
2.5  
4.6  
2.7  
0.173  
0.098  
0.098  
0.018  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.205  
0.106  
0.409  
A
B
H
D
2.5  
2.75  
0.70  
1
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
Dia  
F
F1  
F2  
G
1.70  
1.70  
5.20  
2.7  
L6  
L5  
L2  
L4  
L7  
L3  
G1  
H
D
10  
10.4  
F1  
F2  
L2  
L3  
L4  
L5  
L6  
L7  
Dia.  
16 Typ.  
0.63 Typ.  
28.6  
9.8  
30.6  
10.6  
3.6  
1.126  
0.386  
0.114  
0.626  
0.354  
0.118  
1.205  
0.417  
0.142  
0.646  
0.366  
0.126  
F
E
G1  
2.9  
G
15.9  
9.00  
3.00  
16.4  
9.30  
3.20  
Doc ID 15523 Rev 3  
7/10  
Package Information  
STPS30M100S  
2
Devices in I PAK with nickel-plated back frame must NOT be mounted by frame soldering  
like SMDs. Such devices are intended to be through-hole mounted ONLY and in no  
circumstances shall ST be held liable for any lack of performance or damage arising out of  
soldering of nickel-plated back frames.  
2
Table 7.  
I PAK dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min.  
Max.  
Min.  
Max.  
A
A
A1  
b
4.40  
2.40  
0.61  
1.14  
0.49  
1.23  
8.95  
2.40  
4.95  
10  
4.60  
2.72  
0.88  
1.70  
0.70  
1.32  
9.35  
2.70  
5.15  
10.40  
14  
0.173  
0.094  
0.024  
0.044  
0.019  
0.048  
0.352  
0.094  
0.195  
0.394  
0.512  
0.138  
0.050  
0.181  
0.107  
0.035  
0.067  
0.028  
0.052  
0.368  
0.106  
0.203  
0.409  
0.551  
0.155  
0.055  
E
c2  
L2  
b1  
c
D
c2  
D
L1  
A1  
b1  
b
L
e
e1  
E
c
e
e1  
L
13  
L1  
L2  
3.50  
1.27  
3.93  
1.40  
8/10  
Doc ID 15523 Rev 3  
STPS30M100S  
Ordering information  
3
Ordering information  
Table 8.  
Order code  
STPS30M100ST  
Ordering information  
Marking  
Package  
Weight Base qty Delivery mode  
STPS30M100ST  
TO-220AB  
TO-220FPAB  
I2PAK  
2.3 g  
2.0 g  
50  
50  
50  
Tube  
Tube  
Tube  
STPS30M100SFP STPS30M100SFP  
STPS30M100SR STPS30M100SR  
1.49 g  
4
Revision history  
Table 9.  
Date  
Document revision history  
Revision  
Changes  
25-Mar-2009  
15-Apr-2010  
28-Jan-2011  
1
First issue  
Updated package graphic on front page. Updated Table 3, Table 5,  
Table 6, and Table 7.  
2
3
Added warning paragraph above Table 7.  
Doc ID 15523 Rev 3  
9/10  
STPS30M100S  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
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third party products or services or any intellectual property contained therein.  
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OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
liability of ST.  
ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
© 2011 STMicroelectronics - All rights reserved  
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10/10  
Doc ID 15523 Rev 3  

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